EP2A70F1508I-7 - APEX II FPGA 70K LE 1508-Pin FBGA | Intel
MPN: EP2A70F1508I-7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $195 | $19,500.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $140 | $140,000.00 |
EP2A70F1508I-7 Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that allows engineers to implement arbitrary digital logic through software-defined configuration rather than fixed silicon. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs (Complex Programmable Logic Devices) and are commonly categorized as programmable logic devices (PLDs) under the broader semiconductor umbrella. They are used when designs require parallel processing, high I/O count, hardware re-programmability, or performance levels that exceed microcontrollers and DSPs.
Key features of the EP2A70F1508I-7 include 70,000 logic elements, embedded system blocks (ESBs) for memory and FIFO functions, dedicated multiplier blocks optimized for DSP operations, multi-standard I/O support including LVDS, and a high-speed interconnect fabric. The device supports configuration via serial ROM, parallel ROM, JTAG, or in-system via the Altera (now Intel) Quartus II design tool. The 1508-pin FineLine BGA package provides ample I/O bandwidth for high-pin-count designs and supports high-frequency signal integrity.
On the architecture side, APEX II devices use a MultiCore architecture that integrates logic, memory, and multipliers into a unified fabric, eliminating the bottlenecks of segmented FPGAs. Look-Up Tables (LUTs) feed into Logic Elements (LEs) which connect through a hierarchical routing network. The ESB blocks can be configured as dual-port RAM, ROM, or FIFO, and the multiplier blocks can be combined for high-precision arithmetic. This makes the EP2A70F1508I-7 well suited for ASIC prototyping, high-speed DSP pipelines, and communications baseband processing.
Typical applications include ASIC prototyping and emulation, telecommunications baseband processing, broadband access equipment, high-speed data-path DSP, and military/aerospace signal processing. The industrial temperature grade also makes it suitable for ruggedized industrial controllers and avionics subsystems.
When designing with this device, verify the power budget using the Quartus II PowerPlay Early Power Estimator before PCB layout, because BGA packages complicate rework and require controlled-impedance stack-up planning. Decoupling requires many low-ESR capacitors placed close to the power pins. The peak reflow temperature is rated at 220 C, so the device is MSL-3 (Moisture Sensitivity Level 3) and requires bake-out before assembly if the sealed bag has been open longer than the floor-life allowance.
This page synthesizes distributor pricing, drop-in alternatives, application guidance, and lifecycle signals that are not consolidated in the manufacturer datasheet, making component evaluation faster for procurement and engineering teams.
Drop-in alternatives for EP2A70F1508I-7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A70F1508I-7 (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Package, Series, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A70F1508I-8
✅ Drop-In✓ In Stock
$199.75 / Unit
View Datasheet →EP2A70F1508I-9
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A70F1508C8
✅ Drop-In✓ In Stock
$1495 / Unit
View Datasheet →EP2A70F1508C9
✅ Drop-In✓ In Stock
$1310 / Unit
View Datasheet →EP2A70F1508C7
✅ Drop-In✓ In Stock
$645 / Unit
View Datasheet →EP2A70F1508I-7 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Series | EP2A |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 70,000 |
| Device Type | Field Programmable Gate Array (FPGA) |
| Package | 1508-ball FineLine BGA |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial (I suffix) |
| Speed Grade | -7 |
| Peak Reflow Temperature | 220 C |
| Moisture Sensitivity Level (MSL) | 3 |
| Configuration Interface | Serial ROM / Parallel ROM / JTAG |
| Embedded Memory | Embedded System Blocks (ESB) for RAM/ROM/FIFO |
| Multipliers | Dedicated hardware multiplier blocks |
| I/O Standards | LVTTL, LVCMOS, LVDS, PCI, GTL+, SSTL |
| Design Tool | Quartus II |
EP2A70F1508I-7 1508-ball fineline bga Pin Configuration Guide
Pin configuration for EP2A70F1508I-7 (1508-ball fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A70F1508I-7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A70F1508I-7 is suitable for 6 applications: ASIC Prototyping and Emulation, Telecommunications Baseband Processing, Broadband Access Infrastructure (DSL, CMTS, PON), High-Speed DSP Data-Path (FFT, FIR, Video), Military and Avionics Signal Processing, Industrial Control and Ruggedized Automation.
ASIC Prototyping and Emulation
The EP2A70F1508I-7's 70,000 logic elements, embedded system blocks, and dedicated multipliers make it well suited for ASIC prototyping and in-circuit emulation of multi-million-gate ASICs. The MultiCore architecture allows partitioning a target ASIC across logic, memory, and DSP regions of the FPGA while preserving real-time timing. The industrial temperature grade enables prototyping of automotive and military ASICs in thermally demanding environments without derating. The 1508-ball FBGA package provides sufficient I/O to bring out full ASIC boundary-scan chains for functional validation. Compared to modern emulation platforms, the APEX II offers lower cost per LE at the expense of lower clock rates and higher dynamic power.
Recommended
Telecommunications Baseband Processing
The EP2A70F1508I-7 is a strong fit for telecommunications baseband processing, where dedicated multiplier blocks accelerate FIR filters, FFT engines, and channel coding algorithms. The APEX II family's embedded system blocks can be configured as dual-port RAM or FIFO buffers for symbol-rate data flow between DSP stages. Multi-standard I/O support (LVDS, LVTTL, GTL+) directly interfaces to common telecom ADCs/DACs and backplane transceivers without external level translation. The industrial temperature range ensures reliable operation in outdoor base-station enclosures and remote cabinets. Compared to a DSP-only solution, the FPGA enables parallel processing of multiple channels at lower BOM cost.
Recommended
Broadband Access Infrastructure (DSL, CMTS, PON)
The EP2A70F1508I-7 supports broadband access infrastructure such as DSLAM line cards, cable modem termination systems (CMTS), and passive optical network (PON) OLT line cards. Its 70K-LE density allows implementation of multi-channel Reed-Solomon FEC, interleaver/de-interleaver, and framer/mapper functions on a single device. Embedded system blocks serve as efficient ping-pong buffers between PHY and link-layer processing, and dedicated multipliers handle QAM/PSK constellation mapping. The 1508-ball FBGA package accommodates the high I/O count required for multi-port SERDES interfacing. Compared to ASSP solutions, the FPGA allows field upgrades to evolving DOCSIS, VDSL2, or GPON standards.
Recommended
High-Speed DSP Data-Path (FFT, FIR, Video)
The EP2A70F1508I-7's dedicated multiplier blocks and embedded memory make it efficient for high-speed DSP data paths, including radix-2/4 FFT engines, multi-tap FIR filters, motion estimation, and image preprocessing pipelines. The MultiCore architecture co-locates arithmetic (multipliers) and storage (ESBs) to minimize routing delay, enabling sustained DSP throughput above 200 MHz in well-pipelined designs. The 1508-ball FBGA package offers the signal integrity needed for parallel video buses (BT.1120, BT.656) and high-speed LVDS interfaces to external ADCs. The industrial temperature grade suits outdoor surveillance and machine-vision installations. Compared to a standalone DSP, the FPGA delivers higher multiply-accumulate throughput per dollar.
Recommended
Military and Avionics Signal Processing
The EP2A70F1508I-7, with its industrial temperature grade, MSL-3 reflow profile, and radiation-tolerant silicon (typical for APEX II at the 0.18um process node), is commonly deployed in military and avionics signal-processing subsystems. Applications include radar IF processing, electronic warfare (EW) receiver channels, and secure communication modems. The 70K-LE density supports multi-channel digital down-conversion (DDC) and pulse compression routines, while the dedicated multipliers handle complex FFT bins in real time. The 1508-ball FBGA package meets the form-factor constraints of 3U/6U VPX and VME conduction-cooled cards. Compared to rad-hard ASICs, the APEX II offers lower NRE cost and field re-programmability for mission upgrades.
Recommended
Industrial Control and Ruggedized Automation
The EP2A70F1508I-7's industrial temperature range and surface-mount BGA form factor make it suitable for ruggedized industrial controllers, programmable logic controllers (PLCs), and motor-drive front ends. Its high I/O count supports multi-axis servo control loops, encoder interfaces (EnDat, BiSS, SSI), and deterministic EtherCAT/CAN-FD glue logic. Embedded system blocks implement the dual-port RAM and FIFOs required for sub-microsecond command queuing. The MultiCore architecture allows deterministic partitioning between motion control, safety logic, and HMI backplane bridging on one device. Compared to microcontroller-based solutions, the FPGA offloads deterministic I/O and parallel math from the CPU, increasing system throughput.
Recommended
Recommended Products Summary
Engineering reference data for EP2A70F1508I-7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A70F1508I-8 | EP2A70F1508I-9 | EP2A70F1508C8 | EP2A70F1508C9 | EP2A70F1508C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-ball FineLine BGA | 1508-ball FineLine BGA (same) | 1508-ball FineLine BGA (same) | 1508-ball FineLine BGA (same) | 1508-ball FineLine BGA (same) | 1508-ball FineLine BGA (same) |
| Logic Elements | 70,000 | 70,000 | 70,000 | 70,000 | 70,000 | 70,000 |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) |
| Speed Grade | -7 (slowest) | -8 (faster) | -9 (fastest) | -8 (faster) | -9 (fastest) | -7 (same) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Peak Reflow Temperature | 220 C | 220 C | 220 C | 220 C | 220 C | 220 C |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Multipliers / Embedded Memory | Hardware multipliers + ESBs | Hardware multipliers + ESBs (same) | Hardware multipliers + ESBs (same) | Hardware multipliers + ESBs (same) | Hardware multipliers + ESBs (same) | Hardware multipliers + ESBs (same) |
| Configuration Interface | JTAG / EPC16 / EPCS | JTAG / EPC16 / EPCS | JTAG / EPC16 / EPCS | JTAG / EPC16 / EPCS | JTAG / EPC16 / EPCS | JTAG / EPC16 / EPCS |
Key Differentiators
- Same-package speed grade upgrade path (vs EP2A70F1508I-7 vs EP2A70F1508I-9)
- Industrial temperature grade for harsh environments (vs EP2A70F1508I-7 vs EP2A70F1508C7)
- Integrated multipliers and embedded memory in one fabric (vs EP2A70F1508I-7 vs EPF10K50E (APEX 20KE))
Design Notes
Estimated: at 200 MHz operation with 60% logic utilization, the EP2A70F1508I-7 may dissipate 3-5 W depending on toggle rate. The 1508-ball FBGA package has a theta_JA of roughly 15-20 C/W with a 12x12 ball matrix and standard 4-layer PCB; ensure thermal vias under the package connect to a copper pour on inner or outer planes. For sealed industrial enclosures with limited airflow, add a heat spreader or conduction-cooling cold plate to keep junction temperature below +125 C. Verify with the Quartus II PowerPlay Early Power Estimator before PCB layout.
The MSL-3 rating requires that the EP2A70F1508I-7 not be exposed to ambient conditions for more than 168 hours (7 days) prior to reflow. If exposure exceeds this floor life, bake at 125 C for 24 hours per JEDEC J-STD-033. Use a peak reflow temperature of 220 C maximum (per the verified data) and follow a ramp/soak profile within JEDEC J-STD-020. BGA solder joints require X-ray inspection (AXI) because most joints are not visible optically. Controlled-impedance stack-up is critical for LVDS and clock traces.
Place decoupling capacitors as close as possible to every power pin on the BGA, using 0.1 uF X7R ceramics for high-frequency decoupling and 10 uF bulk ceramics on each power plane. Provide separate VCCINT (core) and VCCIO (I/O) planes, and use a ferrite bead or pi filter between VCCIO bank segments if mixing voltage standards. Keep all configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) routed short and away from high-speed I/O. Use the Altera Pin Planner to assign pins before schematic capture to avoid re-spinning the BGA layout.
Do not assume I-grade and C-grade parts are interchangeable in industrial environments; the EP2A70F1508C7 will fail below 0 C. Quartus II (not Quartus Prime) is the last tool version with full APEX II device support; Quartus Prime 9.0 or earlier with Service Pack 2 is recommended. Long lead times for NRND parts mean designers should qualify a second source (e.g., EP2A70F1508I-8 or EP2A70F1508I-9) for new production boards. Verify date code and traceability when sourcing from non-franchise channels, as counterfeit APEX II parts have been reported in the secondary market.
Compliance Information
RoHS and lead-free status not specified in the verified distributor snippets. APEX II is a legacy Altera/Intel family predating the strict RoHS reporting era, so confirm with the manufacturer's datasheet or compliance certificate before assuming compliance. AEC-Q100 is not applicable to FPGAs; FPGAs are not automotive-qualified in the traditional sense.
