EP2AGX125DF25C6G - Arria II GX FPGA 125K LE 572-FCBGA | Intel
MPN: EP2AGX125DF25C6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1430 | $715,000.00 |
| 1,000 | $1295 | $1,295,000.00 |
EP2AGX125DF25C6G Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and memory controllers. FPGAs sit at the top of the digital semiconductor hierarchy alongside ASICs and CPLDs, distinguished from CPLDs by their higher logic density and from ASICs by their in-system reconfigurability. The Arria II GX family specifically integrates up to 16 high-speed transceivers (3.125 Gbps) alongside the programmable fabric, making it well-suited to protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and CPRI without external PHY chips.
Key features of the EP2AGX125DF25C6G include 118,143 logic elements (LEs), 8,315,904 embedded memory bits, 260 dedicated DSP blocks (18x18 multipliers), integrated PCI Express hard IP, 3.125 Gbps transceivers, support for DDR3/DDR2/QDR II+ memory interfaces, and up to 260 user I/O pins distributed across 16 I/O banks with support for multiple I/O standards including LVDS, LVTTL, LVCMOS, and SSTL. The C6 speed grade positions this part in the mid-range of the Arria II GX speed spectrum.
Architecturally, the EP2AGX125DF25C6G uses a TSMC 40nm process technology with a look-up table (LUT)-based logic fabric, column-based DSP blocks, and TriMatrix embedded memory (MLAB, M9K, M144K blocks). The transceiver blocks include dedicated PMA and PCS layers with hard PCS support for PCIe, XAUI, and Serial RapidIO, offloading serialization, clock-data recovery, and 8b/10b encoding from soft logic and substantially reducing fabric utilization for serial protocols.
Typical applications include wireless baseband processing, video broadcast infrastructure, industrial imaging and machine vision, military radar signal processing, test and measurement equipment, and high-speed data acquisition systems. The combination of high logic density, embedded transceivers, and PCI Express hard IP allows a single Arria II GX device to implement both the application logic and the host interface in a single chip.
When designing with this device, careful attention to power-rail sequencing, decoupling strategy, and signal-integrity routing for the transceiver channels is essential. Reference Quartus II design software and the Arria II GX Handbook for pin assignment, transceiver pre-emphasis settings, and DDR3 interface timing closure guidance.
This page synthesizes distributor availability, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2AGX125DF25C6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX125DF25C6G (same form factor and footprint) — differing in Package, Speed Grade, Family, DSP Blocks, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX125DF25C5G
✅ Drop-In✓ In Stock
$399.5 / Unit
View Datasheet →EP2AGX125DF25C4G
✅ Drop-In✓ In Stock
$399.95 / Unit
View Datasheet →EP2AGX125DF25C6G Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Logic Elements (LEs) | 118,143 |
| Embedded Memory Bits | 8,315,904 |
| DSP Blocks (18x18 Multipliers) | 260 |
| Number of Logic Elements / Cells | 8315904 |
| Total RAM Bits | 8315904 |
| Package | 572-BGA, FCBGA (HBGA) |
| Mounting Type | Surface Mount |
| Number of Terminals | 572 |
| Package Code | HBGA |
| Package Shape | Square |
| Form of Terminal | Ball |
| Speed Grade | C6 |
| RoHS Status | Compliant |
EP2AGX125DF25C6G square Pin Configuration Guide
Pin configuration for EP2AGX125DF25C6G (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX125DF25C6G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX125DF25C6G is suitable for 6 applications: Wireless Baseband Processing, Video Broadcast Infrastructure, Industrial Machine Vision, Test and Measurement Equipment, High-Speed Data Acquisition Systems, Military Radar Signal Processing.
Wireless Baseband Processing
The EP2AGX125DF25C6G is well suited for wireless baseband signal processing in LTE and WiMAX base stations. Its 260 dedicated 18x18 DSP blocks deliver approximately 173 GMACs of MAC throughput, sufficient for FFT/iFFT, channel estimation, and MIMO detection at LTE 20 MHz bandwidth. The integrated 3.125 Gbps transceivers support CPRI up to CPRI v4 and OBSAI for direct connection to RF front-end modules without external PHY. The 8.3 Mbit embedded memory provides ample buffering for symbol-rate processing pipelines, while 118,143 LEs handle MAC-layer scheduling and protocol stack logic. Quartus II DSP Builder accelerates floating-point to fixed-point conversion for rapid algorithm development.
Recommended
Video Broadcast Infrastructure
The EP2AGX125DF25C6G serves as a flexible processing core in broadcast video encoders, decoders, and format converters (e.g., H.264, MPEG-2 transcoding). Its 118K LEs implement multi-stream pipeline logic while the 260 DSP blocks accelerate motion estimation and DCT/iDCT transforms at SD, HD, and 4K resolutions. The integrated transceivers support SMPTE 259M/292M/424M SDI serial video at 270 Mbps to 2.97 Gbps without external serializer chips. DDR3 memory controllers handle frame buffer storage with bandwidth up to 1066 Mbps per interface. PCI Express Gen2 x4 or x8 hard IP provides a direct host interface for video server cards.
Recommended
Industrial Machine Vision
The EP2AGX125DF25C6G powers high-throughput industrial inspection systems including semiconductor AOI, pick-and-place vision, and print inspection. The 118K LEs implement image preprocessing (filtering, thresholding, morphology) while 260 DSP blocks accelerate convolutional neural network inference for defect classification. The high transceiver count supports CoaXPress, Camera Link, and GigE Vision aggregation from multiple cameras. DDR3 controllers buffer full-frame image data at line-scan rates up to 80 kHz. Industrial-grade variants are available for factory floor deployments with extended temperature support.
Recommended
Test and Measurement Equipment
The EP2AGX125DF25C6G is a strong fit for high-end oscilloscopes, logic analyzers, protocol analyzers, and arbitrary waveform generators. Its 260 DSP blocks implement real-time FFT, modulation analysis, and digital filtering at multi-GHz sample rates. The 3.125 Gbps transceivers aggregate data from multi-channel ADC front ends. 118K LEs handle trigger logic, display rendering, and user interface state machines. PCI Express Gen2 x8 hard IP provides a high-bandwidth host interface for waveform data streaming at multi-gigasample per second rates. The flexibility of FPGA fabric allows protocol-specific firmware updates without silicon respin.
Recommended
High-Speed Data Acquisition Systems
The EP2AGX125DF25C6G enables multi-channel data acquisition cards for radar, sonar, and scientific instrumentation. The 3.125 Gbps transceivers accept LVDS or serial ADC data at sample rates above 1 GSPS per channel. The 260 dedicated DSP blocks implement digital downconversion (DDC), pulse compression, and beamforming for phased-array systems. DDR3 memory controllers store large capture buffers with sustained bandwidth above 10 Gbps. The PCIe Gen2 x8 hard IP streams processed data to host processors with up to 4 Gbps transfer rates. Industrial temperature variants operate reliably in field-deployed radar installations.
Recommended
Military Radar Signal Processing
The EP2AGX125DF25C6G is qualified for defense applications including phased-array radar, electronic warfare, and signals intelligence systems. Its 260 DSP blocks implement pulse compression, moving target indication (MTI), and synthetic aperture radar (SAR) processing in real time. The 3.125 Gbps transceivers interface directly to RF digitizers and analog-to-digital converters across multiple channels. Extended temperature and military screening options are available through Intel's defense product line. The 118K LEs implement protocol logic for secure data links and cryptographic offload.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX125DF25C6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX125DF25C5G | EP2AGX125DF25C4G |
|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 572-FCBGA (DF25) | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same |
| Logic Elements | 118,143 | 118,143 (same) | 118,143 (same) |
| Embedded Memory (bits) | 8,315,904 | 8,315,904 (same) | 8,315,904 (same) |
| DSP Blocks (18x18) | 260 | 260 (same) | 260 (same) |
| Speed Grade | C6 | C5 (faster) | C4 (slower) |
| Transceivers | Up to 16 ch @ 3.125 Gbps | Same (3.125 Gbps) | Same (3.125 Gbps) |
| PCI Express Hard IP | Gen1/Gen2 up to x8 | Same | Same |
| Drop-In Compatibility | Reference part | Yes - same package, same die | Yes - same package, same die |
Key Differentiators
- Same-package drop-in across C4/C5/C6 speed grades (vs EP2AGX125DF25C5G / EP2AGX125DF25C4G)
- Hard PCI Express Gen1/Gen2 IP (vs Soft-logic PCIe implementations on competing FPGAs)
- Integrated 3.125 Gbps transceivers with protocol hard PCS (vs Discrete PHY + soft-logic SERDES solutions)
Design Notes
The EP2AGX125DF25C6G FCBGA package requires a thermal management strategy appropriate for high-power FPGAs. At full utilization with high transceiver activity, power dissipation can reach 10-15W. Reference the Altera Arria II GX PowerPlay Early Power Estimator (EPE) spreadsheet for design-specific power estimates. Use at least a 4-layer PCB with a solid ground plane beneath the BGA, and consider a heatsink or thermal interface material for designs exceeding 8W dissipation. Junction temperature must remain below 100C for commercial-grade devices.
The 572-FCBGA DF25 package has 1.0 mm ball pitch and requires HDI PCB stackup with laser-drilled microvias. Use a 6-layer or 8-layer stackup with dedicated ground and power planes. Each BGA ball should connect through a microvia to an internal power/ground plane or signal trace escape. Reference the Altera package mechanical drawing for ball map, pad diameter, and keepout zones. Decoupling: place 0.1uF and 0.01uF MLCCs within 100 mils of every power pin, with bulk 100uF tantalum or polymer capacitors on each power rail.
Transceiver channels require careful PCB routing for 3.125 Gbps operation. Use differential stripline or microstrip with 100 ohm differential impedance, length matching within 5 mils for each TX/RX pair, and continuous reference planes. Minimize vias on transceiver traces; if vias are unavoidable, use back-drilled vias to remove stubs. Maintain at least 3W spacing between transceiver channels and other signals. Reference Altera application note AN558 (Design Recommendations for High-Frequency PCB Layout) for detailed guidance.
The EP2AGX125DF25C6G requires multiple power rails: VCC (core), VCCPD (I/O pre-drivers), VCCIO (I/O banks), VCCR_PCIE/VCCT_PCIE (PCIe transceiver), and VCCA_PLL/VCCT_GXB (PLL and GXB analog supplies). Each rail requires independent regulation with ferrite bead isolation for the analog supplies. Power sequencing should follow Altera's recommended sequence (typically VCC first, then VCCIO, then VCCPD) to prevent latch-up. Use TI or Linear Technology multi-rail controllers such as the LTM4677 or TPS65400 for integrated power management.
Common design pitfalls include: (1) inadequate configuration mode selection - the EP2AGX125 supports FPP, PS, AS, and JTAG modes with specific MSEL pin strapping; (2) ignoring the need for a configuration device (EPCS64 or compatible) for non-volatile storage; (3) leaving JTAG pins floating - they must be pulled to known logic levels; (4) incorrect transceiver reference clock frequency programming in the Quartus II transceiver toolkit; (5) exceeding the maximum of 16 global clock networks without using regional clock networks. Always validate the pin assignments against the Quartus II fitter report before PCB fabrication.
Compliance Information
RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable for FPGAs. Reach compliance assumed based on EU distribution; specific REACH SVHC declaration should be requested from Intel directly. Halogen-free status not explicitly documented in the provided data.
