EP2AGX125EF29C6G - Arria II GX FPGA, 125K LE, 8.3Mbit, 780-BGA | Intel
MPN: EP2AGX125EF29C6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 25 | $1680 | $42,000.00 |
| 100 | $1590 | $159,000.00 |
| 500 | $1495 | $747,500.00 |
EP2AGX125EF29C6G Overview
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and a hierarchy of embedded memory and DSP resources. FPGAs sit above CPLDs in the programmable logic taxonomy and below fixed-function ASICs in per-unit cost, occupying the sweet spot where high logic density, parallel processing, and reconfigurability are required. Within Intel's portfolio, the Arria II GX family targets mid-range applications that need integrated transceivers, embedded transceivers, and PCI Express hard IP without migrating to the higher-cost Stratix series.
Key features of the EP2AGX125EF29C6G include up to 8.315 Mbits of embedded SRAM, embedded 18x18 multipliers for DSP, up to 8 high-speed transceivers per device family, hard PCI Express Gen1/Gen2 controllers, and a comprehensive clock management network with PLLs. The device supports JTAG (IEEE 1149.1) and passive/active configuration schemes including fast passive parallel (FPP) and active serial (AS). The 780-BGA package exposes 372 user I/O and provides the signal integrity needed for DDR2/DDR3 external memory interfaces running up to 533 MHz.
The Arria II GX architecture uses adaptive logic modules (ALMs) rather than legacy 4-input LUTs, delivering finer-grained packing efficiency. The transceiver blocks support data rates up to 6.375 Gbps, enabling protocols such as PCIe Gen2, Serial RapidIO, and CPRI. The on-chip PLLs (up to 8 per device) support fractional-N synthesis, simplifying multi-frequency clock trees common in wireless baseband and video broadcast infrastructure.
Typical applications include wireless baseband processing, video broadcast and contribution encoders, high-speed test and measurement backplanes, military signal processing cards, and PCI Express Gen2 endpoint/root-port designs. The combination of embedded transceivers, hard PCIe IP, and abundant logic also suits the device for medical imaging pre-processing and industrial high-speed vision pipelines.
When designing with this device, allocate sufficient PCB area for the 780-BGA footprint (29 mm x 29 mm) and a multi-layer stack-up (typically 8-12 layers) to maintain signal integrity on the transceiver channels. Use the Quartus II design suite (or its successor) for synthesis, place-and-route, and timing closure. For power estimation, plan for a worst-case TDP near 13-14 W; an appropriately-sized thermal solution or airflow is required in enclosed chassis.
Drop-in alternatives for EP2AGX125EF29C6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX125EF29C6G (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Family, Adaptive Logic Modules (ALM).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX125EF29C5G
✅ Drop-In✓ In Stock
$1090 / Unit
View Datasheet →EP2AGX125EF29C4G
✅ Drop-In✓ In Stock
$1100 / Unit
View Datasheet →EP2AGX125DF25C6G
✅ Drop-In✓ In Stock
$1295 / Unit
View Datasheet →EP2AGX125EF29C6G Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Family | Arria II GX (40 nm) |
| Logic Elements (LE) | 118,143 |
| Embedded Memory | 8,315,904 bits (8.3 Mbit) |
| User I/O Count | 372 |
| Number of Logic Array Blocks (LABs) | 372 (per DigiKey listing parameter) |
| Package | 780-BBGA, FCBGA (29 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | 6 |
| Transceiver Count | Up to 8 multi-gigabit transceivers |
| Transceiver Data Rate | Up to 6.375 Gbps |
| PLL Count | Up to 8 |
| Configuration Mode | FPP, AS, PS, JTAG |
| PCIe Hard IP | PCIe Gen1/Gen2 hard controllers |
| Process Node | 40 nm TSMC |
| RoHS Status | Compliant |
| MSL Level | 3 (per BGA moisture sensitivity norms) |
EP2AGX125EF29C6G 780-bbga, fcbga (29 mm) Pin Configuration Guide
Pin configuration for EP2AGX125EF29C6G (780-bbga, fcbga (29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX125EF29C6G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX125EF29C6G is suitable for 6 applications: Wireless Baseband Processing, Video Broadcast Infrastructure, PCI Express Endpoint Card, Test & Measurement Backplane, Military & Defense Signal Processing, Medical Imaging Pre-Processing.
Wireless Baseband Processing
The EP2AGX125EF29C6G's 118,143 logic elements and embedded 18x18 multipliers support multi-channel LTE and WiMAX baseband processing, while its transceivers handle CPRI links to remote radio heads at up to 6.375 Gbps. The hard PCIe Gen2 IP enables direct connection to a baseband SoC for split-RAN architectures. Placed between the radio front-end and the host processor, the Arria II GX delivers deterministic low-latency DSP parallel to CPU cores, improving cell-edge throughput in dense urban deployments.
Recommended
Video Broadcast Infrastructure
Video contribution encoders and broadcast routers benefit from the EP2AGX125EF29C6G's 8.3 Mbit of embedded memory for line/field buffers and its 3G-SDI transceivers supporting 2.97 Gbps serial digital video. Hard PCIe endpoints let the FPGA feed uncompressed video into a host server's capture card. The 780-BGA package exposes sufficient user I/O for multiple SDI channels, AES audio embedding, and genlock distribution in the same chassis.
Recommended
PCI Express Endpoint Card
The Arria II GX hard PCIe Gen2 controller in the EP2AGX125EF29C6G implements a complete x4 or x8 endpoint with only a small fabric cost, leaving 118K LE for application logic such as protocol bridging, data acquisition, or signal processing. The dedicated transceiver banks map directly to the PCIe lanes at 5 Gbps. The 780-BGA package supports the 100 MHz reference clock and PERn/PETn lane geometry required for standard PCIe edge connectors.
Recommended
Test & Measurement Backplane
The EP2AGX125EF29C6G's 8 multi-gigabit transceivers can drive Serial RapidIO, XAUI, or custom proprietary links to chassis backplanes at up to 6.375 Gbps. Combined with 372 user I/O and 8.3 Mbit memory, the device can implement a high-channel-count logic analyzer or protocol exerciser. The 780-BGA package provides the signal-integrity headroom needed for backplane SERDES at long trace lengths.
Recommended
Military & Defense Signal Processing
The Arria II GX device family supports industrial temperature grades, and the EP2AGX125EF29C6G's 118K LE plus 8 transceivers handle sensor-fusion DSP, software-defined radio front-ends, and ruggedized video processing on VPX and VME backplanes. The BGA package is qualified for shock and vibration profiles typical of ground-vehicle and airborne platforms. Design security via bitstream AES encryption protects IP in deployed systems.
Recommended
Medical Imaging Pre-Processing
Ultrasound and endoscopy pre-processing cards use the EP2AGX125EF29C6G to run beamforming, I/Q demodulation, and image enhancement in parallel across 18x18 multipliers, with embedded memory buffers holding raw RF sample streams. The hard PCIe Gen2 endpoint streams processed frames to a host workstation for rendering. The 780-BGA package and 372 user I/O accommodate multi-channel analog front-end interfaces and DDR2/DDR3 external image memory.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX125EF29C6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX125EF29C5G | EP2AGX125EF29C4G | EP2AGX125DF25C6G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 780-BGA (F29) | 780-BGA (F29) - same | 780-BGA (F29) - same | 780-BGA (F25) - different footprint |
| Logic Elements | 118,143 | 118,143 | 118,143 | 118,143 |
| Embedded Memory | 8,315,904 bits | 8,315,904 bits | 8,315,904 bits | 8,315,904 bits |
| User I/O | 372 | 372 | 372 | 372 |
| Speed Grade | 6 | 5 | 4 | 6 |
| Transceiver Data Rate | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
Key Differentiators
- Faster speed grade (6) at the same package and silicon as C5G and C4G (vs EP2AGX125EF29C5G)
- F29 package variant versus the F25 package on the same die (vs EP2AGX125DF25C6G)
- Hard PCIe Gen2 IP and 8 transceivers integrated at no LE cost (vs Cyclone IV GX equivalent)
Design Notes
Estimated: Arria II GX devices at full transceiver utilization and ~85% logic utilization typically dissipate 10-14 W in commercial 780-BGA packages. With theta_JA of approximately 8-10 C/W (still-air, JEDEC JESD51 conditions), the junction-to-ambient rise alone is insufficient for closed chassis; provide at least 200 LFM airflow, a heat spreader, or attach a heatsink with thermal interface material. Use the Quartus II PowerPlay early power estimator before final PCB layout to size the thermal solution accurately.
The 780-BGA F29 package requires an 8-12 layer PCB stack-up with continuous GND and PWR planes. Use 1.0 mm BGA pitch escape rules with microvia-in-pad or dog-bone fan-out to break out the inner rows. Maintain 100 ohm differential impedance on the transceiver channels and 50 ohm SE for general-purpose I/O. Reference the Altera Arria II GX device handbook pin tables (Pin Connection Guidelines chapter) for bank-VCC requirements, including the dedicated VCCPD, VCCPT, and VCCA_FPLL rails.
Plan for a multi-rail power solution with sequenced enable signals: 0.9 V VCCINT, 1.1 V VCCPT, 2.5 V VCCPD (or 3.0 V depending on bank mix), 1.2 V transceiver PLLs, and 1.5 V/1.8 V DDR2/DDR3 interface voltages. Use a power management IC with the LTM4630 or similar multi-rail module for a compact solution. Decoupling per Altera guidelines is 100 nF at every VCC pin plus 10 uF and 47 uF bulk capacitors at the supply plane entries.
For PCIe Gen2 and Serial RapidIO at 5 Gbps, the transceiver reference clocks must be sourced from a low-jitter oscillator (e.g., SiTime SiT9121 or equivalent) with jitter under 100 fs RMS over 12 kHz-20 MHz. Place the clock driver within 5 cm of the FPGA clock input and isolate the high-speed region with a continuous reference plane. Use the Quartus II IBIS-AMI models for pre-layout channel simulation.
Do not assume a F25 package device (e.g., EP2AGX125DF25C6G) is a drop-in for an F29 design (EP2AGX125EF29C6G) - the pinout and transceiver mapping differ. Always verify the package suffix in the OPN against the schematic's footprint. Another common mistake is to use the EPCS configuration device with a wrong silicon ID; Arria II GX requires a compatible AS configuration device (e.g., EPCS64 or EPCQ16) and the Quartus programmer must match the device ID.
Compliance Information
RoHS compliance per Altera/Intel product documentation. The Arria II GX family is not AEC-Q100 qualified; AEC-Q100 does not apply to FPGAs in this segment.
