EP2AGX125DF25C5G - Arria II GX FPGA 125K LE 572-FCBGA | Intel
MPN: EP2AGX125DF25C5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $418.6 | $418.60 |
| 10 | $415.5 | $4,155.00 |
| 100 | $410.25 | $41,025.00 |
| 250 | $405 | $101,250.00 |
| 500 | $399.5 | $199,750.00 |
EP2AGX125DF25C5G Overview
An FPGA (Field-Programmable Gate Array) is a reprogrammable integrated circuit whose logic resources, routing, and I/O are configured by a hardware description language (HDL) bitstream rather than fixed at fabrication. FPGAs occupy a position in the hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. They are commonly used as glue logic, accelerator blocks, data-path engines, and high-speed serial interfaces in systems where ASIC volume does not justify NRE costs.
Key features of the EP2AGX125DF25C5G include integrated transceivers operating up to 6.375 Gbps, eight PCI Express hard IP blocks, support for DDR3 external memory interfaces up to 800 Mbps data rate, and dedicated 9x9 / 18x18 variable-precision DSP blocks for fixed- and floating-point arithmetic. Embedded memory comprises M20K and 640-bit MLAB blocks providing a total of 8,315,904 memory bits. The -C5 speed grade places this part in the mid-performance tier within the Arria II GX family.
Architecturally, the Arria II GX uses a 40 nm process, an adaptive logic module (ALM) granularity that delivers 8 LUTs per ALM, and dedicated transceiver physical coding sublayer (PCS) and physical medium attachment (PMA) circuitry. Eight PLL blocks and 48 global clock networks support high-fanout timing structures. The transceiver hard IP supports protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, Gbps Ethernet, and SDI.
Typical applications include wireless infrastructure baseband processing, broadcast video switching, military radar signal processing, industrial imaging, PCI Express endpoint and root-port cards, and ASIC prototyping. The combination of mid-range transceiver speed and large logic density makes it suitable for mid-volume designs that require serial connectivity but do not need the top-end 10 Gbps performance of the Arria II GT family.
When designing with the EP2AGX125DF25C5G, verify that Quartus II software version 13.1 or later (with Arria II device support) is available, and confirm the 572-ball FCBGA land pattern matches your PCB layout. The FPGA requires multiple decoupling capacitors and controlled-impedance routing for all transceiver lanes to meet signal-integrity targets.
Drop-in alternatives for EP2AGX125DF25C5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX125DF25C5G (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, DSP Blocks, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX125DF25C4G
✅ Drop-In✓ In Stock
$399.95 / Unit
View Datasheet →EP2AGX125DF25C6G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1295 / Unit
View Datasheet →EP2AGX125DF25C5G Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Family | Arria II GX FPGA |
| Logic Elements (LE) | 118,143 |
| Embedded Memory (bits) | 8,315,904 |
| User I/O Count | 260 |
| Package | 572-BGA, FCBGA |
| Speed Grade | -C5 (mid-grade) |
| Process Technology | 40 nm |
| Transceiver Count | 12 (up to 6.375 Gbps per channel) |
| Transceiver Data Rate | Up to 6.375 Gbps |
| PCIe Hard IP Blocks | 8 |
| DSP Blocks | 9x9 / 18x18 variable-precision |
| Memory Interface Support | DDR3 up to 800 Mbps |
| PLL Count | 8 |
| Global Clock Networks | 48 |
| Mounting Type | Surface Mount (FCBGA) |
| RoHS Status | Compliant |
EP2AGX125DF25C5G 572-bga, fcbga Pin Configuration Guide
Pin configuration for EP2AGX125DF25C5G (572-bga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX125DF25C5G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX125DF25C5G is suitable for 6 applications: Wireless Infrastructure Baseband, PCI Express Endpoint/Add-in Card, Broadcast Video Switching and Processing, Industrial Imaging and Machine Vision, ASIC Prototyping and Design Verification, Radar Signal Processing Front-End.
Wireless Infrastructure Baseband
The EP2AGX125DF25C5G's 118,143 logic elements and 12 transceiver channels at 6.375 Gbps make it well-suited for mid-tier wireless baseband processing, including LTE and small-cell base stations. The 8,315,904 bits of embedded memory enable on-chip buffering of FFT/IFFT windows and channelization data, while the 8 PCIe hard IP blocks can backhaul traffic over PCIe Gen2 to a baseband SoC. Placed between RF front-end and baseband processor, the -C5 speed grade meets timing for CPRI/OBSAI fronthaul links up to 6.375 Gbps without external PHY ICs.
Recommended
PCI Express Endpoint/Add-in Card
With 8 dedicated PCIe hard IP blocks and integrated transceivers supporting PCIe Gen2 (5 Gbps), the EP2AGX125DF25C5G can implement multi-lane PCIe Gen2 endpoint designs without external PHY devices. The 118K LEs handle protocol stack, DMA engines, and user logic, while the embedded memory serves as descriptor and buffer storage. Compared with discrete PCIe switch + FPGA solutions, the integrated hard IP reduces bill of materials and simplifies PCB routing, particularly important for half-length add-in cards.
Recommended
Broadcast Video Switching and Processing
The 12 transceivers support SDI (SMPTE 259M/292M/424M) and 3G-SDI standards at up to 6.375 Gbps, making the EP2AGX125DF25C5G a strong fit for mid-tier broadcast video routers, format converters, and frame synchronizers. The 8,315,904 bits of memory support line and field buffering for video processing, while the 260 user I/Os route audio, control, and metadata streams. Compared with ASSPs that are typically limited to fixed I/O counts, the FPGA provides flexible parallel GPIO for tally, GPI, and genlock signals common in broadcast infrastructure.
Recommended
Industrial Imaging and Machine Vision
The EP2AGX125DF25C5G's embedded memory and DSP blocks enable on-chip pre-processing of high-resolution image streams from Camera Link, CoaXPress, or GigE Vision interfaces. The transceivers support CoaXPress up to 6.25 Gbps per lane, while the 9x9 / 18x18 DSP blocks accelerate filtering, Bayer demosaicing, and edge detection. The -C5 speed grade ensures deterministic frame-rate processing at typical industrial line-scan rates. Placed between image sensors and a host PC, the device reduces host CPU load by performing real-time image enhancement on-FPGA.
Recommended
ASIC Prototyping and Design Verification
With 118,143 LEs, 8.3 Mbits of memory, and 12 high-speed transceivers, the EP2AGX125DF25C5G is suitable for prototyping mid-complexity ASIC designs that require multi-gigabit serial connectivity. Multiple Arria II GX FPGAs can be co-located for larger ASIC prototypes through LVDS inter-FPGA links. Compared with single-FPGA prototypes, the device provides sufficient logic density for typical SoC peripheral subsystems including USB, SATA, and Ethernet MACs that map cleanly to the integrated transceivers.
Recommended
Radar Signal Processing Front-End
The 12 transceivers and 118K LEs suit the EP2AGX125DF25C5G for front-end signal conditioning and pre-processing in phased-array radar applications, where ADC data is sampled at up to 6.375 Gbps per channel. The embedded DSP blocks implement digital down-conversion, pulse compression, and beamforming kernels at full sample rate, while the embedded memory holds range-Doppler maps. The -C5 speed grade is typically sufficient for sub-microsecond latency requirements in military and aerospace radar signal chains.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX125DF25C5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX125DF25C4G | EP2AGX125DF25C6G | EP2AGX125EF35C4N | EP2AGX45DF29C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 572-FCBGA | 572-FCBGA | 572-FCBGA | 572-FCBGA (different ball-out) | FBGA (smaller) |
| Logic Elements | 118,143 | 118,143 | 118,143 | 118,143 | 45,000 |
| Embedded Memory (bits) | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 | 2,310,144 |
| User I/O | 260 | 260 | 260 | 260 | 156 |
| Speed Grade | C5 | C4 (slower) | C6 (faster) | C4 (slower) | C6 (faster) |
| Transceiver Count | 12 | 12 | 12 | 12 | 8 |
| PCIe Hard IP | 8 blocks | 8 blocks | 8 blocks | 8 blocks | 4 blocks |
Key Differentiators
- C5 speed grade balances Fmax and power within Arria II GX 125K family (vs EP2AGX125DF25C4G)
- Same density and features, slower speed grade reduces power (vs EP2AGX125DF25C4G)
- Higher logic density than mid-tier Arria II GX (vs EP2AGX45DF29C6N)
Design Notes
The Arria II GX EP2AGX125DF25C5G -C5 speed grade typically draws 4-8 W in mid-activity designs with several active transceivers. Estimate using the Intel PowerPlay Early Power Estimator (EPE) spreadsheet before final RTL. Multiple decoupling capacitors are required: 100 nF X7R placed within 100 mil of each power pin, plus 10 uF bulk capacitors distributed around the FCBGA perimeter. Use at least 4-layer PCB with dedicated power and ground planes for the 0.8 V core, 1.1 V transceiver supply, 2.5 V/3.3 V I/O supplies, and 1.8 V/2.5 V PLL analog supply.
All 12 transceiver lanes require controlled-impedance routing per the Arria II GX handbook guidelines. For PCIe Gen2 (5 Gbps), use 85 ohm differential impedance; for SDI/3G-SDI, target 75 ohm single-ended or 100 ohm differential. AC coupling capacitors (typically 100 nF X7R) must be placed between the FPGA and the external connector. Match the lane-to-lane length within the tolerance specified for each data rate (e.g. within 150 mil for PCIe Gen2). Reference-plane stitching vias should be placed every 200 mil to maintain signal-integrity return paths.
The 572-FCBGA package exhibits a junction-to-ambient thermal resistance (theta_JA) in the range of 8-15 C/W depending on PCB layer count, copper area, and airflow. For a mid-power application drawing approximately 6 W at room temperature, the junction temperature can approach 80-90 C. Maintain at least a 6-layer PCB with continuous ground plane on the layer directly below the FCBGA, and consider attaching a small heatsink for designs with sustained transceiver activity. Check the device datasheet for the recommended 80 C/W junction-to-case thermal resistance and the max operating junction temperature (typically 100 C for commercial grade).
Common pitfalls when designing with the EP2AGX125DF25C5G include: (1) failing to assign dedicated transceiver reference clock inputs that meet the jitter specification; (2) using incorrect VCCRST/VCCBAT voltage levels which can corrupt the FPGA configuration; (3) missing the MSEL configuration pins which must be tied to specific levels to select AS, PS, JTAG, or FPP configuration mode; (4) overlooking configuration device selection - the EPCQ-L or EPCS16 family is required for active serial configuration. Always verify Quartus II pin planner output against the PCB schematic before tape-out.
Compliance Information
RoHS compliant per the IC-Components and LCSC Verified Web Data entries. Not AEC-Q100 qualified - Arria II GX is intended for commercial/industrial applications; for AEC-Q100-qualified Intel FPGAs, see the Cyclone V or newer automotive device lines.
