EP2AGX45CU17I5G - 42,959 Logic Elements FPGA | Intel
MPN: EP2AGX45CU17I5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $526.7882 | $526.79 |
| 10 | $526.7882 | $5,267.88 |
| 100 | $526.7882 | $52,678.82 |
| 500 | $526.7882 | $263,394.10 |
| 1,000 | $526.7882 | $526,788.20 |
EP2AGX45CU17I5G Overview
An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic elements, routing resources, memory blocks, and configurable I/O. After fabrication, engineers can configure these resources to implement digital circuits, interfaces, control logic, or data-processing pipelines. Within the system hierarchy, the FPGA sits between fixed-function application-specific integrated circuits and software-controlled processors: it provides hardware-level parallelism and deterministic timing while retaining post-manufacturing reconfigurability. The Arria II GX family is presented by distributors as a programmable-logic platform for high-speed applications.
The principal verified features are 42,959 logic elements, 156 I/O, a 358-terminal LFBGA/FCBGA package, industrial temperature grading, and a 40 nm process technology. The listing also gives 0.9 V and 500 MHz values, although their precise electrical test conditions and meanings are not supplied in the provided excerpts. These characteristics support designs that need substantial programmable logic density and a broad external interface count, while the industrial grade indicates suitability for demanding environmental categories when the manufacturer's qualification documentation is reviewed.
The device can be used to implement parallel datapaths, interface bridges, protocol handling, digital filters, and control functions. Its configurable architecture allows logic behavior to be changed through programming, which is valuable during prototyping, product updates, and field upgrades. The 156-I/O count is important for systems that connect multiple buses, converters, memory interfaces, or high-speed peripheral signals. The 358-ball package provides many physical connections, but package-ball verification is essential before design release because similar device suffixes can represent different speed grades, temperature grades, or package options.
Typical applications include industrial automation, data-storage equipment, communications infrastructure, test and measurement, and high-speed digital signal processing. The listed industrial grade and programmable logic resources make the part appropriate for embedded control and interface aggregation, while the 500 MHz listing can help identify the intended performance class, but it should not be treated as a complete timing specification without the manufacturer datasheet. The 0.9 V value likewise requires confirmation in the detailed electrical characteristics before power-tree design is finalized.
When designing with EP2AGX45CU17I5G, verify the complete ordering-code definition, I/O bank voltage limits, supported configuration methods, thermal requirements, signal-integrity rules, and exact ball map from the manufacturer documentation. The short distributor excerpts do not provide the pinout, logic-element architecture details, transceiver specifications, or environmental limits, so those values must remain marked as unavailable rather than inferred.
This page combines the verified distributor specifications, commercial availability, package information, and same-family replacement candidates with clearly identified data gaps. It is intended to help engineers shortlist the FPGA while preserving the distinction between verified facts, such as 42,959 logic elements and 156 I/O, and parameters that require confirmation from the official manufacturer datasheet.
Drop-in alternatives for EP2AGX45CU17I5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX45CU17I5G (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Device Type, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX45CU17I3G
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View Datasheet →EP2AGX45CU17C4G
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View Datasheet →EP2AGX45CU17C6G
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View Datasheet →EP2AGX45CU17I3N
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View Datasheet →EP2AGX45CU17C5N
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$262 / Unit
View Datasheet →EP2AGX45CU17C4G
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View Datasheet →EP2AGX45CU17I5G Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Family | Arria II GX |
| Logic Elements | 42959 |
| Number of I/O | 156 |
| Package | 358-LFBGA, FCBGA |
| Terminal Count | 358 |
| Terminal Form | Ball |
| Package Code | LFBGA |
| Package Shape | Square |
| Temperature Grade | Industrial |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Listed Operating Frequency | 500 MHz |
| Mounting Type | Surface Mount |
| Configuration | Programmable |
EP2AGX45CU17I5G square Pin Configuration Guide
Pin configuration for EP2AGX45CU17I5G (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX45CU17I5G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX45CU17I5G is suitable for 6 applications: Industrial Automation Controllers, Data-Storage Interface Processing, Communications Infrastructure, Test and Measurement Equipment, Digital Signal Processing Systems, High-Speed Interface Aggregation.
Industrial Automation Controllers
EP2AGX45CU17I5G fits industrial automation controllers that need configurable digital logic, deterministic processing, and a substantial number of external connections. Its verified 42,959 logic elements provide capacity for parallel control, sensor-interface aggregation, timing blocks, and protocol logic, while 156 I/O support connections to sensors, actuators, converters, and industrial buses. The listed industrial temperature grade supports use in demanding equipment environments, although the complete manufacturer temperature and qualification data must be reviewed. A practical implementation can place the FPGA between field wiring and a supervisory processor, using configurable I/O for synchronization and local decision-making. Engineers should validate I/O-bank voltages, pin multiplexing, clocking, and package-ball assignments before PCB release. The programmable architecture also permits logic updates during commissioning, which is useful when automation requirements evolve.
Recommended
Data-Storage Interface Processing
EP2AGX45CU17I5G is suitable for data-storage equipment that requires configurable datapaths, protocol handling, and high-speed sequencing. The distributor description identifies it as a low-power, high-speed programmable IC, and the verified listing gives 500 MHz as a relevant performance figure. With 42,959 logic elements, the device can implement buffer management, stream formatting, error handling, or interface adaptation in parallel. Its 156 I/O allow the FPGA to connect storage controllers, serializers, memory devices, and monitoring circuits. The design should treat 500 MHz as a provisional listing value until the official timing and electrical tables confirm its exact condition. Place the FPGA close to the controlled interfaces, control impedance through the PCB stack-up, and verify all I/O-bank constraints. Reconfiguration can also support multiple storage protocols or firmware revisions without changing the entire controller hardware.
Recommended
Communications Infrastructure
EP2AGX45CU17I5G can serve in communications infrastructure where configurable packet processing, clock-domain management, and multiple external interfaces are required. The verified 156-I/O count is valuable for aggregating control, data, and status signals, while 42,959 logic elements support finite-state machines, framing logic, filtering, and protocol conversion. The Arria II GX family is associated with high-speed programmable applications in the supplied distributor descriptions, but the provided excerpts do not confirm transceiver count, line rate, or specific communications protocols. Designers should therefore use the FPGA for logic and interface-processing roles only after checking the official high-speed I/O specifications. The industrial grade is relevant for equipment installations, but system-level reliability, thermal design, and signal integrity still require validation. Controlled impedance, clean power, and package-aware escape routing are especially important for high-speed signal groups.
Recommended
Test and Measurement Equipment
EP2AGX45CU17I5G fits test and measurement systems that need simultaneous capture, processing, timing control, and flexible signal routing. Its 42,959 logic elements allow implementation of counters, trigger logic, data alignment, digital filters, and measurement sequencing, while 156 I/O can interface with converters, sensors, front panels, and communication devices. The device is listed as a low-power, high-speed programmable IC, which makes it a reasonable candidate for compact measurement platforms, but the 500 MHz value requires context from the complete datasheet. Engineers can use the FPGA as a deterministic processing layer between analog or digital acquisition circuitry and a host processor. This architecture supports parallel processing and reconfigurable test modes. Before layout, confirm the actual available I/O, clock constraints, electrical limits, and thermal performance. Use disciplined grounding, short high-speed paths, and verified decoupling to preserve measurement accuracy.
Recommended
Digital Signal Processing Systems
EP2AGX45CU17I5G is appropriate for digital signal processing systems that benefit from parallel hardware execution and configurable datapaths. The verified 42,959 logic elements can support filters, correlation functions, sample-rate conversion, modulation logic, and control sequencing, while the 156-I/O interface count supports multichannel data capture and distribution. The listed 40 nm process technology and 0.9 V value provide context for the device implementation, but they do not replace the official power and timing specifications. In a typical design, the FPGA receives digitized samples, performs parallel processing, and transfers results to memory or a host processor. The programmable fabric allows the processing topology to be adapted for different operating modes. Designers should confirm maximum clock rates, supported memory interfaces, I/O standards, and thermal limits. Place clock and high-speed data routes with controlled impedance and maintain a low-noise power distribution network.
Recommended
High-Speed Interface Aggregation
EP2AGX45CU17I5G can aggregate and adapt multiple high-speed digital interfaces in systems where a fixed-function controller is insufficient. The verified 156 I/O count is useful for connecting converters, memory, control devices, and multiple downstream buses, while 42,959 logic elements provide room for buffering, clock-domain crossing, protocol conversion, and error handling. The distributor description characterizes the part as a low-power, high-speed programmable IC, and the Jotrin result lists 500 MHz, but neither excerpt defines all supported I/O standards or guaranteed timing limits. A robust design uses the FPGA behind appropriate physical-layer or line-interface circuitry rather than assuming direct board-to-board capability. Verify the official high-speed I/O tables, signal-integrity requirements, and power sequencing before implementation. Maintain continuous reference-plane returns, use controlled-impedance routing, and simulate clocks and parallel interfaces across the intended voltage and temperature conditions.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX45CU17I5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX45CU17I3G | EP2AGX45CU17C5G | EP2AGX45CU17C4G | EP2AGX45CU17C6G |
|---|---|---|---|---|---|
| Package | 358-LFBGA, FCBGA | 358-LFBGA, FCBGA | 358-LFBGA, FCBGA | 358-LFBGA, FCBGA | 358-LFBGA, FCBGA |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | Arria II GX | Arria II GX family context | Arria II GX family context | Arria II GX family context | Arria II GX family context |
Key Differentiators
- Verified logic density (vs EP2AGX45CU17C5G)
- Verified high-I/O package context (vs EP2AGX45CU17C4G)
- Industrial temperature grading (vs EP2AGX45CU17I3G)
- Documented ordering and supply visibility (vs Cross-brand alternatives)
Design Notes
The verified listing gives 0.9 V for EP2AGX45CU17I5G, but it does not provide current limits, rail tolerances, power-up sequencing, or recommended decoupling. Before schematic release, obtain the official electrical-characteristics and power-supply-design sections, then size the regulator and decoupling network from the actual rail requirements. Use a solid ground plane, place local capacitors at the relevant power balls, and separate noisy peripheral rails from sensitive FPGA supplies. The 40 nm process listing is useful context but is not enough to estimate power dissipation. Thermal analysis should use the manufacturer's power data and the designed clocking and I/O activity rather than a guessed current value.
EP2AGX45CU17I5G is listed in a 358-LFBGA, FCBGA package, so escape routing, via construction, and ball assignment must follow the official package drawing. The complete ball map is not present in the verified excerpts, and therefore the pinout is intentionally left null. Before layout, download the manufacturer package drawing, compare the land pattern with the selected PCB footprint, and verify every bank, clock, configuration, power, and ground ball. Use a continuous reference plane and controlled impedance for high-speed routes. Keep high-current return paths away from sensitive clock and configuration signals, and confirm the PCB fabricator can support the selected BGA pitch, pad definition, and via-in-pad requirements.
The supplied 500 MHz value is a listing-level figure, not a complete guaranteed timing specification. Treat it as provisional until the official datasheet defines the applicable clock, logic, and I/O conditions. For high-speed interfaces, calculate trace impedance from the actual stack-up, maintain short and symmetric routes where appropriate, provide clean clock distribution, and avoid unnecessary via transitions. Use series termination values from the I/O standard and the device documentation rather than copying values from an unrelated FPGA. The 156-I/O count also does not mean all 156 pins are simultaneously usable in every bank or voltage configuration, so bank planning and simultaneous-switching limits require manufacturer guidance.
The industrial temperature grade makes thermal validation important for EP2AGX45CU17I5G, but the verified excerpts do not supply junction-temperature limits, thermal resistance, or power-consumption curves. Do not infer thermal performance from the 40 nm process technology. Estimate board and junction temperature from the final configuration, clock rates, I/O activity, and manufacturer power model, then verify the calculation with measurements on a representative board. Provide sufficient copper area, thermal vias, and airflow where the design requires it. Keep the decoupling and power layout thermally stable, and avoid placing heat-sensitive components in the device's exhaust path. Confirm the exact environmental ratings and reliability requirements in the official product documentation.
Compliance Information
The verified excerpts do not state RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 compliance. No compliance claim is inferred.
