EP2AGX45CU17C6G - Arria II GX FPGA 42KLE, 156 I/O | Intel
MPN: EP2AGX45CU17C6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $215 | $21,500.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $178 | $178,000.00 |
EP2AGX45CU17C6G Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic device whose internal logic blocks, routing fabric, and I/O buffers are configured by loading a user-defined bitstream into on-chip SRAM configuration cells. Unlike ASICs, FPGAs enable rapid hardware iteration; Arria II GX specifically targets mid-bandwidth applications that need high-speed serial transceivers, embedded memory, and DSP blocks, sitting between Cyclone (low-cost) and Stratix (high-performance) in the Intel FPGA portfolio.
Key features include 156 user I/O pins, dedicated multi-gigabit serial transceivers supporting protocols such as PCIe Gen1, XAUI, and Serial RapidIO, embedded transceivers with CDR support, on-chip memory bandwidth sufficient for high-throughput buffering, and integrated PLLs for clock management. The 0.9 V core reduces dynamic power compared with the 90 nm prior generation, while the 358-ball FCBGA package provides robust thermal performance for transceiver-rich designs.
The architecture combines an FPGA fabric of adaptive logic modules, embedded RAM blocks, DSP blocks, and a high-speed serial interface subsystem, all built on the 40 nm process. Configuration is JTAG-based with AES encryption bitstream support, and the device supports partial reconfiguration in select system designs.
Typical applications include telecom baseband processing, video broadcast and switching, radar signal preprocessing, high-speed serial protocol bridging, industrial imaging pipelines, and test-and-measurement front ends. The 3.75 Gbps transceiver support makes it a strong fit for PCIe Gen1 and XAUI backplanes in line cards.
Designers should consider transceiver reference clock jitter, decoupling for the 0.9 V core rail, and signal-integrity on the FCBGA break-out layer when laying out the PCB. Power estimation through the Early Power Estimator is recommended before final pin assignment.
This page synthesizes distributor stock data, drop-in FPGA alternatives, and transceiver-aware design notes not collected in the manufacturer handbook, providing engineers a one-stop reference for the EP2AGX45CU17C6G.
Drop-in alternatives for EP2AGX45CU17C6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX45CU17C6G (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Logic Elements, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX45CU17C5N
✅ Drop-In✓ In Stock
$262 / Unit
View Datasheet →EP2AGX45CU17C5G
✅ Drop-In✓ In Stock
$228.5 / Unit
View Datasheet →EP2AGX45CU17C4G
✅ Drop-In✓ In Stock
$145.75 / Unit
View Datasheet →EP2AGX45CU17C6G Maximum Ratings & Electrical Characteristics
| Device Family | Arria II GX |
| Logic Elements | 42,959 |
| Total RAM Bits | 3,517,440 |
| User I/O Count | 156 |
| Package | 358-LFBGA (FCBGA) |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Operating Frequency | up to 400 MHz |
| Transceivers | Multi-gigabit transceivers up to 3.75 Gbps |
| Supply Voltage | 0.9 V core |
| Number of Terminals | 358 |
| Terminal Form | Ball (BGA) |
| Package Code | LFBGA |
| Package Shape | Square |
| RoHS Status | Lead free / RoHS Compliant |
EP2AGX45CU17C6G square Pin Configuration Guide
Pin configuration for EP2AGX45CU17C6G (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX45CU17C6G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX45CU17C6G is suitable for 6 applications: Telecom Line Card Baseband Processing, Video Broadcast Switching and Processing, Industrial Imaging and Machine Vision Pipelines, Radar Signal Preprocessing, Test and Measurement Front End, High-Speed Serial Protocol Bridging.
Telecom Line Card Baseband Processing
The EP2AGX45CU17C6G's 42,959 logic elements and 3.5 Mbit of embedded RAM make it a strong fit for telecom line cards where baseband DSP, framing, and packet classification run in parallel. Its multi-gigabit transceivers at 3.75 Gbps support common telecom backplane rates including XAUI and Serial RapidIO, removing the need for external PHY chips. The 156 user I/O accept glue-logic connections to network processors and TDM framers. Designers typically run the FPGA at 200-300 MHz core clocks while the transceivers handle serialization, achieving deterministic latency for backhaul links. The 40 nm process keeps dynamic power under typical telecom thermal budgets even at full I/O toggling.
Recommended
Video Broadcast Switching and Processing
The EP2AGX45CU17C6G is well suited to broadcast video routing and processing where multi-stream SD/HD-SDI aggregation, color-space conversion, and frame buffering must run in real time. The 3.5 Mbit of embedded RAM is enough to double-buffer several SDI streams without external DDR. Transceivers above 1.5 Gbps can drive SDI at 270 Mbps or 1.485 Gbps with low jitter, and the 156 I/O can interface to HDMI receivers, video DACs, and audio embedder chips. The Arria II GX DSP blocks perform chroma resampling and deinterlacing efficiently, freeing logic for control-plane glue. Compared with an ASSP broadcast switch, this FPGA enables proprietary timing and processing pipelines.
Recommended
Industrial Imaging and Machine Vision Pipelines
Industrial machine vision systems use the EP2AGX45CU17C6G to ingest Camera Link or CoaXPress data and run real-time image processing. The transceivers handle CoaXPress at up to 3.125 Gbps per lane, while the FPGA fabric runs Bayer demosaic, color correction, and edge detection pipelines. With 156 I/O the device accepts triggers, encoders, and GPIO from the conveyor line. The 42KLE of logic is sufficient for multi-camera synchronization with hardware timestamping. Designers typically pair this FPGA with DDR2 or DDR3 memory for full-frame buffering, and use the on-chip DSP blocks to accelerate convolutional filters at video rates.
Recommended
Radar Signal Preprocessing
Defense and weather-radar front ends use the EP2AGX45CU17C6G to digitize, downconvert, and pulse-compress RF data before handing it to a DSP processor. The transceivers accept LVDS or serialized ADC outputs at hundreds of MHz, while the FPGA fabric runs matched filters and moving target indication (MTI) algorithms. The 3.5 Mbit of block RAM is enough to hold multiple range bins in fast succession, and the 156 I/O can interface to FMC digitizer cards. The 40 nm process provides predictable timing closure for radar pulse scheduling, and the 358-LFBGA package offers the thermal headroom needed for sealed ruggedized enclosures with limited airflow.
Recommended
Test and Measurement Front End
Test instruments such as protocol analyzers and logic-analyzer backends use the EP2AGX45CU17C6G to capture and time-stamp high-speed serial traffic. The transceivers decode PCIe Gen1, XAUI, SATA, and USB 3.0 signaling, while the FPGA fabric builds protocol-aware state machines for trigger generation. With 156 user I/O and ample block RAM, the device can simultaneously capture multiple lanes and run CRC/error counters. Engineers value the JTAG-based configuration for fast bring-up and the AES bitstream encryption to protect proprietary test IP. Compared with an ASSP, this FPGA adapts quickly to new protocol revs via bitstream update.
Recommended
High-Speed Serial Protocol Bridging
Protocol bridge cards use the EP2AGX45CU17C6G to convert between PCIe, XAUI, Serial RapidIO, and SRIO fabrics in legacy migration scenarios. Each multi-gigabit transceiver can be configured independently, allowing asymmetric rates such as PCIe Gen1 in and XAUI out. The 156 I/O accommodate side-band signals like PERST, REFCLK, and SMBus. The 42KLE of logic is sufficient for transport-layer adaptation, while the 3.5 Mbit of RAM holds packet headers during rate-matching. Industrial and military customers rely on this FPGA for long-lifecycle bridges because Arria II GX has a stable, multi-year product roadmap.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX45CU17C6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX45CU17C5N | EP2AGX45CU17C5G | EP2AGX45CU17C4G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 358-LFBGA (FCBGA) | 358-LFBGA - same | 358-LFBGA - same | 358-LFBGA - same |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 |
| Total RAM Bits | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 |
| Speed Grade | 6 (fastest) | 5 | 5 | 4 |
| User I/O | 156 | 156 | 156 | 156 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| RoHS / Lead-Free | Lead-free / RoHS | Lead-free / RoHS | Lead-free / RoHS | Lead-free / RoHS |
| 1-piece Price (USD, 2026-09-08) | ~285 | ~245 | ~245 | ~225 |
Key Differentiators
- Highest speed grade (6) in the 358-LFBGA Arria II GX family (vs EP2AGX45CU17C5N)
- Lead-free and RoHS compliant for worldwide deployment (vs EP2AGX45CU17C5N)
- Same 42KLE silicon as other 358-LFBGA variants (vs EP2AGX260FF35C6G)
Design Notes
Estimated: at 0.9 V core and 100KLE utilization, the static current is roughly 0.5-1.0 A; dynamic current scales with toggle rate and clock frequency. Use the Quartus Early Power Estimator before PCB layout. Decouple each VCCINT pin with a 0.1 uF X7R capacitor placed within 100 mils, and add bulk 47 uF polymer or 220 uF tantalum capacitors at the regulator outputs. Transceiver supplies (VCCA_PLL, VCCA_TX, VCCR) require separate low-noise LDOs, not shares with VCCINT.
The 358-LFBGA package has a full array of balls on a 1.0 mm pitch - design the PCB with at least 4 layers plus dedicated ground planes. Microvias (8-12 mil laser-drilled) are recommended to break out the inner rows; through-via dog-bones can also work but consume more area. Match differential transceiver trace lengths within 5 mil for PCIe and within 10 mil for XAUI. Maintain a continuous reference plane under each transceiver lane to control impedance at 100 ohm differential.
Transceiver reference clocks must come from a low-jitter oscillator (typical phase noise < -100 dBc/Hz at 100 kHz offset). Route clocks on the top layer over a continuous ground plane and keep them isolated from switching I/O. For multi-lane protocols, lane-to-lane skew should be < 1 ps per cm of trace length difference. Use the Arria II GX handbook's eye-diagram templates to validate SI before tape-out.
Do not enable a transceiver channel until its reference clock is stable - hot-plug events can latch-up the CDR. Always assert the nPERST or equivalent reset after power-up completes. Confirm the JTAG chain order in the Quartus programmer before generating the bitstream; mismatched BSDL files are the most common bring-up failure. Verify the bitstream encryption key matches the device's programmed key, otherwise configuration will silently fail.
Compliance Information
Lead-free and RoHS compliant per the Intel product page and distributor listings. AEC-Q100 does not apply (industrial/commercial FPGA). Halogen-free and conflict-mineral status not stated in available data.
