EP2AGX45CU17C4G - Arria II GX FPGA, 42K LE, 156 I/O, 358-BGA | Intel
MPN: EP2AGX45CU17C4G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $172.36 | $172.36 |
| 10 | $165.5 | $1,655.00 |
| 100 | $158.2 | $15,820.00 |
| 500 | $152 | $76,000.00 |
| 1,000 | $145.75 | $145,750.00 |
EP2AGX45CU17C4G Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), dedicated DSP blocks, embedded RAM, and programmable I/O elements interconnected by a programmable routing fabric. FPGAs sit at the top of the digital logic hierarchy between discrete gate arrays and full ASICs, providing hardware-timed parallelism that microcontrollers cannot match. Within the Altera/Intel portfolio, the Arria II GX family occupies the mid-range transceiver-capable tier above Cyclone and below Stratix, optimized for protocols such as PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI/OBSAI common in wireless backhaul.
Key features include 42,959 logic elements, 2,365 Kbits of dedicated RAM, embedded 18x18 multipliers, 156 user I/Os, and 3.5 Mbits of total embedded memory. The device integrates transceivers supporting data rates up to 3.75 Gbps, hardened PCI Express Gen1/Gen2 endpoints, and a DDR2/DDR3 memory controller interface. Configuration is supported through passive serial (PS), fast passive parallel (FPP), and JTAG modes with built-in decompression and encryption via the AES-128 bitstream security engine.
Architecturally, the EP2AGX45CU17C4G uses a 40nm low-power process with adaptive logic modules (ALMs) that combine look-up tables and registers into 8-input fracturable structures. The transceiver tiles integrate the PHY, PCS, and bonding clocking for protocol portability, while the variable-precision DSP blocks accelerate fixed- and floating-point math for signal processing pipelines.
Typical applications include wireless baseband processing, broadcast video encoders, medical imaging accelerators, industrial motor control, and high-speed serial interface bridging. Engineers select this Arria II GX device when designs need more logic density than Cyclone V but not the full transceiver bandwidth of Stratix IV.
When designing with this FPGA, ensure 0.9V core and 2.5V/3.3V auxiliary rails use low-noise LDO regulators placed within 25mm of the package. A multi-layer PCB with continuous ground planes and matched-length transceiver traces is required for signal integrity above 1 Gbps.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2AGX45CU17C4G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX45CU17C4G (same form factor and footprint) β differing in Package, Speed Grade, Device Type, Logic Elements, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX45CU17C4
β Drop-Inπ Reference alternative (not in catalog)
EP2AGX45CU17I4
β Drop-Inπ Reference alternative (not in catalog)
EP2AGX45CU17C5
β Drop-Inπ Reference alternative (not in catalog)
EP2AGX45CU17C6
β Drop-Inπ Reference alternative (not in catalog)
EP2AGX45CU17C8
β Drop-Inπ Reference alternative (not in catalog)
EP2AGX45CU17I3
β Drop-Inπ Reference alternative (not in catalog)
EP2AGX45CU17C4G Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements | 42,959 |
| Embedded Memory Bits | 3,517,440 |
| Number of LABs/CLBs | 1805 |
| User I/O Count | 156 |
| Supply Voltage - Core | 0.9 V |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | -4 |
| Mounting Type | Surface Mount |
| Package | 358-LFBGA, FCBGA |
| Process Technology | 40 nm |
| Total RAM Bits | 3,517,440 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP2AGX45CU17C4G 358-lfbga, fcbga Pin Configuration Guide
Pin configuration for EP2AGX45CU17C4G (358-lfbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX45CU17C4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX45CU17C4G is suitable for 6 applications: Wireless Baseband Processing, PCI Express Gen1/Gen2 Endpoint, Broadcast Video Processing, Medical Imaging Accelerator, Industrial Motor Control, Serial Protocol Bridging.
Wireless Baseband Processing
The EP2AGX45CU17C4G is well matched to 4G LTE baseband processing boards where 42,959 logic elements plus 18x18 multipliers handle channel estimation, FFT/iFFT, and turbo decoding in real time. The device's integrated transceivers support CPRI and OBSAI fronthaul links up to 3.75 Gbps, eliminating the need for external PHY chips. Designers can place the EP2AGX45CU17C4G between the RF front end and the baseband processor, leveraging 3,517,440 bits of embedded RAM for symbol buffers. This integration reduces board area versus discrete DSP-plus-FPGA partitioning while remaining cost-effective compared to Stratix-grade devices.
Recommended
PCI Express Gen1/Gen2 Endpoint
The EP2AGX45CU17C4G includes a hard PCI Express IP core that supports Gen1 (2.5 Gbps) and Gen2 (5 Gbps) endpoint operation without consuming FPGA fabric resources. With 156 user I/Os and up to 3.75 Gbps transceivers, the device fits PCIe add-in cards, host bus adapters, and industrial PCIe-over-cable applications. The -4 speed grade provides the timing margin required for Gen2 operation across commercial temperature. Designers can pair the EP2AGX45CU17C4G with a small DDR2/DDR3 memory device for DMA buffering, using the embedded memory controller interface for low-latency transactions.
Recommended
Broadcast Video Processing
Broadcast video encoder and decoder platforms benefit from the EP2AGX45CU17C4G's variable-precision DSP blocks and high-speed serial I/O for SDI/HDMI bridging. The 42,959 logic elements handle H.264 or MPEG-2 transform and motion estimation pipelines at 1080p60 throughput, while 3,517,440 bits of embedded RAM provide line and frame buffers. Transceivers support SMPTE 424M/425M 3G-SDI rates, allowing direct connection to broadcast cameras and switchers. Compared to ASIC-based solutions, the EP2AGX45CU17C4G enables late-binding format changes and firmware updates over the air.
Recommended
Medical Imaging Accelerator
Ultrasound beamformers and CT image reconstruction boards use the EP2AGX45CU17C4G to accelerate FIR filtering and back-projection algorithms. The 18x18 multipliers deliver up to 156 GMACs at full DSP utilization, while 3.5 Mbits of RAM holds coefficient tables and intermediate frames. The 358-ball FCBGA package supports the thermal envelope needed for sustained processing in compact medical carts. Designers pair the EP2AGX45CU17C4G with high-speed ADCs over LVDS lanes and stream processed images via the integrated transceivers to a host workstation.
Recommended
Industrial Motor Control
Multi-axis servo drives and industrial inverters use the EP2AGX45CU17C4G to implement field-oriented control (FOC) loops at 50-100 kHz update rates. The 42,959 logic elements and DSP blocks run simultaneous current, speed, and position control on 4-6 axes, while 3,517,440 bits of RAM hold sin/cos lookup tables and observer state. The device's 156 user I/Os connect directly to encoder interfaces, gate drivers, and CAN/EtherCAT PHYs via transceivers. Industrial-grade variants such as EP2AGX45CU17I4 extend operation to -40C to +100C, matching factory-floor requirements.
Recommended
Serial Protocol Bridging
Protocol converter cards bridging Serial RapidIO, Gigabit Ethernet, and PCI Express rely on the EP2AGX45CU17C4G's transceiver flexibility. With multiple 3.75 Gbps lanes and a hardened PCIe endpoint, the device can serve as a switch-fabric bridge between heterogeneous domains in telecom and aerospace systems. The 3.5 Mbits of embedded RAM buffer packets between protocols without external memory, and the AES-128 bitstream encryption protects configuration IP. Compared to ASSPs, the FPGA allows late-binding protocol updates as standards evolve.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX45CU17C4G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX45CU17C4 | EP2AGX45CU17I4 | EP2AGX45CU17C5 | EP2AGX45CU17C6 | EP2AGX45CU17I3 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 358-LFBGA, FCBGA | 358-LFBGA, FCBGA - same | 358-LFBGA, FCBGA - same | 358-LFBGA, FCBGA - same | 358-LFBGA, FCBGA - same | 358-LFBGA, FCBGA - same |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 |
| Speed Grade | -4 | -4 | -4 | -5 | -6 | -3 |
| Operating Temperature | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C |
| Embedded Memory Bits | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 |
| User I/O Count | 156 | 156 | 156 | 156 | 156 | 156 |
| RoHS Compliance | Yes (Green) | No (non-Green) | Yes (Green) | Yes (Green) | Yes (Green) | Yes (Green) |
| Lifecycle Status | Active | Active (legacy) | Active | Active | Active | Active |
Key Differentiators
- Same die with industrial temperature range (vs EP2AGX45CU17I4)
- Lower-cost legacy non-RoHS variant available (vs EP2AGX45CU17C4)
- Faster speed grade available in same package (vs EP2AGX45CU17I3)
- Slower grades offer cost savings for non-timing-critical designs (vs EP2AGX45CU17C6)
Design Notes
The EP2AGX45CU17C4G requires a 0.9V core supply (VCCINT) plus 2.5V/3.3V auxiliary rails (VCCA, VCCPD). Estimated: at typical utilization (~70% LEs, 50% RAM, 25% transceivers), ICCINT draws approximately 0.8-1.2A, requiring an LDO or buck regulator rated for 2A continuous with output ripple below 30 mVpp. Place decoupling capacitors within 5mm of each power pin per Altera's power distribution network guidelines; failure to do so risks logic errors and PLL jitter at high transceiver rates.
The 358-ball FCBGA package requires a 1.0mm ball pitch PCB with microvia stack-up and 4-6 routing layers. Use a continuous ground plane on layer 2 directly beneath the device, and dedicate one layer each to 0.9V core, 2.5V/3.3V auxiliary, and high-speed transceiver signals. Differential transceiver traces must be length-matched within 0.127mm (5 mil) to meet Gen2 PCIe and 3.75 Gbps timing budgets. Maintain 100-ohm differential impedance across the entire transceiver channel.
Estimated: with worst-case power dissipation around 5-7W under full transceiver utilization, junction temperature can rise 25-35C above ambient on a JEDEC JESD51 standard 4-layer test board. For enclosed industrial or broadcast chassis, design for theta_JA around 12-15 C/W via copper pours and thermal vias. The FCBGA package has an exposed die paddle that must be soldered to the PCB thermal pad for proper heat dissipation. Consider a heatsink or forced airflow if junction temperatures approach 100C under sustained load.
Do not confuse the -4 speed grade with the -C4 temperature designation; 'C' here refers to commercial (0-85C), not a clock-domain spec. Also, ensure configuration mode selection via MSEL pins matches your chosen configuration source (AS, PS, FPP, JTAG) before PCB layout - changing MSEL requires board rework. When migrating between speed grades (e.g., -4 to -6), verify timing closure with Quartus TimeQuest; the same RTL may fail static timing at slower grades.
Compliance Information
RoHS compliant per Intel product page. The CU17C4 (non-G) suffix variant is non-RoHS. AEC-Q100 not applicable for FPGAs - see industrial -I variants for extended temperature.
