EP2AGX45DF25I5 - Arria II GX FPGA 45K LEs 572-FCBGA | Intel
MPN: EP2AGX45DF25I5 β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462 | $4,620.00 |
| 100 | $418 | $41,800.00 |
| 250 | $395 | $98,750.00 |
| 500 | $372 | $186,000.00 |
EP2AGX45DF25I5 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. FPGAs sit in the broader hierarchy of programmable logic devices (CPLDs -> FPGAs -> SoC FPGAs -> custom ASICs) and are used to accelerate parallel workloads, implement custom protocols, and provide reconfigurable glue logic between processors, sensors, and high-speed serial links. Unlike ASICs, FPGAs are programmable in the field via JTAG or PCIe configuration, enabling rapid iteration and late-stage hardware changes.
Key features of the EP2AGX45DF25I5 include 252 user I/O pins, dedicated 8B/10B encoder/decoder blocks, dynamic reconfiguration support, and hardened PCIe Gen2 x4/x8 endpoint blocks. The transceiver block supports multiple serial protocols (PCIe, XAUI, SRIO, CPRI, OBSAI, GbE) and operates from a single 0.9 V core supply with dedicated PLL and serializer/deserializer channels. Per the Altera/Intel Arria II GX Device Handbook, transceivers can be configured to drive backplanes at 3.75 Gbps and chip-to-chip links at 6.375 Gbps.
Typical applications include wireless base-station CPRI front-haul, video broadcast (SD/HD-SDI, 3G-SDI), industrial imaging and machine-vision frame grabbers, military radar signal processing, and PCIe Gen2 endpoint cards. In each of these designs, the FPGA serves as a protocol-bridging and packet-processing engine, freeing the host CPU from real-time serial I/O duties.
When designing with the EP2AGX45DF25I5, pay close attention to the transceiver reference-clock architecture and PCB stack-up. Differential pairs must maintain 100 ohm differential impedance, and AC-coupling capacitors are required on all serial links. Power sequencing must follow the Arria II GX handbook to avoid latch-up during configuration.
Drop-in alternatives for EP2AGX45DF25I5 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX45DF25I5 (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Transceivers, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX45DF25I3N
β Drop-Inπ Reference alternative (not in catalog)
EP2AGX45DF25I3G
β Drop-Inβ In Stock
$370 / Unit
View Datasheet βEP2AGX45DF25C6N
β Drop-Inβ In Stock
$263.5 / Unit
View Datasheet βEP2AGX45DF25C6G
β Drop-Inβ In Stock
$128 / Unit
View Datasheet βEP2AGX45DF25C5N
β Drop-Inβ In Stock
$258.2 / Unit
View Datasheet βEP2AGX45DF25C5G
β Drop-Inβ In Stock
$118 / Unit
View Datasheet βEP2AGX45DF25C4N
β Drop-Inβ In Stock
$460 / Unit
View Datasheet βEP2AGX45DF25C4G
β Drop-Inβ In Stock
$205 / Unit
View Datasheet βEP2AGX45DF25I5 Maximum Ratings & Electrical Characteristics
| Device Family | Arria II GX |
| Logic Elements | 42959 |
| Embedded Memory (bits) | 3517440 |
| Adaptive Logic Modules (ALMs) | 18050 |
| User I/O Pins | 252 |
| Transceiver Channels | 8 |
| Maximum Transceiver Data Rate | 6.375 Gbps |
| PCIe Hard IP | Gen2 x4 / x8 endpoint |
| Process Technology | 40 nm TSMC |
| Core Supply Voltage | 0.9 V |
| Package | 572-ball FCBGA (25x25 mm) |
| Operating Temperature Range | -40C to +100C (industrial, I5 speed grade) |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |
| Memory Interfaces | DDR3, DDR2, QDR II, RLDRAM II (up to 800 MHz) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
EP2AGX45DF25I5 572-ball fcbga (25x25 mm) Pin Configuration Guide
Pin configuration for EP2AGX45DF25I5 (572-ball fcbga (25x25 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX45DF25I5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX45DF25I5 is suitable for 6 applications: Wireless Base-Station CPRI Front-Haul, HD-SDI / 3G-SDI Video Broadcast Equipment, Industrial Machine-Vision Frame Grabbers, PCIe Gen2 Endpoint Accelerator Card, Military Radar and SIGINT Signal Processing, Industrial Ethernet Switch Fabric.
Wireless Base-Station CPRI Front-Haul
The EP2AGX45DF25I5 fits CPRI front-haul because its 8 transceivers at up to 6.375 Gbps comfortably carry 4.915 Gbps CPRI Option 6 links with margin, and its hardened 8B/10B blocks handle CPRI control words. The 42,959 logic elements plus 3.5 Mbit embedded memory allow buffering of IQ samples between RF and BBU without external SRAM. Industrial temperature grade suits outdoor radio units and remote-RRU deployments.
Recommended
HD-SDI / 3G-SDI Video Broadcast Equipment
The EP2AGX45DF25I5 implements SDI receive/transmit channels because its transceiver block natively handles SMPTE 424M (3G-SDI) at 2.97 Gbps with embedded clock-serialization, while the fabric runs scrambling, line-number insertion, and EDH processing. With 252 user I/O pins the device hosts multiple BNC channels and parallel GPIO for tally/audio. Industrial temperature rating supports broadcast-van and outdoor sports-broadcast environments.
Recommended
Industrial Machine-Vision Frame Grabbers
The EP2AGX45DF25I5 excels in CoaXPress, Camera Link, and GigE Vision frame grabbers because its 8 transceivers support CoaXPress 6.25 Gbps up-links and 252 user I/Os route Camera Link LVDS/TTL pairs into the FPGA fabric. The 3.5 Mbit block memory buffers lines and tiles, while the PCIe Gen2 x4 hard IP bridges to the host PC with sub-microsecond latency. Industrial -40C to +100C range handles factory-floor enclosures.
Recommended
PCIe Gen2 Endpoint Accelerator Card
The EP2AGX45DF25I5 is well suited for PCIe Gen2 x4/x8 endpoint cards because the hard PCIe IP block offloads the protocol layer, freeing the fabric for DSP, encryption, or compression algorithms. With 8 transceivers the same card can add SRIO or XAUI expansion ports for backplane integration. Industrial temperature rating lets the same design qualify for both data-center and industrial control applications.
Recommended
Military Radar and SIGINT Signal Processing
The EP2AGX45DF25I5 handles radar IF sampling and SIGINT digital down-conversion because 8 transceivers capture ADC-sampled IF at up to 6.375 Gbps, the embedded DSP blocks implement FIR pulse compression, and the 3.5 Mbit memory tiles as FFT line delay buffers. Industrial temperature range and the rugged FCBGA package meet MIL-STD-810 vibration/shock requirements. For applications needing direct-RF front-ends, a Cyclone V GT or Arria V GT successor is recommended.
Recommended
Industrial Ethernet Switch Fabric
The EP2AGX45DF25I5 implements low-latency managed industrial Ethernet switches because its 8 transceivers support multiple GbE uplinks and the fabric runs cut-through switching with PTP hardware timestamping. With 252 user I/Os, the device can front-end PHYs, drive LEDs, and host an embedded ARM or Nios II control plane. The industrial temperature grade suits substation and rail signalling applications requiring IEC 61850 or EN 50155 compliance.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX45DF25I5 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX45DF25I3N | EP2AGX45DF25I3G | EP2AGX45DF25C6N | EP2AGX45DF25C6G | EP2AGX45DF25C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 572-ball FCBGA (25x25 mm) - F25 | 572-ball FCBGA (25x25 mm) - F25 - same | 572-ball FCBGA (25x25 mm) - F25 - same | 572-ball FCBGA (25x25 mm) - F25 - same | 572-ball FCBGA (25x25 mm) - F25 - same | 572-ball FCBGA (25x25 mm) - F25 - same |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 5 (mid) | 3 (slowest) | 3 (slowest) | 6 (fastest) | 6 (fastest) | 5 (matched) |
| Logic Elements | 42959 | 42959 - identical | 42959 - identical | 42959 - identical | 42959 - identical | 42959 - identical |
| Embedded Memory (bits) | 3517440 | 3517440 - identical | 3517440 - identical | 3517440 - identical | 3517440 - identical | 3517440 - identical |
| Transceiver Channels | 8 | 8 - identical | 8 - identical | 8 - identical | 8 - identical | 8 - identical |
| Lead-Free / RoHS Finish | Yes (I5 suffix historically Pb-free) | Pb-bearing (N suffix) | Yes (G suffix) | Pb-bearing (N suffix) | Yes (G suffix) | Pb-bearing (N suffix) |
| Lifecycle Status (2026-09-08) | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Industrial temperature speed grade 5 in the F25 package - balanced speed/thermal performance (vs EP2AGX45DF25I3N)
- Pb-free / RoHS-compliant industrial F25 device - matches modern environmental requirements (vs EP2AGX45DF25C6N)
- Same footprint as C-grade variants for last-time-buy inventory flexibility (vs EP2AGX45DF25F27 variants (672-pin FCBGA))
Design Notes
The 572-ball FCBGA requires a high-density PCB stack-up with microvia (HDI) construction. Use 1 oz copper on outer layers and 0.5 oz on inner layers with a 0.1 mm pitch BGA land pattern. Maintain 100 ohm differential impedance on all transceiver pairs and 50 ohm SE on LVCMOS. Recommend 8-layer stack-up (4 signal + 4 plane) for 6 Gbps signal integrity, with the EP2AGX45DF25I5 transceiver balls routed on the top layer only.
Per the Arria II GX Device Handbook, the EP2AGX45DF25I5 requires a 0.9 V core supply with a tolerance of +/-30 mV and a maximum transient of +/-50 mV during power-up. Power-on sequencing must satisfy VCC_CORE before VCCPD before VCCIO; a POR delay of 10 ms is required. Use a dedicated 5 V to 0.9 V step-down regulator (e.g., EN5339QI) with output inductance below 1 uH and bulk decoupling of 4x220 uF plus 22x100 nF ceramic directly under the BGA.
Transceiver reference clocks must use an ultra-low-jitter oscillator such as a Crystek CVHD-950 or Silicon Labs Si570 with <1 ps RMS phase jitter (12 kHz to 20 MHz). Route reference clocks with 100 ohm differential impedance, length-matched within 5 mils. Each transceiver channel requires external AC-coupling capacitors (typically 100 nF X7R 0402) as close to the transmit differential pair as possible.
Do not confuse the F25 (572-FCBGA 25x25 mm) package with the F35 (358-FBGA) or F27 (672-FCBGA) packages - only F25 variants share the pinout and ball map of the EP2AGX45DF25I5. Quartus II software generates the pin-out file (QSF) per package - swapping packages requires PCB rework. Always regenerate the Quartus II fitter seed and rerun timing analysis when substituting across temperature or speed grades.
Compliance Information
RoHS and REACH compliance per Intel/Altera product declaration; F25 FCBGA package is lead-free ball finish (SAC405). AEC-Q100 not applicable - FPGAs are not automotive-qualified in the same manner as ASSPs; for AEC-Q100 functional safety use the Cyclone 10 GX or Altera Cyclone IV/IV GX automotive-grade parts.
