EP2AGX65DF25I5G - Arria II GX FPGA 60K LE 572-FCBGA | Intel
MPN: EP2AGX65DF25I5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462 | $4,620.00 |
| 100 | $432 | $43,200.00 |
| 500 | $405 | $202,500.00 |
| 1,000 | $378 | $378,000.00 |
EP2AGX65DF25I5G Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/ALMs), programmable routing, I/O cells, and dedicated hard IP such as transceivers, PLLs, and block RAM. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and, unlike ASICs, allow designers to implement and re-implement arbitrary digital circuits post-production using hardware description languages. The Arria II GX family was architected specifically for cost-sensitive, transceiver-heavy applications such as video bridging, wireless baseband preprocessing, and broadcast infrastructure.
Key features of the EP2AGX65DF25I5G include up to 8 full-duplex 3.75 Gbps transceivers with embedded PCIe Gen1 hard IP, hard memory controllers supporting DDR3 up to 800 MHz, and 4 PLLs for clock management. The I5 speed grade balances timing margin and power, while the industrial temperature rating (-40 C to +100 C) supports deployment in harsh environments. The 572-ball FC-FBGA package uses flip-chip BGA technology to provide the high I/O density and signal integrity required by the integrated transceivers.
The architecture combines a programmable logic fabric with hard IP blocks for transceivers, memory controllers, and DSP multipliers, allowing designers to balance flexibility and deterministic performance. The 40 nm low-power process reduces static and dynamic power compared with prior 65 nm and 90 nm Arria/Stratix families, while embedded transceiver CDR and pre-emphasis circuitry simplify board-level design for multi-gigabit links.
Typical applications include video broadcast and professional AV equipment, wireless backhaul and baseband preprocessing, PCIe Gen1 endpoint and root-complex cards, telecom line cards with CPRI/OBSAI fronthaul, and industrial imaging and machine vision. Designers also deploy Arria II GX in test & measurement front-ends and radar signal preprocessing where deterministic latency and on-chip transceiver count matter most.
When selecting this device, consider that the I5 speed grade is one tier below the fastest I6 in the family. Designs that need more margin at 3.75 Gbps or operation in extended industrial ambient should benchmark against the I3 or I5 alternatives in the same family. Always review Quartus II timing closure reports and the transceiver Signal Integrity Development Kit (SIDK) guidelines before tape-out.
This page synthesizes distributor inventory, parametric comparison, and practical design guidance that goes beyond the Arria II GX device handbook, helping engineers and sourcing teams evaluate the EP2AGX65DF25I5G in real-world applications.
Drop-in alternatives for EP2AGX65DF25I5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF25I5G (same form factor and footprint) — differing in Package, Speed Grade, Transceivers, RoHS Status, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX65DF25I5N
✅ Drop-In✓ In Stock
$192 / Unit
View Datasheet →EP2AGX65DF25C5G
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Contact for price
View Datasheet →EP2AGX65DF25I3G
✅ Drop-In✓ In Stock
$920 / Unit
View Datasheet →EP2AGX65DF25C6G
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$184.6758 / Unit
View Datasheet →EP2AGX65DF25C4G
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$149.5 / Unit
View Datasheet →EP2AGX65DF25I5G Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements (LE) | 60,214 |
| Adaptive Logic Modules (ALMs) | 2,530 |
| Total RAM Bits | 5,371,904 |
| User I/O Count | 252 |
| Number of Transceivers | 8 (up to 3.75 Gbps) |
| Embedded Multipliers (18x18) | 312 |
| PLLs | 4 |
| Core Voltage | 0.9 V (range 0.87 V to 0.93 V) |
| Process Technology | 40 nm |
| Speed Grade | I5 (industrial) |
| Operating Temperature | -40 C to +100 C (industrial) |
| Package | 572-ball FC-FBGA |
| Mounting Type | Surface Mount |
| Hard Memory Controller | DDR3 up to 800 MHz |
| RoHS Status | Compliant |
EP2AGX65DF25I5G 572-ball fc-fbga Pin Configuration Guide
Pin configuration for EP2AGX65DF25I5G (572-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65DF25I5G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65DF25I5G is suitable for 6 applications: Video Broadcast and Professional AV Equipment, Wireless Baseband and Backhaul Preprocessing, PCIe Gen1 Endpoint and Root-Complex Cards, Industrial Imaging and Machine Vision, Test & Measurement Front-End Signal Processing, Radar and Lidar Signal Preprocessing.
Video Broadcast and Professional AV Equipment
The EP2AGX65DF25I5G fits professional video and broadcast AV designs thanks to its 8 integrated 3.75 Gbps transceivers and 252 user I/O, which can drive multiple SDI/HDMI/DisplayPort links plus parallel video buses. The 60,214 logic elements and 312 18x18 multipliers handle on-the-fly color space conversion, scaling, and frame-rate conversion in real time. The industrial I5 speed grade supports extended operating temperatures required in outdoor broadcast and mobile production vehicles. DDR3 hard memory controllers up to 800 MHz buffer high-bandwidth video frames without external memory glue logic.
Recommended
Wireless Baseband and Backhaul Preprocessing
The EP2AGX65DF25I5G is well matched to wireless baseband preprocessing, CPRI/OBSAI fronthaul, and small-cell backhaul modems. The 8 transceivers at 3.75 Gbps carry CPRI links up to option 4 (2.4576 Gbps) with margin, while the 60,214 logic elements and 312 DSP multipliers implement FFT/iFFT, channelization, and digital predistortion (DPD) blocks. The 0.9 V core reduces power per channel, which is critical in dense base-station deployments. Industrial temperature rating allows deployment in outdoor or remote radio heads.
Recommended
PCIe Gen1 Endpoint and Root-Complex Cards
The EP2AGX65DF25I5G integrates PCIe Gen1 hard IP via its transceivers, enabling single-chip PCIe x1/x4 endpoint and root-complex designs for industrial, test, and embedded computing cards. The hard IP removes soft-logic PCIe PHY complexity and frees logic for application accelerators or DMA engines. With 5,371,904 bits of embedded RAM and DDR3 controllers, the device can stage large DMA buffers without external FIFOs. The 572-ball FC-FBGA package supports controlled-impedance PCIe lane routing to the edge connector.
Recommended
Industrial Imaging and Machine Vision
The EP2AGX65DF25I5G supports multi-camera machine vision and industrial imaging systems with on-chip DDR3 buffering and 252 I/O for parallel image sensor interfaces. Its 312 18x18 multipliers accelerate Bayer demosaicing, convolution, and edge-detection filters at line rate, while the 8 transceivers carry GigE Vision, CoaXPress, or Camera Link over fibre. The industrial -40 C to +100 C operating range allows deployment on factory floors, in vehicle inspection cells, and in outdoor traffic monitoring. The I5 speed grade balances timing margin and power for fanless industrial chassis.
Recommended
Test & Measurement Front-End Signal Processing
The EP2AGX65DF25I5G is widely used in oscilloscope, logic analyzer, and protocol analyzer front-ends where 8 high-speed transceivers feed DSP blocks for signal conditioning, decimation, and triggering. The 60,214 logic elements and 312 multipliers handle parallel FFT and correlation on multi-gigabit sample streams, while the DDR3 hard controllers manage deep acquisition memory. The 572-ball FC-FBGA delivers the signal integrity needed for the 3.75 Gbps links to ADCs and DACs. Industrial temperature rating is suitable for lab and field test gear.
Recommended
Radar and Lidar Signal Preprocessing
The EP2AGX65DF25I5G supports radar and lidar front-end preprocessing for surveillance, perimeter security, and ADAS prototypes. Its 8 transceivers ingest multi-channel IF or optical data, while 312 18x18 multipliers run pulse compression, MTI filtering, and FFT-based range-Doppler processing in real time. The 5,371,904 bits of on-chip RAM provide fast access to window tables and chirp templates, reducing external memory traffic. The -40 C to +100 C industrial rating and 0.9 V core enable compact, low-power sensor heads suitable for vehicle-mounted and outdoor deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF25I5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF25I5N | EP2AGX65DF25C5G | EP2AGX65DF25I3G | EP2AGX65DF25C6G | EP2AGX65DF25C4G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 572-ball FC-FBGA | 572-ball FC-FBGA | 572-ball FC-FBGA | 572-ball FC-FBGA | 572-ball FC-FBGA | 572-ball FC-FBGA |
| Logic Elements | 60,214 LE | 60,214 LE | 60,214 LE | 60,214 LE | 60,214 LE | 60,214 LE |
| User I/O | 252 | 252 | 252 | 252 | 252 | 252 |
| Speed Grade | I5 (industrial) | I5 (industrial) | C5 (commercial) | I3 (industrial, slower) | C6 (commercial, faster) | C4 (commercial, slower) |
| Operating Temperature | -40 C to +100 C | -40 C to +100 C | 0 C to +85 C | -40 C to +100 C | 0 C to +85 C | 0 C to +85 C |
| Transceivers | 8 x 3.75 Gbps | 8 x 3.75 Gbps | 8 x 3.75 Gbps | 8 x 3.75 Gbps | 8 x 3.75 Gbps | 8 x 3.75 Gbps |
| Core Voltage | 0.9 V (0.87-0.93 V) | 0.9 V (0.87-0.93 V) | 0.9 V (0.87-0.93 V) | 0.9 V (0.87-0.93 V) | 0.9 V (0.87-0.93 V) | 0.9 V (0.87-0.93 V) |
Key Differentiators
- Industrial I5 speed grade with -40 C to +100 C support (vs EP2AGX65DF25C5G)
- 8 integrated 3.75 Gbps transceivers with hard PCIe Gen1 IP (vs EP4CE30F23C8N)
- 60,214 logic elements with 312 18x18 multipliers and 5.4 Mbit embedded RAM (vs EP2AGX45DF25I5G)
Design Notes
The EP2AGX65DF25I5G requires at least three independent supply rails: a 0.9 V core (0.87-0.93 V), a 1.1 V PLL analog supply, and per-bank I/O supplies (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V) depending on bank configuration. Per the Arria II GX handbook, bulk decoupling must include 22 uF or larger tantalum/polymer caps at each regulator output and 0.1 uF + 1 nF ceramic caps within 100 mils of every VCC pin. Power-on sequencing should follow the order VCC_CORE then VCC_PLL then VCC_IO, or use a sequencer IC to avoid latch-up.
Transceiver channel traces on the EP2AGX65DF25I5G must be routed as 100 ohm differential pairs with intra-pair skew under 1 ps and length matching to within 5 mils across all 8 channels. Reference the Altera Transceiver Signal Integrity Development Kit (SIDK) layout stackup recommendations. Use a continuous ground reference plane under all transceiver channels, avoid routing signals over plane splits, and place AC-coupling caps within 200 mils of the transmitter output pads to comply with common-mode voltage requirements.
Although the 572-ball FC-FBGA package exposes a thermal pad, the EP2AGX65DF25I5G is typically cooled via forced airflow or a small heatsink attached to the lid. Estimated: at 100% logic utilization and 8 active transceivers at 3.75 Gbps, worst-case junction power reaches approximately 8 to 10 W. Mount the device on a minimum 6-layer PCB with a 2 oz copper inner ground/power plane to spread heat; derate ambient to 70 C or less in sealed enclosures to keep junction below 100 C.
Do not omit the dedicated VCCPD pins (3.3 V or 2.5 V) that power the configuration block - leaving them floating prevents successful configuration via AS, PS, or JTAG modes. For JTAG programming, the nCONFIG, nSTATUS, CONF_DONE, and DCLK pins must be pulled correctly per the Arria II GX configuration handbook. Also, unused transceiver channels must be powered down in software to save 200 to 400 mW per channel; do not leave them at their default-enabled state in production firmware.
Compliance Information
RoHS and lead-free per Arria II GX product page. AEC-Q100 is not applicable for FPGAs - this is a programmable logic device, not an automotive-grade IC in the AEC sense. Use the I5 industrial speed grade for harsh-environment applications.
