EP2AGX45DF29I5G - Arria II GX FPGA, 45K LE, 3.5Mbit | Intel
MPN: EP2AGX45DF29I5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $398.5 | $3,985.00 |
| 100 | $365 | $36,500.00 |
| 250 | $340 | $85,000.00 |
| 500 | $315 | $157,500.00 |
EP2AGX45DF29I5G Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement arbitrary digital logic functions, memory blocks, DSP arithmetic, and high-speed serial interfaces on a single silicon die. Within the programmable-logic taxonomy, FPGAs sit between fixed-function ASICs (which offer the highest density and lowest unit cost at scale but no post-tape-out flexibility) and CPLDs (which are simpler, non-volatile, and used for glue logic). The Arria II GX family specifically targets mid-bandwidth applications that need integrated transceivers without the cost or power of higher-end Stratix-class parts, placing it in the broader hierarchy of programmable-logic devices -> FPGAs -> mid-range FPGAs with transceivers.
Key features of the EP2AGX45DF29I5G include 45,000 LEs, 3,517,440 embedded memory bits, 42,959 logic elements per the simplified datasheet summary, and 364 maximum user I/Os. The device also embeds dedicated 18x18 multipliers for DSP workloads, PLLs for clock management, and multi-gigabit transceivers supporting common backplane and chip-to-chip protocols. The integrated transceivers eliminate external PHY ICs in many designs, simplifying board layout and BOM.
The architectural core uses a sea-of-LUTs fabric combined with embedded SRAM blocks, hardware DSP slices, and high-speed serial interface tiles. The transceiver tiles support data rates typical of the Arria II GX family for protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and common serial digital interface rates. The 780-ball FCBGA package provides the I/O density required to break out the 364 user I/Os while preserving signal integrity for the multi-gigabit links.
Typical applications include wireless baseband and radio card preprocessing, broadcast video bridging and processing, military and aerospace signal acquisition, and high-speed serial protocol bridging. The combination of mid-range logic density with integrated transceivers also suits imaging, medical imaging back-ends, and industrial test instrumentation where deterministic latency and high data throughput are required.
When designing with this part, allocate the LVDS and transceiver pairs to the package's dedicated banks before general-purpose I/O to preserve signal integrity and meet the multi-gigibt routing constraints. Use the Altera/Intel Quartus II design software (which supports the Arria II GX device family) for place-and-route, timing closure, and transceiver channel configuration; failure to meet transceiver reference-clock jitter budgets is a common cause of link-up failures in production.
This page synthesizes distributor availability, drop-in same-package alternatives from the Arria II GX family, and practical design notes that go beyond the manufacturer datasheet summary, giving engineers a faster path to part selection and qualification.
Drop-in alternatives for EP2AGX45DF29I5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX45DF29I5G (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Node, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX45DF29I5
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP2AGX45DF29I5N
✅ Drop-In✓ In Stock
$318 / Unit
View Datasheet →EP2AGX45DF29I3G
✅ Drop-In✓ In Stock
$690 / Unit
View Datasheet →EP2AGX45DF29I4N
✅ Drop-In✓ In Stock
$195.75 / Unit
View Datasheet →EP2AGX45DF29C6G
✅ Drop-In✓ In Stock
$121.75 / Unit
View Datasheet →EP2AGX45DF29I5G Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements (LE) | 45,000 |
| Embedded Memory Bits | 3,517,440 bits |
| Maximum User I/O | 364 |
| Package | 780-BBGA / FCBGA |
| Speed Grade | I5 (Industrial) |
| Operating Temperature | -40C to +100C (Industrial) |
| Core Supply Voltage (VCC) | 0.9 V nominal |
| Transceivers | Multi-gigabit transceivers integrated |
| DSP Blocks | Embedded 18x18 multipliers |
| PLLs | On-chip PLLs for clock management |
| Configuration Scheme | FPGA, programmable via SRAM |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP2AGX45DF29I5G 780-bbga / fcbga Pin Configuration Guide
Pin configuration for EP2AGX45DF29I5G (780-bbga / fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX45DF29I5G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX45DF29I5G is suitable for 6 applications: Wireless Baseband Preprocessing, Broadcast Video Bridging and Processing, Military and Aerospace Signal Acquisition, High-Speed Serial Protocol Bridging, Industrial Test and Measurement Instrumentation, Medical Imaging Back-End Processing.
Wireless Baseband Preprocessing
The EP2AGX45DF29I5G is well suited to wireless baseband preprocessing cards where the 45K LE fabric runs channel estimation, equalization, FFT/iFFT engines, and MAC-layer glue logic while the integrated multi-gigabit transceivers carry digitized IF or baseband samples to a host ASIC or DSP. The 3,517,440 bits of embedded memory provide line-rate buffering between the antenna framer and the host CPU/PCIe interface without external SRAM, which reduces BOM cost. Industrial speed grade and -40C to +100C operation support outdoor radio units and small-cell deployments. Designers should allocate at least two transceiver channels for CPRI or OBSAI links and budget reference-clock jitter per the Arria II GX transceiver handbook to meet the protocol's eVM mask.
Recommended
Broadcast Video Bridging and Processing
For broadcast video bridges and processing blades, the EP2AGX45DF29I5G implements SDI (SMPTE 259M/292M/424M) deserializers/serializers, genlocking cross-points, and downstream color-space conversion in the programmable fabric. The integrated transceivers handle 270 Mbps / 1.485 Gbps / 2.97 Gbps SDI rates natively without external cable equalizers, simplifying BOM and PCB routing. The 364 user I/Os are sufficient for multi-channel SDI I/O plus housekeeping GPIO. Industrial temperature grade supports outside-broadcast trucks and stadium installations. Use the Quartus II ALTLVDS and transceiver mega-functions to meet SDI jitter masks and lock the genlock PLL to a black-burst reference.
Recommended
Military and Aerospace Signal Acquisition
The EP2AGX45DF29I5G with its I5 industrial speed grade and -40C to +100C operating range suits ruggedized signal-acquisition subsystems in defense and avionics platforms. The 45K LE fabric is large enough to host a full radar preprocessor, electronic-warfare channelizer, or MIL-STD-1553 / ARINC 429 bridge alongside the integrated transceivers that pump digitized RF to a backplane. The 780-ball FCBGA supports the dense break-out required for multiple LVDS ADC/DAC channels. Designers should derate transceiver data rates for the avionics thermal envelope and follow the Arria II GX military temperature derating guidelines in the device handbook. Conformal coating and underfill are recommended for high-vibration environments.
Recommended
High-Speed Serial Protocol Bridging
The EP2AGX45DF29I5G is widely used as a protocol bridge converting between PCIe, Serial RapidIO, Gigabit Ethernet, Aurora, and proprietary backplane links. Its hard multi-gigabit transceivers implementing PCIe Gen1/Gen2 and SRIO eliminate the external PHY that would otherwise be needed, shrinking board area and BOM cost. The 364 I/Os are adequate for 8 lanes of PCIe plus four SRIO lanes plus a 1 GbE management port. The 3.5Mbit of embedded memory buffers packets during rate adaptation. Designers should use the Quartus II hard IP cores (PCIe, SRIO, GBE) to minimize logic utilization and accelerate timing closure at the Gen2 data rate.
Recommended
Industrial Test and Measurement Instrumentation
In modular test instruments such as PXI/PXIe cards, protocol analyzers, and ATE load boards, the EP2AGX45DF29I5G provides the logic capacity and transceiver bandwidth to capture, time-stamp, and pre-process high-speed serial traffic before forwarding to the host CPU. Industrial temperature grade is appropriate for chassis ambient up to +55C with adequate airflow. The integrated transceivers enable direct connection to SATA, USB 3.0 (PIPE), DisplayPort 1.1, or 10 GbE XFI test points without an external retimer. Designers should use the device's JTAG and SignalTap logic analyzer features during bring-up to debug transceiver link-up issues without removing the FPGA from the test slot.
Recommended
Medical Imaging Back-End Processing
Ultrasound, endoscopy, and digital X-ray imaging systems use the EP2AGX45DF29I5G to interface high-channel-count LVDS ADC arrays and to run real-time beamforming, FIR filtering, and image reconstruction in the programmable fabric. The 364 user I/Os comfortably break out 64-128 LVDS pairs from the front-end ADCs, and the 3.5Mbit of embedded memory buffers scanline data between the front-end and the DSP/host. Multi-gigabit transceivers feed the reconstructed image to the host display processor via PCIe or a proprietary link. Industrial temperature grade supports operating-room carts and portable ultrasound units. Designers should leverage the device's hardware DSP blocks for beamforming to free the LE fabric for control and image-processing tasks.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX45DF29I5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX45DF29I5 | EP2AGX45DF29I5N | EP2AGX45DF29I3G | EP2AGX45DF29I4N | EP2AGX45DF29C6G |
|---|---|---|---|---|---|---|
| Package | 780-BBGA / FCBGA | 780-BBGA / FCBGA (same) | 780-BBGA / FCBGA (same) | 780-BBGA / FCBGA (same) | 780-BBGA / FCBGA (same) | 780-BBGA / FCBGA (same) |
| Brand | Intel | Intel (same) | Intel (same) | Intel (same) | Intel (same) | Intel (same) |
| Family | Arria II GX | Arria II GX | Arria II GX | Arria II GX | Arria II GX | Arria II GX |
| Logic Elements | 45,000 | 45,000 | 45,000 | 45,000 | 45,000 | 45,000 |
| Embedded Memory | 3,517,440 bits | 3,517,440 bits | 3,517,440 bits | 3,517,440 bits | 3,517,440 bits | 3,517,440 bits |
| Maximum User I/O | 364 | 364 | 364 | 364 | 364 | 364 |
| Speed Grade | I5 (Industrial) | I5 (Industrial) | I5 (Industrial) | I3 (Industrial, slower) | I4 (Industrial) | C6 (Commercial, fastest) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Lead-Free / RoHS | Yes (G suffix) | No (SnPb finish) | Yes (N suffix) | Yes (G suffix) | Yes (N suffix) | Yes (G suffix) |
| Transceivers | Multi-gigabit integrated | Multi-gigabit integrated | Multi-gigabit integrated | Multi-gigabit integrated | Multi-gigabit integrated | Multi-gigabit integrated |
Key Differentiators
- Mid-density 45K LE fabric with integrated multi-gigabit transceivers (vs Cyclone IV GX family (EP4CGX30/50/75/110))
- 780-ball FCBGA with 364 user I/Os (vs EP2AGX45DF25 series (25x25 mm 484-ball FCBGA))
- 3,517,440 bits of embedded memory (vs EP2AGX20DF29 (smaller family member))
Design Notes
The 780-ball FCBGA package is a high-thermal-mass surface-mount BGA. At full logic utilization with multiple active transceiver lanes, junction temperature can rise rapidly without adequate PCB copper. Per the Arria II GX device handbook, follow the recommended land pattern with at least eight thermal vias in a 4x4 grid under the die-flag pad to conduct heat to internal copper planes. For applications exceeding approximately 50% transceiver lane utilization at Gen2 data rates, a heatsink or forced-air cooling is recommended to keep Tj below +100C for industrial-grade parts.
Implement the 780-ball FCBGA land pattern with NSMD (non-solder-mask-defined) pads and a 0.5 mm or 0.8 mm pitch according to the package variant. Use a 4-6 layer stackup with continuous GND planes on layers 2 and (N-1) below the BGA, and route high-speed transceiver channels on the top layer with matched differential-pair length tuning. The transceiver reference clock traces must be isolated from noisy digital signals and length-matched to within the jitter tolerance specified in the Arria II GX transceiver user guide; violation of this is the most common cause of link-up failure in production.
Do not mix I5 and I3 speed grades within a single multi-FPGA board without re-running Quartus II timing analysis per part - timing models differ and inter-FPGA paths may close at I5 but fail at I3. Always configure the FPGA's configuration mode (AS, PS, JTAG, or FPP) via MSEL pins correctly for the chosen configuration device; a wrong MSEL setting leaves the FPGA unconfigured with no visible error. When migrating between EP2AGX45 variants (e.g., I5 to I3), verify that the Quartus II project settings are updated to match the new device ordering code and re-run fitter and timing analysis.
Compliance Information
RoHS compliance inferred from 'G' suffix per Intel/Altera ordering code convention. AEC-Q100 not applicable - Arria II GX is commercial/industrial grade. Halogen-free status not confirmed in the verified web data.
