EP2AGX45DF29C6G - Arria II GX FPGA, 45K LE, 780-FBGA | Intel
MPN: EP2AGX45DF29C6G β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $168.08 | $168.08 |
| 10 | $155.42 | $1,554.20 |
| 100 | $142.15 | $14,215.00 |
| 500 | $130.5 | $65,250.00 |
| 1,000 | $121.75 | $121,750.00 |
EP2AGX45DF29C6G Overview
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital logic through a configuration bitstream loaded into on-chip SRAM. Within the broader semiconductor hierarchy, FPGAs sit alongside ASICs, microcontrollers, and DSPs as the primary platforms for custom digital hardware. The Arria II GX series targets mid-range applications requiring transceivers, DSP blocks, and substantial on-chip memory, bridging the gap between Cyclone (low-cost) and Stratix (high-performance) families in the Intel FPGA portfolio.
Key features of the EP2AGX45DF29C6G include 45,000 logic elements, 3,517,440 embedded memory bits, 312 (18x18) multipliers for DSP operations, and integrated PCIe hard IP blocks. The 780-FBGA package measures 29x29 mm with 1.0 mm ball pitch, providing high-density I/O access suitable for high-speed parallel interfaces and memory expansion. Up to 8 transceiver channels supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, and CPRI are integrated on-die, reducing external PHY bill-of-materials.
The Arria II GX architecture combines a programmable logic fabric with hard intellectual property (IP) blocks for transceivers, PCIe, and external memory controllers. This hard-IP approach reduces power and silicon area compared with soft implementations. The 40nm process node balances static and dynamic power consumption while delivering mid-range performance.
Typical applications for this device include wireless baseband processing, broadcast video infrastructure, industrial imaging, and PCIe-based add-in cards. The transceiver capability also makes it attractive for software-defined radio and test & measurement equipment where multiple high-speed serial lanes are required.
When designing with this FPGA, ensure proper power-rail sequencing for the core (VCC, VCCP), I/O banks (VCCIO), and transceiver (VCCH) supplies. The transceiver reference clock jitter must meet the data-rate dependent requirements documented in the device handbook; an external jitter-cleaner PLL is often required for backplane applications.
This page synthesizes distributor pricing, drop-in alternatives, and practical design considerations for the EP2AGX45DF29C6G not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2AGX45DF29C6G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX45DF29C6G (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Process Node, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX45DF29C5N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$510 / Unit
View Datasheet βEP2AGX45DF29C5G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$335 / Unit
View Datasheet βEP2AGX45DF29C4N
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$335.45 / Unit
View Datasheet βEP2AGX45DF29C4G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$430 / Unit
View Datasheet βEP2AGX45DF29C3N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$178 / Unit
View Datasheet βEP2AGX45DF29C6G Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Family | Intel FPGA (formerly Altera) |
| Logic Elements (LE) | 45,000 |
| Embedded Memory Bits | 3,517,440 |
| User I/O Count | 364 |
| DSP 18x18 Multipliers | 312 |
| Transceiver Channels | 8 (up to 6.375 Gbps) |
| Package | 780-FBGA (29x29 mm, 1.0 mm pitch) |
| Speed Grade | C6 (commercial, mid-speed) |
| Process Node | 40 nm TSMC low-power |
| Operating Temperature | 0C to +85C (commercial) |
| Hard IP Blocks | PCIe Gen1/Gen2, External Memory Controller |
| Configuration | SRAM-based, volatile |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
EP2AGX45DF29C6G 780-fbga (29x29 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP2AGX45DF29C6G (780-fbga (29x29 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX45DF29C6G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX45DF29C6G is suitable for 6 applications: Wireless Baseband Processing, PCIe Add-In Cards, Broadcast Video Infrastructure, Industrial Imaging and Machine Vision, Software-Defined Radio Platforms, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX45DF29C6G fits wireless baseband processing because its 312 DSP 18x18 multipliers deliver the throughput needed for FFT, channelization, and digital down-conversion stages in LTE and WiMAX base stations. With 45K logic elements the device can host baseband firmware alongside CPRI or OBSAI fronthaul links via the 6.375 Gbps transceivers, eliminating an external PHY. The 780-FBGA package exposes 364 user I/Os to parallel ADC/DAC interfaces while keeping the PCB footprint manageable. Compared with a pure DSP processor, this FPGA provides deterministic latency on each CPRI antenna-carrier path, which is critical for coordinated multi-point (CoMP) operation. Designers should budget approximately 15-20% of logic for CPRI fronthaul framing and the remainder for PHY-layer baseband. Power estimation is approximately 6-8W with typical base-station duty cycles and a few active transceiver channels.
Recommended
PCIe Add-In Cards
The integrated PCIe Gen1/Gen2 hard IP block in the EP2AGX45DF29C6G makes it ideal for PCIe x4 or x8 add-in cards that require low-latency DMA engines. The hard IP removes the logic overhead of a soft PCIe core, freeing approximately 5-10K logic elements for the user application. With 8 transceivers at 6.375 Gbps, the device can simultaneously support a PCIe x4 link plus two SATA or 10GbE SFP+ channels, enabling combo cards. The 780-FBGA package supports the I/O voltage banks needed for legacy 5V-tolerant logic interfacing. Designers should reserve a dedicated transceiver channel for the PCIe refclk to meet jitter specifications. Estimated device power is 5-7W at typical PCIe workloads, well within the 25W PCIe slot power budget before external cooling is required.
Recommended
Broadcast Video Infrastructure
The EP2AGX45DF29C6G is well suited for broadcast video routers, multiviewers, and SDI-over-IP gateways because its transceiver channels natively support SDI, 3G-SDI, and emerging SMPTE 2022/2059 IP video standards at rates up to 6.375 Gbps. The 3.5 Mbit of embedded memory supports line/frame buffers for video processing pipelines without external SDRAM. The 312 DSP multipliers accelerate chroma/luma filtering, scaling, and overlay operations in real time at 1080p60 and 4K rates. The 780-FBGA footprint also provides sufficient LVDS pairs for parallel digital video interfaces (DVI/HDMI bridging). For 4K workflows, designers typically need two cascaded FPGAs or migrate to the 125K-LE variant. Estimated power consumption is 7-9W with all eight transceivers active.
Recommended
Industrial Imaging and Machine Vision
The EP2AGX45DF29C6G handles multi-channel Camera Link, CoaXPress, or GigE Vision aggregation in industrial imaging systems where deterministic frame capture is essential. Its 8 transceivers support up to 8 CoaXPress links at 6.25 Gbps, aggregating 40 Gbps of imaging bandwidth into on-chip processing pipelines. The 312 DSP blocks accelerate real-time image preprocessing (gamma correction, Bayer demosaicing, edge detection) before data is forwarded to a host processor via PCIe. With 364 user I/Os, designers can interface directly to multiple LVDS or SLVS image sensors without external bridge chips. The C6 commercial temperature range suits factory-floor enclosures; for outdoor installations the -I (industrial) variant is preferred. Estimated power dissipation is 6-8W with full transceiver utilization and active DSP pipelines.
Recommended
Software-Defined Radio Platforms
The EP2AGX45DF29C6G suits SDR platforms where multiple RF channels must be digitized and processed simultaneously. Its 8 transceivers handle digital IF sampling at rates up to 6.375 Gbps from multiple ADC chains, while the 312 DSP 18x18 multipliers execute DDC/DUC and channelization filters. The 45K logic elements host waveform-specific firmware (LTE, GSM, custom protocols) that can be reloaded dynamically thanks to the SRAM-based configuration fabric. The 3.5 Mbit embedded memory holds channel state information and symbol-rate buffers without external SDRAM access, reducing latency. The C6 speed grade provides Fmax headroom for the most demanding DSP chains at higher symbol rates. Estimated power is 7-10W depending on transceiver utilization and DSP duty cycle.
Recommended
Test and Measurement Instrumentation
The EP2AGX45DF29C6G is well matched to high-speed oscilloscopes, logic analyzers, and protocol analyzers where multiple high-speed serial lanes must be tapped, buffered, and forwarded to a host. The 8 transceivers support PCIe Gen2 plus protocol-specific links (USB 3.0, SATA, 10GbE) for tap-and-forward probes. The 364 user I/Os provide parallel bus access to legacy probe pods, while the 3.5 Mbit embedded memory acts as a high-speed sample buffer. The C6 speed grade ensures tight timing closure for the trigger and timestamp logic critical to T&M applications. Compared to ASIC implementations, the FPGA enables firmware upgrades for new protocol standards without respin. Estimated power is 5-8W depending on active channel count and memory utilization.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX45DF29C6G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX45DF29C5N | EP2AGX45DF29C5G | EP2AGX45DF29C4N | EP2AGX45DF29C4G | EP2AGX45DF29C3N |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 45,000 | 45,000 - same | 45,000 - same | 45,000 - same | 45,000 - same | 45,000 - same |
| Speed Grade | C6 (fastest) | C5 (-15% Fmax) | C5 (-15% Fmax) | C4 (-20% Fmax) | C4 (-20% Fmax) | C3 (-25% Fmax) |
| Transceiver Channels | 8 x 6.375 Gbps | 8 x 6.375 Gbps - same | 8 x 6.375 Gbps - same | 8 x 6.375 Gbps - same | 8 x 6.375 Gbps - same | 8 x 6.375 Gbps - same |
| Embedded Memory (bits) | 3,517,440 | 3,517,440 - same | 3,517,440 - same | 3,517,440 - same | 3,517,440 - same | 3,517,440 - same |
| DSP 18x18 Multipliers | 312 | 312 - same | 312 - same | 312 - same | 312 - same | 312 - same |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C - same | 0C to +85C - same | 0C to +85C - same | 0C to +85C - same | 0C to +85C - same |
| Lifecycle Status | NRND | NRND - same family | NRND - same family | NRND - same family | NRND - same family | NRND - same family |
Key Differentiators
- Highest speed grade in the EP2AGX45 family (vs EP2AGX45DF29C5N)
- Industrial-temperature family variant available (vs EP2AGX45DF25I5G)
- Higher density in the same FBGA footprint family (vs EP2AGX125EF29I5G)
Design Notes
The EP2AGX45DF29C6G requires five or more power rails: VCC (core), VCCP (PLL analog), VCCIO (I/O banks, 1.2-3.3V), VCCH (transceiver), and VCCA (transceiver analog). Power-on sequencing mandates VCCH and VCCA come up before or simultaneously with VCC to prevent latchup; consult the Arria II GX Handbook pin connection guidelines for the recommended sequence. Estimated quiescent power at typical 8-channel active utilization is 6-9W; full-device worst case with all transceivers active can reach 12-15W. Use a dedicated ferrite bead on each analog supply to isolate it from digital switching noise.
Estimated: with 8W dissipation in the 780-FBGA package (theta_JA approximately 14 C/W on a 4-layer JEDEC test board), the junction temperature rise above ambient is approximately 112C, putting the device at 137C at 25C ambient. This is below the 125C commercial max only if active cooling is added or if transceiver utilization is moderated. A thermal pad must be soldered to a copper heat-spreader plane with thermal vias; without it junction temperature will exceed limits at full load.
Route the 8 transceiver channels with controlled-impedance differential pairs (typically 100 ohm differential) and keep length matching within 150 micrometers intra-pair and 1.5 mm inter-pair for 6.375 Gbps operation. Transceiver reference clock jitter must be below 1 ps RMS for 6.375 Gbps data rates - use a dedicated low-jitter PLL rather than the FPGA's internal PLL. Decoupling requires 100nF X7R capacitors within 2mm of every power pin plus bulk 10uF X5R capacitors per power plane. Ground vias must be stitched around the BGA perimeter at 1mm pitch.
Compliance Information
RoHS compliant per Intel product page. Halogen-free and conflict-minerals declarations not found in the provided verified web data - set to 'unknown'. The Arria II GX family is not AEC-Q100 qualified; choose automotive-grade parts from other Intel families for vehicle applications.
