EP2C20F256C8 - Cyclone II FPGA, 18,752 LE, 256-FBGA | Intel
MPN: EP2C20F256C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.25 | $382.50 |
| 100 | $33.1 | $3,310.00 |
| 500 | $28.95 | $14,475.00 |
| 1,000 | $24.8 | $24,800.00 |
EP2C20F256C8 Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that uses configurable logic blocks (CLBs), programmable interconnect, and I/O cells to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and discrete logic, and below ASICs in terms of per-unit cost vs. flexibility. Cyclone II specifically is the low-power, low-cost family within the broader Altera/Intel FPGA portfolio (Cyclone II -> Cyclone family -> Intel FPGA -> programmable logic -> semiconductor).
Key features include 4 phase-locked loops (PLLs) for clock management, dedicated 18x18 multipliers, and on-chip memory blocks of M4K type (4,608 bits per block, 52 blocks total). The device supports LVDS, LVTTL, LVCMOS, PCI, and SSTL I/O standards, making it compatible with virtually any digital interface. Dual-purpose configuration pins allow JTAG-based in-system programming via the standard Active Serial (AS) or Joint Test Action Group (JTAG) modes using the Quartus II design software.
Cyclone II FPGAs use a 4-input look-up table (LUT) architecture with embedded SRAM configuration cells. The silicon is fabricated in a 90 nm process, providing a balance between logic density, static power, and dynamic performance. The 'C8' speed grade corresponds to a -8 internal commercial speed rating with a maximum internal clock frequency around 402.5 MHz per the device family.
Typical applications include digital video processing, industrial motor control, automotive infotainment prototypes, custom peripheral expansion, and glue-logic replacement. The 256-FBGA package with 1.0 mm ball pitch is suitable for reflow-solder assembly on standard 4-layer PCBs.
When designing with this part, ensure that all configuration mode pins are correctly terminated and that the JTAG chain respects the TCK-to-TDI propagation delay budget. Use Quartus II (legacy) or Quartus Prime Lite Edition for synthesis, place-and-route, and bitstream generation.
This page synthesizes verified distributor data, parametric drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for EP2C20F256C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C20F256C8 (same form factor and footprint) — differing in Process Technology, Package, Speed Grade, Total RAM Bits, Embedded Multipliers (18x18).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C20F256C7N
✅ Drop-In✓ In Stock
$38.5 / Unit
View Datasheet →EP2C20F256C7
✅ Drop-In✓ In Stock
$55.28 / Unit
View Datasheet →EP2C20F256C6N
✅ Drop-In✓ In Stock
$41.5 / Unit
View Datasheet →EP2C20F256I8N
✅ Drop-In✓ In Stock
$43.5 / Unit
View Datasheet →EP2C20F256C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$20.85 / Unit
View Datasheet →EP2C20F256C8 Maximum Ratings & Electrical Characteristics
| Series | Cyclone II |
| Family | FPGA (Field-Programmable Gate Array) |
| Logic Elements | 18,752 |
| Configurable Logic Blocks (CLBs) | 1,172 |
| Total RAM Bits | 239,616 |
| M4K Memory Blocks | 52 |
| Embedded Multipliers (18x18) | 26 |
| Phase-Locked Loops (PLLs) | 4 |
| Maximum User I/O | 142 |
| Maximum Internal Clock Frequency | 402.5 MHz |
| I/O Voltage Standards | LVDS, LVTTL, LVCMOS, PCI, SSTL |
| Process Technology | 90 nm CMOS (low-k dielectric) |
| Package | 256-FBGA (FineLine BGA), 1.0 mm ball pitch |
| Operating Temperature (Commercial) | 0C to +85C |
| Speed Grade | C8 (-8 commercial) |
| Mounting Type | Surface Mount (BGA) |
| Configuration Mode | Active Serial (AS), JTAG |
| Design Software | Quartus II / Quartus Prime Lite |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP2C20F256C8 256-fbga (fineline bga), 1.0 mm ball pitch Pin Configuration Guide
Pin configuration for EP2C20F256C8 (256-fbga (fineline bga), 1.0 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C20F256C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C20F256C8 is suitable for 7 applications: Industrial Motor Control, Digital Video Processing Pipeline, Custom Peripheral / Glue Logic Bridge, Communications / Telecom Front-End, Automotive Infotainment Prototyping, Test & Measurement Instrumentation, LED Display & Lighting Control.
Industrial Motor Control
The EP2C20F256C8 suits industrial motor-control applications where multiple control loops must execute in parallel. Its 26 dedicated 18x18 multipliers and 4 PLLs handle field-oriented control (FOC) math and PWM generation for three-phase inverters simultaneously. The 402.5 MHz internal clock, combined with 18,752 logic elements, supports encoder feedback decoding, PID loops, and Sigma-Delta filter interfaces in a single chip. With up to 142 user I/O, the FPGA can directly connect to Hall sensors, quadrature encoders, gate drivers, and isolated communication peripherals like CAN or RS-485 transceivers. The C8 commercial temperature range (0C to +85C) is acceptable for IP54 control cabinets, while the EP2C20F256I8N industrial option covers harsher factory environments. Compared to a microcontroller + DSP dual-chip solution, the Cyclone II consolidates control and communication logic into one programmable device, reducing BOM cost and improving determinism in safety-critical loops.
Recommended
Digital Video Processing Pipeline
The EP2C20F256C8 is widely deployed in cost-sensitive video processing designs where parallel pixel-domain operations outperform software. With 18,752 logic elements and 239 Kbits of embedded RAM, it can implement real-time deinterlacing, color-space conversion, and scaling pipelines for SD and low-resolution HD video streams. The 26 hardware multipliers accelerate FIR filter taps for sharpening and noise reduction. The 256-FBGA package provides the I/O density required for parallel digital video interfaces such as BT.656 or LVDS-based flat-panel links, while the 4 PLLs generate the multiple pixel clocks needed for capture, processing, and display domains. The Cyclone II family is mature and well-supported by the Quartus II design toolchain, with reference designs for video overlay and frame-rate conversion. Compared to ASSP video processors, this FPGA offers full algorithmic flexibility and field upgradability via JTAG.
Recommended
Custom Peripheral / Glue Logic Bridge
The EP2C20F256C8 excels as a programmable peripheral bridge when an off-the-shelf microcontroller lacks the right combination of interfaces. With 142 user I/O pins and support for LVDS, LVTTL, LVCMOS, PCI, and SSTL standards, the FPGA can translate between legacy parallel buses, custom sensor formats, and modern serial links in a single chip. The 4 PLLs clean up jittery external clocks and re-clock signals to downstream devices. 239 Kbits of RAM is sufficient for FIFO buffering between mismatched bus speeds, and the 26 multipliers enable inline CRC, hash, or scrambling functions. Designers commonly use Cyclone II to glue between an ARM processor and a custom ASIC, or to add missing I2C/SPI/UART channels to an FPGA SoC-less design. Drop-in compatibility with the EP2C20F256I8N variant allows the same glue logic to be deployed in industrial temperature environments without board redesign.
Recommended
Communications / Telecom Front-End
Telecommunications and networking equipment leverages the EP2C20F256C8 for low-latency protocol bridging and packet processing. The 18,752 LE provide the parallelism to inspect Ethernet frames, perform CRC checks, and route traffic across multiple PHYs in real time. Hardware multipliers accelerate AES, CRC-32, and HDLC operations used in legacy telecom standards. With 142 user I/O and LVDS support, the FPGA can directly interface with SGMII/SerDes companions or backplane transceivers. The 4 PLLs derive multiple reference clocks needed for TDM, E1/T1, and sync-E interfaces. The mature 90 nm Cyclone II architecture offers predictable timing closure, important for telecom applications with strict jitter budgets. Compared to a software-based routing solution on a CPU, the FPGA-based approach reduces per-packet latency from microseconds to tens of nanoseconds.
Recommended
Automotive Infotainment Prototyping
The EP2C20F256C8 is frequently used as a prototyping platform for automotive infotainment and ADAS prototype designs, where pre-production algorithm development requires full hardware flexibility. The 18,752 logic elements and 26 dedicated 18x18 multipliers accelerate lane-detection, surround-view stitching, and image preprocessing algorithms before committing to an ASIC. 4 PLLs synthesize the pixel clocks needed for multi-camera capture. The 142 user I/O accommodate parallel camera input, automotive Ethernet PHYs, and MOST bus bridges. Designers appreciate that Quartus II provides automotive-qualified reference flows and IP cores for CAN, LIN, and FlexRay. Note: production automotive deployments require AEC-Q100 qualified parts, but for engineering prototypes and pre-silicon validation the C8 commercial variant is widely accepted. Drop-in compatibility with industrial variants simplifies qualification test.
Recommended
Test & Measurement Instrumentation
Test and measurement equipment such as logic analyzers, protocol exercisers, and stimulus generators use the EP2C20F256C8 to combine pattern generation, capture, and protocol decoding in a single reprogrammable device. The 18,752 logic elements implement trigger state machines and pattern-matching comparators. The 4 PLLs synthesize the multiple clock domains needed for source-synchronous interfaces like DDR, LVDS, and parallel ADCs. Hardware multipliers accelerate inline DSP operations such as FFT or FIR filtering for signal integrity measurements. The 256-FBGA package with 1.0 mm ball pitch allows placement on standard 4-layer test-instrument PCBs using conventional reflow profiles. Compared to fixed-function ASIC-based T&M gear, an FPGA-based instrument is firmware-upgradable for new protocols and standards.
Recommended
LED Display & Lighting Control
Large-format LED video walls, architectural lighting, and pixel-accurate RGB lighting fixtures use the EP2C20F256C8 as a high-channel-count PWM controller and refresh engine. The 18,752 logic elements and 4 PLLs drive hundreds of PWM channels with precise gamma-corrected color depth, supporting bit-depth modulation up to 16-bit per channel. The 26 hardware multipliers accelerate color-temperature and HDR tone-mapping algorithms on a per-frame basis. 142 user I/O pins allow direct connection to multiple LED driver chains via LVDS or LVCMOS, eliminating intermediate buffer ASICs. The 256-FBGA package with 1.0 mm pitch is straightforward to integrate on a 4-layer backplane PCB. Compared to discrete microcontroller arrays, the FPGA consolidates the entire video pipeline into one part, simplifying the BOM and reducing manufacturing test time.
Recommended
Recommended Products Summary
Engineering reference data for EP2C20F256C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C20F256C7N | EP2C20F256C7 | EP2C20F256C6N | EP2C20F256I8N | EP2C20F256C8N |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (1.0 mm pitch) | 256-FBGA (1.0 mm pitch) - same | 256-FBGA (1.0 mm pitch) - same | 256-FBGA (1.0 mm pitch) - same | 256-FBGA (1.0 mm pitch) - same | 256-FBGA (1.0 mm pitch) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C8 (-8) | C7 (-7, slower) | C7 (-7, slower) | C6 (-6, slowest) | I8 (-8, industrial temp) | C8 (-8, same) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Logic Elements | 18,752 | 18,752 | 18,752 | 18,752 | 18,752 | 18,752 |
| Total RAM Bits | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 |
| User I/O | 142 | 142 | 142 | 142 | 142 | 142 |
| Lifecycle | Active | Active | Active | Active | Active | Active |
Key Differentiators
- Faster speed grade for timing-critical logic (vs EP2C20F256C7N)
- Commercial vs. industrial temperature envelope (vs EP2C20F256I8N)
- Altera legacy suffix compatibility (vs EP2C20F256C7)
- 18,752 LE - mid-tier Cyclone II density (vs EP2C8F256C8)
Design Notes
Estimated: the 256-FBGA package has a theta_JA in the range of 15-20 C/W with a properly designed 4-layer PCB and thermal vias under the center ball array. Cyclone II FPGAs at full toggle activity (~100 MHz fabric clock, ~70% utilization) typically dissipate 0.5-1.5 W; ensure the PCB has a continuous inner ground plane and 0.5 mm thermal vias on a 1.2 mm pitch under the die shadow. For high-utilization industrial designs using the EP2C20F256I8N, monitor junction temperature via the on-chip temp-sense diode and reduce toggle activity if Tj exceeds 100C.
Route all 256 BGA balls on a 4-layer PCB with microvia-in-pad or 0.2 mm dogbone fanout if using standard via-in-pad process. Maintain a 0.2 mm clearance between adjacent BGA vias and signal traces. All VCCINT and VCCA power balls require their own 0.1 uF decoupling caps placed within 5 mm, plus bulk 10-47 uF tantalum or ceramic caps at each power-supply pin. Configuration mode pins (MSEL[3:0], nCONFIG, nSTATUS, CONF_DONE) must be pulled to valid logic levels per the Cyclone II Device Handbook, Chapter 4. JTAG pins (TCK, TMS, TDI, TDO) require 4.7 kohm pull-ups to VCCA.
Do not confuse the EP2C20F256C8 (commercial temp) with the EP2C20F256I8N (industrial temp) when ordering - they share an identical ball map but different operating temperature ratings. Ensure the configuration mode matches your EPCS or JTAG programmer; AS mode requires an external serial configuration flash such as EPCS4 or EPCS16. Do not leave unused I/O banks unpowered - either tie to VCCIO and configure as inputs with weak pull-ups, or drive to a defined state. Verify the Quartus II pinout assignment against the Cyclone II Package Information chapter; mismatched bank voltages will cause I/O contention. Finally, always revalidate timing closure when swapping between speed grades (C6/C7/C8/I8) - the static timing analyzer must re-fit with the new speed-grade model.
When using LVDS I/O standards on the EP2C20F256C8, match trace lengths within a bank to within 0.5 mm and maintain 100 ohm differential impedance. Place series-stuffing resistors within 3 mm of the FPGA pin when driving long backplane traces. For DDR-style source-synchronous interfaces, use the PLL's phase-shift capability to deskew the clock-to-data relationship; the Quartus II TimeQuest timing analyzer will report the achieved margin. Keep high-speed SERDES-like signals on inner stripline layers, and avoid routing LVDS signals across power-plane splits.
Compliance Information
RoHS compliant per DigiKey listing. Halogen-free status not explicitly stated in available data. Cyclone II family is not AEC-Q100 qualified - choose Cyclone IV/10 LP automotive variants for AEC-Q100.
