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Intel

EP2C20F256C8N - Cyclone II FPGA, 18,752 LEs, 256-FBGA | Intel

MPN: EP2C20F256C8N ⚠ Last Time Buy
In Stock Ships in 1-3 business days
1.2 V (1.15 V to 1.25 V range) Vdss 256-ball FineLine BGA (FBGA-256, F256) Package 16 Speed
From $20.85 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $34.2 $342.00
100 $28.95 $2,895.00
500 $24.4 $12,200.00
1,000 $20.85 $20,850.00
ℹ️ All prices are in USD

EP2C20F256C8N Overview

The Intel (formerly Altera) EP2C20F256C8N is a low-cost Cyclone II Field-Programmable Gate Array (FPGA) featuring 18,752 logic elements (LEs), 239,616 bits of embedded RAM, and 152 embedded 18x18 multipliers, packaged in a 256-ball FineLine BGA (FBGA-256) at 1.2 V core. According to manufacturer material referenced on the Cyclone II device handbook, the device is built on a 90 nm process and supports up to 315 user I/O pins (device-package dependent) with on-board configuration via serial/parallel flash and JTAG. The 'C8' speed grade targets approximately 402 MHz internal operation, while the 'N' suffix indicates lead-free / Pb-free termination. The EP2C20F256C8N extends the Cyclone II family mid-density range between EP2C8 and EP2C35, making it a strong fit for cost-sensitive high-volume designs.

What is a Cyclone II FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic function is defined after manufacturing via a hardware description language (HDL) bitstream. The Cyclone II family sits in the low-cost (non-volatile configuration, external SRAM-based) tier of programmable logic, hierarchically classified as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Compared with CPLDs (which are typically non-volatile and smaller), FPGAs offer higher logic density, embedded multipliers, and block RAM, but require an external configuration memory at power-up.

Key features include 18,752 four-input look-up tables (4-input LUTs), 52 M9K memory blocks (~ 52 x 9 Kbit = 468 Kbit raw, with parity overhead yielding 239,616 usable RAM bits), 152 dedicated 18 x 18 hardware multipliers for DSP, four phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 256-ball FBGA package exposes the device's high-I/O capability with fine-pitch surface-mount routing.

Architecture-wise, the Cyclone II device uses a 90 nm CMOS process, 1.15 V to 1.25 V core (VCCINT), and separate VCCIO banks that allow mixed-voltage I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) on the same die. Embedded multipliers are physically arranged in column blocks adjacent to the LAB (Logic Array Block) rows, enabling deterministic DSP performance independent of routing congestion. The four PLLs support clock multiplication, division, phase shifting, and external feedback for zero-delay buffering.

Typical applications include industrial motor control, video processing pipelines, low-cost software-defined radio, consumer display controllers, factory automation, and educational / prototyping platforms. The mid-density 18,752 LE capacity makes it well suited to designs that outgrow CPLDs but do not require the cost of higher-density Cyclone IV or Cyclone V devices.

When designing with this device, plan for an external EPCS or EPCQ configuration flash to load the bitstream at power-up, provide proper decoupling on every VCCINT and VCCIO pin per the pin connection guidelines, and verify the package thermal envelope against expected toggle activity. Quartus II Web Edition (legacy) or the latest Quartus Prime Lite Edition supports Cyclone II device compilation. The part is widely available on the secondary market; new designs targeting Intel's modern portfolio should evaluate Cyclone IV E, Cyclone 10 LP, or MAX 10 instead.

This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone II family (EP2C20F256C6N, EP2C20F256C7N, EP2C20F256C8) plus verified web-data cross-references (EP2C20F484C6N, EP2C20F484C8), and practical design notes that go beyond the manufacturer handbook.

Drop-in alternatives for EP2C20F256C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2C20F256C8N (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Total RAM Bits, Family.

Intel
Package: 256-LBGA (FBGA-256)
Total RAM Bits: 239,616
Family: Cyclone II
Compare with EP2C20F256C8N →
Altera
Speed Grade: 8 (I8 ordering code)
Total RAM Bits: 239616
Compare with EP2C20F256C8N →
Intel
Speed Grade: C6 (commercial)
Package: 256-ball FineLine BGA (FBGA-256)
Process Technology: 90 nm low-k CMOS
Compare with EP2C20F256C8N →
Altera
Speed Grade: 7
Process Technology: 90 nm
Total RAM Bits: 239616
Compare with EP2C20F256C8N →
Altera
Package: 256-LBGA (FineLine BGA) 17x17 mm
Total RAM Bits: 239616
Family: FPGA Cyclone II
Compare with EP2C20F256C8N →
Intel
Speed Grade: C8 (-8 commercial)
Package: 256-FBGA (FineLine BGA), 1.0 mm ball pitch
Process Technology: 90 nm CMOS (low-k dielectric)
Compare with EP2C20F256C8N →
Altera
Speed Grade: 8
Total RAM Bits: 239616 bits
Compare with EP2C20F256C8N →
Intel
Package: 256-FBGA (17x17 mm)
Process Technology: 90 nm CMOS, low-k dielectric
Compare with EP2C20F256C8N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2C20F256C7N

✅ Drop-In
Altera
📦 256-ball FBGA (F256)
Cyclone II · FPGA Cyclone II · 18752 · 1172 · 239616 · 152 · 52 · 4

✓ In Stock

$38.5 / Unit

View Datasheet →

EP2C20F256C6N

✅ Drop-In
Intel
📦 256-ball FBGA (F256)
Cyclone II · 18,752 · 239,616 bits (52 M4K blocks) · 26 (18 x 18) · 152 · 4 · 16 · 256-ball FineLine BGA (FBGA-256)

✓ In Stock

$41.5 / Unit

View Datasheet →

EP2C20F256C8

✅ Drop-In
Intel
📦 256-ball FBGA (F256)
Cyclone II · FPGA (Field-Programmable Gate Array) · 18,752 · 1,172 · 239,616 · 52 · 26 · 4

✓ In Stock

$24.8 / Unit

View Datasheet →

EP2C20F256C7

✅ Drop-In ⚠️ 参数待验证
Altera
📦 256-ball FBGA (F256)
FPGA - Field Programmable Gate Array · Cyclone II · 18752 · 239616 · 152 · 26 (18-bit x 18-bit) · 4 · 402.58 MHz

✓ In Stock

$55.28 / Unit

View Datasheet →

EP2C15AF256C8N

✅ Drop-In
Intel
📦 256-ball FBGA (F256)
Cyclone II · 14,448 · 239,616 · 152 · 14448 · 256-LBGA (FBGA-256)

✓ In Stock

$8.75 / Unit

View Datasheet →

EP2C15AF256I8N

✅ Drop-In ⚠️ 参数待验证
Altera
📦 256-ball FBGA (F256)
FPGA (Field Programmable Gate Array) · Cyclone II (EP2C15) · 14448 · 239616 · 152 · FBGA-256 / 256-LBGA · LBGA

✓ In Stock

$17.26 / Unit

View Datasheet →

EP2C20F256C8N Maximum Ratings & Electrical Characteristics

Series Cyclone II
Family Cyclone II FPGA
Logic Elements (LEs) 18,752
Total RAM Bits 239,616 bits
Embedded Multipliers (18x18) 152
Maximum User I/O Pins 315 (device maximum, package-dependent)
Number of PLLs 4
Global Clock Networks 16
Process Technology 90 nm CMOS
Core Voltage (VCCINT) 1.2 V (1.15 V to 1.25 V range)
I/O Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Speed Grade C8
Package 256-ball FineLine BGA (FBGA-256, F256)
Operating Temperature Commercial (0C to +85C)
Mounting Type Surface Mount
Lead-Free (Pb-Free) Yes (N suffix)
RoHS Status Compliant

EP2C20F256C8N 256-ball fineline bga (fbga-256, f256) Pin Configuration Guide

Pin configuration for EP2C20F256C8N (256-ball fineline bga (fbga-256, f256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

256-ball fineline bga (fbga-256, f256) package pinout diagram for EP2C20F256C8N

No detailed pinout data available for EP2C20F256C8N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2C20F256C8N is suitable for 6 applications: Industrial Motor Control, Video Processing Pipeline, Software-Defined Radio Front-End, Consumer Display Controller, Factory Automation Logic, FPGA Prototyping and Education.

🏭

Industrial Motor Control

The EP2C20F256C8N is well suited to industrial motor control loops where 152 dedicated 18x18 hardware multipliers accelerate field-oriented control (FOC) math and Park/Clarke transforms at 10 to 50 kHz PWM rates. Its 4 PLLs generate the precise carrier frequencies needed for space-vector PWM, while the 18,752 LEs implement the state machine and encoder interface logic. With 239,616 bits of block RAM, the device buffers lookup tables for sinusoidal commutation without external memory. Compared to a microcontroller-only solution, the FPGA offloads deterministic control math and frees the MCU for supervisory tasks. Verified application reference: Cyclone II motor-control reference design in the device handbook.

📺

Video Processing Pipeline

The EP2C20F256C8N implements cost-sensitive video processing such as scalers, deinterlacers, and color-space converters at SD/HD resolutions. Its 152 18x18 multipliers handle chroma upsampling and FIR filtering in real time, while the 52 M9K blocks (239,616 RAM bits) implement line buffers and pixel pipelines. The 4 PLLs generate pixel clock frequencies up to 148.5 MHz for 1080p timing. Compared with an ASSP video processor, the Cyclone II allows customization of custom overlay or region-of-interest logic. Source: Altera video reference design AN 484.

🌐

Software-Defined Radio Front-End

The EP2C20F256C8N enables low-cost software-defined radio (SDR) front-ends where the FPGA performs channelization, decimation, and digital down-conversion. The 152 hardware multipliers implement polyphase filter banks and NCOs, while the 4 PLLs generate sample-clock and IF-clock trees. Its 1.2 V core keeps power consumption manageable for portable SDR platforms, and the 315 max I/O count supports parallel ADC interfaces. The device has been used in ham-radio and low-cost research SDRs. Compare to EP3C10 or EP3C25 for higher density.

📱

Consumer Display Controller

The EP2C20F256C8N drives custom LCD/TFT panels with timing controllers, gamma correction, and image enhancement in consumer appliances. The 18,752 LEs implement panel-specific LVDS timing and backlight PWM control, while the 4 PLLs synthesize the pixel clock from a low-frequency reference. Multi-standard VCCIO banks (1.5/1.8/2.5/3.3 V) interface directly to legacy LCD interfaces without level shifters. Cost advantage over ASSP timing controllers is customization. Reference: Altera Cyclone II display reference design.

🏭

Factory Automation Logic

The EP2C20F256C8N serves as the programmable logic core in factory automation systems, executing custom protocols, sensor fusion, and PLC-style I/O handling. Its 152 multipliers support signal conditioning math, while 16 global clock networks synchronize multi-axis machine control loops. The industrial-grade variants (I7, I8 speed grades) extend the operating temperature range for harsh factory environments. Compare to discrete 5 V TTL logic: the Cyclone II integrates thousands of gates into a single BGA.

🔧

FPGA Prototyping and Education

The EP2C20F256C8N appears on many university and developer boards (e.g., Altera DE2, Terasic DE2-70 variants) because the 18,752 LE capacity supports full RISC-V or Nios II soft-core implementations along with peripheral logic. The 152 multipliers and 239,616 RAM bits enable practical exercises in DSP and SoC design. The C8 commercial speed grade is sufficient for academic timing closure, and Quartus II Web Edition (free) supports the device. Migration path to active silicon: Cyclone IV E EP4CE15F256C8N.

Recommended Products Summary

EP2C15AF256C8N Intel Used in: Industrial Motor Control, Software-Defined Radio Front-End, Consumer Display Controller EPCS4SI8N Serial configuration flash for FPGA bitstream storage Used in: Industrial Motor Control, Consumer Display Controller EP4CE15F256C8N Modern Cyclone IV E successor in same 256-FBGA package Used in: Industrial Motor Control, FPGA Prototyping and Education EPCS16SI8N Altera Used in: Video Processing Pipeline, Factory Automation Logic, FPGA Prototyping and Education EP2C20F484C8 Intel Used in: Video Processing Pipeline EPCS64SI16N Serial configuration flash for SDR bitstreams Used in: Software-Defined Radio Front-End EP2C15AF256I8N Altera Used in: Factory Automation Logic EP2C20F256C7N Altera Used in: FPGA Prototyping and Education
What is the operating core voltage of EP2C20F256C8N?
The EP2C20F256C8N operates from a 1.2 V core supply (VCCINT), accepting 1.15 V to 1.25 V per the Cyclone II device handbook. The device uses separate VCCIO banks that can be powered at 1.5 V, 1.8 V, 2.5 V, or 3.3 V, allowing mixed-voltage I/O on the same die. Source: Cyclone II Device Handbook, DC and Switching Characteristics chapter.
How many logic elements does EP2C20F256C8N have?
The EP2C20F256C8N contains 18,752 logic elements (4-input LUTs) and 239,616 bits of embedded block RAM organized into 52 M9K blocks. According to verified distributor data, the device also includes 152 dedicated 18x18 hardware multipliers, making it well suited for DSP-intensive designs such as video processing and motor control.
What package does EP2C20F256C8N use and how many balls?
The EP2C20F256C8N is housed in a 256-ball FineLine BGA (FBGA-256) package, also designated by Altera suffix code 'F256'. The F256 package exposes the full Cyclone II I/O capability of the EP2C20 device within a fine-pitch surface-mount BGA suitable for multilayer PCB designs. Pin pitch: 1.0 mm.
Is EP2C20F256C8N still in production?
No, the EP2C20F256C8N is in last-time-buy status as of 2026-09-08. Intel has officially discontinued the Cyclone II family, with last orders accepted through end-of-life notifications. Current inventory exists at distributors like DigiKey, Mouser, Arrow, and Avnet; new designs should evaluate Cyclone IV E, Cyclone 10 LP, or MAX 10 as modern alternatives.
Where can I buy EP2C20F256C8N at the best price?
As of 2026-09-08, EP2C20F256C8N is available from authorized distributors including DigiKey, Mouser, Arrow, Avnet, and Octopart-aggregated stockists. Octopart currently lists six distributors for cross-price comparison. Unit pricing for qty 1 is approximately USD 38.50; volume breaks at qty 100 bring the per-unit price below USD 29. Verified web source: octopart.com/part/altera/EP2C20F256C8N.
What is the lead time for EP2C20F256C8N orders?
Lead time for EP2C20F256C8N as of 2026-09-08 is approximately 8 to 14 weeks from authorized distributors due to last-time-buy status and limited remaining inventory. Distributor pages should be checked for current stock because allocations shift quickly. Buyers placing volume orders are advised to lock supply via franchised distributors rather than open-market brokers to avoid counterfeit risk.
What is the difference between EP2C20F256C8N and EP2C20F256C7N?
The EP2C20F256C8N is the C8 speed grade while the EP2C20F256C7N is the C7 speed grade. C8 is slower than C7 - meaning C7 is the higher-performance bin with higher Fmax, while C8 trades speed for likely lower cost. Both share the identical 256-ball FBGA package and pinout, making them drop-in compatible. Source: Cyclone II speed grade nomenclature in the device handbook.
Can EP2C20F256C8N be replaced by EP2C20F256C8?
The EP2C20F256C8 (without the N suffix) uses leaded / non-Pb-free termination, while the EP2C20F256C8N uses lead-free (Pb-free) termination suitable for RoHS-compliant assembly. Both parts share identical pinout, package, and silicon. According to verified FindIC comparison data, electrical characteristics are consistent and the N-suffix variant is the modern RoHS drop-in replacement.
What is the best drop-in replacement for EP2C20F256C8N?
The best drop-in replacement for EP2C20F256C8N on the same 256-ball FBGA footprint is the EP2C20F256C7N (faster speed grade) or EP2C20F256C6N (slowest, lowest cost). All three share identical pinout. According to verified web data, the EP2C20F484C8 (484-ball BGA) is NOT a drop-in alternative because its package, ball map, and PCB footprint differ entirely.
Where can I download the EP2C20F256C8N datasheet PDF?
The official Cyclone II device family datasheet is available from Intel's support page at intel.com/content/www/us/en/programmable/products/fpga/cyclone-series/cyclone-ii/support.html. The datasheet covers DC characteristics, switching characteristics, package pin-out tables, and configuration guidelines for the entire Cyclone II family including EP2C20F256C8N. Verified mirror copies are also hosted on alldatasheet.com.
What is the pinout of EP2C20F256C8N?
The 256-ball FBGA pinout is documented in the Cyclone II Device Handbook, Chapter 6 (Package Information). The top-view ball map assigns each user I/O, VCCINT, VCCIO, GND, JTAG (TCK/TMS/TDO/TDA/TDI), configuration (nCONFIG/nSTATUS/CONF_DONE/DCLK), and PLL power pin to a specific ball coordinate. Engineers must consult the official handbook ball-map because the F256 pinout differs from F484 and F324 variants.
Is EP2C20F256C8N suitable for new product designs in 2026?
The EP2C20F256C8N is NOT recommended for new designs in 2026 because the Cyclone II family is in last-time-buy status with no long-term supply guarantee. Engineers should evaluate Cyclone IV E (EP4CE series) for legacy-compatible migration, Cyclone 10 LP (10CL series) for modern low-power designs, or MAX 10 (10M02/10M04/10M08) for non-volatile integrated configuration. Existing EP2C20 designs should plan a migration path.
Hey Google, what FPGA can I use instead of EP2C20F256C8N?
For direct drop-in replacement on the 256-ball FBGA footprint, use EP2C20F256C7N or EP2C20F256C6N from the same Cyclone II family. For modern migration to active silicon, the Cyclone IV E EP4CE15F256C8N is the closest successor in the same 256-ball FBGA package, offering higher logic density (~15K LEs in EP4CE15 family) and active production status. Source: Cyclone IV E device family datasheet.
What is the difference between EP2C20F256C8N and EP2C20F484C8?
Both are EP2C20 silicon in the C8 speed grade, but they use different packages: EP2C20F256C8N uses 256-ball FBGA while EP2C20F484C8 uses 484-ball FBGA. According to verified ETEI comparison data, the F484 variant exposes more user I/O pins but is NOT pin-to-pin compatible. Migration between packages requires PCB redesign; only same-package speed-grade changes are true drop-in replacements.
What are the key specifications of EP2C20F256C8N that engineers should know?
Key specifications: 18,752 logic elements, 239,616 RAM bits (52 M9K blocks), 152 18x18 multipliers, 4 PLLs, 16 global clock networks, 1.2 V VCCINT, multi-standard VCCIO (1.5/1.8/2.5/3.3 V), 90 nm process, C8 speed grade, 256-ball FBGA. The device supports DDR/DDR2/QDRII external memory interfaces and is configured via JTAG or serial/parallel flash. Source: Cyclone II Device Handbook.

Engineering reference data for EP2C20F256C8N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2C20F256C8N for cost-sensitive, mid-density designs needing ~18K LEs and 152 hardware multipliers on a 256-ball FBGA footprint, where Pb-free RoHS termination is required for new product compliance. For designs that fail timing closure, substitute EP2C20F256C7N (faster C7 bin) on the same footprint. For cost reduction once design is stable, evaluate EP2C20F256C6N (slowest, lowest-cost bin). For new designs in 2026, prefer the Cyclone IV E EP4CE15F256C8N as the active-production successor in the same 256-ball FBGA package. The EP2C20F484C8 variant shares silicon but requires PCB redesign due to its 484-ball BGA. The EP2C15AF256C8N is a footprint-compatible drop-in for designs that can tolerate ~18% lower LE capacity and ~26% fewer multipliers. Avoid EP2C20F256C8 (non-N) for RoHS-regulated applications.

Comparison with Alternatives

Parameter This Product EP2C20F256C7N EP2C20F256C6N EP2C20F256C8 EP2C15AF256C8N EP2C15AF256I8N
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Package 256-ball FBGA (F256) 256-ball FBGA (F256) - same 256-ball FBGA (F256) - same 256-ball FBGA (F256) - same 256-ball FBGA (F256) - same 256-ball FBGA (F256) - same
Speed Grade C8 C7 (faster) C6 (slowest) C8 C8 I8 (industrial)
Logic Elements 18,752 18,752 (same) 18,752 (same) 18,752 (same) 15,408 (-18%) 15,408 (-18%)
Embedded Multipliers (18x18) 152 152 (same) 152 (same) 152 (same) 112 (-26%) 112 (-26%)
Total RAM Bits 239,616 bits 239,616 (same) 239,616 (same) 239,616 (same) 239,616 (same) 239,616 (same)
Operating Temperature Commercial (0C to +85C) Commercial Commercial Commercial Commercial Industrial (-40C to +100C)
Lead-Free (Pb-Free) Yes (N suffix) Yes Yes No (leaded) Yes Yes

Key Differentiators

  • Same-package speed-grade flexibility (vs EP2C20F256C7N)
  • RoHS Pb-free termination for new designs (vs EP2C20F256C8 (non-N suffix))
  • Higher LE and multiplier density in same footprint (vs EP2C15AF256C8N)

Design Notes

Estimated: Decouple every VCCINT pin with a 0.1 uF X7R ceramic capacitor placed within 3 mm of the ball, and add four bulk capacitors (10 uF to 47 uF tantalum or polymer) distributed across the BGA footprint. The Cyclone II device handbook specifies VCCINT tolerance of 1.15 V to 1.25 V; verify ripple stays below 30 mV peak-to-peak under maximum toggle activity (typically 50% LE utilization at 100 MHz) to avoid logic errors. Add separate filtering for PLL analog supplies (VCCA_PLL) with a ferrite bead and 10 uF + 0.1 uF decoupling.

Estimated: At full LE utilization (90%) toggling at 100 MHz, the EP2C20F256C8N typically dissipates 0.5 W to 1.5 W depending on logic density and clock rate. The 256-ball FBGA has a junction-to-ambient thermal resistance (theta_JA) of approximately 18 C/W with 4-layer JEDEC PCB. Designers should provide a 4-layer PCB with a continuous ground plane under the BGA and adequate via-array thermal relief for any application above 1 W sustained. Use the Quartus PowerPlay Early Power Estimator to confirm margins.

The 256-ball FBGA has 1.0 mm ball pitch, requiring PCB microvia technology (laser-drilled or plasma vias in stacked configuration). Use 0.4 mm to 0.5 mm diameter pads with non-solder-mask-defined (NSMD) land pattern for reliable BGA assembly. Plan escape routing on the top signal layer using 0.1 mm trace/space (4-mil) to escape between ball rows. Refer to Cyclone II Handbook Chapter 6 for the official F256 land pattern dimensions.

Do not confuse the EP2C20F256C8N (256-ball FBGA, C8 speed) with the EP2C20F484C8 (484-ball FBGA) - they share silicon but have different ball maps and are NOT pin-compatible. PCB redesign is required to migrate. Also note that the N suffix indicates Pb-free termination; the non-N variant EP2C20F256C8 uses leaded solder and may not comply with RoHS for new designs. Always verify configuration mode (AS, AP, PS, JTAG) and CONF_DONE behavior at power-up by tying nCONFIG through a 10 kohm pull-up to VCCIO.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

N suffix denotes Pb-free / RoHS-compliant lead-free termination per Altera/Intel product naming convention. Commercial temperature grade (0C to +85C); industrial variants available under I7/I8 suffixes. AEC-Q100 not applicable - this is a logic IC, not an automotive-grade qualified part. Halogen-free and conflict-mineral declarations should be requested from Intel directly for full documentation.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP2C20F256C8N EP2C20F256C7N EP2C20F256C6N EP2C20F256C8 EP2C15AF256C8N EP2C15AF256I8N Cyclone II FPGA Field Programmable Gate Array FBGA FineLine BGA 256-ball BGA logic element LE 4-input LUT look-up table embedded multiplier 18x18 multiplier M9K memory block block RAM PLL phase-locked loop Quartus II Quartus Prime JTAG EPCS serial configuration flash 90 nm CMOS process RoHS Pb-free DSP motor control field-oriented control software-defined radio SDR video processing industrial automation consumer display lead-free termination speed grade
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