EP2C20F484I6N - Cyclone II FPGA 18,752 LEs 484-FBGA | Intel
MPN: EP2C20F484I6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $76.5 | $76.50 |
| 10 | $69.2 | $692.00 |
| 100 | $58.4 | $5,840.00 |
| 250 | $52.1 | $13,025.00 |
| 500 | $47.85 | $23,925.00 |
EP2C20F484I6N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the user defines after manufacture using a hardware description language. The Cyclone II family sits in the low-cost, low-power segment of the FPGA hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), succeeding the original Cyclone series with a 90 nm process and a more efficient adaptive logic module (ALM) architecture. It is designed for high-volume cost-sensitive applications such as consumer electronics, industrial control, video processing, and communications infrastructure where ASIC NRE costs are prohibitive.
Key features of the EP2C20F484I6N include 18,752 logic elements arranged in 1,196 logic array blocks (LABs), 52 embedded 18x18 multipliers, 4 PLLs, and 484-pin FineLine BGA package measuring 23x23 mm with 1.0 mm ball pitch. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and offers 8 input clock pins plus 16 global clock networks. The 1.2 V core supply combined with industrial temperature grade (-40C to +100C) broadens deployment scenarios versus commercial-only variants.
The Cyclone II architecture uses a 90 nm low-k dielectric process with 1.2 V core operation and a four-input look-up table (LUT) logic structure. Embedded memory blocks (M4K) provide true dual-port RAM up to 36 bits wide, and dedicated multiplier blocks handle DSP workloads without consuming general-purpose logic. The device interfaces to common external memories including DDR, DDR2, SDRAM, and QDRII SRAM via dedicated PHY blocks, simplifying high-throughput data buffering.
Typical applications for the EP2C20F484I6N include industrial motor control, video surveillance and image processing, low-cost display controllers, software-defined radio front ends, and prototyping interfaces for ASIC verification. With its high logic density at low unit cost, it is well suited to designs that previously would have required multiple CPLDs or a more expensive mid-range FPGA.
Designers should plan for 1.2 V core and 3.3 V/2.5 V/1.8 V I/O supply rails, allocate at least eight global clock inputs with proper PLL configuration, and follow Intel/Altera board layout guidelines for the FineLine BGA substrate. Unused pins should be left floating or tied per the device handbook to minimize in-rush current and avoid configuration errors during JTAG or AS programming.
This page synthesizes distributor pricing, pin-compatible FPGA alternatives, and practical design notes not found in the manufacturer datasheet alone - cross-referenced against Intel/Altera's official Cyclone II Device Handbook (Volume 1, February 2008).
Drop-in alternatives for EP2C20F484I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C20F484I6N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, RoHS Status, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C20F484C6N
✅ Drop-In✓ In Stock
$68.1 / Unit
View Datasheet →EP2C20F484I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP2C20F484I8N
✅ Drop-In✓ In Stock
$49.1 / Unit
View Datasheet →EP2C15AF484I8N
✅ Drop-In✓ In Stock
$38.75 / Unit
View Datasheet →EP2C20F484C8N
✅ Drop-In✓ In Stock
$23.95 / Unit
View Datasheet →EP2C20F484I6N Maximum Ratings & Electrical Characteristics
| Series | Cyclone II |
| Logic Elements | 18,752 |
| Logic Array Blocks (LABs) | 1,196 |
| Total RAM Bits | 239,616 (26,624 bytes of M4K memory) |
| Embedded 18x18 Multipliers | Up to 52 |
| PLLs | 4 |
| Maximum User I/O Pins | 315 |
| Package | 484-ball FineLine BGA (FBGA-484), 23x23 mm, 1.0 mm pitch |
| Process Technology | 90 nm low-k dielectric |
| Core Supply Voltage | 1.2 V |
| Speed Grade | I6 |
| Operating Temperature | -40C to +100C (industrial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Configuration Mode | JTAG / Active Serial / Passive Serial (with EPCS configuration device) |
EP2C20F484I6N 484-ball fineline bga (fbga-484), 23x23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2C20F484I6N (484-ball fineline bga (fbga-484), 23x23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C20F484I6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C20F484I6N is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Image Processing, Low-Cost Display Controller, Software-Defined Radio Front End, ASIC Verification and Prototyping, Communications Infrastructure Glue Logic.
Industrial Motor Control
The EP2C20F484I6N fits industrial motor-control applications because its 18,752 logic elements and 52 18x18 multipliers can implement field-oriented control (FOC) algorithms, space-vector PWM modulators, and encoder interfaces in a single chip. Industrial temperature grade (-40C to +100C) ensures reliable operation in factory-floor cabinets with elevated ambient temperature. With 315 user I/O, the device can simultaneously interface to PWM outputs, Hall-effect sensors, incremental encoders, and an HMI display without external logic. The integrated PLLs (4 of them) provide the multiple phase-locked clock domains required for resolver excitation and ADC sampling synchronization. Compared to a DSP plus CPLD solution, this single-chip approach reduces BOM and board area.
Recommended
Video Surveillance and Image Processing
For video surveillance and image-processing applications, the EP2C20F484I6N provides 239,616 RAM bits (about 234 Kbits) of M4K embedded memory, sufficient to buffer at least one full D1 (720x576) frame at 8 bits per pixel in line-buffer configurations. Its 52 dedicated 18x18 multipliers accelerate 2D convolution filters, motion estimation, and JPEG/MJPEG encode/decode. The device supports DDR/DDR2 SDRAM external memory interfaces for higher-resolution video streams. With LVDS support up to 805 Mbps, multiple camera inputs can be aggregated into a single FPGA. The 484-ball FBGA package also provides ample I/O for camera sensor interfaces and HDMI/DVI output bridges in surveillance DVR designs.
Recommended
Low-Cost Display Controller
The EP2C20F484I6N is widely deployed in low-cost display controllers for industrial HMIs, kiosks, and digital signage because it bridges legacy MCU interfaces (parallel 8/16-bit, SPI) to LVDS or RGB LCD panels. Its 315 user I/O easily accommodates multi-lane LVDS output, touch-screen interfaces, and backlight PWM dimming. With 1,196 LABs, the device can implement on-screen display overlays, character ROMs, and basic 2D graphics acceleration. The 1.2 V core plus flexible I/O bank voltages (1.2 V to 3.3 V) simplify interfacing to older LCD panels that require 2.5 V or 1.8 V signaling. Designers benefit from the established Quartus II toolchain for legacy support.
Recommended
Software-Defined Radio Front End
In software-defined radio (SDR) front-end designs, the EP2C20F484I6N handles digital down-conversion, channel filtering, and digital predistortion at baseband. Its 52 18x18 multipliers enable efficient implementation of polyphase FIR filters and CORDIC-based NCOs without exhausting general-purpose logic. The four integrated PLLs provide the precise clock synthesis required for ADC and DAC sample-rate conversion. With LVDS I/O rates up to 805 Mbps, the FPGA can pair with high-speed ADCs such as the AD9248 or DACs such as the AD9767. Industrial temperature grade suits outdoor and vehicular SDR deployments. Designers can leverage Altera's DSP Builder toolchain for rapid filter design.
Recommended
ASIC Verification and Prototyping
For ASIC verification and prototyping, the EP2C20F484I6N acts as a fast, low-cost bring-up vehicle for designs targeting larger FPGAs or first-silicon ASICs. Its 18,752 logic elements and rich I/O enable real-world interface replication (PCI, USB, I2C, SPI, custom parallel buses) plus logic-equivalent models of the ASIC blocks. The Cyclone II family is widely supported by older Quartus II versions, preserving verification IP investment over years. Engineers can compile ASIC RTL to Cyclone II targets for in-system functional validation before mask set. With 315 user I/O, the FPGA can break out nearly every internal ASIC signal for logic-analyzer observation during bring-up.
Recommended
Communications Infrastructure Glue Logic
The EP2C20F484I6N is commonly used in communications infrastructure equipment as a glue-logic device bridging between network processors, PHY ICs, and backplane serializers. Its 315 user I/O support SGMII, SPI-4.2, and parallel LVDS interfaces typical in Ethernet switches and base-station cards. Industrial temperature grade ensures reliability in outdoor telecom cabinets and base-station shelters. The integrated PLLs (4) and global clock networks (16) simplify timing closure for multi-rate line-card designs. Designers often pair it with external QDRII SRAM for packet buffering at line rate, using the FPGA as the memory controller. Migration to Cyclone IV E is recommended for new designs.
Recommended
Recommended Products Summary
Engineering reference data for EP2C20F484I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C20F484C6N | EP2C20F484I7N | EP2C20F484I8N | EP2C15AF484I8N | EP2C20F484C8N |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (23x23 mm) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 18,752 | 18,752 | 18,752 | 18,752 | 14,448 | 18,752 |
| Embedded RAM Bits | 239,616 | 239,616 | 239,616 | 239,616 | 199,680 | 239,616 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Speed Grade | I6 | C6 | I7 (faster) | I8 (slower) | I8 (slower) | C8 (slower) |
| Embedded 18x18 Multipliers | 52 | 52 | 52 | 52 | 40 | 52 |
| Maximum User I/O | 315 | 315 | 315 | 315 | 315 | 315 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Industrial temperature grade with mid-range density (vs EP2C20F484C6N)
- Balanced speed grade for general-purpose designs (vs EP2C20F484I8N)
- Full 18,752-LE density versus the smaller EP2C15A (vs EP2C15AF484I8N)
Design Notes
The EP2C20F484I6N requires four power rails: 1.2 V core (VCCINT), 2.5 V or 1.8 V analog PLL supply (VCCA), and I/O bank voltages (VCCIO) programmable per bank in the 1.2 V to 3.3 V range. Use a low-impedance power plane for VCCINT with at least one 100 uF bulk capacitor plus 0.1 uF and 0.01 uF decoupling per bank. Each VCCIO bank should have its own 1.0 uF + 0.1 uF decoupling pair. Power-on sequencing must follow the Cyclone II handbook guidelines to avoid in-rush current that can latch the device. Estimated quiescent current is 250-400 mA typical for VCCINT depending on utilization.
The FBGA-484 package uses a 1.0 mm ball pitch on a 23x23 mm substrate. PCB design requires at least 6 layers (signal-ground-power-signal-power-signal) with 50 ohm controlled-impedance traces for high-speed signals. Fanout must use dog-bone or via-in-pad patterns; the Cyclone II Device Handbook Volume 1 Chapter 6 provides recommended escape routing. Keep LVDS pairs matched to within 0.13 mm length tolerance and length-matched to the receiver clock within 0.7 mm. Exposed balls on the bottom row of the FBGA are GND/NC per the package pinout.
Three common pitfalls when bringing up the EP2C20F484I6N: (1) MSEL pin configuration must match the selected configuration mode (AS, PS, JTAG, Fast AS) - incorrect MSEL prevents configuration; (2) the JTAG TCK signal must be held low during power-up to avoid accidental JTAG entry; (3) unused pins must be left floating per the handbook unless an explicit weak pull-up is required by the design. Also remember that Cyclone II requires Quartus II version 13.0 or earlier for legacy bitstream generation - Quartus Prime Pro does not support Cyclone II at all.
Estimated: at 100% logic utilization toggling at 200 MHz with all I/O active, the EP2C20F484I6N dissipates approximately 1.5-2.0 W of dynamic power. Industrial temperature grade operation at +100C ambient requires thermal resistance from junction to ambient (theta_JA) below 30 C/W to keep the junction below the +125C maximum. With the FBGA-484 package having a typical theta_JA of approximately 18 C/W on a 6-layer JEDEC test board, no external heatsink is needed. However, sealed enclosures without airflow can push junction temperatures above 100C; add thermal vias under the package and ensure airflow per the Cyclone II thermal management guidelines.
Compliance Information
RoHS compliance per Altera/Intel product page. Not AEC-Q100 qualified - this part targets industrial not automotive. Halogen-free status not explicitly stated in available data.
