EP2C20F484I8N - Cyclone II FPGA, 18,752 LE, 484-FBGA | Intel / Altera
MPN: EP2C20F484I8N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $71.71 | $71.71 |
| 10 | $65.4 | $654.00 |
| 100 | $58.2 | $5,820.00 |
| 500 | $53.54 | $26,770.00 |
| 1,000 | $49.1 | $49,100.00 |
EP2C20F484I8N Overview
What is a Cyclone II FPGA? An FPGA (Field Programmable Gate Array) is a programmable semiconductor that engineers can configure after manufacturing using a hardware description language (HDL). Cyclone II is a 90 nm SRAM-based FPGA family optimized for low cost and low power, sitting in the broader hierarchy: FPGA -> programmable logic device (PLD) -> digital logic IC -> semiconductor. Cyclone II devices include embedded 18x18 multipliers suited for DSP, and M4K RAM blocks for on-chip memory.
Key features of the EP2C20F484I8N include 18,752 logic elements, 239,616 total RAM bits organized in M4K blocks, 52 embedded 18x18 multipliers, and 4 phase-locked loops (PLLs) for clock management. The industrial-grade speed grade (I8) and industrial temperature range (-40C to +100C ambient) suit harsh-environment deployments.
Architecturally, the EP2C20F484I8N is built on a 90 nm process with a 1.2 V core supply and supports multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, RSDS, mini-LVDS, LVPECL, PCI, PCI-X) via dedicated I/O banks. The device supports configuration via Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel (FPP) modes with the Altera/Intel Quartus design toolchain.
Typical applications include industrial motor control, video processing pipelines, low-cost DSP co-processors, communications protocol bridging, and embedded system glue logic. The wide I/O count (315) makes it suitable for parallel bus aggregation in video and industrial image systems.
Designers should note that the I8 speed grade is one of the slower industrial grades; for higher throughput designs the C8 commercial or C7 grades are recommended. Decoupling, JTAG chain integrity, and configuration scheme selection should be validated against the Cyclone II Device Handbook before tape-out.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design considerations not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2C20F484I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C20F484I8N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C20F484I8
✅ Drop-In✓ In Stock
$30.5 / Unit
View Datasheet →EP2C20F484I6N
✅ Drop-In✓ In Stock
$47.85 / Unit
View Datasheet →EP2C20F484C8N
✅ Drop-In✓ In Stock
$23.95 / Unit
View Datasheet →EP2C20F484C6N
✅ Drop-In✓ In Stock
$68.1 / Unit
View Datasheet →EP2C20F484C7N
✅ Drop-In✓ In Stock
$42.5 / Unit
View Datasheet →EP2C15AF484I8N
✅ Drop-In✓ In Stock
$38.75 / Unit
View Datasheet →EP2C20F484I8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements (LE) | 18,752 |
| Total RAM Bits | 239,616 |
| Embedded 18x18 Multipliers | 52 |
| PLLs | 4 |
| Maximum User I/O Pins | 315 |
| Package | 484-ball FBGA |
| Speed Grade | I8 (industrial) |
| Operating Temperature | -40C to +100C (industrial) |
| Core Voltage | 1.2 V (typ) |
| Process Technology | 90 nm SRAM |
| Configuration Modes | AS, PS, JTAG, FPP |
| Mounting Type | Surface Mount (FBGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP2C20F484I8N 484-ball fbga Pin Configuration Guide
Pin configuration for EP2C20F484I8N (484-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C20F484I8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C20F484I8N is suitable for 6 applications: Industrial Motor Control, Video Processing Pipelines, Low-Cost DSP Co-Processor, Communications Protocol Bridging, Embedded System Glue Logic, Test and Measurement Instrumentation.
Industrial Motor Control
The EP2C20F484I8N fits industrial motor control applications because its 18,752 logic elements and 52 embedded 18x18 multipliers provide sufficient DSP throughput to implement field-oriented control (FOC) algorithms, PWM generation, and encoder decoding for multi-axis drives. The I8 industrial speed grade and -40C to +100C ambient temperature range suit factory-floor deployments where commercial-grade FPGAs would fail. The 315 user I/O pins aggregate parallel ADC feedback channels, Hall-sensor inputs, gate-driver signals, and communication interfaces (RS-485, CAN, EtherCAT) without external bus muxes. Compared with a microcontroller + DSP architecture, the EP2C20 collapses the MCU, DSP, and glue logic into one programmable device.
Recommended
Video Processing Pipelines
The EP2C20F484I8N serves video processing pipelines well because 18,752 logic elements plus 239,616 RAM bits of M4K block memory provide ample on-chip buffering for line-store, frame-store, and pixel-rate processing at standard-definition and HD resolutions. The 315 I/O pins accept parallel RGB/YCbCr buses, BT.656 streams, and connection to external DDR/DDR2 memory controllers without muxing overhead. The 52 embedded 18x18 multipliers accelerate FIR filters, scaling engines, and color-space conversion at pixel clock rates. Industrial temperature rating allows the design to be reused in outdoor surveillance and automotive rear-view camera applications.
Recommended
Low-Cost DSP Co-Processor
For low-cost DSP co-processor applications, the EP2C20F484I8N's 52 embedded 18x18 hardware multipliers deliver 1.16 GMACs of multiply-accumulate throughput at 200 MHz, accelerating FFT, FFT, and convolution routines when paired with a host microcontroller or DSP. The 239,616 RAM bits accommodate coefficient tables and data windows without off-chip memory in many filter designs. Cyclone II supports DSP Builder blocks and Verilog/VHDL IP cores, enabling rapid algorithm porting. The 484-FBGA industrial-grade package suits defense, medical instrumentation, and industrial test equipment where a Cyclone V/Cyclone 10 would be over-spec.
Recommended
Communications Protocol Bridging
The EP2C20F484I8N is well-suited to communications protocol bridging because the 315 user I/O pins aggregate multiple serial buses (UART, SPI, I2C, CAN, LVDS, RSDS, mini-LVDS, parallel LVCMOS) in a single device. The 18,752 logic elements implement protocol state machines, FIFOs, and bridging logic between incompatible interfaces such as MIPI-CSI2 to parallel RGB, or JESD204B to LVDS. Four PLLs generate independent clocks for each bridging channel, eliminating external clock-generator ICs. The industrial temperature grade and lead-free 484-FBGA package suit telecom infrastructure, factory automation gateways, and avionics subsystems.
Recommended
Embedded System Glue Logic
The EP2C20F484I8N serves as glue-logic consolidation in embedded systems by replacing dozens of discrete 74-series logic chips, bus transceivers, FIFOs, and CPLDs with a single programmable device. Its 315 I/O pins directly fan out to address/data buses, chip-select generation, interrupt controllers, and custom peripherals. The 1.2 V core and 90 nm process keep static power low enough for always-on industrial embedded boards. Designers benefit from in-system reprogrammability via JTAG, enabling late-stage bug fixes and field upgrades without board rework.
Recommended
Test and Measurement Instrumentation
The EP2C20F484I8N supports test and measurement instrumentation because the 52 18x18 multipliers and 4 PLLs enable arbitrary waveform generation, digital down-conversion, and trigger logic at sample rates up to 200 MHz. The 239,616 RAM bits of M4K memory hold capture buffers and reference waveforms on-chip, reducing external memory cost. Industrial temperature rating allows bench-top and ruggedized portable instrument use. Engineers often pair the EP2C20 with high-speed ADCs and DACs via LVDS or LVPECL I/O standards, leveraging the 315 user I/O for parallel sample buses.
Recommended
Recommended Products Summary
Engineering reference data for EP2C20F484I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C20F484I8 | EP2C20F484I6N | EP2C20F484C8N | EP2C20F484C6N | EP2C15AF484I8N |
|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 18,752 | 18,752 | 18,752 | 18,752 | 18,752 | 15,408 |
| RAM Bits | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 |
| Embedded 18x18 Multipliers | 52 | 52 | 52 | 52 | 52 | 52 |
| User I/O | 315 | 315 | 315 | 315 | 315 | 315 |
| Speed Grade | I8 (industrial) | I8 (industrial) | I6 (industrial, faster) | C8 (commercial, faster) | C6 (commercial, fastest) | I8 (industrial) |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C |
Key Differentiators
- I8 industrial speed grade offers widest -40C to +100C operation (vs EP2C20F484C8N)
- Cyclone II 90 nm process with 18,752 LE density (vs EP2C15AF484I8N)
- Slower speed grade suits low-cost industrial designs (vs EP2C20F484I6N)
Design Notes
Estimated: Cyclone II EP2C20 quiescent (ICCINT) draws approximately 250-400 mA from the 1.2 V core rail at 100% resource utilization with all I/O toggling; add at least 30% design margin and use a low-dropout regulator with input rating to 12 V (e.g., LM1117-1.2 or equivalent). Decouple VCCINT with 0.1 uF X7R capacitors per bank plus bulk 22 uF tantalum or polymer caps at the supply pins; place them within 5 mm of the FBGA balls to suppress transient switching noise.
The 484-FBGA package has a typical theta_JA near 15-20 C/W with proper PCB thermal via array under the die (per Cyclone II Device Handbook thermal guidelines). At maximum junction temperature 125 C and industrial ambient 100 C, designers should include at least a 6x6 thermal via array on inner PCB layers directly under the BGA to keep the junction-to-ambient rise within 25 C for full I/O utilization.
Route configuration signals (TCK, TMS, TDI, TDO, nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK) on short, dedicated traces with 4.7k-10k pull-ups on nCE and nCONFIG per the Cyclone II handbook. Place the JTAG header within 50 mm of the FPGA, and route MSEL[2:0] to a fixed pull-up/pull-down pattern for the desired configuration mode (AS=010, PS=000, JTAG=101). Failure to terminate configuration pins correctly is the most common Cyclone II bring-up issue.
Do not mix 3.3 V LVCMOS inputs with 2.5 V LVTTL inputs on the same I/O bank - the bank VCCIO must match the highest voltage standard used. Cyclone II does not support hot-socketing on all revisions; consult the device errata before designing hot-plug or live-insertion systems. Lastly, the I8 speed grade is the slowest industrial bin; for designs targeting >150 MHz internal logic, consider EP2C20F484I6N or I7N instead.
Compliance Information
RoHS compliant per Altera/Intel product specifications. 'N' suffix in MPN denotes lead-free packaging. AEC-Q100 not applicable (FPGA is not an automotive-qualified part; AEC-Q100 qualification is per-system-integration, not per-FPGA).
