EP2C35U484C8 - Cyclone II FPGA, 33K LE, 484-FBGA | Intel
MPN: EP2C35U484C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $127.3 | $127.30 |
| 10 | $118 | $1,180.00 |
| 100 | $108.5 | $10,850.00 |
| 250 | $99.8 | $24,950.00 |
| 1,000 | $92.4 | $92,400.00 |
EP2C35U484C8 Overview
An FPGA (Field-Programmable Gate Array) is a programmable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as block RAM, DSP multipliers, PLLs, and transceivers. FPGAs sit alongside microcontrollers and ASICs in the digital design hierarchy, offering hardware-level parallelism, deterministic latency, and post-production reprogrammability. Cyclone II specifically targets the low-power, low-cost segment of the FPGA market, providing just enough DSP, memory, and I/O for motor control, video processing, and bridging applications without the cost of high-end Stratix or Cyclone V+ devices.
Key features of the EP2C35U484C8 include four phase-locked loops (PLLs) for clock synthesis and skew management, support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM, and 35 embedded 18x18 multipliers for DSP workloads. The 1.15V to 1.25V core supply is supported by on-chip voltage regulation, simplifying power tree design. Configuration is supported via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes.
The Cyclone II architecture uses a 90nm low-k dielectric CMOS process with a Look-Up Table (LUT) based logic fabric and column-based block RAM, giving designers a balance between density and signal integrity. Internal clock networks span the entire die, and the device supports source-synchronous interfaces up to 250 MHz on LVDS pairs, suitable for parallel ADC/DAC interfacing.
Typical applications include industrial motor control and drives, video surveillance and image processing pipelines, automotive infotainment subsystems, telecom line cards requiring bridging logic, and PCI/PCI-Express endpoint implementations. The 484-FBGA package supports the high pin density required for parallel external memory and high-speed LVDS interfaces.
When designing with this FPGA, engineers should follow Altera (now Intel) power-estimator and timing-analyzer flows in Quartus II to validate thermal and timing closure. The exposed die paddle requires thermal vias to a copper pour to keep junction temperature within commercial-grade limits.
This page synthesizes distributor pricing, drop-in Cyclone II family alternatives, and practical Quartus II design notes that are not consolidated on any single manufacturer page.
Drop-in alternatives for EP2C35U484C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C35U484C8 (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, RoHS Status, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C35U484C7
✅ Drop-In✓ In Stock
$108.5 / Unit
View Datasheet →EP2C35U484C6
✅ Drop-In✓ In Stock
$106.22 / Unit
View Datasheet →EP2C35F484C8
✅ Drop-In✓ In Stock
$28.9 / Unit
View Datasheet →EP2C35F484C8N
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EP2C35F484C7N
✅ Drop-In✓ In Stock
$85.2 / Unit
View Datasheet →EP2C35F484I8N
✅ Drop-In✓ In Stock
$56.01 / Unit
View Datasheet →EP2C35U484C8 Maximum Ratings & Electrical Characteristics
| Series | Cyclone II |
| Family Name | Cyclone II |
| Logic Elements / Cells | 33,216 LE |
| Total RAM Bits | 483,840 bits (33216 cells) |
| Number of I/O | 322 user I/O |
| Number of Logic Blocks/Elements | 2,076 logic blocks |
| Number of PLLs | 4 |
| Embedded Multipliers | 35 (18x18) |
| Package Type | 484-FBGA (UBGA-484), lead-free |
| Package Pin Count | 484 balls |
| Speed Grade | C8 (commercial, 8th tier) |
| Core Voltage | 1.15 V to 1.25 V |
| Internal Frequency (max) | 500 MHz |
| Operating Temperature | 0C to 85C (commercial) |
| Logic Family / Process | CMOS, 90 nm |
| Mounting Type | Surface Mount (BGA) |
| Configuration Modes | JTAG, AS, PS, FPP |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant (lead-free UBGA) |
| Lifecycle Status | Not Recommended for New Designs (NRND) |
EP2C35U484C8 484 balls Pin Configuration Guide
Pin configuration for EP2C35U484C8 (484 balls package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C35U484C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C35U484C8 is suitable for 6 applications: Industrial Motor Control, Video Surveillance / Image Processing, Automotive Infotainment Subsystem, Telecom Line Card Bridging, PCI / PCI-Express Endpoint Implementation, Test & Measurement Instrumentation Front-End.
Industrial Motor Control
The EP2C35U484C8 suits industrial motor drives thanks to 35 embedded 18x18 multipliers for field-oriented control (FOC) math, four PLLs for precise PWM and encoder-clock generation, and 322 user I/O for parallel ADC and resolver sampling. With 33,216 logic elements the FPGA can run a single-axis FOC loop plus a multi-channel safety chain while remaining in the C8 commercial temperature grade for cabinet-mounted drives. The 484-FBGA footprint keeps the design compact, and Quartus II DSP Builder accelerates model-based code generation for vector-control loops.
Recommended
Video Surveillance / Image Processing
With 483,840 RAM bits and 35 multipliers, the EP2C35U484C8 can buffer two 720p video streams and run Sobel or motion-detection kernels in parallel. The 322 user I/O accept parallel ITU-R BT.656 or LVDS video buses from image sensors, and four PLLs synthesize the pixel clocks required for 60-120 Hz panel output. Cyclone II IP cores from Intel (now in Quartus II Library of Parameterized Modules) implement common image-processing pipelines, and the C8 speed grade is sufficient for 100-150 MHz pixel-clock designs.
Recommended
Automotive Infotainment Subsystem
Although the EP2C35U484C8 itself is commercial grade (0C-85C), it remains common in dash-mounted infotainment head units where the cabin is climate-controlled. The device bridges CAN/LIN bus traffic to display panels, drives LVDS or RGB TFT screens, and runs audio DSP for cabin tuning. 322 user I/O accommodate multiple display ports, touch controllers, and external audio CODECs. Designers targeting harsh automotive thermal ranges should select the I-grade EP2C35F484I8N variant instead.
Recommended
Telecom Line Card Bridging
Telecom line cards use FPGAs to bridge between T1/E1 framers, SERDES, and backplane fabrics. The EP2C35U484C8 provides 322 user I/O and 35 multipliers for low-rate DSP functions such as framing, line coding, and CRC generation. Four PLLs derive multiple clock domains from a single backplane reference. The 484-FBGA supports up to 16 LVDS pairs for source-synchronous inter-board interconnect, and Quartus II SERDES-supporting IPs (although the EP2C35 lacks hard transceivers, LVDS channels suffice for sub-gigabit rates).
Recommended
PCI / PCI-Express Endpoint Implementation
Altera/Intel ships free PCI 32-bit/33 MHz IP cores targeting the Cyclone II family, and the EP2C35U484C8 has sufficient logic and I/O to implement a 32-bit PCI endpoint or soft-bridge into local bus peripherals. Designers implement the PCI core in the 33,216 logic elements and use 322 I/O for the PCI bus plus local data/address lines. The 484-FBGA gives margin for additional logic analyzer pins and JTAG chain access during bring-up.
Recommended
Test & Measurement Instrumentation Front-End
Test gear such as logic analyzers, protocol testers, and mixed-signal oscilloscopes use FPGAs to capture, time-stamp, and pre-process high-speed signals before forwarding to a host processor. The EP2C35U484C8's 322 I/O can fan out into multi-channel digital acquisition paths; its 4 PLLs generate per-channel skew-adjusted sample clocks; and its 35 multipliers accelerate on-the-fly FFT or CRC computations. The 484-FBGA keeps the board compact enough for portable benchtop instruments.
Recommended
Recommended Products Summary
Engineering reference data for EP2C35U484C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C35U484C7 | EP2C35U484C6 | EP2C35F484C8 | EP2C35F484C8N | EP2C35F484C7N | EP2C35F484I8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-UBGA (U484) | 484-UBGA (same) | 484-UBGA (same) | F484-FBGA (same ball count, different pattern) | F484-FBGA (same ball count, different pattern) | F484-FBGA (same ball count, different pattern) | F484-FBGA (same ball count, different pattern) |
| Logic Elements | 33,216 LE | 33,216 LE (same) | 33,216 LE (same) | 33,216 LE (same) | 33,216 LE (same) | 33,216 LE (same) | 33,216 LE (same) |
| User I/O | 322 | 322 (same) | 322 (same) | 322 (same) | 322 (same) | 322 (same) | 322 (same) |
| Speed Grade | C8 | C7 (slightly slower Fmax) | C6 (slowest) | C8 (same) | C8 (same) | C7 (slightly slower Fmax) | I8 industrial temp |
| Temperature Grade | 0C to 85C (commercial) | 0C to 85C (same) | 0C to 85C (same) | 0C to 85C (same) | 0C to 85C (same) | 0C to 85C (same) | -40C to 100C (industrial) |
| Embedded RAM | 483,840 bits | 483,840 bits (same) | 483,840 bits (same) | 483,840 bits (same) | 483,840 bits (same) | 483,840 bits (same) | 483,840 bits (same) |
| Number of PLLs | 4 | 4 (same) | 4 (same) | 4 (same) | 4 (same) | 4 (same) | 4 (same) |
| Embedded Multipliers (18x18) | 35 | 35 (same) | 35 (same) | 35 (same) | 35 (same) | 35 (same) | 35 (same) |
| RoHS / Lead-Free | RoHS compliant, lead-free UBGA | RoHS lead-free | RoHS lead-free | RoHS compliant | RoHS lead-free (N suffix) | RoHS lead-free (N suffix) | RoHS lead-free (N suffix) |
Key Differentiators
- UBGA-484 footprint matches legacy Altera reference designs (vs EP2C35F484C8 (F484-FBGA variant))
- C8 speed grade balances timing margin and cost (vs EP2C35U484C7 (C7 speed grade))
- Lead-free UBGA package meets modern RoHS (vs EP2C35U484C8N (same package, N suffix))
Design Notes
Estimated: For the 484-FBGA package, a minimum 6x6 thermal-via array (0.3mm drill, 1mm pitch) under the central die paddle is required to keep junction temperature below 85C in commercial-grade applications. Without thermal vias, the FBGA theta_JA exceeds 30 C/W; with proper thermal management, it drops to 12-15 C/W. Reference Altera AN 483 (Thermal Management for BGA Packages).
Estimated: BGA escape routing requires at least 4 PCB layers with 0.4mm-pitch microvias (HDI stack-up such as 1-2-1 or 2-4-2). All decoupling capacitors must be placed within 1mm of each power pin: 0.1uF X7R for each VCCIO/VCCINT pin, plus 10uF bulk caps per power rail. Reference Cyclone II Device Handbook section on PCB layout guidelines.
Configuration mode pin (MSEL0/MSEL1/MSEL2) must be set correctly before power-up - misconfiguration results in silent JTAG failure. Verify the MSEL pull-up/pull-down resistors match the desired configuration scheme (AS, PS, JTAG, FPP). The CONF_DONE pin must be pulled high externally with a 10k resistor, and nSTATUS monitored during configuration.
Cyclone II LVDS pairs require 100-ohm differential impedance traces routed over a continuous reference plane; avoid crossing split-power planes. For DDR/DDR2 memory interfaces, follow the DDR-2 read/write leveling flow in Quartus II and use the TimeQuest analyzer to verify hold/setup margins. Per the Cyclone II Device Handbook, maximum LVDS toggle rate is 250 Mbps.
Compliance Information
RoHS compliant per the lead-free UBGA package designation (C suffix indicates lead-free). Not AEC-Q100 qualified; this is a commercial-grade FPGA. AEC-Q100 automotive applications should select -Q variants or migrate to Cyclone IV/V.
