EP2C35F484C8N - Cyclone II FPGA, 33K LEs, 484-FBGA | Intel
MPN: EP2C35F484C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $79 | $7,900.00 |
| 500 | $71.5 | $35,750.00 |
| 1,000 | $65 | $65,000.00 |
EP2C35F484C8N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacturing through user programming. FPGAs occupy a unique tier in the digital design hierarchy: more capable than discrete logic (74-series gates) and CPLDs (Complex Programmable Logic Devices), but lower-cost and lower-power than ASICs (Application-Specific Integrated Circuits). They are widely used for glue logic, digital signal processing front-ends, custom peripheral buses, and pre-ASIC prototyping. Within that taxonomy, the Cyclone II series specifically targets cost-sensitive, high-volume applications where every logic element and I/O pin must be maximized per dollar.
Key features include 35,000 LEs (the Cyclone II nomenclature counts logical resources slightly above the LE name, equivalent to roughly 33K fully-routed logic elements), up to 483,840 RAM bits arranged in 4-kbit M4K blocks supporting true dual-port operation, and 35 embedded 18x18 multipliers for DSP applications. The device also includes four PLLs and supports LVDS I/O standards on selected pins.
The Cyclone II architecture uses a 2D row/column interconnect backed by SRAM configuration memory. Its 90 nm process allows high logic density at low static power. Configuration is loaded from a passive serial, JTAG, or EPCS configuration device. The 484-FBGA package exposes 322 user I/Os, giving designers generous headroom for memory buses, video interfaces, and parallel connectivity.
Typical applications include industrial motor control, video processing and display bridges, telecom line cards, low-cost DSP co-processing, and pre-silicon ASIC prototyping. The combination of abundant DSP blocks and external memory interfaces makes it well suited to image-pipeline front-ends. Per the manufacturer datasheet, the EP2C35F484C8N speed grade 8 corresponds to a -8 commercial temperature rating, balancing timing margin against cost.
When designing with this device, plan a multi-rail power tree for 1.2 V VCCINT, 3.3 V VCCIO, and PLL analog supplies, with careful decoupling on every VCCIO bank. The 484-FBGA demands a multi-layer PCB with microvia-in-pad stackup; signal integrity on LVDS pairs requires matched-length routing. Although the part is mature, lead-time and lifecycle pressure have shifted many new designs to Cyclone IV or Cyclone V equivalents.
This page synthesizes distributor pricing, drop-in alternatives from the Cyclone II family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2C35F484C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C35F484C8N (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, RoHS Status, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C35F484C8
✅ Drop-In✓ In Stock
$28.9 / Unit
View Datasheet →EP2C35F484C7N
✅ Drop-In✓ In Stock
$85.2 / Unit
View Datasheet →EP2C35F484C6N
✅ Drop-In✓ In Stock
$118.2 / Unit
View Datasheet →EP2C50F484C8N
✅ Drop-In✓ In Stock
$68.2 / Unit
View Datasheet →EP2C20F484C8N
✅ Drop-In✓ In Stock
$23.95 / Unit
View Datasheet →EP2C70F484C8N
✅ Drop-In📋 Reference alternative (not in catalog)
EP2C35F484C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements | 33,216 |
| Embedded Memory (M4K blocks) | 105 blocks |
| Embedded Memory Bits | 483,840 bits |
| User I/Os | 322 |
| Embedded Multipliers (18x18) | 35 |
| PLLs | 4 |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.5 V, 1.8 V, 2.5 V, 3.3 V (bank-dependent) |
| Process Technology | 90 nm |
| Package | 484-pin FBGA (FineLine BGA) |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | 8 |
| Mounting Type | Surface Mount |
| Maximum Internal Frequency | 402.58 MHz |
| RoHS Status | Compliant |
EP2C35F484C8N 484-pin fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP2C35F484C8N (484-pin fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C35F484C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C35F484C8N is suitable for 7 applications: Industrial Motor Control and Drive, Video Processing and Display Bridge, Telecom Line Card Glue Logic and Protocol Bridging, Pre-Silicon ASIC Prototyping, Low-Cost DSP Co-Processor, Embedded Control and Custom Peripherals, Test and Measurement Instrumentation.
Industrial Motor Control and Drive
The EP2C35F484C8N's 35 embedded 18x18 multipliers and 322 user I/Os make it well-suited to industrial motor control, where field-oriented control (FOC) algorithms require multiple simultaneous multiply-accumulate operations per PWM cycle. The 484-FBGA exposes enough I/O for parallel encoder feedback, Hall sensor inputs, and isolated gate-driver interfaces to IGBT bridges, while the four PLLs provide jitter-clean clocks for the ADC sampling domain. Compared with a discrete DSP, the FPGA integrates encoder decoding, commutation logic, and protective trip handling in one programmable device, reducing BOM and board area. The commercial 0C to +85C rating supports most enclosed cabinet environments; for harsher installations, migrate to the EP2C35F484I8N industrial variant on the same footprint.
Recommended
Video Processing and Display Bridge
With 33K LEs and 483 kbits of embedded memory, the EP2C35F484C8N bridges legacy parallel video interfaces (RGB/TTL, ITU-R BT.656) to LVDS, HDMI transmitters, or MIPI bridges. The 322 user I/Os accept wide video buses (16/18/24-bit) without external muxes, and the M4K blocks provide line-buffer storage for de-interlacing or scaling. LVDS I/O support on select pins enables direct drive of flat-panel connectors without an external serializer. Compared with an ASSP video processor, the FPGA allows proprietary scaling algorithms, color-space conversions, and timing quirks handled in firmware rather than silicon. Per the Cyclone II datasheet, the -8 speed grade sustains typical 720p processing rates at common pixel clocks.
Recommended
Telecom Line Card Glue Logic and Protocol Bridging
The EP2C35F484C8N is widely deployed in telecom line cards as protocol-bridging glue logic between backplane SERDES, TDM time-slots, and control processors. Its 33K LEs accommodate custom framer/derframer logic and pseudo-wire interworking, while four PLLs derive jitter-clean clocks from the backplane reference. The 322 I/Os allow direct bus attachment to MPCBs, framers, and TSI switches without bus-extension devices. Compared with discrete 74-series logic, the FPGA consolidates board area and adapts to protocol changes via firmware update. The Cyclone II datasheet documents the DC characteristics required for telecom -48 V backplane systems via downstream regulators.
Recommended
Pre-Silicon ASIC Prototyping
Engineers use the EP2C35F484C8N as a pre-silicon ASIC prototype platform because the 33K-LE density, 322 I/Os, and 35 DSP blocks map cleanly onto mid-size ASIC RTL blocks. The 484-FBGA package supports high pin-count connectivity required for memory-mapped prototypes, and the JTAG-based Quartus II toolchain accelerates bring-up. Speed grade -8 yields conservative timing margin when validating the design at real-world clocks. Per Altera/Intel documentation, Cyclone II FPGAs have been used to validate hundreds of pre-silicon designs, including network processors and consumer SoCs. Once the ASIC is taped out, the FPGA platform can be reused as production test infrastructure.
Recommended
Low-Cost DSP Co-Processor
The EP2C35F484C8N's 35 embedded 18x18 multipliers provide up to 35 simultaneous multiply-accumulate operations per clock cycle, offloading FFT, FIR, and matrix operations from a host processor. The 483 kbits of M4K embedded memory support small coefficient tables and sliding window buffers without external SRAM. Compared with a dedicated DSP chip, the FPGA allows reconfiguration of the data path for different algorithms (e.g., radar FFT vs. audio crossover). The 90 nm process keeps quiescent power low enough for fanless industrial enclosures. Per the Cyclone II datasheet, typical DSP applications run at the 100-200 MHz range at speed grade -8.
Recommended
Embedded Control and Custom Peripherals
The EP2C35F484C8N integrates custom peripheral glue logic, exotic bus interfaces, and real-time state machines that off-the-shelf microcontrollers cannot match. The 322 user I/Os accommodate multiple parallel buses (PCI, local bus, memory-mapped peripherals) plus GPIO banks for legacy logic replacement. Four PLLs multiply low-frequency crystals to clock ADC, DAC, and communications blocks. Compared with discrete 74-series logic, the FPGA reduces component count and enables late-stage bus-protocol changes without a board spin. Per the Cyclone II datasheet, the on-chip PLL range covers typical embedded control clocking from 10 MHz to 400 MHz.
Recommended
Test and Measurement Instrumentation
The EP2C35F484C8N is used in test and measurement instruments where custom stimulus generation, pattern capture, and protocol decoding are needed. The 33K LEs implement protocol-aware logic analyzers or arbitrary waveform generators, while 322 I/Os support wide parallel probe buses. The four PLLs provide precisely tuned clocks for serial protocol decode (I2C, SPI, UART, custom). Compared with fixed-function tester ASICs, the FPGA is field-upgradeable to new protocols. Per the Cyclone II datasheet, the -8 speed grade enables real-time capture of high-speed serial links at hundreds of megabits per second, useful for bench instrument front-ends.
Recommended
Recommended Products Summary
Engineering reference data for EP2C35F484C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C35F484C8 | EP2C35F484C7N | EP2C35F484C6N | EP2C50F484C8N | EP2C20F484C8N | EP2C70F484C8N |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 33,216 | 33,216 (same) | 33,216 (same) | 33,216 (same) | 50,560 (+52%) | 18,752 (-44%) | 68,416 (+106%) |
| Embedded Memory | 483,840 bits | 483,840 bits (same) | 483,840 bits (same) | 483,840 bits (same) | 594,432 bits (+23%) | 239,616 bits (-50%) | 1,152,000 bits (+138%) |
| Embedded 18x18 Multipliers | 35 | 35 (same) | 35 (same) | 35 (same) | 86 (+146%) | 26 (-26%) | 150 (+329%) |
| User I/Os | 322 | 322 (same) | 322 (same) | 322 (same) | 294 (-9%) | 315 (-2%) | 294 (-9%) |
| PLLs | 4 | 4 (same) | 4 (same) | 4 (same) | 4 (same) | 4 (same) | 4 (same) |
| Speed Grade | -8 | -8 (same) | -7 (slower) | -6 (slowest) | -8 (same) | -8 (same) | -8 (same) |
| Lead-Free Finish | Yes (Pb-free) | No (SnPb finish) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
Key Differentiators
- Drop-in higher-density upgrade path on same 484-FBGA footprint (vs EP2C20F484C8N)
- Pin-compatible speed grade flexibility within the same part family (vs EP2C35F484C7N / EP2C35F484C6N)
- Pb-free lead finish for RoHS-compliant manufacturing (vs EP2C35F484C8)
Design Notes
The EP2C35F484C8N requires a multi-rail power tree: VCCINT at 1.2 V for the core logic, VCCIO at 1.5 V/1.8 V/2.5 V/3.3 V per I/O bank (each bank is independent), plus PLL analog VCCA_PLL at 1.2 V and the JTAG/configuration VCCPD at 3.3 V. Per the Cyclone II Device Handbook, the core current peaks around 500 mA during configuration and around 300 mA in steady-state at full logic utilization; the I/O current depends on switching frequency. Place a 100 uF bulk capacitor plus 0.1 uF / 1 uF ceramics at every VCC pin group, and keep the PLL analog supply isolated from the digital core with a ferrite bead and dedicated decoupling to prevent jitter.
The 484-FBGA package (1.0 mm ball pitch) requires a multi-layer PCB with microvia-in-pad stackup to fan out the BGA. Estimated: at least 6 layers are recommended to provide solid ground and power planes directly under the device. Per the Cyclone II PCB layout guidelines, all VCC and GND balls must connect to their planes with short, low-inductance vias; signal layers should be referenced to a continuous ground plane. Matched-length routing is mandatory for LVDS pairs and for DDR memory interfaces, with length matching within the timing budget specified by Quartus II timing analysis.
Per the Cyclone II pin tables, dedicated configuration and JTAG pins (nCE, nCONFIG, nSTATUS, CONF_DONE, MSEL0/MSEL1, TCK, TMS, TDI, TDO) must be wired to their pull-up/pull-down resistors and configuration device exactly as shown in the reference schematics. The MSEL pins set configuration mode (AS, PS, JTAG) and must match the chosen EPCS or EPC2 configuration device. The JTAG chain should support both production programming and debug; isolate the JTAG connector with a protection network. LVDS I/O support is pin-limited, so LVDS-capable pins must be reserved early in pin planning.
Common pitfalls when designing with the EP2C35F484C8N: (1) assuming commercial-temperature grade covers industrial use - migrate to EP2C35F484I8N for -40C to +100C operation; (2) leaving MSEL pins floating - they must be tied to a fixed configuration mode per the datasheet; (3) failing to provide proper POR delay - the FPGA requires a clean power-on ramp and may enter configuration errors if VCCINT or VCCIO are out of order; (4) underestimating inrush current during configuration - the 100 uF bulk cap recommendation in the datasheet is not optional; (5) using single-event upset (SEU) blind designs - in safety-critical applications, scrub the configuration memory or use a watchdog reconfiguration strategy.
Estimated: at 100 percent logic utilization and 100 MHz toggle, the EP2C35 dissipates roughly 1.5-2.5 W primarily through I/O switching and interconnect. The 484-FBGA package has a theta_JA in the 18-25 C/W range on a 4-layer JEDEC test board, giving a junction temperature rise of 25-50 C above ambient. For typical office environments (25 C ambient) the junction stays well below 125 C without a heatsink, but high-altitude or enclosed-cabinet deployments must perform a thermal survey. Place board-level temperature sensors near the FPGA center ball pattern and follow the manufacturer thermal management AN for layer-stackup recommendations.
Compliance Information
RoHS compliant per Intel/Altera product page. Trailing 'N' suffix indicates Pb-free terminal finish per JEDEC J-STD-020. AEC-Q100 not applicable - FPGAs are not typically AEC-Q100 qualified at this density. Halogen-free status not stated in the verified web data.
