EP2C35F484I8N - Cyclone II FPGA, 33K LEs, 484-BGA | Intel
MPN: EP2C35F484I8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $93.36 | $93.36 |
| 10 | $84.02 | $840.20 |
| 100 | $74.69 | $7,469.00 |
| 500 | $65.35 | $32,675.00 |
| 1,000 | $56.01 | $56,010.00 |
EP2C35F484I8N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader hierarchy: programmable logic device -> logic IC -> integrated circuit. Unlike an ASIC, an FPGA's logic fabric, routing, and I/O can be reconfigured by the designer after manufacture, making FPGAs ideal for prototyping, low-volume production, and designs requiring parallel processing, custom I/O timing, or in-field firmware updates. Cyclone II is positioned as a low-cost, high-volume FPGA for cost-sensitive applications such as digital signal processing, communications, industrial control, and embedded processing.
Key features of the EP2C35F484I8N include 33,216 logic elements and 483,840 embedded RAM bits arranged in M4K blocks, four general-purpose PLLs for clock synthesis and management, and 322 user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device is supported by the Altera/Intel Quartus II design suite, which provides synthesis, place-and-route, timing analysis, and IP core integration. Configuration is supported via active serial (AS), passive serial (PS), JTAG, and Fast Passive Parallel (FPP) modes with the EPCS serial configuration device family.
The Cyclone II architecture combines a logic array based on 4-input look-up tables (4-LUTs) with embedded multiplier blocks and M4K memory blocks for efficient DSP and buffering. The 90 nm CMOS process provides a balanced trade-off between density, performance, and static power consumption. Internal signal integrity is preserved through dedicated routing channels and predictable timing closure, while the Quartus II toolchain enables iterative design refinement against timing constraints up to several hundred MHz depending on logic utilization.
Typical applications include industrial control and motor drive systems, video processing and image acquisition pipelines, communications protocol bridging (UART, SPI, I2C, PCIe, Ethernet MAC), consumer electronics with custom video or display interfaces, and educational or prototype development boards. The 322 available I/O pins in the F484 package make the device well suited to designs requiring parallel data buses, multiple ADC/DAC interfaces, or wide memory buses to external SRAM/SDRAM.
When designing with the EP2C35F484I8N, ensure that the 1.2 V core and 3.3 V/2.5 V/1.8 V I/O supplies are properly decoupled with 100 nF and 10 uF capacitors placed close to the power balls, and follow Intel/Altera's PCB layout guidelines for BGA fanout to maintain signal integrity on high-speed LVDS pairs.
This page synthesizes distributor pricing, drop-in Cyclone II and Cyclone IV/FPGA alternatives, PCB layout notes, and design considerations not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2C35F484I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C35F484I8N (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, Process Technology, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C35F484I8
✅ Drop-In✓ In Stock
$163.7027 / Unit
View Datasheet →EP2C35F484I7N
✅ Drop-In✓ In Stock
$26.4 / Unit
View Datasheet →EP2C35F484I6N
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP2C35F484C8N
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EP2C20F484I8N
✅ Drop-In✓ In Stock
$49.1 / Unit
View Datasheet →EP2C35F484I8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone II |
| Family | Cyclone II EP2C35 |
| Logic Elements | 33,216 |
| Total RAM Bits | 483,840 |
| Number of Logic Cells / Gates | 33,216 |
| Number of I/O | 322 max user I/O |
| Embedded Memory | 483,840 bits (M4K blocks) |
| Number of PLLs | 4 |
| Package | 484-BGA (FineLine BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (industrial, I8) |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V (typical) |
| Configuration Mode | AS / PS / JTAG / FPP |
| RoHS Status | Compliant (Pb-free) |
| Lead Free | Yes |
EP2C35F484I8N 484-bga (fineline bga) Pin Configuration Guide
Pin configuration for EP2C35F484I8N (484-bga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C35F484I8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C35F484I8N is suitable for 7 applications: Industrial Motor Control, Video Processing & Image Acquisition, Communications Protocol Bridging, FPGA Development & Prototyping Boards, Test & Measurement Instrumentation, LED Display & Signage Controllers, Aerospace & Defense Prototyping.
Industrial Motor Control
The EP2C35F484I8N's 33,216 logic elements and 322 user I/O pins make it a strong fit for industrial motor control designs that require parallel feedback channels and deterministic PWM generation. Its four general-purpose PLLs can synthesize the high-resolution PWM clocks needed for field-oriented control (FOC) loops on 3-phase BLDC or PMSM motors, while the 483,840 bits of embedded RAM in M4K blocks provide local buffering for current-sense ADC samples without consuming external memory bandwidth. Industrial deployments benefit from the I8 industrial temperature grade (-40C to +100C junction) for reliable operation in factory cabinets and outdoor panels, and the 1.2 V core / 3.3 V I/O split allows direct interface to 3.3 V analog front ends. Compared to discrete DSP+microcontroller architectures, the FPGA consolidates control loops and commutation logic into one deterministic fabric.
Recommended
Video Processing & Image Acquisition
The EP2C35F484I8N handles real-time video pipelines such as camera-link input, color-space conversion, scaling, and overlay generation. Its M4K memory blocks (483,840 bits total) provide line buffers for image data, while the 322 I/O pins easily accept parallel 16-bit or 24-bit RGB buses plus synchronization and control signals. The four PLLs generate pixel clocks up to hundreds of MHz needed for standard video rates (1080p60 requires ~148.5 MHz), and the industrial temperature grade supports video surveillance, machine-vision, and broadcast equipment operating in non-climate-controlled environments. Designers pair the FPGA with external DDR SDRAM for frame buffering and a video DAC for analog output, with the FPGA acting as the timing brain that resolves the asynchronous data flow between the camera sensor, memory, and display.
Recommended
Communications Protocol Bridging
The EP2C35F484I8N excels at bridging industrial and embedded communications protocols - UART, SPI, I2C, CAN, Ethernet MAC, PCIe, USB, and custom LVDS links - through its parallel I/O fabric. With 322 I/O pins, the FPGA can instantiate many independent protocol cores simultaneously, and the 33,216 logic elements are sufficient to implement multiple soft IP cores from the Altera MegaWizard or third-party libraries. The four PLLs support independent reference clocks for each protocol domain, and the industrial temperature range suits factory-floor and outdoor communication gateways. Typical deployments include multi-protocol industrial routers, protocol-conversion modules for legacy serial equipment, and embedded gateway designs where an FPGA offloads bus conversion from a CPU. The Quartus II toolchain provides IP cores for Ethernet MAC, PCIe, and common industrial protocols.
Recommended
FPGA Development & Prototyping Boards
The EP2C35F484I8N is a popular FPGA for university labs, evaluation kits, and developer prototyping boards such as the Altera Cyclone II EP2C35 development kit and third-party Terasic-style boards. The 33,216 logic elements provide ample headroom for student projects spanning custom CPU cores, signal-processing demos, and computer-architecture coursework, while the 484-FBGA package is large enough to expose SDRAM, Flash, Ethernet PHY, VGA/DVI, audio codec, and GPIO headers. The Quartus II Web Edition (free) supports full programming flows, and the EPCS serial configuration device allows instant on-board programming via the USB-Blaster. Industrial-grade silicon ensures reliable operation across the temperature swings of a teaching lab or engineering bench.
Recommended
Test & Measurement Instrumentation
The EP2C35F484I8N suits mid-range bench instruments - logic analyzers, protocol exercisers, custom waveform generators, and data-acquisition front ends - that demand deterministic timing and many parallel I/O. The four PLLs generate the sample clocks for multi-channel ADCs, the 483,840 RAM bits buffer acquisition bursts before DMA to a host, and the 322 I/O pins accommodate 16+ channel logic probes plus SPI/I2C/UART instrument buses. Industrial temperature operation enables use in non-conditioned labs and field service kits. Designers benefit from the FPGA's ability to implement custom trigger logic, pattern generation, and on-the-fly DSP (FIR filtering, decimation) in the same fabric, eliminating the FPGA-to-DSP latency of two-chip solutions.
Recommended
LED Display & Signage Controllers
Large LED video walls and digital signage controllers rely on FPGAs to drive hundreds to thousands of RGB LED channels with precise timing and refresh-rate control. The EP2C35F484I8N's 322 user I/O pins can drive many shift-register chains in parallel, while its 33,216 logic elements implement gamma correction, color-space conversion, and refresh-rate multiplexing in a single fabric. The four PLLs synthesize the high-frequency clocks needed for HUB75-style LED panels, and the 483,840 RAM bits hold lookup tables for gamma and color mapping. Industrial temperature grade ensures reliable operation in outdoor enclosures, kiosks, and stadium scoreboards where ambient conditions vary widely. Compared to microcontroller-based LED controllers, the FPGA delivers far higher refresh rates and lower latency.
Recommended
Aerospace & Defense Prototyping
While the EP2C35F484I8N is not formally MIL-PRF or DO-254 certified, its 33,216 logic elements and industrial temperature grade make it useful for prototype-phase aerospace and defense designs such as mission-computing sub-assemblies, avionics bus monitors (ARINC 429, MIL-STD-1553 prototyping), and signal-conditioning front ends. The four PLLs generate the disciplined clocks used in synchronous data converters, and the 322 I/O pins support parallel sensor arrays and high-speed transceivers. Designers working toward flight-qualified hardware often use Cyclone II as a development platform before porting to radiation-hardened FPGAs, leveraging the same Quartus II toolchain and IP core library to accelerate the final design. The F484 BGA package is widely supported by aerospace PCB assembly houses.
Recommended
Recommended Products Summary
Engineering reference data for EP2C35F484I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C35F484I8 | EP2C35F484I7N | EP2C35F484I6N | EP2C35F484C8N | EP2C20F484I8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 33,216 | 33,216 | 33,216 | 33,216 | 33,216 | 18,752 |
| Total RAM Bits | 483,840 | 483,840 | 483,840 | 483,840 | 483,840 | 239,616 |
| Max User I/O | 322 | 322 | 322 | 322 | 322 | 315 |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | -8 | -8 | -7 | -6 | -8 | -8 |
| RoHS / Lead-Free | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest speed grade within the Cyclone II F484 industrial family (vs EP2C35F484I7N)
- Industrial temperature range with full RoHS compliance (vs EP2C35F484C8N)
- Higher logic and RAM density than Cyclone II EP2C20 in identical package (vs EP2C20F484I8N)
- Same package footprint as Cyclone II EP2C20, easier migration than going to Cyclone V (vs 5CEFA5M13I7N (Cyclone V))
Design Notes
The EP2C35F484I8N requires at least three supply rails: VCCINT (1.2 V core), VCCIO (3.3 V, 2.5 V, 1.8 V, or 1.5 V for I/O banks), and VCCA (2.5 V PLL analog). Decouple each supply pin with a 100 nF ceramic capacitor placed within 3 mm of the BGA ball, and add a single 10 uF bulk capacitor per supply plane. Estimated quiescent current for the EP2C35 is typically 300-500 mA on VCCINT at 25C before any switching activity; high-utilization designs with many LVDS channels can add another 200-400 mA. Always sequence VCCINT before VCCIO at power-up to prevent I/O latch-up, and hold nCONFIG low until all rails are stable. The Cyclone II handbook provides reference power-tree schematics.
Design the PCB with a continuous ground plane directly under the EP2C35F484I8N's F484 BGA footprint, and use microvia or via-in-pad technology to escape the 1.0 mm pitch BGA balls. Fanout routing should leave at least 8 mil trace-to-pad clearance and follow Intel/Altera's BGA breakout guidelines to maintain signal integrity on LVDS pairs and high-speed clock traces. Estimated: the 484-BGA requires a minimum 4-layer PCB stackup (signal-GND-power-signal) for cost-effective designs, with the top signal layer dedicated to fanout and outer signal layers to horizontal/vertical routing. Keep LVDS pair trace length matching to within 150 mil to meet Cyclone II LVDS skew budgets.
Place the EPCS configuration device (e.g., EPCS16, EPCS64) within 50 mm of the EP2C35F484I8N's nCSO, DCLK, ASDO, and Data0 pins to minimize configuration clock skew. Keep JTAG chain traces (TCK, TMS, TDI, TDO) short and away from switching power and clock signals. For multi-FPGA designs sharing a configuration chain, add 33 ohm series termination on TCK to dampen reflections. Quartus II Programmer expects a 10-pin Altera USB-Blaster header on the board for JTAG access; reserve 25 mm x 10 mm of board space near the FPGA for this header.
Estimated: at 25C ambient and a typical industrial-utilization design (~50% LE usage, ~25% toggle rate), the EP2C35F484I8N dissipates roughly 1-2 W. The F484 BGA's exposed thermal pad (if present) must be soldered to a copper pour of at least 1 square inch on the top layer and stitched to inner ground planes with a thermal via array (0.3 mm vias, 1.2 mm pitch) to keep junction temperature below 100C at industrial temperatures. Designs that use high-utilization DSP blocks or many LVDS channels can dissipate 3-4 W; in those cases add bottom-layer copper or a small heatsink.
Common pitfalls when designing with the EP2C35F484I8N include: (1) forgetting to tie nCONFIG high through a 10 kohm pull-up, causing the device to fail configuration startup; (2) leaving VCCIO banks at different voltages that conflict with mixed I/O standards; (3) using the I8 suffix in commercial-temperature products (use C8N instead); (4) ignoring Quartus II's pinout assignments for MSEL[2:0] which set the configuration mode (AS standard = 000, AS fast = 010, PS = 100, JTAG = 101); (5) routing LVDS pairs with more than 250 mil of intra-pair skew, which exceeds Cyclone II LVDS budgets. Always run the Quartus II TimeQuest timing analyzer before tape-out to verify all timing paths.
Compliance Information
RoHS compliant per Altera/Intel product page; lead-free (Pb-free) BGA balls. Not AEC-Q100 qualified - select a Cyclone II or Cyclone IV automotive variant if automotive grade is required. Halogen-free status not stated in the provided web data.
