EP2C50U484C6N - Cyclone II FPGA 50K LE | Intel FPGAs
MPN: EP2C50U484C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $298.48 | $298.48 |
| 10 | $274.5 | $2,745.00 |
| 100 | $245 | $24,500.00 |
| 250 | $220 | $55,000.00 |
| 500 | $198.5 | $99,250.00 |
EP2C50U484C6N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. FPGAs occupy a tier between fixed-function ASICs (high NRE cost, low per-unit cost) and microcontrollers (fixed instruction set, lower throughput). The Cyclone II family, the second-generation low-cost FPGA line from Altera/Intel, is widely deployed in industrial control, communications, video processing, and education platforms, balancing logic density, embedded multipliers, and memory blocks against unit price.
The EP2C50U484C6N integrates 594,432 bits of embedded RAM distributed across M4K memory blocks and provides 250 DSP blocks for fixed- and floating-point signal processing. The 484-ball UBGA package exposes 294 user I/O pins and supports differential signaling at up to several hundred megabits per second. Clock management is handled by up to four PLLs per device, allowing flexible on-chip frequency synthesis.
Cyclone II architecture combines logic array blocks (LABs) with embedded multiplier/adder primitives and a configurable interconnect, enabling high-throughput DSP and datapath designs. The 90 nm process with low-k dielectric and 1.2 V core keeps dynamic power modest, while the I/O ring can be configured per bank to interface with 3.3 V, 2.5 V, 1.8 V, 1.5 V, or 1.2 V domains in the same device.
Typical applications include industrial motor control, video and image processing, software-defined radio front-ends, educational development boards, and embedded control prototypes. It is also commonly deployed as a custom bus bridge, protocol converter, or low-volume ASIC replacement in telecom and consumer devices.
Designers should plan thermal dissipation by estimating switching power (estimated: P = 0.5 * V * C * f * toggle_rate * density) and provide adequate decoupling. Configuration is loaded via JTAG or Active Serial (AS) mode from a low-cost EPCS serial flash, which keeps bill-of-materials cost low for production units.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, enabling engineers to compare options and select an FPGA that fits both their performance and cost envelope.
Drop-in alternatives for EP2C50U484C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C50U484C6N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, Lead-Free / RoHS.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C50U484C7N
✅ Drop-In✓ In Stock
$133.18 / Unit
View Datasheet →EP2C50U484C8N
✅ Drop-In✓ In Stock
$155.85 / Unit
View Datasheet →EP2C50U484I8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$182.6 / Unit
View Datasheet →EP2C50U484I7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP2C50U484I6N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP2C50U484C6N Maximum Ratings & Electrical Characteristics
| Series | Cyclone II |
| Logic Elements | 50,528 |
| Logic Array Blocks (LABs) | 3,158 |
| Total Memory Bits | 594,432 |
| Embedded Multiplier Blocks (DSP) | 250 (18x18) |
| PLLs | 4 |
| User I/O Pins | 294 |
| Maximum User I/O | 315 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS, low-k dielectric |
| Operating Temperature | 0C to +85C (Commercial) |
| Internal Frequency | up to 500 MHz |
| Package | 484-pin UBGA (Ultra FineLine BGA) |
| Mounting Type | Surface Mount |
| Configuration Mode | JTAG, Active Serial (AS), Passive Serial (PS) |
| Lead Free | Yes |
| RoHS Status | Compliant |
EP2C50U484C6N 484-pin ubga (ultra fineline bga) Pin Configuration Guide
Pin configuration for EP2C50U484C6N (484-pin ubga (ultra fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C50U484C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C50U484C6N is suitable for 6 applications: Industrial Motor Control, Video and Image Processing, Software-Defined Radio Front-End, Embedded Control Prototyping (Nios II soft-core), ASIC Replacement and Low-Volume Production, Education and FPGA Training Platforms.
Industrial Motor Control
The EP2C50U484C6N is well suited for industrial motor control where multiple PWM channels, encoder feedback, and field-oriented control loops must run in parallel. Its 250 18x18 multipliers handle Park and Clarke transforms, the 4 PLLs generate the timing references for resolver excitation, and 294 user I/Os accept Hall sensors, encoder quadrature, and brake FET gate drives. Unlike smaller Cyclone II parts, the 50K LE capacity allows implementation of multi-axis control plus a soft Nios II processor for housekeeping. Designers typically instantiate one PLL per motor to keep switching noise isolated and use SSTL I/O to ADC reference inputs for current sense.
Recommended
Video and Image Processing
The EP2C50U484C6N handles real-time video pipelines thanks to 594 Kbit of embedded RAM and 250 DSP blocks. Designers commonly build line buffers from M4K memory blocks to delay VGA/DVI streams, while 18x18 multipliers accelerate 2D convolution, scaling, and color-space conversion. The 294 I/Os allow direct connection to DDR memory, parallel ADC front-ends, and HDMI/DVI transceivers. With Quartus VIP and the Altera Video Suite, common operations such as deinterlacing and alpha blending fit within 50K logic elements at 60 fps, making the part a popular choice for surveillance and broadcast equipment.
Recommended
Software-Defined Radio Front-End
In software-defined radio, the EP2C50U484C6N performs digital down-conversion, channelization, and modulation/demodulation. Its 250 DSP blocks can implement up to 250 18x18 FIR taps or complex multipliers at >250 MHz, sufficient for narrowband and moderate-bandwidth waveforms. The four PLLs derive baseband, intermediate, and ADC sampling clocks from a single reference. LVDS pairs link the FPGA to high-speed ADCs and DACs commonly used in SDR front-ends. Although Cyclone II is older than modern RF FPGAs, the cost-effective LE capacity makes it attractive for ham-radio transceivers, prototyping platforms, and university research.
Recommended
Embedded Control Prototyping (Nios II soft-core)
The EP2C50U484C6N can host a Nios II/f soft processor plus custom peripherals, making it ideal for embedded control prototypes where a microcontroller is too slow but an ASIC is overkill. With 50K logic elements, designers can run a 32-bit Nios II/f at >100 DMIPS, add custom accelerators in parallel, and store firmware in on-chip ROM. Multiple PLLs generate peripheral clocks for Ethernet MAC, USB ULPI, and DDR memory controllers. The 594 Kbit of RAM is sufficient for small RTOS use cases, with off-chip SDRAM supplementing large buffers.
Recommended
ASIC Replacement and Low-Volume Production
The EP2C50U484C6N is a strong ASIC replacement for low- and mid-volume products where ASIC NRE masks and tooling costs are not amortizable. Designers integrate CPU cores, custom logic, and memory interfaces on one device, keeping unit cost low while retaining in-field reprogrammability. The 90 nm process and proven Quartus toolchain shorten development time, and the 484-UBGA package supports the high I/O count typical of bridging and protocol-conversion ASICs. It is widely used in telecom line cards, industrial gateways, and consumer audio products.
Recommended
Education and FPGA Training Platforms
Universities and training centers use the EP2C50U484C6N in DE2-115-class development boards because 50K logic elements expose students to a full design flow without overwhelming the toolchain. The board fabric includes SRAM, SDRAM, Flash, Ethernet, video DACs, audio CODECs, and GPIO headers - enough peripheral mix to teach RTL design, timing closure, soft-core integration, and SoC concepts. Quartus II Web Edition supports the device free of charge, lowering the barrier for student projects and lab assignments.
Recommended
Recommended Products Summary
Engineering reference data for EP2C50U484C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C50U484C7N | EP2C50U484C8N | EP2C50U484I6N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 484-pin UBGA | 484-pin UBGA - same | 484-pin UBGA - same | 484-pin UBGA - same |
| Series | Cyclone II | Cyclone II | Cyclone II | Cyclone II |
| Logic Elements | 50,528 | 50,528 | 50,528 | 50,528 |
| DSP Blocks | 250 (18x18) | 250 (18x18) | 250 (18x18) | 250 (18x18) |
| Embedded Memory | 594,432 bits | 594,432 bits | 594,432 bits | 594,432 bits |
| User I/O | 294 | 294 | 294 | 294 |
| Speed Grade | C6 (commercial) | C7 (faster) | C8 (fastest) | I6 (industrial) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
Key Differentiators
- Fastest speed grade vs C6N target (vs EP2C50U484C8N)
- Industrial temperature range (vs EP2C50U484I6N)
- Larger embedded memory vs smaller Cyclone II parts (vs EP2C20F484C8N)
Design Notes
Estimated core power for a 50% utilization Cyclone II design at 250 MHz is roughly 0.5-1.0 W. Decouple the 1.2 V core rail with 4-6 low-ESR 100 nF ceramics near each VCCINT ball group, plus a bulk 220 uF tantalum. VCCAUX (2.5 V) and VCCIO banks require 100 nF per pin group. Use one dedicated ground plane tied to the thermal pad to keep return paths short.
The 484-UBGA uses a staggered 1.00 mm pitch ball array. Route signals on inner layers using 0.1 mm traces with 0.2 mm spacing and keep power shapes on outer layers. Provide microvia-in-pad if using HDI stack-up; standard through-via designs work but increase breakout difficulty. Matched-length routing within +/-25 mil is needed for LVDS pairs at >400 Mbps.
Estimated junction temperature rise for full-utilization 50K-LE design at 250 MHz is roughly 15-20 C with adequate airflow. Place thermal vias under the package thermal pad and connect them to a continuous ground plane. In enclosed industrial enclosures, derate clock frequency by 25% if ambient exceeds 60 C. The -I (industrial) variant is recommended above 85 C ambient.
Do not leave JTAG TCK floating - tie it to GND through 10 kohm when unused to prevent accidental configuration. Use Active Serial (AS) mode with an EPCS16 or larger for production to keep BOM cost low. Always configure unused user I/O pins as tri-stated inputs with weak pull-up, otherwise they may source/sink current and increase I/O power.
Compliance Information
RoHS-compliant per Intel/Altera product page. Halogen-free status not explicitly listed in the verified web data and should be confirmed against the manufacturer's MDDS. Not AEC-Q100 qualified - choose automotive-grade Cyclone IV or Cyclone V families for AEC-Q100 designs.
