EP2C50U484C8N - Cyclone II FPGA, 50K LE, 484-FBGA | Intel
MPN: EP2C50U484C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $196.84 | $196.84 |
| 10 | $188.55 | $1,885.50 |
| 100 | $175.2 | $17,520.00 |
| 250 | $165.4 | $41,350.00 |
| 500 | $155.85 | $77,925.00 |
EP2C50U484C8N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and multiplier blocks that can be reconfigured by the designer after manufacture. FPGAs sit in the programmable logic hierarchy between general-purpose microcontrollers and ASICs: they offer higher performance and parallelism than MCUs, but lower per-unit cost and shorter time-to-market than full-custom ASICs for low-to-medium volumes. The Cyclone II family targets cost-sensitive applications such as consumer, communications, industrial, and automotive driver assistance.
Key features of the EP2C50U484C8N include up to 86 embedded 18x18 multipliers, 4 PLLs, support for external memory interfaces including DDR, DDR2, SDR SDRAM, and QDRII SRAM, and configuration via passive serial, active serial, or JTAG. The -C8 speed grade specifies a commercial temperature range (0C to +85C) with the mid-tier timing closure, and the 'N' suffix denotes lead-free / RoHS-compliant packaging.
Architecture-wise, Cyclone II uses 4-input look-up tables (LUT4) per logic element with associated carry and register chains, delivering predictable timing and high logic utilization. The 90 nm process keeps static and dynamic power low versus the previous Cyclone generation, while the embedded M4K memory blocks can be configured in widths from x1 to x36 and depths up to 4 Kbits, supporting true dual-port, simple dual-port, and single-port RAM plus FIFO and shift-register modes.
Typical applications include video processing pipelines, industrial control and machine vision, motor control, protocol bridging (UART/SPI/I2C to Ethernet or PCIe soft IP), telecom line cards, and educational / development boards. Designers migrating from ASICs or larger FPGAs frequently select this device for cost-down on proven designs.
When designing with this device, pay close attention to power estimation using the Intel PowerPlay Early Power Estimator before final pin assignment, and reserve dedicated clock pins and PLL reference inputs for low-jitter clocking. The 484-FBGA package requires controlled-impedance PCB design with microvia or via-in-pad capability for reliable assembly.
This page synthesizes distributor pricing, package-compatible drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single source for sourcing and selection decisions.
Drop-in alternatives for EP2C50U484C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C50U484C8N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C50U484C7N
✅ Drop-In✓ In Stock
$133.18 / Unit
View Datasheet →EP2C50U484C7
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2C50U484C6N
✅ Drop-In✓ In Stock
$198.5 / Unit
View Datasheet →EP2C50U484C6
✅ Drop-In✓ In Stock
$115.42 / Unit
View Datasheet →EP2C50U484C8
✅ Drop-In✓ In Stock
$72.89 / Unit
View Datasheet →EP2C50F484C8N
✅ Drop-In✓ In Stock
$68.2 / Unit
View Datasheet →EP2C50U484C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone II |
| Family | Cyclone II (90 nm) |
| Logic Elements (LE) | 50,528 |
| Embedded Memory (M4K blocks) | 594,432 bits (129 M4K blocks) |
| Embedded 18x18 Multipliers | 86 |
| PLLs | 4 |
| User I/Os | 294 |
| I/O Banks | 8 |
| Speed Grade | C8 (commercial, mid-tier) |
| Operating Temperature | 0C to +85C (commercial) |
| Package | 484-ball FBGA (UBGA-484) |
| Mounting Type | Surface Mount |
| Process Technology | 90 nm low-k CMOS |
| Configuration Methods | Passive Serial, Active Serial, JTAG |
| Memory Interface Support | DDR, DDR2, SDR SDRAM, QDRII SRAM |
| RoHS Status | Compliant (lead-free) |
| MSL Level | 3 (168 hours) |
EP2C50U484C8N 484-ball fbga (ubga-484) Pin Configuration Guide
Pin configuration for EP2C50U484C8N (484-ball fbga (ubga-484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C50U484C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C50U484C8N is suitable for 6 applications: Video Processing Pipeline, Industrial Motor Control, Communications Protocol Bridging, Telecom Line Card Glue Logic, Machine Vision and Image Pre-Processing, Development and Education Platform.
Video Processing Pipeline
The EP2C50U484C8N fits video processing applications because its 50,528 logic elements and 594 Kbits of embedded M4K memory provide line-buffer and frame-buffer capacity for resolutions up to 1080p60, while its 86 embedded 18x18 multipliers enable real-time color-space conversion, scaling, and edge enhancement. The 294 user I/Os in 8 banks comfortably handle parallel video buses (24-bit RGB plus control) plus BT.656 / BT.1120 serial streams, and the 4 PLLs derive pixel clocks from external 27/74.25/148.5 MHz references. Designers typically instantiate VIP (Video and Image Processing) Suite IP from Quartus II for Bayer demosaic, gamma correction, and chroma resampling. Power dissipation in a typical HD pipeline stays below 2 W with the 90 nm Cyclone II process, removing the need for forced-air cooling.
Recommended
Industrial Motor Control
The EP2C50U484C8N is well suited to industrial motor control loops because its high logic count supports FOC (Field-Oriented Control) and space-vector PWM IP at switching frequencies up to 50 kHz with sub-microsecond control loop latency. The Cyclone II's 4 PLLs generate the precise PWMC and ADC-sampling clocks, while 294 user I/Os interface with multi-axis resolver feedback, encoder inputs (QEP), gate drivers, and SPI-controlled power-stage telemetry. Industrial-grade -I7N variants exist for harsh environments. According to the Cyclone II datasheet, the device supports 3.3 V LVTTL/LVCMOS and differential I/O standards (LVDS, RSDS) for noise-immune encoder links. Designers implement protection schemes (over-current, desaturation, brake interlocks) in hardware logic for sub-microsecond response.
Recommended
Communications Protocol Bridging
The EP2C50U484C8N excels at protocol bridging applications such as UART/SPI/I2C-to-Ethernet or PCIe conversion because 50K logic elements plus 86 multipliers can implement soft 10/100 Ethernet MACs or PCIe Gen1 endpoint controllers alongside legacy peripherals. The Cyclone II supports multiple I/O standards (LVDS, SSTL, HSTL) on the same die, allowing direct connection to DDR/DDR2 memories for packet buffering with 594 Kbits of internal block RAM handling descriptors and headers. Designers use Nios II soft-core processors for protocol stack processing. According to Intel reference designs, a typical multi-protocol bridge fits in 30-40% of the device's logic resources with headroom for traffic shaping and statistics counters.
Recommended
Telecom Line Card Glue Logic
Telecom line cards use the EP2C50U484C8N for backplane interfacing, TDM bus aggregation, and protocol translation between T1/E1 framers and packet networks. The device's 4 PLLs synchronize to backplane clocks while 8 I/O banks support mixed voltage standards (1.5V HSTL, 1.8V LVCMOS, 2.5V LVCMOS, 3.3V LVTTL) on a single chip, eliminating external level shifters. The 86 embedded multipliers can implement FEC (forward error correction) or DSP filtering for line conditioning. Cyclone II's hardware CRC engines accelerate HDLC/PPP framing. According to the Cyclone II handbook, sustained LVDS performance exceeds 600 Mbps per pair, adequate for gigabit serial backplane links.
Recommended
Machine Vision and Image Pre-Processing
The EP2C50U484C8N is a cost-effective platform for industrial machine vision pre-processing tasks including Bayer demosaic, lens-shading correction, and histogram equalization. With 50K logic elements, the device implements these pipelines at 60-120 fps for 2-megapixel sensors using parallel logic and M4K block RAM for line buffers. The 86 18x18 multipliers accelerate 2D convolution filters for edge detection. Designers use Camera Link or MIPI-CSI2 adapters (via LVDS pairs) to interface industrial cameras; the device's LVDS I/O supports up to 640 Mbps per pair. Pre-processed frames are forwarded to a host CPU over Gigabit Ethernet or USB 3.0 soft cores.
Recommended
Development and Education Platform
The EP2C50U484C8N is widely deployed on educational development boards (Terasic DE2, Altera Cyclone II Starter Kit) because 50K logic elements provide sufficient resources for student projects including Nios II soft-core processors, VGA controllers, audio processing, and custom peripherals. Quartus II Web Edition (free) supports the full Cyclone II family, removing licensing barriers. The 484-FBGA package is impractical for hand-soldering, but commercial dev boards expose all 294 user I/Os through headers for breadboard experimentation. Course labs typically demonstrate RISC soft-core instantiation, custom instruction acceleration, and real-time video/audio processing on this part.
Recommended
Recommended Products Summary
Engineering reference data for EP2C50U484C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C50U484C7N | EP2C50U484C7 | EP2C50U484C6N | EP2C50U484C6 | EP2C50U484C8 | EP2C50F484C8N |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (UBGA-484) | 484-FBGA (UBGA-484) - same | 484-FBGA (UBGA-484) - same | 484-FBGA (UBGA-484) - same | 484-FBGA (UBGA-484) - same | 484-FBGA (UBGA-484) - same | 484-FBGA (UBGA-484) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C8 (commercial, mid-tier) | C7 (slower) | C7 (slower) | C6 (slowest) | C6 (slowest) | C8 (same) | C8 (same) |
| Logic Elements | 50,528 | 50,528 | 50,528 | 50,528 | 50,528 | 50,528 | 50,528 |
| Embedded Memory (bits) | 594,432 | 594,432 | 594,432 | 594,432 | 594,432 | 594,432 | 594,432 |
| 18x18 Multipliers | 86 | 86 | 86 | 86 | 86 | 86 | 86 |
| User I/Os | 294 | 294 | 294 | 294 | 294 | 294 | 294 |
| Lead-Free (RoHS) | Yes (N suffix) | Yes | No (leaded) | Yes | No (leaded) | No (leaded) | Yes |
| Variant | U (standard) | U | U | U | U | U | F (Fast) |
Key Differentiators
- Lead-free / RoHS-compliant terminal finish (vs EP2C50U484C8)
- Same die with faster speed-grade option available (vs EP2C50U484C6N)
- Standard 'U' (Ultra) variant for cost-optimized designs (vs EP2C50F484C8N)
- Wide distributor channel availability as of 2026 (vs EP2C50F484I7N)
Design Notes
The Cyclone II EP2C50 dissipates between 0.5 W (idle, low toggle rates) and 2-3 W (fully utilized with 100% I/O toggle at 200 MHz). The 484-FBGA package has a theta_JA of approximately 15 C/W with a standard 4-layer JEDEC test board (no airflow), so worst-case junction rise above ambient is around 45 C. For designs that run near full utilization continuously, include thermal vias under the package center array and a small copper heat spreader on the top side to keep Tj below 100 C.
The 484-FBGA uses 1.0 mm ball pitch and requires microvia or via-in-pad PCB technology for reliable assembly. Standard 0.4 mm via-pad pitch is achievable with 4-mil laser-drilled microvias (stacked or staggered). Reflow profile must follow JEDEC J-STD-020 MSL-3 (168-hour floor life), so the part must be baked before assembly if the bag has been open more than 168 hours. Use no-clean flux and post-reflow x-ray inspection of every BGA joint.
Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet before final pin assignment to estimate core and I/O power. Typical static current is around 0.3 A at 1.2 V core; dynamic current scales with toggle rate and clock frequency. Decouple the core supply (VCCINT) with at least six 0.1 uF + four 4.7 uF ceramic capacitors placed directly under the package, plus a bulk 100 uF tantalum or polymer capacitor at the regulator output.
Do not leave any I/O bank unused without proper VREF and VCCIO termination - floating banks can draw excess current and inject noise into adjacent banks. Always strap CONFIG_DONE, nCONFIG, and nSTATUS to valid logic levels during operation. The Cyclone II does not retain configuration without an external configuration device, so include an EPCS serial flash on every board even for prototyping. Reset the FPGA after power-up before any configuration attempt.
For DDR/DDR2 interfaces, use the Cyclone II's dedicated DQS/DQSn pins (not regular LVDS) and follow the Cyclone II External Memory Interface Guidelines for trace matching (within +/-25 ps for DDR2-400). Enable on-die termination (OCT) for both read and write paths. For source-synchronous LVDS interfaces, enable Dynamic Phase Alignment (DPA) to absorb board skew up to one bit period.
Compliance Information
RoHS compliance and lead-free terminal finish confirmed by 'N' suffix in MPN and Altera/Intel product page. Halogen-free status not explicitly confirmed in verified data - marked as unknown. Not AEC-Q100 qualified; choose -I7N industrial-temperature variants (-40C to +100C) for harsh-environment applications. Cyclone II family is included in Intel's product longevity program with guaranteed supply through 2027.
