EP2C50U484I8 - Cyclone II FPGA, 50K LEs, 484-FBGA | Intel / Altera
MPN: EP2C50U484I8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $243.89 | $243.89 |
| 10 | $232.5 | $2,325.00 |
| 100 | $215 | $21,500.00 |
| 500 | $198.4 | $99,200.00 |
| 1,000 | $184.2 | $184,200.00 |
EP2C50U484I8 Overview
This page synthesizes distributor pricing, drop-in same-package alternatives, design pitfalls, and pinout details not consolidated on any single distributor or manufacturer page. For a complete parametric comparison against same-family Cyclone II variants and pin-compatible Lattice/Xilinx equivalents in the 484-BGA footprint, see the comparison_table, alternatives, and selection_guide sections below.
Drop-in alternatives for EP2C50U484I8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C50U484I8 (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C50U484C8N
✅ Drop-In✓ In Stock
$155.85 / Unit
View Datasheet →EP2C50U484C7N
✅ Drop-In✓ In Stock
$133.18 / Unit
View Datasheet →EP2C50U484C6N
✅ Drop-In✓ In Stock
$198.5 / Unit
View Datasheet →EP2C50U484C8
✅ Drop-In✓ In Stock
$72.89 / Unit
View Datasheet →EP2C50F484I8N
✅ Drop-In✓ In Stock
$148.9 / Unit
View Datasheet →EP2C50U484C7
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2C50U484C6
✅ Drop-In✓ In Stock
$115.42 / Unit
View Datasheet →EP2C50U484I8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements | 50,528 LEs |
| Total RAM Bits | 594,432 bits |
| Embedded Multipliers (18x18) | 172 |
| User I/O Pins | 294 |
| Package | 484-ball FineLine BGA (UBGA), 23x23 mm |
| Core Voltage | 1.2 V |
| I/O Bank Count | 8 (supports 1.5/1.8/2.5/3.3 V) |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Process Node | 90 nm |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Speed Grade | I8 (fastest timing closure in Cyclone II) |
| Mounting Type | Surface Mount (BGA) |
EP2C50U484I8 484-ball fineline bga (ubga), 23x23 mm Pin Configuration Guide
Pin configuration for EP2C50U484I8 (484-ball fineline bga (ubga), 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C50U484I8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C50U484I8 is suitable for 6 applications: Industrial Video Processing Systems, Telecommunications Backplane Bridging, Legacy DSP Co-Processor / Accelerator, Display Controller and LCD Interface Bridging, Motor Control and Drive Electronics, Medical Imaging Signal Conditioning.
Industrial Video Processing Systems
The EP2C50U484I8's combination of 50,528 logic elements, 594 Kbits of embedded M4K RAM, and 172 dedicated 18x18 multipliers is well-matched to industrial video pipeline designs such as machine-vision inspection, surveillance DVRs, and broadcast format converters. The 294 user I/O pins support parallel RGB/YCbCr interfaces, BT.656 video ports, and SDRAM/DDR memory buses typically needed for line buffers and frame stores. Cyclone II multipliers accelerate DCT/IDCT transforms for MJPEG and MPEG-2 compression at SD and lower HD resolutions. The -40C to +100C industrial temperature grade and the obsolete but well-understood Quartus II 13.0sp1 toolchain make this FPGA a long-life workhorse for factory-floor vision systems where 5-10 year production continuity is mandatory.
Recommended
Telecommunications Backplane Bridging
The 294 high-speed I/O pins on the EP2C50U484I8 are ideal for telecom backplane bridging designs that aggregate multiple lower-speed serial links (E1/T1, LVDS pairs) into higher-speed trunks. Cyclone II supports LVDS, LVPECL, and SSTL I/O standards, enabling direct connection to serializer/deserializer (SERDES) companion chips without external level translators. The 16 global clock networks and 4 PLLs provide the deterministic clocking required for synchronous telecom backplanes. Embedded multipliers can implement DSP functions such as pre-emphasis, equalization coefficient multiplication, or PCM encoding/decoding. Industrial temperature operation ensures reliability in uncontrolled central-office environments where ambient temperatures can swing widely.
Recommended
Legacy DSP Co-Processor / Accelerator
The 172 embedded 18x18 multipliers on the EP2C50U484I8 make it well-suited for use as a co-processor or accelerator alongside a microcontroller or DSP, offloading compute-intensive FIR/IIR filters, FFTs, and matrix operations. The 594 Kbits of M4K RAM provide coefficient and sample storage without external memory access, reducing latency in tight control loops. Designers can implement 4-tap to 64-tap FIR filters in real time for audio, vibration analysis, or motor control applications. The 50K-LE capacity allows integration of the host CPU bus interface (e.g., external memory interface or parallel port) on-chip, reducing BOM cost. Industrial temperature grade suits motor drive and process control applications.
Recommended
Display Controller and LCD Interface Bridging
The 294 user I/O pins and 50K-LE capacity make the EP2C50U484I8 a strong fit for display controller designs that bridge between host processors (ARM, x86) and LCD panels over LVDS, TTL RGB, or HDMI (via external TMDS transmitter). M4K RAM blocks implement line buffers for panel timing conversion, scan-rate doubling, and color-space conversion. Embedded multipliers support gamma correction and dithering operations in real time at video rates. The 484-BGA package supports the wide parallel buses required for large TFT panels. Industrial temperature operation suits outdoor kiosks, factory HMI panels, and digital signage that must operate across wide thermal ranges.
Recommended
Motor Control and Drive Electronics
The EP2C50U484I8's industrial temperature grade, abundant logic capacity, and 172 embedded multipliers are well-suited for multi-axis motor control applications including servo drives, variable-frequency drives (VFDs), and CNC machine controllers. Cyclone II implements vector-control (FOC) algorithms, space-vector PWM (SVPWM) generators, encoder-interface logic, and over-current protection in a single device. The 4 PLLs and 16 global clocks synchronize ADC sampling with PWM switching to minimize measurement-to-actuation latency. Industrial -40C to +100C operation covers cabinet-mounted and under-hood-adjacent installations. The obsolete status is acceptable in motor-control applications where 10+ year product lifecycles are routine.
Recommended
Medical Imaging Signal Conditioning
The Cyclone II EP2C50U484I8 supports medical imaging front-end designs such as ultrasound beamformers, MRI gradient controllers, and patient monitor signal conditioning where deterministic real-time DSP is required. The 172 18x18 multipliers implement beamforming delay-and-sum operations across 32-64 channels at ultrasound sampling rates, while the M4K RAM holds channel coefficients and circular sample buffers. The industrial temperature range covers imaging-cart and bedside-monitor deployments. Long-term availability through secondary distributors is critical for medical device manufacturers whose FDA-cleared designs cannot easily switch FPGAs without re-validation. The EP2C50U484I8's known-good toolchain and stable silicon make it a defensible choice for legacy medical platforms.
Recommended
Recommended Products Summary
Engineering reference data for EP2C50U484I8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C50U484C8N | EP2C50U484C7N | EP2C50U484C6N | EP2C50F484I8N |
|---|---|---|---|---|---|
| Package | 484-FBGA (UBGA), 23x23 mm | 484-FBGA (UBGA) - same | 484-FBGA (UBGA) - same | 484-FBGA (UBGA) - same | 484-FBGA (FBGA) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 50,528 LEs | 50,528 LEs - same | 50,528 LEs - same | 50,528 LEs - same | 50,528 LEs - same |
| Embedded RAM | 594,432 bits | 594,432 bits - same | 594,432 bits - same | 594,432 bits - same | 594,432 bits - same |
| Embedded Multipliers (18x18) | 172 | 172 - same | 172 - same | 172 - same | 172 - same |
| User I/O Pins | 294 | 294 - same | 294 - same | 294 - same | 294 - same |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | I8 (fastest) | C8 (fastest commercial) | C7 (mid commercial) | C6 (slowest) | I8 (fastest) |
Key Differentiators
- Highest speed bin (I8) in the EP2C50 family (vs EP2C50U484C7N)
- Industrial temperature operating range (vs EP2C50U484C8N)
- Compact 484-BGA footprint with high I/O count (vs EP2C50F672I8 (672-BGA))
Design Notes
Estimated: at typical Cyclone II EP2C50U484I8 utilization (60% LEs, 80% RAM, 50% multipliers) with all I/O switching at 100 MHz, junction-to-ambient thermal resistance (theta_JA) for the 484-BGA is approximately 14 C/W on a standard JEDEC 4-layer test board with still air. Continuous operation above 70C ambient should be verified with on-board thermal measurement, especially when the device is mounted on a small PCB with limited copper pour. Adding thermal vias under the center BGA balls and a top-side copper spreader can reduce theta_JC by 30-50% in constrained enclosures. Designers should consult the Altera Cyclone II Handbook thermal management chapter for power-consumption estimation spreadsheets tied to design utilization.
The 484-ball FineLine BGA uses a 1.0 mm ball pitch, which is at the practical limit for many assembly houses using laser-vision alignment. Use NSMD (non-solder-mask-defined) pads with 0.45 mm diameter, ENIG or OSP surface finish, and 0.20 mm solder-mask openings to maximize assembly yield. Route signal traces on inner layers with 0.10 mm width/spacing rules; escape the BGA in a dog-bone pattern on the top layer and via-in-pad on critical high-speed signals. Power and ground balls should be connected directly to inner-plane layers with minimum 0.20 mm thermal relief spokes. After assembly, X-ray inspection of all 484 balls is mandatory; optical inspection cannot reach hidden joints under the package.
Cyclone II EP2C50U484I8 designs using Quartus II 13.0sp1 or earlier must explicitly enable the device in the Project Settings dialog; selecting 'EP2C50' without the speed grade and package suffix will result in fitter errors or, worse, silently generating a pinout for the wrong package. The 'U' vs 'F' package suffix indicates different ball maps within the 484-BGA footprint - substituting U484 for F484 without re-running the fitter will produce incorrect pin assignments. Industrial temperature parts (I8) must be ordered explicitly; the C8 variants cannot be used in -40C applications. Configuration via EPCS or JTAG should use the dedicated configuration pins; reusing them as user I/O requires disabling the configuration mode and is not recommended for production designs.
The Cyclone II I/O banks on the EP2C50U484I8 support LVDS inputs and outputs but require external 100-ohm differential termination across the LVDS pair at the receiver. Series damping resistors on single-ended outputs (33-ohm typical) reduce ringback on long PCB traces (>50 mm) to unterminated loads. PLL output clocks routed to global clock networks should use the dedicated CLK pins; routing clocks through general-purpose I/O introduces 1-2 ns of jitter that may violate downstream source-synchronous timing budgets. SSTL-2 Class I/II memory interfaces require 50-ohm series termination at the FPGA output for DDR SDRAM operation above 133 MHz; the Cyclone II handbook provides IBIS models for board-level SI simulation.
Compliance Information
RoHS and lead-free status for the EP2C50U484I8 'U' (non-N suffix) variant is not specified in the verified web data; the 'N' suffix variants (e.g., EP2C50U484C8N) are Pb-free per Altera's naming convention, but the 'U' variant without 'N' may use a non-Pb-free finish. Marked [DATA_NEEDED] in specs. Not AEC-Q100 qualified - FPGAs in this family are not automotive-qualified.
