EP2C5F256C6N - 4,608 LEs Cyclone II FPGA 256-FBGA | Intel / Altera
MPN: EP2C5F256C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $19.8 | $198.00 |
| 100 | $16.5 | $1,650.00 |
| 500 | $13.95 | $6,975.00 |
| 1,000 | $11.4 | $11,400.00 |
EP2C5F256C6N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened blocks such as block RAM, multipliers, and PLLs. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) under digital logic ICs, enabling parallel hardware execution that microcontrollers and DSPs cannot match. Cyclone II was Altera's second-generation low-cost family, extending FPGA density up to 68,416 LEs in the family ceiling while keeping unit cost low enough for consumer and industrial volume.
Key features of the EP2C5F256C6N include 4,608 logic elements, 119,808 embedded RAM bits (M4K) organized into 26 blocks of 4,608 bits each, two general-purpose PLLs, 158 maximum user I/Os, and a 1.2 V core supply with hot-socketing support. The 256-pin FineLine BGA package measures 17 mm × 17 mm with a 1.0 mm ball pitch, balancing board routability against compact PCB area.
Architecturally, Cyclone II uses a 90 nm CMOS process, an SRAM-based configuration cell (volatile, requiring a configuration flash or EPCS device at boot), and embedded M4K memory blocks supporting true dual-port and single-port modes at up to 250 MHz. The device is configured via JTAG or Active Serial using the EPCS series configuration devices. Performance typically reaches 150 MHz internal logic operation, with internal multipliers absent on this density (Cyclone II multipliers start on the EP2C20 and larger).
Typical applications include industrial motor control and factory automation, video processing and image-pipeline front ends, consumer electronics requiring custom glue logic, telecommunications line-card glue logic, educational FPGA development boards, and low-cost prototyping platforms. Designers choose the EP2C5F256C6N when they need a low-density, low-cost FPGA with enough I/O to interface to memory buses and parallel peripherals.
When designing with this FPGA, plan the configuration memory (an EPCS1/EPCS4 serial flash is recommended) and verify the I/O bank voltage compatibility (LVTTL, LVCMOS, SSTL, HSTL on most banks). The 1.2 V core requires a stable regulator; consider decoupling bulk and ceramic caps within 100 mils of each VCC/VCCINT ball per Altera's cyclone II handbook layout guide.
This page synthesizes distributor pricing, same-package Cyclone II alternatives, and practical Quartus II configuration notes that the manufacturer datasheet alone does not surface.
Drop-in alternatives for EP2C5F256C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C5F256C6N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, RoHS Status, Total RAM Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C5F256C7N
✅ Drop-In✓ In Stock
$23.4 / Unit
View Datasheet →EP2C5F256C8N
✅ Drop-In✓ In Stock
$11.84 / Unit
View Datasheet →EP2C5F256I7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP2C5F256A7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP2C8F256C6N
✅ Drop-In✓ In Stock
$31.2 / Unit
View Datasheet →EP2C8F256C7N
✅ Drop-In✓ In Stock
$8.31 / Unit
View Datasheet →EP2C5F256C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements | 4,608 |
| Embedded Memory Bits | 119,808 bits |
| Embedded Memory Blocks (M4K) | 26 blocks of 4,608 bits |
| Maximum User I/Os | 158 |
| PLLs | 2 |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Package | 256-ball FineLine BGA (FBGA), 17x17 mm, 1.0 mm pitch |
| Configuration Method | JTAG, Active Serial (EPCS) |
| Operating Temperature (Commercial, C6) | 0C to +85C |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
EP2C5F256C6N 256-ball fineline bga (fbga), 17x17 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2C5F256C6N (256-ball fineline bga (fbga), 17x17 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C5F256C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C5F256C6N is suitable for 6 applications: Industrial Motor Control and Factory Automation, Video Processing and Image Pipeline Front Ends, Consumer Electronics Custom Glue Logic, Telecommunications Line-Card Glue Logic, Educational FPGA Development Boards, Low-Cost Prototyping Platform.
Industrial Motor Control and Factory Automation
The EP2C5F256C6N is well-suited for industrial motor control and factory automation because it integrates 158 user I/Os to interface directly to encoder feedback, PWM outputs, and multiple sensor buses. With 4,608 logic elements, the device can host a soft-core CPU (Nios II/e) for supervisory logic while dedicating dedicated fabric to PWM generation, current sensing, and field-oriented control loops. The 26 M4K blocks (119,808 bits) provide ample buffer space for velocity and position look-up tables, while the two PLLs synthesize the precise clock domains required by Sigma-Delta ADC interfaces. Industrial designs benefit from the same-package drop-in to EP2C5F256I7N when extended temperature operation is needed.
Recommended
Video Processing and Image Pipeline Front Ends
For video processing and image pipeline front ends, the EP2C5F256C6N provides the right balance of parallel fabric and embedded memory at a Cyclone II price point. The 26 M4K blocks (4,608 bits each) implement line buffers for video scaling and color-space conversion pipelines without external SRAM. Its 158 user I/Os accept parallel ITU-R BT.656 / DVI/TTL video buses, while the two PLLs generate pixel clocks and timing references with sub-nanosecond jitter. Designers targeting up to 720p video can use this device as a pre-processing front end before a higher-density FPGA or dedicated video encoder. The 256-FBGA package provides the signal integrity required for 100+ MHz parallel video buses.
Recommended
Consumer Electronics Custom Glue Logic
The EP2C5F256C6N is a popular choice for consumer electronics custom glue logic, replacing discrete TTL/CMOS ICs with a single programmable device. The 4,608 LEs consolidate board-level glue logic, custom timing controllers, and protocol bridges (I2C to SPI, UART to parallel) while reducing BOM cost and PCB area. The 1.2 V core and configurable I/O voltages (1.5/1.8/2.5/3.3 V) simplify interfacing with mixed-voltage system-on-chips common in set-top boxes and digital cameras. Hot-socketing support enables field upgrades without powering down the host. The commercial temperature grade (0C to +85C) is ideal for indoor consumer products where industrial-grade parts would be over-specified.
Recommended
Telecommunications Line-Card Glue Logic
In telecommunications line cards, the EP2C5F256C6N implements low-density glue logic and protocol adaptation between PHY devices, framers, and backplane SERDES interfaces. Its 158 user I/Os and 2 PLLs allow routing of multiple T1/E1 links, while M4K memory blocks buffer HDLC frames and packet payloads. Cyclone II is well-documented in telecom reference designs and benefits from a mature IP ecosystem (Nios II, PCML, RapidIO). The 256-FBGA package supports controlled-impedance board designs required by telecom line cards. For new designs, consider migrating to Cyclone IV E which offers lower power and longer lifecycle support.
Recommended
Educational FPGA Development Boards
The EP2C5F256C6N has been a workhorse on educational FPGA development boards from Terasic and others, providing students with enough logic (4,608 LEs), memory (119,808 bits), and I/O (158 pins) to learn Verilog/VHDL, implement soft-core CPUs (Nios II), and prototype real peripherals. Its mature Quartus II toolchain is well-documented in textbooks and tutorials. The 256-FBGA package exposes enough I/O to drive VGA/DVI, audio codecs, DRAM, and GPIO headers simultaneously. The -6 commercial speed grade provides headroom for student timing closure. Educators appreciate the vast reference designs, lab manuals, and IP cores available online.
Recommended
Low-Cost Prototyping Platform
For low-cost prototyping, the EP2C5F256C6N delivers FPGA fabric at under USD 25 per unit (as of 2026-09-08), making it attractive for early-stage hardware validation, proof-of-concept builds, and reference designs. The 4,608 LEs accommodate substantial test logic, and the 119,808 bits of embedded RAM support realistic buffer and queue scenarios. Designers can prototype in this device and migrate to the pin-compatible EP2C8F256C7N if utilization exceeds 70% - the upgrade preserves the PCB layout and pin assignments. Active Serial configuration via EPCS1/EPCS4 simplifies board bring-up, while JTAG supports rapid iteration during development.
Recommended
Recommended Products Summary
Engineering reference data for EP2C5F256C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C5F256C7N | EP2C5F256C8N | EP2C5F256I7N | EP2C8F256C6N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-FBGA (17x17 mm, 1.0 mm pitch) | 256-FBGA (17x17 mm, 1.0 mm pitch) - same | 256-FBGA (17x17 mm, 1.0 mm pitch) - same | 256-FBGA (17x17 mm, 1.0 mm pitch) - same | 256-FBGA (17x17 mm, 1.0 mm pitch) - same |
| Logic Elements | 4,608 | 4,608 | 4,608 | 4,608 | 8,256 |
| Embedded Memory (bits) | 119,808 | 119,808 | 119,808 | 119,808 | 165,888 |
| Maximum User I/Os | 158 | 158 | 158 | 158 | 158 |
| PLLs | 2 | 2 | 2 | 2 | 2 |
| Speed Grade | -6 | -7 | -8 | -7 | -6 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Fastest speed grade in the EP2C5 family (vs EP2C5F256C8N)
- Lowest-cost entry into 256-FBGA Cyclone II family (vs EP2C8F256C6N)
- Commercial temperature range (0C to +85C) (vs EP2C5F256I7N)
Design Notes
The EP2C5F256C6N requires a stable 1.2 V core supply (VCCINT) capable of delivering up to approximately 500 mA under typical operating conditions, plus separate VCCIO rails for each I/O bank (1.5/1.8/2.5/3.3 V). Use a low-dropout regulator with output accuracy within ±3% and place bulk capacitors (22 µF tantalum or 47 µF ceramic) within 100 mils of each VCCINT ball. Add 0.1 µF and 0.01 µF ceramic decoupling caps in parallel for high-frequency noise suppression. Estimated: total quiescent power approximately 0.6 W at 25°C, 0% toggle, 0% I/O activity.
The 256-FBGA package with 1.0 mm ball pitch requires a 4- or 6-layer PCB stackup with microvia or via-in-pad technology for reliable assembly. Per Altera Cyclone II Handbook layout guidelines, route signals on inner layers with continuous ground planes beneath the BGA to control impedance and reduce crosstalk. Maintain at least 8 mil trace width and 4 mil spacing within the BGA break-out region. After layout, run signal-integrity simulations on critical buses (clock, parallel video, DRAM) using HyperLynx or similar tools.
Do not assume the EP2C5F256C6N is pin-compatible with Cyclone IV E (EP4CE6E22C8N) - ball assignments differ even though both use 256-FBGA packages. Also note that Cyclone II is volatile SRAM-based: without an EPCS configuration flash attached, the FPGA will not boot. MSL3 moisture-sensitivity level requires proper dry-bag storage and reflow profile compliance. Estimated: typical reflow peak temperature 245°C (Pb-free) per JEDEC J-STD-020.
Compliance Information
RoHS/REACH compliance not confirmed in verified web data - marked as [DATA_NEEDED: rohs_status]. The EP2C5F256C6N is the commercial-grade variant (not AEC-Q100); use EP2C5F256A7N for automotive applications.
