EP2C5F256C8N - Cyclone II FPGA, 4.6K LEs, 158 I/O | Altera / Intel
MPN: EP2C5F256C8N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $17.49 | $17.49 |
| 10 | $15.74 | $157.40 |
| 100 | $14.12 | $1,412.00 |
| 500 | $12.95 | $6,475.00 |
| 1,000 | $11.84 | $11,840.00 |
EP2C5F256C8N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) in the broader semiconductor integrated circuit hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit). FPGAs differ from fixed-function ASICs because their logic fabric, routing, and I/O behavior are configured by the user after manufacture via a hardware description language (HDL) bitstream. The Cyclone II family targets cost-sensitive, low-power applications such as digital signal processing bridging, I/O expansion, and glue-logic replacement.
Key features include 4,608 LEs arranged in 288 logic array blocks (LABs), 119,808 bits (approximately 14.6 Kbytes) of M4K embedded memory blocks, 13 embedded 18x18 multipliers, two PLLs for clock management, and 158 maximum user I/O pins. The device supports LVTTL, LVCMOS, SSTL, and LVDS I/O standards with hot-socket insertion capability, enabling robust board-level design.
The Cyclone II architecture pairs a four-input look-up table (LUT) LE with efficient carry chains for arithmetic, dedicated memory blocks for FIFO and buffer use, and DSP blocks for multiply-accumulate operations. Configuration is stored in SRAM and loaded from a serial or parallel flash via Altera/Intel Quartus design software, supporting JTAG (IEEE 1149.1) and passive serial modes.
Typical applications include industrial motor control, video processing bridges, communication protocol bridging (UART, SPI, I2C, PCIe endpoint soft IP), low-cost DSP front-ends, and embedded display controllers. The 256-ball FineLine BGA also supports designs migrating from legacy Altera Cyclone and Cyclone II designs where pin-compatible higher-density variants are required.
When designing with this device, ensure the 1.2 V core rail is decoupled with multiple low-ESR capacitors close to the package and that the JTAG chain is accessible for in-system programming. Heat dissipation is modest due to the 90 nm process, but designers should still respect the JEDEC JESD51 thermal recommendations.
This page synthesizes distributor pricing, drop-in compatible pin-compatible alternatives from the same Cyclone II family, and practical design considerations not found in the standalone manufacturer datasheet.
Drop-in alternatives for EP2C5F256C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C5F256C8N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Operating Temperature, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C8F256C8N
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Contact for price
View Datasheet →EP2C5F256C7N
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$23.4 / Unit
View Datasheet →EP2C5F256C6N
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$11.4 / Unit
View Datasheet →EP2C5AF256I8N
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$16.1 / Unit
View Datasheet →EP2C5F256C8
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$23.9 / Unit
View Datasheet →EP2C5F256C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements (LE) | 4,608 |
| Logic Array Blocks (LAB) | 288 |
| Embedded Memory (M4K blocks) | 119,808 bits (~14.6 Kbytes) |
| Embedded 18x18 Multipliers | 13 |
| PLLs | 2 |
| Maximum User I/O Pins | 158 |
| Process Technology | 90 nm low-k CMOS |
| Core Voltage | 1.2 V |
| Speed Grade | 8 (commercial) |
| Package | 256-ball FineLine BGA (FBGA-256) |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), Passive Serial |
| RoHS Status | Compliant (lead-free) |
EP2C5F256C8N 256-ball fineline bga (fbga-256) Pin Configuration Guide
Pin configuration for EP2C5F256C8N (256-ball fineline bga (fbga-256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C5F256C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C5F256C8N is suitable for 6 applications: Industrial Motor Control, Video and Display Bridging, Communication Protocol Bridging, Low-Cost DSP Front-End, Embedded Display Controller, Test & Measurement Instrumentation.
Industrial Motor Control
The EP2C5F256C8N is well-suited for industrial motor control such as BLDC, stepper, and field-oriented control (FOC) drives because it pairs 4,608 logic elements with 13 dedicated 18x18 hardware multipliers that can execute Park/Clarke transforms and PI loops in parallel. The two on-chip PLLs let the design generate the high-resolution PWM carrier and tachometer sample clock from a single external crystal, simplifying the analog front end. With 158 user I/Os, the FPGA can interface directly to Hall sensors, quadrature encoders, gate drivers, and isolated communication links without an external CPLD. The 256-ball FineLine BGA keeps the footprint compact while the commercial 0C to +85C operating range is sufficient for sealed industrial enclosures. Compared with a microcontroller, the FPGA determinism enables sub-microsecond control loop latency.
Recommended
Video and Display Bridging
The EP2C5F256C8N is widely used for video format bridging - converting between parallel RGB, LVDS, HDMI, DVI, and MIPI-style camera interfaces - because the abundant user I/O count (158 pins) supports wide parallel video buses without external serializers. The 119 Kbits of M4K memory act as line buffers or frame-rate conversion FIFOs, eliminating external SRAM in many designs. The four-input LUT architecture combined with the 13 hardware 18x18 multipliers handles scaling, color-space conversion, and chroma resampling at 60 Hz with low latency. Designers typically pair the FPGA with an external HDMI PHY and a small flash for bitstream storage, using the JTAG port for in-system bring-up. This application benefits from the device's low cost and stable Quartus II / Quartus Prime toolchain support for Cyclone II.
Recommended
Communication Protocol Bridging
In communication gateways, the EP2C5F256C8N bridges between legacy industrial protocols (UART, SPI, I2C, CAN, RS-485) and modern interfaces such as Ethernet, USB, or PCIe soft IP cores. The 4,608 LEs are sufficient to instantiate multiple soft controllers concurrently, while the hardware multipliers accelerate CRC and encryption if needed. The two PLLs generate independent reference clocks for Ethernet MAC timing and CAN bit-rate switching, removing the need for multiple crystals. With 158 user I/Os the FPGA can simultaneously interface to multiple UART channels, isolated SPI buses, and an external Ethernet PHY. Industrial designers appreciate the deterministic latency and the ability to add custom protocol extensions without an MCU firmware loop.
Recommended
Low-Cost DSP Front-End
The EP2C5F256C8N serves as an affordable DSP front-end for sensor signal conditioning, FIR/IIR filtering, FFT pre-processing, and motor-current analysis. The 13 hardware 18x18 multipliers deliver up to ~26 GMACs of multiply-accumulate throughput at 250 MHz, which is sufficient for 256-point FFTs and adaptive filters in real time. M4K memory blocks provide dual-port or single-port buffers for sample-rate conversion and windowing. Engineers can implement sigma-delta modulators for precision ADC front-ends or run motor-current signature analysis for predictive maintenance. Compared with a fixed-function DSP, the FPGA offers full algorithm flexibility, allowing per-customer tuning without changing silicon.
Recommended
Embedded Display Controller
The EP2C5F256C8N is commonly used as an embedded display controller that drives small-to-medium TFT LCD panels, generates RGB timing, performs alpha blending, and reads image data from flash or external memory. Its 158 user I/Os comfortably support 24-bit parallel RGB888 plus touch-panel SPI/I2C, backlight PWM, and TE signals without external bus expanders. The hardware multipliers accelerate image scaling and rotation, while the M4K memory holds line buffers to bridge between display refresh rates and source data rates. Designers typically pair this FPGA with a small SPI flash for bitstream plus a QSPI flash for image assets, keeping the BOM under $5 in volume.
Recommended
Test & Measurement Instrumentation
In bench test equipment and ATE fixtures, the EP2C5F256C8N acts as a flexible stimulus/response engine with user-defined patterns, custom timing generators, and protocol-aware decoding. The 158 I/Os allow direct connection to logic-analyzer-like probe pods, while the 13 multipliers enable on-the-fly CRC, BCH, or PRBS generation for signal-integrity testing. The JTAG port plus passive-serial configuration let engineers load new test patterns in seconds, dramatically reducing ATE development time. The 256-ball FBGA package provides enough decoupling pins to keep switching noise low even when driving 100 MHz parallel patterns. This makes the FPGA an attractive glue-logic replacement versus discrete CPLD chains.
Recommended
Recommended Products Summary
Engineering reference data for EP2C5F256C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C8F256C8N | EP2C5F256C7N | EP2C5F256C6N | EP2C5AF256I8N | EP2C5F256C8 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same |
| Logic Elements | 4,608 | 8,256 (+79%) | 4,608 (same) | 4,608 (same) | 4,608 (same) | 4,608 (same) |
| Embedded Memory | 119,808 bits | 165,888 bits (+38%) | 119,808 bits (same) | 119,808 bits (same) | 119,808 bits (same) | 119,808 bits (same) |
| Embedded Multipliers (18x18) | 13 | 18 (+38%) | 13 (same) | 13 (same) | 13 (same) | 13 (same) |
| Speed Grade | -8 | -8 (same) | -7 (slower) | -6 (slowest) | -8 (same) | -8 (same) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| RoHS Compliant | Yes (N suffix) | Yes | Yes | Yes | Yes | Non-N variant (may not be RoHS) |
| Maximum User I/O | 158 | 182 | 158 (same) | 158 (same) | 158 (same) | 158 (same) |
| PLLs | 2 | 2 (same) | 2 (same) | 2 (same) | 2 (same) | 2 (same) |
Key Differentiators
- Drop-in higher-capacity upgrade within identical footprint (vs EP2C8F256C8N)
- Speed-grade flexibility (vs EP2C5F256C7N)
- Industrial temperature grade on identical footprint (vs EP2C5AF256I8N)
- Cyclone II architecture with mature Quartus II toolchain (vs Xilinx Spartan-6 XC6SLX9)
Design Notes
The EP2C5F256C8N requires a tightly regulated 1.2 V core supply (VCCINT), a 1.2 V/2.5 V/3.3 V selectable auxiliary supply (VCCAUX), and per-bank I/O supplies (VCCIO[1..8]). Decouple each supply pin with a 0.1 uF X7R ceramic plus a 10 uF bulk capacitor placed within 50 mils of the BGA ball. Estimated: ICCINT at 250 MHz with all LEs active is approximately 200-300 mA typical, but always consult the Cyclone II PowerPlay early-power estimator in Quartus II for an accurate per-design budget.
The 256-ball FineLine BGA has a 1.0 mm ball pitch; use at least 4 PCB layers with one continuous ground plane beneath the package. Escape the inner balls through a 0.4 mm via-in-pad or dog-bone fan-out, and verify the PCB house supports the chosen ball-pitch and finish (ENIG or OSP recommended for lead-free assembly). Matched-length impedance control is required for LVDS and DDR interfaces, and all JTAG signals should be length-matched within 100 mils to avoid configuration glitches.
Estimated: at maximum toggle rate and full logic utilization in a JEDEC JESD51-7 4-layer test board, the EP2C5F256C8N dissipates approximately 0.5-1.0 W typical and up to 1.5 W maximum. Theta-JA of the 256-ball FBGA is approximately 25-30 C/W with adequate copper pour, so junction temperature rise above 70C ambient is roughly 15-45 C. Always verify with Cyclone II PowerPlay for production designs, especially in sealed industrial enclosures.
Do not power VCCINT before VCCAUX, otherwise the FPGA may latch up; respect the power-sequencing guidelines in the Cyclone II datasheet. The MSEL[0..3] pins must be tied high or low for the desired configuration mode (Passive Serial, Active Serial, JTAG) before VCCINT ramps. Pull nCONFIG high with a 10 kohm resistor and CONF_DONE low with 10 kohm to ensure clean configuration start; otherwise the bitstream may fail to load. Always store at least two copies of the bitstream in the configuration flash for failsafe recovery.
Place the 50 MHz or 100 MHz reference clock crystal within 200 mils of the dedicated CLK input pins to avoid EMI; route clocks on an inner layer with continuous ground reference. Use impedance-controlled traces for LVDS pairs (typically 100 ohm differential) and series-termination resistors at the FPGA driver. Keep JTAG chain signals away from high-speed I/O switching to avoid noise coupling during in-system programming. For DDR or LVDS interfaces, follow the Cyclone II board design guidelines for length matching within 50 ps.
Compliance Information
RoHS compliant (N suffix indicates lead-free finish). Not AEC-Q100 qualified - this is a commercial-grade FPGA. Halogen-free status not specified in the verified data. Conflict minerals compliance per Intel / Altera standard policy.
