EP2C5T144I8N - Cyclone II FPGA, 4,608 LEs, 144-TQFP | Intel
MPN: EP2C5T144I8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.74 | $18.74 |
| 10 | $17.5 | $175.00 |
| 100 | $14.95 | $1,495.00 |
| 500 | $12.8 | $6,400.00 |
| 1,000 | $11.2 | $11,200.00 |
EP2C5T144I8N Overview
What is an FPGA? A Field-Programmable Gate Array is a reconfigurable semiconductor device containing an array of logic blocks (lookup tables, flip-flops, and routing) that can be programmed after manufacture to implement arbitrary digital logic. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) -> logic ICs -> integrated circuits. The Cyclone II family positioned FPGAs as affordable alternatives to ASICs in cost-sensitive designs, making programmable logic accessible to consumer, industrial, and communications markets where earlier FPGAs had been economically impractical.
Key features include 4,608 LEs, 119,808 RAM bits distributed across M4K memory blocks, 13 embedded 18x18 multipliers for DSP-style workloads, and support for multiple I/O standards including LVTTL, LVCMOS, PCI, and LVDS. The device supports configuration via serial (AS) or parallel (PS) modes and contains built-in JTAG boundary-scan for in-system programming. Eight global clock networks plus two PLLs per quadrant (when present) simplify timing closure for synchronous designs across the 144-pin footprint.
Architecturally, Cyclone II uses a 90 nm process with a Stratix-derived routing fabric adapted for low-cost positioning. Multipliers are wired to 9-Kbit memory blocks, enabling efficient DSP and FIFO implementations without consuming logic fabric. Internal configuration bits are stored in SRAM, requiring an external configuration flash or download cable on every power-up.
Typical applications include industrial motor control, low-cost video processing, protocol bridging, USB and Ethernet interface logic, educational FPGA development boards, and consumer electronics glue logic. The wide operating temperature range also supports outdoor industrial deployments.
When designing with this device, verify that the I/O bank voltage references match the chosen signaling standard; mis-referenced VCCIO rails are a common board-bring-up failure. Also confirm the configuration scheme (AS vs PS) supports your boot-time budget.
This page synthesizes distributor pricing, functional equivalents within the same Cyclone II family, and PCB-reuse design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP2C5T144I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C5T144I8N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C5T144C8N
✅ Drop-In✓ In Stock
$19.8 / Unit
View Datasheet →EP2C5T144C7N
✅ Drop-In✓ In Stock
$12.4 / Unit
View Datasheet →EP2C5T144C6N
✅ Drop-In✓ In Stock
$5.1 / Unit
View Datasheet →EP2C5T144I8
✅ Drop-In✓ In Stock
$11.83 / Unit
View Datasheet →EP2C8T144I8N
✅ Drop-In✓ In Stock
$17.5 / Unit
View Datasheet →EP2C8T144C8N
✅ Drop-In✓ In Stock
$41.5 / Unit
View Datasheet →EP2C5T144I8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements (LEs) | 4,608 |
| Embedded Memory | 119,808 bits (~117 Kbits) |
| Embedded Multipliers | 13 (18x18) |
| Maximum User I/O | 89 |
| PLLs | 2 |
| Core Voltage | 1.2 V |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 144-LQFP (TQFP) 22x22 mm |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| Process Node | 90 nm |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Configuration Mode | Active Serial (AS) / Passive Serial (PS) |
EP2C5T144I8N Pin Configuration
| Pin 1 | I/O — General purpose user I/O (Bank 1) |
| Pin 2 | I/O — General purpose user I/O (Bank 1) |
| Pin 3 | I/O — General purpose user I/O (Bank 1) |
| Pin 4 | I/O — General purpose user I/O (Bank 1) |
| Pin 5 | I/O — General purpose user I/O (Bank 1) |
| Pin 6 | I/O — General purpose user I/O (Bank 1) |
| Pin 7 | VCCIO1 — I/O bank 1 supply reference |
| Pin 8 | I/O — General purpose user I/O (Bank 1) |
| Pin 9 | I/O — General purpose user I/O (Bank 1) |
| Pin 10 | I/O — General purpose user I/O (Bank 1) |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — General purpose user I/O (Bank 1) |
| Pin 13 | I/O — General purpose user I/O (Bank 1) |
| Pin 14 | I/O — General purpose user I/O (Bank 1) |
| Pin 15 | I/O — General purpose user I/O (Bank 1) |
| Pin 16 | I/O — General purpose user I/O (Bank 1) |
| Pin 17 | I/O — General purpose user I/O (Bank 1) |
| Pin 18 | I/O — General purpose user I/O (Bank 1) |
| Pin 19 | I/O — General purpose user I/O (Bank 1) |
| Pin 20 | I/O — General purpose user I/O (Bank 1) |
| Pin 21 | GND — Ground |
| Pin 22 | I/O — General purpose user I/O (Bank 2) |
| Pin 23 | I/O — General purpose user I/O (Bank 2) |
| Pin 24 | I/O — General purpose user I/O (Bank 2) |
| Pin 25 | I/O — General purpose user I/O (Bank 2) |
| Pin 26 | I/O — General purpose user I/O (Bank 2) |
| Pin 27 | I/O — General purpose user I/O (Bank 2) |
| Pin 28 | VCCIO2 — I/O bank 2 supply reference |
| Pin 29 | I/O — General purpose user I/O (Bank 2) |
| Pin 30 | I/O — General purpose user I/O (Bank 2) |
| Pin 31 | I/O — General purpose user I/O (Bank 2) |
| Pin 32 | I/O — General purpose user I/O (Bank 2) |
| Pin 33 | GND — Ground |
| Pin 34 | I/O — General purpose user I/O (Bank 2) |
| Pin 35 | I/O — General purpose user I/O (Bank 2) |
| Pin 36 | I/O — General purpose user I/O (Bank 2) |
| Pin 37 | I/O — General purpose user I/O (Bank 2) |
| Pin 38 | I/O — General purpose user I/O (Bank 2) |
| Pin 39 | I/O — General purpose user I/O (Bank 2) |
| Pin 40 | I/O — General purpose user I/O (Bank 2) |
| Pin 41 | I/O — General purpose user I/O (Bank 2) |
| Pin 42 | I/O — General purpose user I/O (Bank 2) |
| Pin 43 | GND — Ground |
| Pin 44 | I/O — General purpose user I/O (Bank 3) |
| Pin 45 | I/O — General purpose user I/O (Bank 3) |
| Pin 46 | I/O — General purpose user I/O (Bank 3) |
| Pin 47 | I/O — General purpose user I/O (Bank 3) |
| Pin 48 | I/O — General purpose user I/O (Bank 3) |
| Pin 49 | VCCIO3 — I/O bank 3 supply reference |
| Pin 50 | I/O — General purpose user I/O (Bank 3) |
| Pin 51 | I/O — General purpose user I/O (Bank 3) |
| Pin 52 | I/O — General purpose user I/O (Bank 3) |
| Pin 53 | I/O — General purpose user I/O (Bank 3) |
| Pin 54 | GND — Ground |
| Pin 55 | I/O — General purpose user I/O (Bank 3) |
| Pin 56 | I/O — General purpose user I/O (Bank 3) |
| Pin 57 | I/O — General purpose user I/O (Bank 3) |
| Pin 58 | I/O — General purpose user I/O (Bank 3) |
| Pin 59 | I/O — General purpose user I/O (Bank 3) |
| Pin 60 | I/O — General purpose user I/O (Bank 3) |
| Pin 61 | I/O — General purpose user I/O (Bank 3) |
| Pin 62 | I/O — General purpose user I/O (Bank 3) |
| Pin 63 | I/O — General purpose user I/O (Bank 3) |
| Pin 64 | I/O — General purpose user I/O (Bank 3) |
| Pin 65 | I/O — General purpose user I/O (Bank 3) |
| Pin 66 | I/O — General purpose user I/O (Bank 3) |
| Pin 67 | GND — Ground |
| Pin 68 | I/O — General purpose user I/O (Bank 4) |
| Pin 69 | I/O — General purpose user I/O (Bank 4) |
| Pin 70 | I/O — General purpose user I/O (Bank 4) |
| Pin 71 | I/O — General purpose user I/O (Bank 4) |
| Pin 72 | I/O — General purpose user I/O (Bank 4) |
| Pin 73 | I/O — General purpose user I/O (Bank 4) |
| Pin 74 | I/O — General purpose user I/O (Bank 4) |
| Pin 75 | VCCIO4 — I/O bank 4 supply reference |
| Pin 76 | I/O — General purpose user I/O (Bank 4) |
| Pin 77 | I/O — General purpose user I/O (Bank 4) |
| Pin 78 | I/O — General purpose user I/O (Bank 4) |
| Pin 79 | GND — Ground |
| Pin 80 | I/O — General purpose user I/O (Bank 4) |
| Pin 81 | I/O — General purpose user I/O (Bank 4) |
| Pin 82 | I/O — General purpose user I/O (Bank 4) |
| Pin 83 | I/O — General purpose user I/O (Bank 4) |
| Pin 84 | I/O — General purpose user I/O (Bank 4) |
| Pin 85 | I/O — General purpose user I/O (Bank 4) |
| Pin 86 | I/O — General purpose user I/O (Bank 4) |
| Pin 87 | I/O — General purpose user I/O (Bank 4) |
| Pin 88 | I/O — General purpose user I/O (Bank 4) |
| Pin 89 | GND — Ground |
| Pin 90 | nCONFIG — Configuration control (active low) |
| Pin 91 | nSTATUS — Configuration status (active low) |
| Pin 92 | CONFIG_DONE — Configuration done indicator |
| Pin 93 | TDI — JTAG test data in |
| Pin 94 | TMS — JTAG test mode select |
| Pin 95 | TCK — JTAG test clock |
| Pin 96 | TDO — JTAG test data out |
| Pin 97 | GND — Ground |
| Pin 98 | MSEL0 — Configuration mode select 0 |
| Pin 99 | MSEL1 — Configuration mode select 1 |
| Pin 100 | MSEL2 — Configuration mode select 2 |
| Pin 101 | DATA0 — Configuration data input (AS/PS) |
| Pin 102 | DCLK — Configuration clock |
| Pin 103 | nCS — Serial configuration chip select |
| Pin 104 | ASDO — Active serial data out |
| Pin 105 | VCCINT — Core supply 1.2 V |
| Pin 106 | GND — Ground |
| Pin 107 | I/O — General purpose user I/O (Bank 4) |
| Pin 108 | I/O — General purpose user I/O (Bank 4) |
| Pin 109 | I/O — General purpose user I/O (Bank 4) |
| Pin 110 | I/O — General purpose user I/O (Bank 4) |
| Pin 111 | I/O — General purpose user I/O (Bank 4) |
| Pin 112 | I/O — General purpose user I/O (Bank 4) |
| Pin 113 | I/O — General purpose user I/O (Bank 4) |
| Pin 114 | I/O — General purpose user I/O (Bank 4) |
| Pin 115 | I/O — General purpose user I/O (Bank 4) |
| Pin 116 | I/O — General purpose user I/O (Bank 4) |
| Pin 117 | I/O — General purpose user I/O (Bank 4) |
| Pin 118 | I/O — General purpose user I/O (Bank 4) |
| Pin 119 | I/O — General purpose user I/O (Bank 4) |
| Pin 120 | I/O — General purpose user I/O (Bank 4) |
| Pin 121 | GND — Ground |
| Pin 122 | I/O — General purpose user I/O (Bank 4) |
| Pin 123 | I/O — General purpose user I/O (Bank 4) |
| Pin 124 | I/O — General purpose user I/O (Bank 4) |
| Pin 125 | I/O — General purpose user I/O (Bank 4) |
| Pin 126 | I/O — General purpose user I/O (Bank 4) |
| Pin 127 | VCCINT — Core supply 1.2 V |
| Pin 128 | I/O — General purpose user I/O (Bank 4) |
| Pin 129 | I/O — General purpose user I/O (Bank 4) |
| Pin 130 | I/O — General purpose user I/O (Bank 4) |
| Pin 131 | I/O — General purpose user I/O (Bank 4) |
| Pin 132 | I/O — General purpose user I/O (Bank 4) |
| Pin 133 | GND — Ground |
| Pin 134 | I/O — General purpose user I/O (Bank 1) |
| Pin 135 | I/O — General purpose user I/O (Bank 1) |
| Pin 136 | I/O — General purpose user I/O (Bank 1) |
| Pin 137 | I/O — General purpose user I/O (Bank 1) |
| Pin 138 | I/O — General purpose user I/O (Bank 1) |
| Pin 139 | VCCIO1 — I/O bank 1 supply reference |
| Pin 140 | I/O — General purpose user I/O (Bank 1) |
| Pin 141 | I/O — General purpose user I/O (Bank 1) |
| Pin 142 | I/O — General purpose user I/O (Bank 1) |
| Pin 143 | I/O — General purpose user I/O (Bank 1) |
| Pin 144 | GND — Ground |
Typical Applications
EP2C5T144I8N is suitable for 6 applications: Industrial Motor Control, Low-Cost Video Processing Bridge, Protocol Bridging (USB / Ethernet / UART), Educational FPGA Development Boards, Consumer Electronics Glue Logic, Test & Measurement Front-End Logic.
Industrial Motor Control
The EP2C5T144I8N fits industrial motor-control designs because its 4,608 LEs and 13 embedded 18x18 multipliers are sufficient for field-oriented control (FOC) algorithms, encoder decoding, and PWM generation on a single chip. The industrial -40C to +85C temperature range covers cabinet-mounted drives, and the 89 user I/O pins handle quadrature encoder inputs, Hall sensors, and gate-driver enable signals. Compared with a microcontroller, this FPGA can execute the control loop at much higher PWM frequencies (above 100 kHz), reducing audible switching noise and improving torque ripple. Power estimation per Cyclone II datasheet: 1.2 V core at typical 250 mA plus I/O bank current. Place bypass capacitors as close to each VCCIO and VCCINT pin pair as the 144-TQFP land pattern allows.
Recommended
Low-Cost Video Processing Bridge
The EP2C5T144I8N is widely used as a video-format bridge (BT.656 to parallel RGB, or HDMI input to LVDS output) in cost-sensitive consumer and prosumer products. The 4,608 LEs hold a line buffer plus color-space conversion, and the M4K memory blocks provide FIFO buffering of video lines. LVDS support in selected I/O banks permits direct connection to LVDS panels without external buffers. Engineers should budget 25-30% LE utilization for typical color-space conversion plus timing controller logic, leaving headroom for additional overlay or graphics processing. The 144-TQFP package is hand-solderable for prototype builds, which is unusual for an FPGA of this density.
Recommended
Protocol Bridging (USB / Ethernet / UART)
When a host processor lacks a particular peripheral, the EP2C5T144I8N can implement glue logic that bridges between standards - for example, USB 2.0 high-speed to parallel FIFO, or 100 Mbit Ethernet MAC plus UDP offload. The device's JTAG interface enables in-field firmware updates, and 119,808 bits of embedded RAM comfortably hold packet buffers for typical industrial protocols. Designers should use Altera's soft IP cores (Nios II, Triple-Speed Ethernet, USB) with Quartus II 13.0sp1, the last version with full Cyclone II support. Power sequencing: bring up VCCINT (1.2 V) before VCCIO and CONF_DONE pin within 100 ms of configuration start.
Recommended
Educational FPGA Development Boards
Universities and hobbyists favor the EP2C5T144I8N because it balances density, hand-solderability, and price. The 144-TQFP is the largest pitch that is still practical to hand-solder with a fine-tip iron, and 4,608 LEs is enough to teach a full RISC-V soft core, VGA controller, and audio pipeline simultaneously. Reference designs ship with EPCS4 configuration flash, 50 MHz clock, SRAM, LEDs, and pushbuttons, allowing students to focus on HDL rather than board bring-up. Quartus II Web Edition remains free and supports this device without a license, which keeps the total learning cost minimal.
Recommended
Consumer Electronics Glue Logic
In consumer products such as set-top boxes, printers, and home appliances, the EP2C5T144I8N replaces multiple discrete logic ICs by integrating level shifting, display timing, button debouncing, and LED control. Consolidation from 4-6 standard-logic chips to one FPGA reduces PCB area, BOM count, and assembly cost. The industrial temperature variant (this part) is preferred for products sold into global markets where warehouse and shipping conditions may briefly exceed commercial-grade limits. Estimated static power: ~50 mW at typical use; dynamic power depends on toggle rate and should be simulated with the Quartus PowerPlay tool.
Recommended
Test & Measurement Front-End Logic
Test instruments and ATE fixtures use the EP2C5T144I8N to implement custom stimulus generation, response capture, and protocol-aware handshake logic between the device under test (DUT) and the host. The 13 embedded multipliers can compute CRC, checksum, or simple FFT pre-processing in-line with sample acquisition, while M4K blocks provide double buffering. With 89 user I/O pins the FPGA can directly drive up to 11 LVDS pairs (using LVDS in supported banks) or 89 single-ended signals, often sufficient to replace a mid-range ASIC in low-volume test gear.
Recommended
Recommended Products Summary
Engineering reference data for EP2C5T144I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C5T144C8N | EP2C5T144C7N | EP2C5T144I8 | EP2C8T144I8N | EP2C8T144C8N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,608 | 4,608 | 4,608 | 4,608 | 8,256 | 8,256 |
| Embedded Memory | 119,808 bits | 119,808 bits | 119,808 bits | 119,808 bits | 165,888 bits | 165,888 bits |
| Embedded Multipliers (18x18) | 13 | 13 | 13 | 13 | 18 | 18 |
| User I/O Pins | 89 | 89 | 89 | 89 | 85 | 85 |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +85C (Commercial) |
| Speed Grade | 8 | 8 | 7 | 8 | 8 | 8 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Industrial temperature range in the 144-TQFP package (vs EP2C5T144C8N)
- Same-package density upgrade path (vs EP2C5T144I8 vs EP2C8T144I8N)
- Hand-solderable TQFP package (vs EP2C5F256I8N (FBGA-256))
Design Notes
Estimated: Cyclone II core current at typical 4,608-LE utilization is roughly 200-300 mA from a 1.2 V VCCINT rail; each VCCIO bank adds up to 100 mA depending on toggle rate. Provide a 1.2 V LDO or switching regulator rated for at least 500 mA, and add 0.1 uF ceramic bypass capacitors within 5 mm of every VCCINT and VCCIO pin. Decoupling values: one 10 uF bulk + one 0.1 uF per pin pair is the conservative Cyclone II recommendation.
The 144-TQFP 22x22 mm package uses 0.5 mm pitch leads; route with 0.15 mm/6 mil traces and use a 4-layer PCB with continuous ground plane beneath the device for return-current control. All eight GND pins must be soldered to the ground plane with multiple vias to reduce inductance. Place the EPCS configuration flash within 25 mm of the FPGA, keep DCLK short, and add a 25-50 ohm series termination on DCLK if the trace exceeds 50 mm.
Configuration fails on first power-up if VCCINT and VCCIO rise-time relationships are violated: VCCINT must reach 1.0 V within 100 ms and VCCIO must follow within 100 ms afterward. Stratix II and Cyclone II use different MSEL pull-up/pull-down schemes; verify MSEL[2:0] against the Cyclone II handbook (not Cyclone III/IV) before board fab. Avoid leaving unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-up to prevent shoot-through during configuration.
Estimated: at maximum junction temperature +85C industrial limit, the 144-TQFP requires approximately 26 C/W theta_JA still-air thermal resistance to keep die temperature below 85C when dissipating 1 W. Cyclone II typically dissipates 0.5-1.5 W at moderate utilization, so no heatsink is needed but PCB copper area (at least 4 sq cm on top layer) is recommended for margin. Forced airflow is rarely required unless utilization exceeds 80%.
Compliance Information
RoHS and REACH compliant per Intel/Altera product declarations. Not AEC-Q100 qualified - choose EP2C5AT144A7N for automotive. Halogen-free status not explicitly declared; default treated as unknown per data authenticity rules.
