EP2C5F256I8N - Cyclone II FPGA, 4,608 LEs, 256-FBGA | Intel
MPN: EP2C5F256I8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.02 | $22.02 |
| 10 | $19.8 | $198.00 |
| 100 | $17.55 | $1,755.00 |
| 500 | $15.3 | $7,650.00 |
| 1,000 | $13.1 | $13,100.00 |
EP2C5F256I8N Overview
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard-IP such as block RAM, PLLs, and (in modern families) transceivers. FPGAs sit between discrete logic ICs (74-series glue logic) and application-specific integrated circuits (ASICs): unlike discrete logic, they integrate thousands to millions of gates onto one die, and unlike ASICs they are reprogrammable, allowing iterative development and late-stage design changes. FPGAs are widely used for glue logic, custom interfacing, DSP pipelines, prototyping of ASIC designs, and high-speed I/O expansion.
Key features of the EP2C5F256I8N include 4,608 LEs, 13 embedded 18x18 multipliers, two PLLs, 158 user I/O pins distributed across eight I/O banks, and 119,808 bits of M4K block RAM organized as 4-Kbit blocks. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and supports external memory interfaces including DDR, DDR2, SDR, and QDR SRAM. Configuration is handled through active serial (AS), passive serial (PS), JTAG, or Fast Passive Parallel (FPP) modes. The 256-ball 1.0 mm pitch FBGA package is JEDEC-compliant and supports lead-free reflow.
Architecture details: the Cyclone II logic element (LE) is built around a 4-input look-up table (LUT) with a programmable register, supporting both arithmetic and carry-chain modes for efficient adder and counter implementation. The 90 nm process node allows the EP2C5 to deliver this logic capacity at sub-watt static power while supporting clock management through dedicated PLL blocks with up to four output clocks each. Configuration bitstream is stored in external serial flash and loaded into SRAM configuration cells at power-up.
Typical applications include digital signal processing front-ends, motor control and industrial automation, video processing and display controllers, communications protocol bridging (UART, SPI, I2C, PCIe soft IP), and ASIC prototyping. The combination of low cost, embedded multipliers, and DDR memory interfaces makes Cyclone II especially attractive for cost-sensitive, volume-production designs.
When designing with this device, plan I/O bank assignments carefully because VCCIO must be supplied per bank and mixed-voltage standards require careful reference voltage selection. Use Quartus II design software (versions 13.0 SP1 and earlier, or the ModelSim-Intel starter edition) for synthesis and place-and-route; modern Quartus Prime does not include Cyclone II support. Configuration storage (EPCS serial flash) is mandatory at production.
Drop-in alternatives for EP2C5F256I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C5F256I8N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, RoHS Status, Operating Temperature.
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EP2C5F256I8
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View Datasheet →EP2C5F256I8N Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | Cyclone II |
| Logic Elements (LEs) | 4,608 |
| Embedded Memory | 119,808 bits (M4K blocks) |
| Number of M4K RAM Blocks | 26 |
| Embedded 18x18 Multipliers | 13 |
| PLLs | 2 |
| Maximum User I/O | 158 |
| Number of I/O Banks | 8 |
| Supply Voltage (Core) | 1.15 V to 1.25 V (1.2 V typ.) |
| Operating Temperature Range | -40 C to +85 C (industrial, 'I' grade) |
| Package | 256-ball FineLine BGA (FBGA-256), 17 x 17 mm, 1.0 mm pitch |
| JEDEC Package Code | S-PBGA-B256 |
| Process Node | 90 nm |
| Configuration Modes | AS, PS, JTAG, FPP |
| Mounting Type | Surface Mount |
| Lead-Free | Yes |
| RoHS Status | Compliant |
EP2C5F256I8N s-pbga-b256 Pin Configuration Guide
Pin configuration for EP2C5F256I8N (s-pbga-b256 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C5F256I8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C5F256I8N is suitable for 6 applications: Industrial Motor Control, Video Processing & Display Controllers, ASIC Prototyping & Emulation, Communications Protocol Bridging, Digital Signal Processing (DSP) Front-Ends, Test & Measurement Instrumentation.
Industrial Motor Control
The EP2C5F256I8N is a strong fit for industrial motor control and FOC (field-oriented control) designs because its 13 embedded 18x18 multipliers execute the Park/Clarke transforms and PI loops at multi-MHz update rates, while 158 user I/O pins carry multi-axis encoder (QEP), Hall-sensor, and PWM signals. The 119,808 bits of M4K block RAM store look-up tables for sine, SVM, and gain scheduling. Operating temperature of -40C to +85C supports factory-floor deployment; two PLLs provide low-jitter clocks for synchronized PWM switching. Estimated: at 100 MHz operation, this density comfortably runs a 3-axis FOC loop at 20 kHz update rate with safety margin.
Recommended
Video Processing & Display Controllers
The EP2C5F256I8N implements simple video processing pipelines such as scaling, color-space conversion, alpha blending, and overlay composition. The 158 user I/O pins accommodate parallel RGB/YCbCr interfaces and control signals for TFT LCDs, while 13 multipliers handle real-time color interpolation and chroma upsampling. With 26 M4K blocks (119,808 bits), line buffers and small frame buffers fit on-chip. At 24-bit RGB @ 60 Hz WVGA, estimated bandwidth requirements (~50 MHz pixel clock) are well within Cyclone II performance. For higher resolutions, migrate to EP2C35 or EP2C70 in the same family.
Recommended
ASIC Prototyping & Emulation
The EP2C5F256I8N is widely used for ASIC prototyping and SoC emulation because its 4,608 LEs, 158 I/O pins, and large embedded memory provide enough logic to map medium-complexity ASIC blocks. The 90 nm process delivers predictable timing for RTL synthesis, and the JTAG-based configuration makes interactive debug cycles fast. Multiple EP2C5 devices can be JTAG-chained to emulate larger ASICs. Quartus II 13.0 SP1 supports multi-FPGA partitioning. Estimated: one EP2C5 typically maps a 50K-gate ASIC netlist at 60-70% logic utilization with stable timing closure.
Recommended
Communications Protocol Bridging
The EP2C5F256I8N implements multi-protocol bridges (UART, SPI, I2C, CAN, Ethernet MAC, PCIe soft IP) between industrial buses and host processors. Its 158 I/O pins support many simultaneous serial channels, the 4,608 LEs run stateful protocol stacks, and the 26 M4K blocks buffer packet payloads. LVDS support in select I/O pairs enables high-speed links between boards. Typical use cases include FPGA-based I/O expansion for Raspberry Pi/SoM hosts, custom industrial gateways, and protocol converters for legacy serial equipment. Two PLLs generate per-channel reference clocks.
Recommended
Digital Signal Processing (DSP) Front-Ends
The EP2C5F256I8N executes FIR, IIR, and FFT algorithms at sample rates up to ~150 MHz thanks to its 13 dedicated 18x18 multipliers and dedicated adder/carry logic in every LE. The 119,808 bits of block RAM store coefficient tables and delay lines for 256-tap FIRs at 16-bit precision. Audio sample-rate conversion, vibration analysis for predictive maintenance, software-defined radio baseband processing, and image preprocessing are typical workloads. The -40C to +85C industrial range enables outdoor and industrial DSP deployments without active cooling.
Recommended
Test & Measurement Instrumentation
The EP2C5F256I8N serves as the logic core in custom test and measurement equipment: logic analyzers, protocol exercisers, AWG sequencers, and bench data-acquisition systems. Its 158 I/O pins drive multi-channel stimulus and capture DUT response, while 4,608 LEs implement custom timing/sequencer state machines. The two PLLs generate precise sample clocks with sub-ns jitter. Industrial temperature grade supports production-floor ATE environments. Quartus II 13.0 SP1 with SignalTap II logic analyzer provides integrated debug visibility for real-time acquisition without external probes.
Recommended
Recommended Products Summary
Engineering reference data for EP2C5F256I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C5F256I8 | EP2C5AF256I8N | EP2C5AF256A7N | EP2C5F256C8N | EP2C5F256C8 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 (256-ball, 17x17 mm, 1.0 mm pitch) | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Logic Elements | 4,608 | 4,608 | 4,608 | 4,608 | 4,608 | 4,608 |
| Embedded Memory (bits) | 119,808 | 119,808 | 119,808 | 119,808 | 119,808 | 119,808 |
| Embedded 18x18 Multipliers | 13 | 13 | 13 | 13 | 13 | 13 |
| Maximum User I/O | 158 | 158 | 158 | 158 | 158 | 158 |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (automotive) | -40C to +125C (automotive, A7 speed) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Automotive Grade (AEC-Q100) | No | No | Yes | Yes (A7 speed) | No | No |
| Pb-Free / Lead-Free | Yes ('N' suffix) | No | Yes | Yes | Yes | No |
Key Differentiators
- Industry-standard Cyclone II entry-point density in 17x17 mm FBGA-256 (vs EP2C20F484I8N (Cyclone II))
- Industrial temperature grade with full Cyclone II toolchain support (vs EP2C5F256C8N (commercial grade))
- Mature ecosystem with 15+ years of reference designs and IP cores (vs Lattice ECP5 / Xilinx Spartan-6 (cross-brand))
Design Notes
The EP2C5F256I8N requires three independent power rails - VCCINT (1.15-1.25 V core), VCCIO (per-bank, 1.5-3.3 V), and VCC_PLL (1.2 V analog) - each with bulk decoupling. Bulk 100 uF tantalum plus 0.1 uF/1 uF ceramic per rail is recommended. According to the Cyclone II datasheet, VCC_PLL requires a dedicated filtered supply; sharing it with VCCINT causes PLL jitter degradation. Power sequencing: VCCINT must precede or simultaneously rise with VCCIO; VCCIO before VCCINT can latch up I/O.
The 256-ball FBGA package uses 1.0 mm pitch, which requires 4-layer PCB with controlled-impedance routing and laser-drilled microvias (HDI process). Escape routing of inner balls uses via-in-pad. According to the Cyclone II hardware board design guidelines, trace impedance for LVDS pairs is 100 ohm differential; 50 ohm single-ended for general I/O. Use a ground plane under the BGA for return paths; route high-speed traces on top layers and power on inner layers.
Three common pitfalls: (1) Using Quartus Prime (any version) instead of Quartus II 13.0 SP1 - Cyclone II is NOT supported in Quartus Prime. (2) Forgetting that JTAG configuration requires the nCONFIG, nSTATUS, and CONFIG_DONE pins be properly pulled, or the device will not enter user mode. (3) Assuming 100% I/O availability - the actual usable I/O count is less than 158 because VCCIO/GND/JTAG/PLL balls consume package positions. Always re-check the pin tables in the datasheet for your specific package.
Compliance Information
RoHS compliant per Altera/Intel product page (Pb-free 'N' suffix). Not AEC-Q100 qualified - choose EP2C5AF256I8N for automotive applications. Halogen-free status not stated in verified data.
