EP2C8T144C6N - Cyclone II FPGA, 8K LE, 144-LQFP | Intel
MPN: EP2C8T144C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $35.37 | $35.37 |
| 10 | $30.5 | $305.00 |
| 100 | $22.8 | $2,280.00 |
| 500 | $17.95 | $8,975.00 |
| 1,000 | $14.2 | $14,200.00 |
EP2C8T144C6N Overview
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows designers to implement arbitrary digital logic functions through an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. FPGAs sit in the digital logic hierarchy alongside ASICs and CPLDs, offering higher density than CPLDs while providing lower non-recurring engineering cost than ASICs. The Cyclone II family is positioned as a low-power, low-cost alternative to ASICs for volume production in consumer, industrial, and automotive applications.
Key features of the EP2C8T144C6N include 8,256 logic elements distributed across 36 logic array blocks (LABs), 36 embedded 18x18 multipliers for DSP-style arithmetic, two PLLs for clock synthesis, and embedded memory totaling approximately 165 Kbits. The 144-pin LQFP package exposes 85 user I/O pins supporting LVTTL, LVCMOS, PCI, SSTL, and LVDS I/O standards, enabling flexible interfacing with a wide range of external peripherals and memory devices.
The Cyclone II architecture uses a 4-input lookup table (LUT) as its fundamental logic element, with embedded multiplier blocks and M4K memory blocks providing dedicated arithmetic and storage resources. Configuration data is stored in SRAM cells, requiring a configuration device (such as the EPCS series) or a JTAG/microcontroller-based scheme to load the bitstream at power-up. The 90 nm process provides an optimal balance between cost, power, and density for mid-range FPGA designs.
Typical applications include digital signal processing front-ends, motor control, video processing bridges, industrial automation controllers, telecommunications glue logic, and educational FPGA platforms. The combination of low unit cost and ample DSP resources makes the EP2C8T144C6N particularly attractive for prototyping and small-to-medium volume production runs.
When designing with the EP2C8T144C6N, plan a robust configuration strategy using JTAG for development and an EPCS configuration flash for production. The 144-pin LQFP package supports hand-solderable prototypes, but multi-layer PCB design with dedicated ground and power planes is essential for signal integrity at higher toggle rates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers the complete picture for selecting and sourcing the EP2C8T144C6N.
Drop-in alternatives for EP2C8T144C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C8T144C6N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C8T144C8N
✅ Drop-In✓ In Stock
$41.5 / Unit
View Datasheet →EP2C8T144C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$20.85 / Unit
View Datasheet →EP2C8T144I8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$17.5 / Unit
View Datasheet →EP2C8T144I7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP2C8T144C6
✅ Drop-In✓ In Stock
$22.62 / Unit
View Datasheet →EP2C5T144C8N
✅ Drop-In✓ In Stock
$19.8 / Unit
View Datasheet →EP2C5T144C6N
✅ Drop-In✓ In Stock
$5.1 / Unit
View Datasheet →EP2C8T144C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements | 8,256 |
| Total RAM Bits | 165,888 |
| Number of Logic Elements / Cells | 8,256 |
| Total Memory Bits | 165,888 |
| Number of I/O | 85 |
| Voltage - Supply | 1.15 V to 1.25 V (core) |
| Operating Temperature | 0C to +85C (commercial) |
| Package / Case | 144-LQFP (TQFP) |
| Supplier Device Package | 144-TQFP (20x20 mm) |
| Mounting Type | Surface Mount |
| Process Technology | 90 nm CMOS SRAM |
| Configuration Method | SRAM - volatile (EPCS/JTAG required) |
EP2C8T144C6N Pin Configuration
| Pin 1 | I/O — User I/O (Bank 1) |
| Pin 2 | I/O — User I/O (Bank 1) |
| Pin 3 | I/O — User I/O (Bank 1) |
| Pin 4 | I/O — User I/O (Bank 1) |
| Pin 5 | I/O — User I/O (Bank 1) |
| Pin 6 | I/O — User I/O (Bank 1) |
| Pin 7 | I/O — User I/O (Bank 1) |
| Pin 8 | I/O — User I/O (Bank 1) |
| Pin 9 | I/O — User I/O (Bank 1) |
| Pin 10 | I/O — User I/O (Bank 1) |
| Pin 11 | VCCIO1 — I/O Bank 1 supply voltage |
| Pin 12 | I/O — User I/O (Bank 1) |
| Pin 13 | I/O — User I/O (Bank 1) |
| Pin 14 | I/O — User I/O (Bank 1) |
| Pin 15 | I/O — User I/O (Bank 1) |
| Pin 16 | I/O — User I/O (Bank 1) |
| Pin 17 | I/O — User I/O (Bank 1) |
| Pin 18 | I/O — User I/O (Bank 1) |
| Pin 19 | I/O — User I/O (Bank 1) |
| Pin 20 | I/O — User I/O (Bank 1) |
| Pin 21 | GND — Ground |
| Pin 22 | I/O — User I/O (Bank 2) |
| Pin 23 | I/O — User I/O (Bank 2) |
| Pin 24 | I/O — User I/O (Bank 2) |
| Pin 25 | I/O — User I/O (Bank 2) |
| Pin 26 | I/O — User I/O (Bank 2) |
| Pin 27 | I/O — User I/O (Bank 2) |
| Pin 28 | I/O — User I/O (Bank 2) |
| Pin 29 | I/O — User I/O (Bank 2) |
| Pin 30 | I/O — User I/O (Bank 2) |
| Pin 31 | I/O — User I/O (Bank 2) |
| Pin 32 | I/O — User I/O (Bank 2) |
| Pin 33 | VCCIO2 — I/O Bank 2 supply voltage |
| Pin 34 | I/O — User I/O (Bank 2) |
| Pin 35 | I/O — User I/O (Bank 2) |
| Pin 36 | I/O — User I/O (Bank 2) |
| Pin 37 | I/O — User I/O (Bank 2) |
| Pin 38 | I/O — User I/O (Bank 2) |
| Pin 39 | I/O — User I/O (Bank 2) |
| Pin 40 | I/O — User I/O (Bank 2) |
| Pin 41 | I/O — User I/O (Bank 2) |
| Pin 42 | I/O — User I/O (Bank 2) |
| Pin 43 | GND — Ground |
| Pin 44 | I/O — User I/O (Bank 3) |
| Pin 45 | I/O — User I/O (Bank 3) |
| Pin 46 | I/O — User I/O (Bank 3) |
| Pin 47 | I/O — User I/O (Bank 3) |
| Pin 48 | I/O — User I/O (Bank 3) |
| Pin 49 | I/O — User I/O (Bank 3) |
| Pin 50 | I/O — User I/O (Bank 3) |
| Pin 51 | I/O — User I/O (Bank 3) |
| Pin 52 | I/O — User I/O (Bank 3) |
| Pin 53 | I/O — User I/O (Bank 3) |
| Pin 54 | I/O — User I/O (Bank 3) |
| Pin 55 | VCCIO3 — I/O Bank 3 supply voltage |
| Pin 56 | I/O — User I/O (Bank 3) |
| Pin 57 | I/O — User I/O (Bank 3) |
| Pin 58 | I/O — User I/O (Bank 3) |
| Pin 59 | I/O — User I/O (Bank 3) |
| Pin 60 | I/O — User I/O (Bank 3) |
| Pin 61 | I/O — User I/O (Bank 3) |
| Pin 62 | I/O — User I/O (Bank 3) |
| Pin 63 | I/O — User I/O (Bank 3) |
| Pin 64 | I/O — User I/O (Bank 3) |
| Pin 65 | I/O — User I/O (Bank 3) |
| Pin 66 | GND — Ground |
| Pin 67 | nSTATUS — Configuration status (open-drain) |
| Pin 68 | DCLK — Configuration clock (PS mode) |
| Pin 69 | DATA0 — Configuration data input (PS mode) |
| Pin 70 | nCONFIG — Configuration control (active-low) |
| Pin 71 | CONF_DONE — Configuration done (open-drain) |
| Pin 72 | MSEL0 — Configuration mode select bit 0 |
| Pin 73 | MSEL1 — Configuration mode select bit 1 |
| Pin 74 | MSEL2 — Configuration mode select bit 2 |
| Pin 75 | VCCINT — Core supply voltage (1.2V) |
| Pin 76 | GND — Ground |
| Pin 77 | TDI — JTAG test data input |
| Pin 78 | TMS — JTAG test mode select |
| Pin 79 | TCK — JTAG test clock |
| Pin 80 | TDO — JTAG test data output |
| Pin 81 | nCE — Chip enable (active-low) |
| Pin 82 | VCCIO4 — I/O Bank 4 supply voltage |
| Pin 83 | I/O — User I/O (Bank 4) |
| Pin 84 | I/O — User I/O (Bank 4) |
| Pin 85 | I/O — User I/O (Bank 4) |
| Pin 86 | I/O — User I/O (Bank 4) |
| Pin 87 | I/O — User I/O (Bank 4) |
| Pin 88 | I/O — User I/O (Bank 4) |
| Pin 89 | I/O — User I/O (Bank 4) |
| Pin 90 | I/O — User I/O (Bank 4) |
| Pin 91 | I/O — User I/O (Bank 4) |
| Pin 92 | I/O — User I/O (Bank 4) |
| Pin 93 | VCCIO4 — I/O Bank 4 supply voltage |
| Pin 94 | I/O — User I/O (Bank 4) |
| Pin 95 | I/O — User I/O (Bank 4) |
| Pin 96 | I/O — User I/O (Bank 4) |
| Pin 97 | I/O — User I/O (Bank 4) |
| Pin 98 | I/O — User I/O (Bank 4) |
| Pin 99 | I/O — User I/O (Bank 4) |
| Pin 100 | I/O — User I/O (Bank 4) |
| Pin 101 | I/O — User I/O (Bank 4) |
| Pin 102 | I/O — User I/O (Bank 4) |
| Pin 103 | I/O — User I/O (Bank 4) |
| Pin 104 | GND — Ground |
| Pin 105 | I/O — User I/O (Bank 1) |
| Pin 106 | I/O — User I/O (Bank 1) |
| Pin 107 | I/O — User I/O (Bank 1) |
| Pin 108 | I/O — User I/O (Bank 1) |
| Pin 109 | I/O — User I/O (Bank 1) |
| Pin 110 | I/O — User I/O (Bank 1) |
| Pin 111 | I/O — User I/O (Bank 1) |
| Pin 112 | I/O — User I/O (Bank 1) |
| Pin 113 | I/O — User I/O (Bank 1) |
| Pin 114 | I/O — User I/O (Bank 1) |
| Pin 115 | I/O — User I/O (Bank 1) |
| Pin 116 | I/O — User I/O (Bank 1) |
| Pin 117 | VCCIO1 — I/O Bank 1 supply voltage |
| Pin 118 | I/O — User I/O (Bank 1) |
| Pin 119 | I/O — User I/O (Bank 1) |
| Pin 120 | I/O — User I/O (Bank 1) |
| Pin 121 | I/O — User I/O (Bank 1) |
| Pin 122 | I/O — User I/O (Bank 1) |
| Pin 123 | I/O — User I/O (Bank 1) |
| Pin 124 | I/O — User I/O (Bank 1) |
| Pin 125 | I/O — User I/O (Bank 1) |
| Pin 126 | I/O — User I/O (Bank 1) |
| Pin 127 | I/O — User I/O (Bank 1) |
| Pin 128 | GND — Ground |
| Pin 129 | CLK0 — PLL Clock input 0 (Bank 3) |
| Pin 130 | CLK1 — PLL Clock input 1 (Bank 3) |
| Pin 131 | I/O — User I/O (Bank 3) |
| Pin 132 | I/O — User I/O (Bank 3) |
| Pin 133 | I/O — User I/O (Bank 3) |
| Pin 134 | I/O — User I/O (Bank 3) |
| Pin 135 | I/O — User I/O (Bank 3) |
| Pin 136 | I/O — User I/O (Bank 3) |
| Pin 137 | I/O — User I/O (Bank 3) |
| Pin 138 | I/O — User I/O (Bank 3) |
| Pin 139 | I/O — User I/O (Bank 3) |
| Pin 140 | I/O — User I/O (Bank 3) |
| Pin 141 | I/O — User I/O (Bank 3) |
| Pin 142 | I/O — User I/O (Bank 3) |
| Pin 143 | VCCIO3 — I/O Bank 3 supply voltage |
| Pin 144 | VCCINT — Core supply voltage (1.2V) |
Typical Applications
EP2C8T144C6N is suitable for 6 applications: Industrial Motor Control, Video Processing Bridge, Digital Signal Processing Front-End, Industrial Communications and Glue Logic, Educational and Prototyping Platform, Consumer Electronics Control Logic.
Industrial Motor Control
The EP2C8T144C6N's 8,256 logic elements and 36 embedded 18x18 multipliers make it a strong fit for industrial motor control loops, including field-oriented control (FOC) and space-vector PWM (SVPWM). With 85 user I/O in the 144-LQFP package, designers can interface directly to Hall sensors, encoder inputs, gate drivers, and ADC feedback channels without external logic. The two PLLs allow flexible clock generation for encoder sampling and PWM switching frequencies, while the M4K memory blocks provide lookup-table storage for sine and Clarke transforms. Drop-in speed-grade flexibility (C6 to C8) gives design teams a margin to handle timing closure without PCB redesign.
Recommended
Video Processing Bridge
For bridging between image sensors, video processors, and display panels, the EP2C8T144C6N provides ample LUT capacity for color-space conversion, frame-rate conversion, and timing generator logic. The 36 embedded 18x18 multipliers support real-time scaling and chroma resampling at standard video rates (480p to 720p). Its 85 I/O are sufficient to handle parallel RGB, BT.656, or LVDS video interfaces directly, while the 165,888 bits of RAM buffer a full video line for deinterlacing or scaling. The 144-LQFP package is hand-solderable, making it ideal for prototype video bridges used in surveillance, signage, or machine-vision applications.
Recommended
Digital Signal Processing Front-End
With 36 dedicated 18x18 multipliers and 8,256 logic elements, the EP2C8T144C6N implements FIR filters, FFTs, and other DSP functions at baseband or audio sample rates. The M4K memory blocks (totaling 165,888 bits) can store filter coefficients and sample buffers, while the PLLs generate the precise clocks needed for ADC/DAC interfaces. Its low unit cost makes it attractive for production DSP front-ends in audio processing, biomedical instrumentation, or software-defined radio baseband. Quartus II DSP Builder and Verilog/VHDL flows are fully supported, with reference designs available from Intel for common FIR and FFT implementations.
Recommended
Industrial Communications and Glue Logic
The EP2C8T144C6N is well suited for industrial protocol bridging, protocol conversion, and complex glue logic between microcontrollers, sensors, and communication transceivers. It can implement Modbus, CANopen, EtherCAT slave, PROFINET IRT, or custom industrial protocols in parallel with protocol translation. The 144-LQFP package's 85 I/O are sufficient to bridge multiple UART/SPI/I2C buses, while the embedded RAM supports packet buffering and protocol state machines. The commercial temperature grade (0C to +85C) is adequate for indoor cabinet environments; for harsher industrial sites, choose the EP2C8T144I8N drop-in alternative with -40C to +100C support.
Recommended
Educational and Prototyping Platform
The combination of low unit cost, hand-solderable 144-LQFP package, and free Quartus II Web Edition toolchain makes the EP2C8T144C6N a popular choice for university FPGA courses, hobbyist projects, and engineering prototypes. The 8,256 logic elements provide enough capacity for full RISC-V soft cores (e.g. PicoRV32), custom instruction sets, and graduate-level projects without immediately running out of resources. Reference boards (e.g. Altera Cyclone II Starter Kit) pair this FPGA with EPCS configuration flash, SDRAM, VGA, and GPIO headers - enabling end-to-end learning of HDL design, synthesis, place-and-route, and verification.
Recommended
Consumer Electronics Control Logic
In consumer products such as smart appliances, set-top boxes, and home entertainment peripherals, the EP2C8T144C6N provides the logic capacity to handle user-interface decoding, LED matrix driving, IR receiver decoding, and peripheral multiplexing. Its 85 I/O are sufficient to drive 7-segment displays, key-scan matrices, and multiple PWM channels for backlight or motor control. The low unit cost and proven Cyclone II reliability make it attractive for consumer volumes where ASIC NRE cannot be amortized. Reference designs from Intel cover I2C/SPI master-slave bridging, HDMI CEC handling, and IR protocol decoding.
Recommended
Recommended Products Summary
Engineering reference data for EP2C8T144C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C8T144C8N | EP2C8T144C7N | EP2C8T144I8N | EP2C5T144C8N | EP2C5T144C6N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 4,608 | 4,608 |
| Speed Grade | -C6 (fast) | -C8 (slower) | -C7 (intermediate) | -I8 (industrial) | -C8 (slower) | -C6 (matches) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User I/O | 85 | 85 | 85 | 85 | 89 | 89 |
| Embedded RAM (bits) | 165,888 | 165,888 | 165,888 | 165,888 | 119,808 | 119,808 |
Key Differentiators
- Largest Cyclone II LE density in the 144-LQFP package (vs EP2C5T144C6N)
- Fastest speed grade available in 144-LQFP (-C6) (vs EP2C8T144C8N)
- Commercial temperature only - industrial variant is a drop-in upgrade (vs EP2C8T144I8N)
Design Notes
The EP2C8T144C6N requires separate VCCINT (core, 1.15-1.25 V) and VCCIO1/VCCIO2/VCCIO3/VCCIO4 (I/O banks, 1.5/1.8/2.5/3.3 V) supplies. Decouple each VCCINT pin with one 0.1 uF ceramic plus one 10 uF bulk capacitor placed within 5 mm of the pin. Each VCCIO bank should have its own 0.1 uF + 10 uF decoupling pair to prevent switching noise from coupling between banks and corrupting logic levels on adjacent I/O standards.
Use a 4-layer PCB stackup (signal-GND-VCC-signal) with one continuous GND plane and one continuous VCC plane. The 144-TQFP package has a 0.5 mm pin pitch - route two traces between adjacent pads using 0.20 mm trace width with 0.20 mm clearance. Place a 4x4 via array (0.3 mm drilled, 0.5 mm pad) under the package thermal pad area (none for LQFP, but place ground vias around the package perimeter for thermal spreading and signal return paths).
Do not leave MSEL[2:0] floating - tie them to VCCINT or GND through 1 kohm resistors to define configuration mode. CONF_DONE and nSTATUS are open-drain and require a 10 kohm pull-up to VCCIO. The Cyclone II configuration sequence is sensitive to nCONFIG rising-edge timing - ensure power supplies have stabilized and PLL clock inputs are stable before nCONFIG is released, otherwise configuration may fail intermittently.
Cyclone II LVDS inputs require an external 100-ohm differential termination resistor across the pair placed within 5 mm of the FPGA pin. SSTL and HSTL I/O standards require external VTT termination at the receiver end. For clock inputs CLK0/CLK1, keep traces short and impedance-controlled (50-ohm single-ended or 100-ohm differential) to avoid jitter exceeding the PLL input specification. Always refer to the Cyclone II Device Handbook chapter 'I/O Features' for the specific standard being used.
Compliance Information
RoHS, REACH, halogen-free, and conflict-mineral status were not explicitly confirmed in the Verified Web Data for this part - see Intel/Altera product page for current compliance documentation. The 'N' suffix in the MPN indicates lead-free / Pb-free plating per Altera's legacy naming convention.
