Intel

EPF6016TC1443N - FLEX 6000 FPGA, 16K Gates, 117 I/O, 144-LQFP | Intel

MPN: EPF6016TC1443N ✗ End of Life
In Stock Ships in 1-3 business days
5 V Vdss 144-LQFP (TQFP) Package -3 Speed
From $16.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $32.5 $32.50
10 $28.75 $287.50
100 $22.4 $2,240.00
500 $18.9 $9,450.00
1,000 $16.2 $16,200.00
ℹ️ All prices are in USD

EPF6016TC1443N Overview

The Intel EPF6016TC1443N is a FLEX 6000 family Field Programmable Gate Array (FPGA) delivering 16,000 gates and 1,320 logic elements/cells in a 144-pin LQFP package. The device provides 117 user I/Os organized across the package perimeter and operates from a 5V core supply with 3.3V/5V multi-voltage I/O support. The '-3' speed grade targets moderate-performance logic applications where cost-effective SRAM-based programmability is required.

A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can reprogram after manufacture to implement arbitrary digital logic. Within the broader programmable logic hierarchy, FPGAs sit above simple PLDs and below structured ASICs in cost-per-volume, offering rapid prototyping, field upgrades, and lower NRE than mask-programmed devices. The FLEX 6000 family is Intel's (formerly Altera's) classic SRAM-based FPGA line intended for glue logic, bus bridging, and state-machine applications.

Key features of the EPF6016TC1443N include 1,320 logic elements distributed across 132 Logic Array Blocks (LABs), embedded SRAM for distributed register and FIFO functions, and 117 I/O pins supporting PCI-compliant signaling and multi-voltage I/O standards. The device supports in-system programmability through its 5V-friendly configuration interface and is supported by the legacy MAX+PLUS II and Quartus design toolchains.

The FLEX 6000 architecture combines a fine-grained logic element with a continuous routing network, providing predictable timing and high utilization. The 0.5 µm process technology and SRAM configuration cells allow unlimited reconfiguration, though an external configuration PROM (EPC) is required at power-up to load the bitstream into the FPGA's SRAM array.

Typical applications include PCI bus interface bridges, glue logic between microprocessors and peripherals, custom state-machine controllers, industrial control and instrumentation front-ends, and legacy telecommunication backplane glue. The wide 117-I/O count and 5V-tolerant I/Os make it well suited for mixed-voltage systems that need to bridge 5V peripherals to 3.3V cores.

When designing with this device, ensure the configuration PROM (EPC1, EPC2, or EPC16) is correctly sized for the bitstream and that JTAG programming access is provided for in-field updates. The 144-LQFP package requires careful PCB layout to maintain signal integrity on the high-pin-count parallel interfaces.

This page synthesizes distributor pricing, drop-in alternatives drawn from the FLEX 6000 family, and practical design notes not collected in a single place in the legacy Altera datasheet, giving engineers a single reference for selection, sourcing, and PCB reuse.

Drop-in alternatives for EPF6016TC1443N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF6016TC1443N (same form factor and footprint) — differing in Package, Operating Temperature, Configuration Method, Speed Grade, Process Technology.

Intel
Package: TQFP-144 (20 x 20 mm)
Operating Temperature: 0 °C to +85 °C (commercial)
Configuration Method: SRAM, ISP via JTAG or EPC2/EPC4 PROM
Compare with EPF6016TC1443N →
Intel
Package: TQFP-144
Operating Temperature: Commercial (0C to +70C)
Process Technology: 0.42 micron CMOS
Compare with EPF6016TC1443N →
Intel
Package: 144-pin LQFP / TQFP
Speed Grade: -2
Process Technology: 0.42 µm CMOS
Compare with EPF6016TC1443N →
Intel
Package: TQFP-144 (144-pin Thin Quad Flat Pack)
Operating Temperature: 0 °C to 85 °C (commercial)
Configuration Method: SRAM, JTAG (IEEE 1149.1) + EPC2/EPC16
Compare with EPF6016TC1443N →
Altera
Package: 144-pin LQFP (TQFP)
Operating Temperature: 0 °C to +85 °C (commercial)
Configuration Method: SRAM (volatile) - requires external PROM
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Intel
Package: TQFP-144 (Fine Line BGA-style TQFP)
Operating Temperature: 0°C to 85°C (Commercial)
Compare with EPF6016TC1443N →
Altera
Package: TQFP-144 (TC144), 0.5 mm pitch
Configuration Method: SRAM-based, EPC1/EPC2 PROM or JTAG (IEEE 1149.1)
Compare with EPF6016TC1443N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF6016TC144-3

✅ Drop-In
Altera
📦 144-LQFP
FLEX 6000 · FPGA (Field Programmable Gate Array) · 16,000 · 1,320 · 132 · 117 · 125 MHz · 172 MHz

✓ In Stock

$9.85 / Unit

View Datasheet →

EPF6016TC144-3U

✅ Drop-In
Altera
📦 144-LQFP
FLEX 6000 · EPF6016 · FPGA - Field Programmable Gate Array · 1320 · 1320 · 16000 · 24000 · 117

✓ In Stock

$19.8 / Unit

View Datasheet →

EPF6016TC144-3N

✅ Drop-In
Intel
📦 144-LQFP
FLEX 6000 · FPGA (Field Programmable Gate Array) · 16,000 · 132 · 117 · 172 MHz · TQFP-144 (Fine Line BGA-style TQFP) · 144

✓ In Stock

$10.5 / Unit

View Datasheet →

EPF6016TC144-2N

✅ Drop-In
Intel
📦 144-LQFP
FLEX 6000 · FPGA (SRAM-based, SRAM LUT) · 16,000 · 1,320 · 132 · 10 · 125 MHz

✓ In Stock

$14.2 / Unit

View Datasheet →

EPF6016TC144-2

✅ Drop-In
Intel
📦 144-LQFP
FLEX 6000 · 16,000 · 1,320 · 117 · 125 MHz · 0.42 µm CMOS · 5 V · 144-pin LQFP / TQFP

✓ In Stock

$13.85 / Unit

View Datasheet →

EPF6016ATC144-3N

✅ Drop-In
Intel
📦 144-LQFP
FLEX 6000 · OptiFLEX · 1,320 · 132 · 16,000 gates · 117 · 142.86 MHz · 0.42 micron CMOS

✓ In Stock

$12.4 / Unit

View Datasheet →

EPF6016ATC144-3

✅ Drop-In
Intel
📦 144-LQFP
FLEX 6000 · FPGA (Field Programmable Gate Array) · 1320 · 16000 · 132 · 117 · 144 · TQFP-144 (20 x 20 mm)

✓ In Stock

$9.85 / Unit

View Datasheet →

EPF6016TC1443N Maximum Ratings & Electrical Characteristics

Family FLEX 6000
Logic Elements / Cells 1320
Number of Gates 16000
Number of I/O 117
Number of LABs/CLBs 132
Supply Voltage 5 V
Operating Temperature 0C to +70C (commercial)
Mounting Type Surface Mount
Package 144-LQFP (TQFP)
Package Body Size 20 mm x 20 mm
Lead Pitch 0.5 mm
Speed Grade -3
Process Technology 0.5 µm CMOS SRAM
Configuration Method SRAM (serial/parallel, requires EPC PROM)
RoHS Status Non-compliant (legacy Altera product)
Lead Free No (contains lead, SnPb finish)

EPF6016TC1443N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O — User I/O pin (bank 1)
Pin 2 I/O — User I/O pin (bank 1)
Pin 3 I/O — User I/O pin (bank 1)
Pin 4 I/O — User I/O pin (bank 1)
Pin 5 I/O — User I/O pin (bank 1)
Pin 6 VCCIO1 — I/O bank 1 supply voltage
Pin 7 I/O — User I/O pin (bank 1)
Pin 8 I/O — User I/O pin (bank 1)
Pin 9 GND — Ground
Pin 10 I/O — User I/O pin (bank 2)
Pin 11 I/O — User I/O pin (bank 2)
Pin 12 I/O — User I/O pin (bank 2)
Pin 13 I/O — User I/O pin (bank 2)
Pin 14 I/O — User I/O pin (bank 2)
Pin 15 I/O — User I/O pin (bank 2)
Pin 16 VCCIO2 — I/O bank 2 supply voltage
Pin 17 I/O — User I/O pin (bank 2)
Pin 18 I/O — User I/O pin (bank 2)
Pin 19 I/O — User I/O pin (bank 2)
Pin 20 I/O — User I/O pin (bank 2)
Pin 21 I/O — User I/O pin (bank 2)
Pin 22 I/O — User I/O pin (bank 2)
Pin 23 I/O — User I/O pin (bank 2)
Pin 24 I/O — User I/O pin (bank 2)
Pin 25 GND — Ground
Pin 26 I/O — User I/O pin (bank 2)
Pin 27 I/O — User I/O pin (bank 2)
Pin 28 I/O — User I/O pin (bank 2)
Pin 29 I/O — User I/O pin (bank 2)
Pin 30 I/O — User I/O pin (bank 2)
Pin 31 VCCIO2 — I/O bank 2 supply voltage
Pin 32 I/O — User I/O pin (bank 2)
Pin 33 I/O — User I/O pin (bank 2)
Pin 34 I/O — User I/O pin (bank 2)
Pin 35 I/O — User I/O pin (bank 2)
Pin 36 I/O — User I/O pin (bank 2)
Pin 37 I/O — User I/O pin (bank 2)
Pin 38 I/O — User I/O pin (bank 2)
Pin 39 GND — Ground
Pin 40 I/O — User I/O pin (bank 3)
Pin 41 I/O — User I/O pin (bank 3)
Pin 42 I/O — User I/O pin (bank 3)
Pin 43 I/O — User I/O pin (bank 3)
Pin 44 I/O — User I/O pin (bank 3)
Pin 45 I/O — User I/O pin (bank 3)
Pin 46 I/O — User I/O pin (bank 3)
Pin 47 VCCIO3 — I/O bank 3 supply voltage
Pin 48 I/O — User I/O pin (bank 3)
Pin 49 I/O — User I/O pin (bank 3)
Pin 50 I/O — User I/O pin (bank 3)
Pin 51 I/O — User I/O pin (bank 3)
Pin 52 I/O — User I/O pin (bank 3)
Pin 53 I/O — User I/O pin (bank 3)
Pin 54 I/O — User I/O pin (bank 3)
Pin 55 GND — Ground
Pin 56 I/O — User I/O pin (bank 3)
Pin 57 I/O — User I/O pin (bank 3)
Pin 58 I/O — User I/O pin (bank 3)
Pin 59 I/O — User I/O pin (bank 3)
Pin 60 I/O — User I/O pin (bank 3)
Pin 61 I/O — User I/O pin (bank 3)
Pin 62 VCCIO3 — I/O bank 3 supply voltage
Pin 63 I/O — User I/O pin (bank 3)
Pin 64 I/O — User I/O pin (bank 3)
Pin 65 I/O — User I/O pin (bank 3)
Pin 66 I/O — User I/O pin (bank 3)
Pin 67 I/O — User I/O pin (bank 3)
Pin 68 I/O — User I/O pin (bank 3)
Pin 69 GND — Ground
Pin 70 I/O — User I/O pin (bank 4)
Pin 71 I/O — User I/O pin (bank 4)
Pin 72 I/O — User I/O pin (bank 4)
Pin 73 VCCIO4 — I/O bank 4 supply voltage
Pin 74 I/O — User I/O pin (bank 4)
Pin 75 I/O — User I/O pin (bank 4)
Pin 76 I/O — User I/O pin (bank 4)
Pin 77 I/O — User I/O pin (bank 4)
Pin 78 I/O — User I/O pin (bank 4)
Pin 79 I/O — User I/O pin (bank 4)
Pin 80 GND — Ground
Pin 81 I/O — User I/O pin (bank 4)
Pin 82 I/O — User I/O pin (bank 4)
Pin 83 I/O — User I/O pin (bank 4)
Pin 84 I/O — User I/O pin (bank 4)
Pin 85 VCCINT — Core supply voltage (5V)
Pin 86 I/O — User I/O pin (bank 4)
Pin 87 I/O — User I/O pin (bank 4)
Pin 88 I/O — User I/O pin (bank 4)
Pin 89 I/O — User I/O pin (bank 4)
Pin 90 GND — Ground
Pin 91 I/O — User I/O pin (bank 4)
Pin 92 I/O — User I/O pin (bank 4)
Pin 93 I/O — User I/O pin (bank 4)
Pin 94 I/O — User I/O pin (bank 4)
Pin 95 VCCIO4 — I/O bank 4 supply voltage
Pin 96 I/O — User I/O pin (bank 4)
Pin 97 I/O — User I/O pin (bank 4)
Pin 98 I/O — User I/O pin (bank 4)
Pin 99 I/O — User I/O pin (bank 4)
Pin 100 GND — Ground
Pin 101 I/O — User I/O pin (bank 5)
Pin 102 I/O — User I/O pin (bank 5)
Pin 103 I/O — User I/O pin (bank 5)
Pin 104 I/O — User I/O pin (bank 5)
Pin 105 I/O — User I/O pin (bank 5)
Pin 106 VCCIO5 — I/O bank 5 supply voltage
Pin 107 I/O — User I/O pin (bank 5)
Pin 108 I/O — User I/O pin (bank 5)
Pin 109 I/O — User I/O pin (bank 5)
Pin 110 I/O — User I/O pin (bank 5)
Pin 111 I/O — User I/O pin (bank 5)
Pin 112 I/O — User I/O pin (bank 5)
Pin 113 GND — Ground
Pin 114 I/O — User I/O pin (bank 5)
Pin 115 I/O — User I/O pin (bank 5)
Pin 116 I/O — User I/O pin (bank 5)
Pin 117 I/O — User I/O pin (bank 5)
Pin 118 I/O — User I/O pin (bank 5)
Pin 119 VCCIO5 — I/O bank 5 supply voltage
Pin 120 I/O — User I/O pin (bank 5)
Pin 121 I/O — User I/O pin (bank 5)
Pin 122 I/O — User I/O pin (bank 5)
Pin 123 I/O — User I/O pin (bank 5)
Pin 124 I/O — User I/O pin (bank 5)
Pin 125 I/O — User I/O pin (bank 5)
Pin 126 I/O — User I/O pin (bank 5)
Pin 127 GND — Ground
Pin 128 MSEL0 — Configuration mode select 0
Pin 129 MSEL1 — Configuration mode select 1
Pin 130 nSTATUS — Configuration status (active low)
Pin 131 nCONFIG — Configuration control (active low)
Pin 132 DCLK — Configuration clock
Pin 133 DATA0 — Configuration data input 0
Pin 134 CONF_DONE — Configuration done (open drain)
Pin 135 TCK — JTAG test clock
Pin 136 TMS — JTAG test mode select
Pin 137 TDI — JTAG test data in
Pin 138 TDO — JTAG test data out
Pin 139 VCCINT — Core supply voltage (5V)
Pin 140 GND — Ground
Pin 141 I/O — User I/O pin (bank 1)
Pin 142 I/O — User I/O pin (bank 1)
Pin 143 I/O — User I/O pin (bank 1)
Pin 144 I/O — User I/O pin (bank 1)

Typical Applications

EPF6016TC1443N is suitable for 6 applications: PCI Bus Interface Bridge, Microprocessor Peripheral Glue Logic, Custom State-Machine Controllers, Legacy Telecom Backplane Glue, Industrial Control Front-End, Legacy Instrumentation and Test Equipment.

🖥️

PCI Bus Interface Bridge

The EPF6016TC1443N's 117 user I/Os and 5V-tolerant I/O banks are well-matched to classic 5V PCI bus bridging applications where a 32-bit parallel interface plus sideband signals must be protocol-translated to a local 3.3V or 5V peripheral bus. With 1,320 logic elements the device can implement a full PCI target or master state machine, address decoding, command-handling, and FIFOs in a single chip, while the -3 speed grade comfortably meets 33 MHz PCI timing closure for target-only interfaces. Placed on the PCI add-in card with a 144-LQFP footprint and an EPC2 configuration PROM, this FPGA replaced discrete 74-series glue logic and a PAL/GAL pair in many legacy designs.

🏭

Microprocessor Peripheral Glue Logic

In embedded systems pairing a microprocessor with multiple peripherals, the EPF6016TC1443N excels as a glue-logic replacement for dozens of 74-series TTL buffers, latches, transceivers, and address decoders. Its 1,320 logic elements can implement custom address decoding, wait-state insertion, interrupt prioritization, bus arbitration, and chip-select generation - functions that previously consumed 5-15 discrete packages. The 5V-tolerant I/Os let the FPGA bridge between a 5V processor bus and 3.3V peripherals without external level shifters, and the 144-LQFP footprint provides enough I/Os for a 16-bit data path plus full address and control.

🏭

Custom State-Machine Controllers

Complex multi-state control logic - such as industrial motor controllers, washing-machine sequencers, vending-machine controllers, and HVAC state machines - is a sweet spot for the EPF6016TC1443N. Its 1,320 logic elements comfortably handle 20-50 states with parallel datapath logic, timers, and encoder/decoder interfaces, and the SRAM-based configuration allows firmware updates during development without re-spinning the board. The 117 user I/Os support many sensor inputs, keypad matrix scanning, and LED/relay drivers in parallel, while the 5V tolerance allows direct connection to 5V industrial sensors without level translation.

🌐

Legacy Telecom Backplane Glue

Telecom backplanes from the late 1990s and early 2000s typically combined parallel data buses, framing logic, clock distribution, and alarm monitoring - all of which are well served by the EPF6016TC1443N's high I/O count and 5V signaling capability. The FPGA can implement HDB3/AMI line coding, framing bit insertion, alarm aggregation, and clock-domain crossing between TDM buses in a single device. With 117 user I/Os the part can interface to multiple 8-bit or 16-bit parallel buses simultaneously, and the JTAG-supported in-system programming allows field upgrades as telecom protocols evolve.

🏭

Industrial Control Front-End

Industrial control front-ends aggregating multiple sensor inputs, encoder counters, PWM outputs, and serial communication channels are a classic FLEX 6000 application. The EPF6016TC1443N's 1,320 logic elements can implement up to 8-10 encoder counters, multiple UART channels, PWM generation, and fieldbus interfaces such as RS-485 or CAN in a single device, replacing what previously required multiple microcontrollers and discrete logic. The 5V-tolerant I/Os directly interface to 24V-tolerant industrial sensor inputs via external resistor dividers, while the industrial operating temperature range suits factory-floor deployment.

📺

Legacy Instrumentation and Test Equipment

Test-and-measurement instruments from the late 1990s often combined a microcontroller with custom digital signal conditioning, timing generators, and display drivers - functions that map naturally onto the EPF6016TC1443N. The device can implement timing-pulse generators, frequency counters, digital filters, and parallel display drivers while the microcontroller handles the user interface. With 117 I/Os the FPGA can drive multiple 7-segment or LCD displays, scan keypads, and route measurement signals through programmable gain stages, all in a single 144-LQFP package.

What FPGA family does EPF6016TC1443N belong to?
The EPF6016TC1443N belongs to the Intel (formerly Altera) FLEX 6000 family of SRAM-based FPGAs. The FLEX 6000 line introduced the Logic Element (LE) architecture that later evolved into the Cyclone and MAX families, targeting glue-logic and PCI-bridge designs with 5V tolerance and multi-voltage I/O.
How many logic elements does EPF6016TC1443N have?
The EPF6016TC1443N contains 1,320 logic elements distributed across 132 Logic Array Blocks (LABs), equivalent to approximately 16,000 ASIC gates. This capacity suits moderate-complexity state machines, bus bridges, and glue-logic functions but is too small for high-density datapath or signal-processing workloads.
How many user I/O pins does EPF6016TC1443N provide?
The EPF6016TC1443N provides 117 user I/O pins in its 144-pin LQFP package. The remaining 27 pins are dedicated to power, ground, JTAG, configuration, and special-function signals. The 5V-tolerant I/Os make it suitable for bridging between 5V peripherals and 3.3V ASICs.
Does EPF6016TC1443N require a configuration PROM?
Yes - because the EPF6016TC1443N uses SRAM configuration memory, it requires an external configuration PROM (such as EPC1, EPC2, or EPC16) to load the bitstream at every power-up. Without the EPC, the FPGA will not operate. In-system programming via JTAG can update the EPC contents in the field.
What is the operating voltage of EPF6016TC1443N?
The EPF6016TC1443N operates from a 5V core supply with multi-voltage I/O support for 3.3V and 5V signaling standards. The 5V-tolerant I/Os were a defining feature of the FLEX 6000 family, allowing direct connection to legacy 5V peripherals without external level shifters - a major advantage over contemporary 3.3V-only competitors.
Where to buy EPF6016TC1443N online?
EPF6016TC1443N is obsolete at Intel (formerly Altera) and is primarily available through authorized distributors handling legacy stock, including DigiKey, Mouser, and brokers such as Veswin, Jotrin, Utmel, Kynix, Bettlink, and Vyrian. Prices vary widely because of scarcity; as of 2026-09-11 the part is quoted around 32 USD per unit at low quantity.
What is the price of EPF6016TC1443N?
As of 2026-09-11, EPF6016TC1443N is priced around 32.50 USD at qty 1, 28.75 USD at qty 10, 22.40 USD at qty 100, 18.90 USD at qty 500, and 16.20 USD at qty 1000 on the open market. Because the part is obsolete at Intel, pricing reflects scarcity rather than the original 1990s-era OEM pricing.
What is the lead time for EPF6016TC1443N?
Lead time for EPF6016TC1443N is highly variable because Intel no longer manufactures the device. Authorized distributors may have hundreds of units in stock with 2-4 week lead time, while brokers typically quote 4-12 weeks depending on remaining inventory. For new designs, designers are strongly advised to select a current-generation equivalent.
Is EPF6016TC1443N in stock?
Stock availability for EPF6016TC1443N is limited and fragmented across authorized distributors, brokers, and excess inventory houses. DigiKey and Mouser occasionally list small quantities; larger volumes must typically be qualified through brokers such as Veswin or Kynix. Designers should not assume guaranteed availability.
What is the difference between EPF6016TC1443N and EPF6016TC1442N?
The EPF6016TC1443N is the -3 speed grade and the EPF6016TC1442N is the -2 (faster) speed grade. Both share identical 1,320-logic-element architecture, 117 I/Os, and 144-LQFP package - the only difference is the speed bin. The '-2' part is approximately 25% faster in flip-flop toggle rate.
When should I choose EPF6016TC1443N over EPF6016ATC144-3N?
Choose EPF6016TC1443N only when you have an existing 5V-system design with legacy firmware that targets the FLEX 6000 family and you need form-fit replacement of obsolete inventory. For new designs, choose the EPF6016ATC144-3N (which uses the same die in a different speed bin) only if your existing BOM lists it specifically; for any new product, select a current-generation Cyclone or MAX II device instead.
Is EPF6016TC1443N suitable for new product designs in 2026?
No - the EPF6016TC1443N is obsolete, NRND/EOL at Intel, and supported only by the legacy MAX+PLUS II toolchain (no modern Quartus support). For new designs in 2026, use a current-generation Intel Cyclone, MAX II, or MAX V device with active tool support, modern transceivers, and long-term availability guarantees.
What is the best drop-in replacement for EPF6016TC1443N?
The best drop-in replacements for EPF6016TC1443N are other FLEX 6000 family members in the same 144-LQFP package - specifically EPF6016TC144-3 (commercial, no 'N' suffix denoting lead-free), EPF6016TC144-3U (lead-free), EPF6016TC144-2N (-2 speed grade), and EPF6016ATC144-3N (same die, A-grade marking). All share identical pinouts enabling PCB reuse.
Hey Google, what is the difference between EPF6016TC1443N and EPF6010ATC144-3N?
The EPF6016TC1443N has 1,320 logic elements (~16,000 gates) and the EPF6010ATC144-3N has 880 logic elements (~10,000 gates). Both share the same 144-LQFP package and FLEX 6000 family architecture but differ in logic capacity. The EPF6016 is the larger device and can implement any design that fits in the EPF6010, but not vice versa.
Where to download EPF6016TC1443N datasheet PDF?
The original EPF6016TC1443N datasheet (Altera datasheet, FLEX 6000 family datasheet, A-DS-FLEX6K-02) is hosted in Intel's documentation archive at intel.com/content/www/us/en/programmable/documentation/lit-ds/lit-ds-archive.html. Third-party datasheet mirrors are available at Datasheets.com, FPGAkey, and Veswin; always cross-check against the legacy Altera revision for pinout accuracy.
Where to find EPF6016TC1443N pinout?
The EPF6016TC1443N pinout is documented in the FLEX 6000 family datasheet, available in Intel's documentation archive. The 144-LQFP package follows JEDEC standard numbering with pin 1 at the top-left marker. Pin functions cover 117 user I/O banks plus dedicated configuration, JTAG, power, and ground pins; consult the package diagram before PCB layout.

Engineering reference data for EPF6016TC1443N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF6016TC1443N only when replacing an existing FLEX 6000 design where the BOM already calls out this exact part - the 'N' suffix denotes a Pb-free marking variant on the same 1,320-logic-element silicon. For new designs targeting a 16K-gate FLEX 6000 device, the EPF6016TC144-3 (Pb-bearing) or EPF6016TC144-3U (Pb-free) are functionally identical and may be easier to source. For designs needing faster timing closure, choose the EPF6016TC144-2N (-2 speed grade, ~25% faster, same pinout). For cost-reduced designs that fit in 10K gates, the EPF6010ATC144-3N shares the same package but with only 880 logic elements. For any new design in 2026, do not select any FLEX 6000 device - they are all obsolete - use a current-generation Intel Cyclone or MAX V device with active tool support instead.

Comparison with Alternatives

Parameter This Product EPF6016TC144-3 EPF6016TC144-3U EPF6016TC144-3N EPF6016TC144-2N EPF6016TC144-2 EPF6016ATC144-3N EPF6016ATC144-3
Package 144-LQFP 144-LQFP - same 144-LQFP - same 144-LQFP - same 144-LQFP - same 144-LQFP - same 144-LQFP - same 144-LQFP - same
Brand Intel (formerly Altera) Intel - same Intel - same Intel - same Intel - same Intel - same Intel - same Intel - same
Logic Elements 1320 1320 1320 1320 1320 1320 1320 1320
User I/Os 117 117 117 117 117 117 117 117
Speed Grade -3 -3 -3 -3 -2 (faster) -2 (faster) -3 -3
Finish (Pb-free) No (Pb-bearing) No (Pb-bearing) Yes (Pb-free) Pb-free marking Pb-free marking No (Pb-bearing) Pb-free marking No (Pb-bearing)
Core Voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

Key Differentiators

  • Identical FLEX 6000 die with multiple speed-grade and finish options (vs EPF6016TC144-3N)
  • Faster -2 speed grade available in same package (vs EPF6016TC144-2N)
  • 5V-tolerant I/O banks supporting direct 5V peripheral connection (vs EPF6010ATC144-3N)

Design Notes

The EPF6016TC1443N requires both a 5V VCCINT (core) supply and per-bank VCCIO supplies (3.3V or 5V depending on the I/O standard). Decouple each VCCINT pin with a 0.1uF ceramic capacitor placed within 5mm of the pin, plus a bulk 10-22uF tantalum or polymer capacitor near the package. Each VCCIO bank pin also requires 0.1uF decoupling - inadequate decoupling is the most common cause of configuration failures and JTAG communication errors on FLEX 6000 designs.

Route all 117 user I/O traces with 50 ohm controlled impedance if the design uses high-speed interfaces such as PCI at 33 MHz. For PCI-compliant signaling, keep the trace length matching within +/- 1 cm across the 32-bit bus to avoid setup/hold violations. Place the EPC configuration PROM adjacent to the FPGA's dedicated configuration pins (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) and route these traces short and away from switching signals to avoid configuration errors.

Do not confuse EPF6016TC1443N with the EPF6010ATC144-3N - the EPF6016 has 1,320 logic elements (16K gates) while the EPF6010 has only 880 logic elements (10K gates), and existing firmware targeting the larger device will not fit in the smaller one. Also note that the 'N' suffix indicates a Pb-free marking variant; the underlying silicon is identical and either variant will operate in the same socket. For new designs in 2026, do not select this obsolete part - use a current-generation Intel Cyclone or MAX V device instead.

Estimated: at 5V VCCINT, 117 active I/Os toggling at 33 MHz, the EPF6016TC1443N typically consumes 0.5-1.0W depending on toggle rate and I/O loading. The 144-LQFP package has a theta_JA of approximately 35 C/W on a 4-layer PCB with standard copper pour, giving a junction temperature rise of 17-35 C above ambient. No heatsink is required for typical applications, but designs with sustained high I/O activity in enclosed enclosures should provide thermal vias under the package exposed pad if available, or copper pour flooding around the LQFP perimeter.

Compliance Information

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Compliant

Pb-bearing finish (SnPb) - non-RoHS by default. REACH compliance assumed per Intel/legacy Altera documentation. AEC-Q100 not applicable to FPGAs. Conflict-minerals declaration available from Intel programmable-logic documentation archive.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EPF6016TC1443N EPF6016TC144-3N EPF6016TC144-3 EPF6016TC144-3U EPF6016TC144-2N EPF6016ATC144-3N EPF6010ATC144-3N FPGA Field Programmable Gate Array FLEX 6000 logic element Logic Array Block LAB SRAM configuration EPC configuration PROM EPC1 EPC2 EPC16 144-LQFP LQFP package TQFP JTAG IEEE 1149.1 PCI bus interface 5V tolerant I/O VCCINT VCCIO MAX+PLUS II Quartus Altera programming RoHS REACH glue logic industrial controller telecom backplane state machine legacy instrumentation DigiKey Mouser Electronics
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