EPF6016ATI144-3 - FLEX 6000 FPGA, 132 LABs, 117 I/O, 144-LQFP | Intel
MPN: EPF6016ATI144-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.85 | $2,185.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $15.9 | $15,900.00 |
EPF6016ATI144-3 Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic through configuration rather than fixed silicon. The FLEX 6000 family sits within Intel's PLD hierarchy: PLD -> SRAM-based FPGA -> FLEX 6000 series -> EPF6016 sub-family. FPGAs enable rapid prototyping, hardware-level parallelism, and post-manufacture design changes that ASICs cannot offer, making them ideal for glue logic, interface bridging, and small-to-medium digital systems.
Key features of the EPF6016ATI144-3 include 16,000 typical gates, a 4-input Look-Up Table (LUT) architecture, SRAM-based configuration memory, multiVolt I/O support for interfacing with 5.0V, 3.3V, and 2.5V devices, and JTAG-compliant boundary-scan testing (IEEE Std. 1149.1). The device also offers in-system programmability (ISP) via the JTAG port or the dedicated configuration interface, allowing field upgrades without removing the part from the board.
Architecturally, the FLEX 6000 series uses an SRAM-based 4-input LUT fabric with embedded memory and routing interconnect, providing a balance of logic density and predictable timing. The 144-LQFP package offers 117 usable I/O pins after accounting for power, ground, configuration, and JTAG pins. The "I" in the part number indicates the industrial operating range, and the speed grade "-3" places this part in the standard-performance tier.
Typical applications include telecommunications interface cards, industrial control and glue logic, legacy digital system prototyping, glue logic between microcontrollers and peripherals, parallel bus interfaces, and state-machine controllers. The 117 user I/O count and 142.86 MHz Fmax support moderate-complexity designs that require parallel processing or multiple parallel interfaces.
When designing with this device, note that configuration data must be loaded from an external serial or parallel PROM at power-up because FLEX 6000 devices are SRAM-based and lose configuration when power is removed. Power sequencing, decoupling, and JTAG chain integrity are critical design considerations. This part is marked as obsolete on distributor channels - design for longevity by sourcing authorized stock or planning a migration to the MAX II or Cyclone equivalent families.
Drop-in alternatives for EPF6016ATI144-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016ATI144-3 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Configuration Method, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016ATI144-3N
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →EPF6016ATC144-3N
✅ Drop-In✓ In Stock
$12.4 / Unit
View Datasheet →EPF6016ATC144-3
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$9.85 / Unit
View Datasheet →EPF6016ATC144-3S
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$18.1 / Unit
View Datasheet →EPF6016ATC144-2
✅ Drop-In✓ In Stock
$13.85 / Unit
View Datasheet →EPF6016ATC144-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$19.5 / Unit
View Datasheet →EPF6016ATI144-3 Maximum Ratings & Electrical Characteristics
| Series | FLEX 6000 |
| Family | EPF6016 |
| Logic Elements (LEs) | 1320 |
| Logic Array Blocks (LABs) | 132 |
| Number of I/O | 117 |
| Typical Gates | 16,000 |
| Operating Temperature Range | -40C to +100C (TJ) |
| Operating Voltage (Core) | 3.3 V |
| Technology | CMOS, SRAM-based |
| Maximum Frequency | 142.86 MHz |
| Package | 144-LQFP (TQFP) |
| Mounting Type | Surface Mount |
| Package Code | LFQFP |
| Terminal Form | Gull Wing |
| Terminal Position | Quad |
| Number of Terminals | 144 |
| Part Status | Obsolete |
EPF6016ATI144-3 lfqfp Pin Configuration Guide
Pin configuration for EPF6016ATI144-3 (lfqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6016ATI144-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6016ATI144-3 is suitable for 6 applications: Industrial Glue Logic and Bus Bridging, Telecommunications Interface Cards, Legacy Digital System Prototyping, State-Machine Controllers and Sequencers, Parallel Data Acquisition Front-Ends, In-System Reconfigurable Controllers.
Industrial Glue Logic and Bus Bridging
The EPF6016ATI144-3 fits industrial glue logic applications by providing 1320 logic elements and 117 user I/O pins, enough to bridge parallel buses between microcontrollers, ASICs, and peripherals. With multiVolt I/O support (5.0V, 3.3V, 2.5V), the device interfaces legacy 5V peripherals to modern 3.3V processors without external level shifters. The industrial temperature range (-40C to +100C) supports factory-floor and outdoor enclosures. Compared with a discrete TTL/CMOS gate-array implementation, a single FLEX 6000 FPGA replaces dozens of packages, simplifies PCB layout, and allows post-production logic revisions via JTAG reconfiguration per IEEE Std. 1149.1. Expected benefit: 10x board-area reduction and field-upgradable logic.
Recommended
Telecommunications Interface Cards
In telecom interface cards the EPF6016ATI144-3's 117 user I/O and 142.86 MHz Fmax provide enough bandwidth and pin count for protocol conversion, framer interfacing, and TDM bus multiplexing. The SRAM-based architecture lets designers implement multiple protocol stacks in one device and switch via JTAG reconfiguration. The -3 speed grade places this part in the standard-performance tier; telecom designs needing higher throughput can migrate to the Cyclone family for higher Fmax. The 144-LQFP footprint supports legacy backplane cards where board space allows only through-hole-compatible SMT packages. Estimated benefit: replace multiple TTL protocol bridges with one reconfigurable device.
Recommended
Legacy Digital System Prototyping
The EPF6016ATI144-3 is widely used in legacy digital system prototyping where engineers migrate TTL/CMOS gate-array prototypes into a single programmable device. The 16,000 typical gates and 4-input LUT architecture allow mapping of dozens of 74xx logic functions into one chip, while the 117 user I/O pins cover most parallel-interface prototyping needs. Industrial temperature support lets prototypes move directly into field trials without redesign. The JTAG (IEEE 1149.1) interface allows iterative logic changes without removing the part. Compared with discrete logic implementations, the FLEX 6000 reduces prototype board spin count by allowing logic corrections via bitstream updates alone.
Recommended
State-Machine Controllers and Sequencers
Multi-state machine controllers and waveform sequencers fit the EPF6016ATI144-3's architecture, which uses 4-input LUTs and 132 LABs well-suited to FSM encoding and high-density sequential logic. The 142.86 MHz Fmax comfortably supports sequencing logic at multi-MHz state rates, and the 117 I/O pins handle parallel output actuators, parallel input sensors, and status LEDs. The industrial temperature range supports machine-control cabinet environments. The SRAM-based configuration allows end-of-line customization - each machine variant can be programmed at final test. Compared with PAL/GAL implementations, the FLEX 6000 supports many more states and concurrent state machines.
Recommended
Parallel Data Acquisition Front-Ends
Parallel data acquisition front-ends with multiple ADC/DAC channels benefit from the EPF6016ATI144-3's 117 user I/O count and 142.86 MHz internal performance. The device can implement channel-multiplexer control, FIFO buffering, parallel-to-serial conversion, and timing generators in a single chip, replacing discrete logic trees. MultiVolt I/O support lets the FPGA directly interface 5V and 3.3V ADC/DAC devices. The industrial temperature range supports laboratory-instrument and process-control front-ends. Compared with discrete logic, the FPGA simplifies PCB layout and allows last-minute timing-path corrections via JTAG reconfiguration.
Recommended
In-System Reconfigurable Controllers
Applications requiring field-upgradable firmware benefit from the EPF6016ATI144-3's SRAM-based configuration and JTAG (IEEE 1149.1) interface, which together allow logic changes without removing the part from the board. The 144-LQFP package is widely accepted by contract manufacturers for both initial build and field retrofit. Industrial temperature support lets the device operate in unattended outdoor and factory-floor installations. The 117 I/O count covers most retrofittable control designs. Compared with OTP (one-time-programmable) PLDs, the FLEX 6000 reduces field-service cost by allowing remote or on-site logic updates without de-soldering.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016ATI144-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016ATI144-3N | EPF6016ATC144-3N | EPF6016ATC144-3 | EPF6016ATC144-3S | EPF6016ATC144-2 | EPF6016ATC144-2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Logic Elements | 1320 | 1320 | 1320 | 1320 | 1320 | 1320 | 1320 |
| Number of I/O | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Operating Temperature | -40C to +100C (TJ, industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Speed Grade | -3 (standard) | -3 (standard) | -3 (standard) | -3 (standard) | -3 (standard) | -2 (slower) | -2 (slower) |
| Lead-Free / RoHS | SnPb finish | Yes (lead-free) | Yes (lead-free) | SnPb finish | Yes (lead-free) | SnPb finish | Yes (lead-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature range (vs EPF6016ATC144-3N)
- Lead-free drop-in availability (vs EPF6016ATI144-3 (this part))
- Same-package, same-silicon migration to commercial grade (vs EPF6016ATC144-3N)
Design Notes
The FLEX 6000 EPF6016ATI144-3 requires a stable 3.3V core supply (VCCINT) and a separate VCCIO bank supply. Place 0.1uF decoupling capacitors adjacent to every power pin, with 10uF bulk capacitors at board entry points. Power-up sequence per the FLEX 6000 datasheet must allow VCCINT to settle before configuration begins; a configuration failure typically indicates power-supply noise or incorrect ramp rate.
Route JTAG signals (TCK, TMS, TDI, TDO, TRST) with short traces and a 10k pull-up on TCK to ensure a clean JTAG chain. Place the EPC2 or EPCS configuration PROM adjacent to the FPGA DATA/DCLK/nCONFIG pins. Use a single ground plane to minimize return-path discontinuity; split planes are not recommended because of multi-bank I/O switching noise.
FLEX 6000 devices are SRAM-based and lose configuration when power is removed - a configuration PROM is mandatory, not optional. Do not leave nCONFIG floating; tie it to VCC via a 10k resistor or drive it with the system reset. MultiVolt I/O banks must each have their VCCIO tied even if unused, otherwise I/O pins remain tri-stated and may oscillate. Industrial-grade (-I suffix) parts cannot be downgraded to commercial specifications without re-validating timing.
Compliance Information
Original -3 variant uses SnPb terminal finish (not lead-free). The -3N variant is lead-free / RoHS-compliant. No AEC-Q100 qualification - not designed for automotive safety-critical applications. RoHS, REACH, halogen, and conflict-minerals data not available in verified sources.
