EP2S60F484C3N - 60KLE Stratix II FPGA 484-FBGA | Intel
MPN: EP2S60F484C3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1552.45 | $1,552.45 |
| 10 | $1480.2 | $14,802.00 |
| 25 | $1425 | $35,625.00 |
| 100 | $1310.5 | $131,050.00 |
| 250 | $1245.75 | $311,437.50 |
EP2S60F484C3N Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic and routing are defined by a user-supplied configuration bitstream. FPGAs sit at the intersection of ASICs (high performance, high NRE) and microcontrollers (low cost, fixed function), enabling hardware-level parallelism and rapid design iteration. Stratix II parts are positioned for high-throughput signal processing, telecom, and ASIC-prototype workloads, slotting into the broader Intel programmable logic family between Cyclone II (low-cost) and Stratix III (next-generation high-end).
The -3 speed grade marks this as the fastest of the commercial Stratix II variants, with Fmax targets of approximately 450 MHz on internal DSP blocks. The device supports LVDS, LVPECL, HSTL, SSTL, and LVTTL I/O standards, exposes up to 334 user I/O pins, and integrates dedicated high-speed serial interfaces up to 1 Gbps on select device members. The F484 package uses a 1.0 mm ball pitch and an exposed-die flip-chip BGA construction, providing robust thermal and electrical performance for production hardware.
Architecturally, the Stratix II logic element is an 8-input adaptive look-up table (ALUT) - a departure from the classic 4-input LUT - yielding higher effective logic utilization per area. The TriMatrix memory block hierarchy allows the Quartus II place-and-route tool to map user RAM/ROM requirements to the most area-efficient block size, while 12 DSP blocks deliver up to 48 GMACs of multiply-accumulate throughput at 450 MHz.
Typical applications include high-speed DSP pipelines (radar, software-defined radio, video processing), telecom line-card packet processing, ASIC prototyping, and high-density logic consolidation. The 484-BGA package suits production PCBs where board area is moderate and routing density favors fan-out over fan-in packages. Designers transitioning from Stratix (original) benefit from the same Quartus II toolchain but gain roughly 50 percent higher performance and 30 percent lower power at the same function.
A key design consideration is configuration mode selection: the EP2S60F484C3N supports fast passive parallel (FPP), fast active serial (AS), passive serial (PS), and JTAG configuration, and bitstream size (~22 Mbits uncompressed) drives the choice of configuration PROM. Plan PCB layout with dedicated configuration clock and data pins, ensure MSEL pin strapping matches the selected mode, and provide a clean POR ramp on VCCINT (1.2 V nominal) before any I/O activity.
Drop-in alternatives for EP2S60F484C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S60F484C3N (same form factor and footprint) — differing in Speed Grade, Package, Family, Operating Temperature, PLLs.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S60F484C5
✅ Drop-In✓ In Stock
$491.55 / Unit
View Datasheet →EP2S60F484C4
✅ Drop-In✓ In Stock
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View Datasheet →EP2S60F484C3
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP2S60F484I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1195 / Unit
View Datasheet →EP2S60F484I5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1325 / Unit
View Datasheet →EP2S60F484C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 60,440 |
| Adaptive LUTs (ALUTs) | 48,352 |
| Embedded Memory (TriMatrix) | 2,544 Kbits (M4K + M512 + M-RAM) |
| Embedded DSP Blocks | 12 (48 GMACs at 450 MHz) |
| Maximum User I/O Pins | 334 |
| Package | 484-BGA (F484), 1.0 mm pitch |
| Process Technology | 90 nm CMOS, 1.2 V core |
| Speed Grade | -3 (fastest commercial) |
| Operating Temperature (Commercial) | 0C to +85C (TJ) |
| Supply Voltage VCCINT | 1.2 V nominal |
| Configuration Modes | FPP, AS, PS, JTAG |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP2S60F484C3N 484-bga (f484), 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2S60F484C3N (484-bga (f484), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S60F484C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S60F484C3N is suitable for 7 applications: Software-Defined Radio (SDR) Baseband, Telecom Line-Card Packet Processing, High-Performance DSP for Video Processing, ASIC Prototyping and Emulation, Industrial Motion Control and Servo Drive, Medical Imaging Pre-Processor, Aerospace Avionics Databus Interface.
Software-Defined Radio (SDR) Baseband
The EP2S60F484C3N fits SDR baseband designs because its 60,440 LEs and 12 DSP blocks running at up to 450 MHz deliver the multiply-accumulate throughput required for digital down-conversion (DDC) and channelization filters. Its TriMatrix memory (2,544 Kbits) absorbs the buffering between the ADC front-end and the modem processor without external SRAM, reducing board area and latency. The -3 speed grade supports timing closure on LTE and WiMAX FFT/iFFT pipelines, while 334 user I/Os in the F484 BGA expose parallel LVDS interfaces to ADC/DAC components. Compared with newer Stratix IV, the EP2S60 trades power efficiency for lower unit cost in legacy or cost-sensitive SDR programs.
Recommended
Telecom Line-Card Packet Processing
The EP2S60F484C3N is well-suited for telecom line-card packet processing engines that perform classification, policing, and forwarding at multi-gigabit line rates. Its 8-input ALUT architecture efficiently maps wide CAM-like lookup tables into single logic elements, while 334 I/O pins support multiple SGMII/SerDes interfaces to PHY devices. The 1.2 V VCCINT core keeps per-port power manageable for line cards with multiple FPGAs. Its TriMatrix memory blocks provide deterministic low-latency buffering for queue management, and the Quartus II SOPC Builder flow integrates Nios II soft processors for control-plane tasks.
Recommended
High-Performance DSP for Video Processing
The EP2S60F484C3N enables real-time HD video processing pipelines - such as 2D/3D filtering, motion estimation, and format conversion - by combining 12 DSP blocks (48 GMACs at 450 MHz) with abundant TriMatrix memory for line buffers. Its ALM-based logic fabric implements wide arithmetic datapaths efficiently, while 334 I/Os support multiple 10-bit/12-bit video buses and BT.656/1125 interfaces. The F484 BGA package provides robust thermal performance for sustained DSP workloads without active cooling. Designers can pair the FPGA with external DDR2 SDRAM via dedicated DQS/DQ pins for frame buffering.
Recommended
ASIC Prototyping and Emulation
The EP2S60F484C3N serves as an ASIC prototyping platform, partitioning RTL designs across multiple FPGAs via TimeBridge or multi-FPGA partitioning flows in Quartus II. Its 60,440 LEs approximate 1.5 million ASIC gates (industry rule-of-thumb), making it suitable for mid-complexity ASIC pre-silicon validation. The 484-BGA package supports fast bring-up with standard sockets, and the JTAG configuration mode enables iterative bitstream loading during debug sessions. Logic designers can integrate soft IP (Nios II, DDR controllers, Ethernet MACs) for full system emulation before tape-out.
Recommended
Industrial Motion Control and Servo Drive
The EP2S60F484C3N fits multi-axis motion control boards where deterministic, parallel execution of current, velocity, and position loops is critical. Its DSP blocks execute PID and field-oriented control (FOC) math at microsecond loop rates, while TriMatrix memory buffers encoder feedback from multiple axes simultaneously. The 334 user I/Os accept quadrature encoder inputs, PWM outputs to gate drivers, and SPI/I2C links to digital isolators. The F484 BGA package supports industrial temperature variants (EP2S60F484I4N) for factory-floor deployments. Real-time deterministic behavior avoids the jitter of CPU-based control loops.
Recommended
Medical Imaging Pre-Processor
The EP2S60F484C3N is used in medical imaging systems (ultrasound beamformers, CT reconstruction pre-processors) for parallel channel processing where low latency and deterministic timing are mandatory. Its 12 DSP blocks perform envelope detection, log compression, and beamforming math across 64-128 channels simultaneously, while TriMatrix memory holds sample buffers between ADC bursts. LVDS I/O standards support high-speed digitizer links, and the 484-BGA package provides EMI isolation through its flip-chip construction. The device meets medical design lifecycle requirements via its long-term Intel support.
Recommended
Aerospace Avionics Databus Interface
The EP2S60F484C3N implements MIL-STD-1553, ARINC 429, and other avionics databus interfaces in ruggedized subsystems. Its abundant LEs implement multiple protocol controllers in parallel with Manchester encoding/decoding, while the F484 BGA package withstands vibration per MIL-STD-810 when board-mounted with underfill or staking. The 1.2 V core reduces power dissipation in sealed, conduction-cooled enclosures, and the JTAG configuration path supports in-system reconfiguration during flight-line maintenance. Legacy aerospace programs maintain the EP2S60F484I4N industrial-temperature variant for extended-temperature avionics bays.
Recommended
Recommended Products Summary
Engineering reference data for EP2S60F484C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S60F484C5 | EP2S60F484C4 | EP2S60F484C3 | EP2S60F484I4N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-BGA (F484) | 484-BGA (F484) - same | 484-BGA (F484) - same | 484-BGA (F484) - same | 484-BGA (F484) - same |
| Logic Elements | 60,440 LEs | 60,440 LEs | 60,440 LEs | 60,440 LEs | 60,440 LEs |
| Speed Grade | -3 (fastest) | -5 (slower) | -4 (mid) | -3 (same) | -4 industrial |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (Industrial) |
| Lead-Free / RoHS | Yes (RoHS) | Yes (RoHS) | Yes (RoHS) | No (leaded) | Yes (RoHS) |
| Embedded Memory | 2,544 Kbits | 2,544 Kbits | 2,544 Kbits | 2,544 Kbits | 2,544 Kbits |
| DSP Blocks | 12 blocks (48 GMACs) | 12 blocks | 12 blocks | 12 blocks | 12 blocks |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Fastest Stratix II speed grade available in the F484 BGA (vs EP2S60F484C5)
- Lead-free RoHS-compliant variant of the Stratix II family (vs EP2S60F484C3 (leaded))
- Industrial-temperature variant available in same F484 package (vs EP2S60F484I4N)
Design Notes
Estimated: Stratix II EP2S60 power consumption at full utilization (all 60K LEs switching, 12 DSP blocks active, 450 MHz) is approximately 15-22 W. Provide a 1.2 V VCCINT regulator rated at 25 A peak with 1.5% accuracy and star-ground routing from the regulator output. VCCIO rails are bank-dependent; power only populated banks to reduce quiescent draw. Use a TI TPS54620 or equivalent 6-A synchronous buck per VCCIO bank.
The F484 BGA has theta_JA of approximately 11 C/W with 4-layer PCB and 200 LFM airflow. At 20 W dissipation, junction temperature rises ~220 C above ambient, exceeding the 125 C limit. Recommended: use 8-layer PCB with internal ground planes, minimize via count to thermal pads, add a 25x25 mm copper heatsink if chassis allows, and consider derating design utilization to 70% for safety margin in commercial-temperature operation.
Route all differential pairs (LVDS) with 100 ohm differential impedance, length-matched within 150 mils. Place configuration clock (DCLK) and data (DATA[7:0]) traces away from switching power signals. Use 0.1 uF X7R decoupling caps within 100 mils of every VCCINT/VCCIO ball, and add 10 uF bulk caps every 4 mm along the BGA perimeter. Expose ground paddle on layer 2 as stitched via fence for return-current management.
Do not leave MSEL pins floating - strap them to ground or VCCIO via 1 kohm resistors to select configuration mode before power-on reset. Always assert nCONFIG and observe nSTATUS during power-up; a stuck nSTATUS indicates bitstream CRC failure or VCCINT out-of-range. Do not apply I/O voltage before VCCINT - this can latch-up the device and cause permanent damage. Use the dedicated CONF_DONE LED to verify successful configuration.
Compliance Information
RoHS compliant per 'N' suffix in part number. AEC-Q100 not applicable for FPGA. Industrial temperature variants (EP2S60F484I4N) available for harsh environments.
