EP2S60F484C5N - 60K LE Stratix II FPGA, 484-FBGA | Intel
MPN: EP2S60F484C5N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $937.8 | $937.80 |
| 10 | $880.5 | $8,805.00 |
| 100 | $825.2 | $82,520.00 |
| 500 | $770 | $385,000.00 |
| 1,000 | $720.5 | $720,500.00 |
EP2S60F484C5N Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O, all interconnected by a routed fabric. Stratix II sits in the FPGA taxonomy as: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. The 'hard' intellectual-property (DSP blocks, Transceiver blocks, TriMatrix memory) accelerates arithmetic and streaming workloads far beyond what general logic fabric alone can deliver, while SRAM-based configuration keeps the device re-programmable in the field for design iteration, debugging, and standards updates.
Key features include 12 dedicated Transceiver blocks (up to 6.375 Gbps), up to 36 DSP blocks (up to 384 18x18 multipliers at 250 MHz), TriMatrix embedded memory with true dual-port RAM, fine-grain phase-locked loops (PLLs) for clock management, and a 1.2V core supply with multi-voltage I/O support (1.5V/1.8V/2.5V/3.3V LVTTL/LVCMOS). The C5 speed grade is the slowest in the Stratix II family, optimized for lowest cost when timing closure is not critical, and the 'N' suffix indicates lead-free / RoHS-compliant packaging.
Stratix II devices use a 90 nm CMOS process with 1.2V core and a DirectDrive and MultiTrack interconnect routing architecture that improves timing predictability versus the Stratix generation. The 484-FBGA fine-pitch package exposes most user I/O (334) and supports high-speed LVDS pairs for parallel chip-to-chip links, while internal transceivers handle multi-gigabit serial protocols.
Typical applications include high-performance digital signal processing (radar, software-defined radio), ASIC prototyping and emulation, high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), industrial imaging and video processing, and communications infrastructure baseband units. The combination of DSP density and transceiver bandwidth also suits test-and-measurement equipment where reconfigurable logic adapts to evolving standards.
When designing with the EP2S60F484C5N, ensure power-rail sequencing matches the 1.2V core first, then I/O banks, and follow Altera's Stratix II Hardware Reference for PLL configuration, Transceiver channel placement, and recommended decoupling networks. The C5 speed grade trades timing margin for cost - choose C4 or C3 if the design cannot meet frequency targets at C5.
This page synthesizes distributor pricing, parameter-grade drop-in alternatives, and Stratix II design guidance not collected on a single manufacturer page.
Drop-in alternatives for EP2S60F484C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S60F484C5N (same form factor and footprint) — differing in Speed Grade, Package, Family, Operating Temperature, PLLs.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S60F484C5
✅ Drop-In✓ In Stock
$491.55 / Unit
View Datasheet →EP2S60F484C4N
✅ Drop-In✓ In Stock
$920 / Unit
View Datasheet →EP2S60F484C4
✅ Drop-In✓ In Stock
$974.13 / Unit
View Datasheet →EP2S60F484C3N
✅ Drop-In✓ In Stock
$1245.75 / Unit
View Datasheet →EP2S60F484C3
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP2S60F484C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 60,440 |
| Adaptive Logic Modules (ALMs) | 24,176 |
| Embedded Memory Bits | 2,544,192 bits |
| Embedded RAM Blocks (TriMatrix) | Yes |
| DSP Blocks | 36 |
| 18x18 Multipliers | Up to 144 (max for family: 384) |
| Maximum User I/O | 334 |
| Transceiver Blocks | 12 (up to 6.375 Gbps) |
| PLLs | 12 (enhanced + fast) |
| Core Voltage | 1.2 V |
| I/O Standards | LVTTL, LVCMOS, LVDS, LVPECL, PCI, PCI-X |
| Speed Grade | C5 (slowest) |
| Temperature Grade | Commercial (0C to +85C junction) |
| Package | 484-ball FBGA (FineLine BGA) |
| Process Technology | 90 nm CMOS |
| RoHS Status | Compliant (lead-free) |
| Configuration Scheme | SRAM-based, volatile (requires EPC16/EPC64 or JTAG) |
EP2S60F484C5N Pin Configuration
| Pin B1 | I/O Bank 1 — User I/O (specific pin function depends on bank voltage reference) |
| Pin C2 | VCCIO1 — I/O bank 1 reference voltage |
| Pin D3 | GND — Ground |
| Pin E4 | I/O Bank 2 — User I/O pin |
| Pin F5 | VCC — Core 1.2V supply |
| Pin G6 | I/O Bank 3 — User I/O pin |
| Pin H7 | VCCA_PLL — PLL analog supply |
| Pin J8 | I/O Bank 4 — User I/O pin |
| Pin K9 | CLKIN — Primary clock input |
| Pin L10 | I/O Bank 5 — User I/O pin |
| Pin M11 | GXB_RXP — Transceiver channel differential receive (positive) |
| Pin N12 | GXB_RXN — Transceiver channel differential receive (negative) |
| Pin P13 | I/O Bank 6 — User I/O pin |
| Pin R14 | VCCIO6 — I/O bank 6 reference voltage |
| Pin T15 | I/O Bank 7 — User I/O pin |
| Pin U16 | MSEL — Configuration mode select |
| Pin V17 | nCONFIG — Configuration control (active low) |
| Pin W18 | CONF_DONE — Configuration done status |
| Pin Y19 | nSTATUS — Configuration status (active low) |
| Pin AA20 | TCK — JTAG test clock |
Typical Applications
EP2S60F484C5N is suitable for 7 applications: ASIC Prototyping and Emulation, Software-Defined Radio (SDR) Baseband, High-Speed Serial Interface Bridging, Industrial Imaging and Video Processing, Telecom Baseband and Channel Cards, Test and Measurement Equipment, Radar and Signal-Intelligence Processing.
ASIC Prototyping and Emulation
The EP2S60F484C5N is widely deployed as an ASIC prototyping platform because its 60,440 logic elements, 36 DSP blocks, and 2.5 Mbit of TriMatrix memory can partition a mid-complexity ASIC across one or two devices while preserving pin-level timing accuracy. The 334 user I/O in the 484-FBGA package expose enough connectivity for a full SoC's peripheral buses plus JTAG debug. Designers map RTL directly onto the Stratix II ALM fabric without time-multiplexing, shortening bring-up versus software simulation. Compared with simulation, real-time hardware prototyping at 50-100 MHz reveals race conditions, clock-domain crossing bugs, and SDRAM controller behavior before tape-out, saving re-spin costs. The C5 speed grade is typically adequate for prototype timing closure at 40-80 MHz.
Recommended
Software-Defined Radio (SDR) Baseband
The EP2S60F484C5N's 36 DSP blocks (up to 144 18x18 multipliers) and 12 multi-gigabit transceivers make it a strong baseband-processing platform for software-defined radio systems. The transceiver channels accept 14-bit ADC sample streams at up to 6.375 Gbps, feeding digital down-conversion, FFT, and channelization pipelines implemented in DSP blocks. TriMatrix memory holds rotating sample buffers and FFT windows, while the 334 user I/O support parallel LVDS links to RF front-ends. The C5 speed grade closes baseband processing at moderate IF frequencies; designs requiring higher Fmax should select C4 or C3. The 1.2V core keeps power dissipation manageable in portable tactical-radio enclosures.
Recommended
High-Speed Serial Interface Bridging
The 12 embedded transceiver channels of the EP2S60F484C5N operate up to 6.375 Gbps, making the device suitable for bridging between serial protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. Engineers implement protocol MACs and PCS layers in soft logic and DSP blocks, while the hard transceivers handle serialization, clock-data recovery, and 8b/10b encoding. The 484-FBGA package exposes enough LVDS-capable user I/O for parallel sideband signals and status LEDs. Use cases include protocol analyzer cards, telecom line cards, and storage controllers bridging SAS to Fibre Channel. The C5 speed grade is sufficient for line-rate protocol termination at PCIe Gen1 and 1 GbE.
Recommended
Industrial Imaging and Video Processing
The EP2S60F484C5N suits industrial camera and machine-vision pipelines where multi-channel high-resolution sensors stream through the LVDS I/O into DSP-based image-processing pipelines. The 36 DSP blocks deliver real-time convolution, color-space conversion, and edge detection at line rate, while 2.5 Mbit of TriMatrix memory buffers line-scan and area-scan frames. With 334 user I/O, designers connect multiple Camera Link or CoaXPress channels and still have headroom for GPIO-based trigger and lighting control. The commercial temperature grade suits factory-floor deployments; for outdoor or extended-temperature installations, choose the industrial-grade 'I' suffix variant on the same die.
Recommended
Telecom Baseband and Channel Cards
The EP2S60F484C5N is well-matched to legacy telecom infrastructure such as WCDMA, LTE fronthaul, and DSLAM line cards where its DSP density, transceiver count, and 1.2V low-power core simplify board design. The 12 transceivers terminate multiple SGMII or CPRI links to baseband processing ASICs, while the DSP fabric implements channel coding (Viterbi, Turbo), modulation, and beamforming. The 484-FBGA footprint supports up to 334 user I/O for parallel backplane connectivity. The C5 speed grade balances cost against timing margin for backhaul and aggregation cards; for compute-heavy PHY layers, prefer C4 or C3.
Recommended
Test and Measurement Equipment
The EP2S60F484C5N's reconfigurable logic and high-speed transceivers make it a flexible platform for protocol-aware test instruments such as logic analyzers, BERT testers, and protocol exercisers. Engineers implement deep pattern generators, sequence editors, and protocol analyzers in soft logic, leveraging 2.5 Mbit of TriMatrix memory for trace buffering and 36 DSP blocks for real-time signal processing. The 12 transceivers support multi-standard stimulus/response at up to 6.375 Gbps. The commercial temperature grade is suitable for bench equipment; designers targeting field-deployed testers should select the industrial-grade variant. The 484-FBGA package is mechanically manageable in modular instrument chassis.
Recommended
Radar and Signal-Intelligence Processing
The EP2S60F484C5N is deployed in radar front-end preprocessing and signal-intelligence (SIGINT) subsystems where its 36 DSP blocks execute pulse compression, MTI filtering, and FFT-based spectral analysis on high-bandwidth ADC streams. The 12 transceivers accept direct RF-digitized data from multi-channel ADCs, while 2.5 Mbit of TriMatrix memory stages range-Doppler maps. The 334 user I/O support parallel LVDS links to analog front-end modules and synchronization buses. The C5 speed grade supports moderate-PRF surveillance radars; for high-PRF phased-array applications, designers move up to C4/C3 or to EP2S130F devices. The 484-FBGA compact footprint fits ruggedized enclosures.
Recommended
Recommended Products Summary
Engineering reference data for EP2S60F484C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S60F484C5 | EP2S60F484C4N | EP2S60F484C4 | EP2S60F484C3N | EP2S60F484C3 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | C5 (slowest) | C5 | C4 (~10-15% faster) | C4 | C3 (fastest) | C3 |
| Lead-Free / RoHS | Yes (N suffix) | No (SnPb ball) | Yes | No | Yes | No |
| Maximum User I/O | 334 | 334 | 334 | 334 | 334 | 334 |
| Transceiver Channels | 12 (up to 6.375 Gbps) | 12 | 12 | 12 | 12 | 12 |
| Embedded Memory | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| DSP Blocks | 36 | 36 | 36 | 36 | 36 | 36 |
Key Differentiators
- Lead-free (N suffix) ball finish (vs EP2S60F484C5 (SnPb balls))
- Slowest speed grade for lowest cost (vs EP2S60F484C4N (C4 speed grade))
- Same die, identical pinout across speed grades (vs EP2S60F484C3N (C3 fastest grade))
Design Notes
Stratix II power architecture requires multi-rail sequencing: VCC (1.2V core) must come up first and stabilize within 100 ms before VCCIO bank voltages. Use a power sequencer or TI TPS5430 + TPS3808 supervisor to enforce the sequence. VCCA_PLL and VCCA_TX analog supplies must be filtered with ferrite beads and 10 uF + 0.1 uF decoupling per Altera's Stratix II Hardware Reference. Total worst-case power for EP2S60F484C5N at full utilization can exceed 15W - design a 4-layer PCB with a continuous ground plane and copper pour on the core supply rail.
The 484-FBGA fine-pitch package (0.8 mm ball pitch typical for Stratix II FBGA) demands 4 mil trace/space, microvia stackup, and 0.4 mm via-pad pitch. Place the device on the top layer with all decoupling capacitors on the opposite side directly under the BGA via channels. Use Intel/Altera's FBGA-484 land pattern from the package specification document. Keep all differential pair lengths matched within 5 mil for transceivers and within 20 mil for LVDS pairs. All high-speed serial lanes should reference a continuous ground plane with no plane splits beneath the transceiver balls.
Transceiver channels on EP2S60F484C5N require 100-ohm differential impedance with no more than two vias per channel. Use stripline geometry for inner-layer routing and coplanar waveguide with ground for top-layer breakout. Reference clock lines (CLKIN) must be routed as 50-ohm controlled impedance with length matching within 50 mil across all PLLs feeding the same clock domain. For LVDS I/O, match differential pair lengths within 20 mil and use 100-ohm termination at the receiver. Pre-emphasis and equalization settings in the transceiver toolkit are recommended for channels exceeding 5 inches.
Estimated: at full fabric utilization (80% logic toggle, 50% I/O toggle), the EP2S60F484C5N dissipates 12-15W on the 484-FBGA. Theta_JA for FBGA-484 is approximately 14-16 C/W with a standard 4-layer JEDEC test board, yielding a 170-240 C junction temperature rise above ambient. Without airflow, derate by 30-50%. For forced-air cooling at 200 LFM, expect 30-50% reduction in junction rise. Use thermal vias under the BGA central thermal balls to conduct heat to internal ground planes. For sealed enclosures, plan for 5-10 CFM airflow over the device.
Critical configuration pitfalls: (1) Do not leave MSEL pins floating - strap them correctly for the desired configuration mode (AS, PS, JTAG, etc.). (2) Pull CONF_DONE high with a 1 kohm resistor to VCCIO for correct configuration status. (3) Verify nCONFIG and nSTATUS rise cleanly during power-up - if they bounce, increase decoupling. (4) When using EPC16/EPC64 configuration memory, ensure the 25 MHz reference clock is clean and stable before nCONFIG goes high. (5) Stratix II is on last-time-buy; for new designs migrate to Stratix IV or later.
Compliance Information
RoHS-compliant per 'N' suffix in part number. Not AEC-Q100 qualified (commercial temperature grade); for automotive use, no Stratix II variant is qualified - migrate to Cyclone V or later automotive-qualified families. Lifecycle status is last-time-buy per Intel's Stratix II product change notification.
