EP2S60F484C3 - Stratix II FPGA, 60K LE, 484-FBGA | Intel / Altera
MPN: EP2S60F484C3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
EP2S60F484C3 Overview
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are used to implement arbitrary digital logic, parallel processing pipelines, and custom compute accelerators that would be impractical to realize in fixed ASICs. The Stratix II family specifically targets high-performance DSP, communications, and signal-processing designs.
The EP2S60F484C3 contains 24,176 adaptive logic modules (ALMs) - the Stratix II successor to traditional 4-input LUT-based logic - and integrates 3,022 LABs, twelve 9-bit embedded multipliers, and 12 embedded DSP blocks. The part supports configuration via passive serial, fast passive parallel, and JTAG modes, and exposes up to 12 global clock networks plus 16 PLLs for high-fanout clock distribution.
The device supports up to 717 MHz internal operation per published Stratix II performance documentation, with embedded memory blocks totaling 2.5 Mbits that can be configured as simple dual-port, true dual-port, or shift-register RAM. The 1.0 mm pitch 484-ball FineLine BGA package provides high I/O density for memory-rich and high-bandwidth designs.
Typical applications include high-speed digital signal processing, telecommunications baseband processing, ASIC prototyping, military/aerospace signal processing, and high-speed image processing pipelines. Designers select the EP2S60F484C3 when the target design requires mid-range logic capacity, plentiful block RAM, and a proven legacy fabric that is supported across multiple Quartus II tool versions.
When designing with this part, verify Quartus II tool support for the specific device speed grade (C3) and confirm that the JTAG chain and configuration scheme are supported by the chosen programmer. The 484-FBGA package requires 4-6 layer PCB stack-ups with controlled-impedance traces and matched-length clock routing.
Drop-in alternatives for EP2S60F484C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S60F484C3 (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, PLLs, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S60F484C4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$974.13 / Unit
View Datasheet →EP2S60F484C5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$491.55 / Unit
View Datasheet →EP2S60F484I4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$138.4 / Unit
View Datasheet →EP2S60F484C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1245.75 / Unit
View Datasheet →EP2S60F484C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$920 / Unit
View Datasheet →EP2S90F484C3
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP2S60F484C3 Maximum Ratings & Electrical Characteristics
| Series | Stratix II |
| Manufacturer | Altera (now Intel FPGA) |
| Logic Elements | 60,440 |
| Adaptive Logic Modules (ALMs) | 24,176 |
| LABs/CLBs | 3,022 |
| Total RAM Bits | 2,544,192 |
| User I/O Count | 334 |
| Package | 484-BBGA, FCBGA (FBGA-484) |
| Package Size | 23 x 23 mm, 1.0 mm pitch |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Speed Grade | C3 |
| Operating Temperature | 0C to +85C (commercial) |
| Number of PLLs | 12 (Stratix II typical) |
| Mounting Type | Surface Mount |
| Total Multipliers | 12 (9-bit embedded multiplier blocks) |
EP2S60F484C3 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2S60F484C3 (23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S60F484C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S60F484C3 is suitable for 6 applications: High-Speed DSP and Signal Processing, Telecommunications Baseband Processing, ASIC Prototyping and Emulation, Industrial Control and Automation, Aerospace and Defense Signal Processing, High-Speed Image and Video Processing.
High-Speed DSP and Signal Processing
The EP2S60F484C3 fits high-speed DSP applications because it integrates 12 dedicated 9-bit embedded multiplier blocks and 24,176 adaptive logic modules in the Stratix II architecture, enabling FIR filters, FFT engines, and digital downconverters to operate at hundreds of MHz. The 2,544,192 bits of embedded memory support dual-port buffering and coefficient storage, while the 12 PLLs handle multiple clock domains for mixed sample-rate pipelines. Placed on a DSP daughter card with external ADC/DAC such as the AD9235 or AD9744, the EP2S60F484C3 achieves greater throughput than DSP processor alternatives. Trade-off: the 90 nm process consumes more power than modern 28/14 nm FPGAs, so thermal design and Quartus II tool chain support are critical for production deployment.
Recommended
Telecommunications Baseband Processing
The EP2S60F484C3 serves telecom baseband applications because the 60,440 logic elements and 334 user I/O pins support multi-channel baseband processing, channel coding/decoding, and digital up/down conversion in a single device. The 484-FBGA package provides high board-density interconnect for backplane interfaces such as CPRI, OBSAI, and Serial RapidIO. With 12 PLLs and abundant block RAM, the EP2S60F484C3 can implement multi-carrier modulation schemes (QAM, PSK, OFDM) in parallel. Compared to ASSPs of the same era, the FPGA offers reconfigurability for evolving 3G/4G standards. Limitation: 1.2 V core and 90 nm process result in moderate power density; airflow cooling is recommended in chassis designs.
Recommended
ASIC Prototyping and Emulation
The EP2S60F484C3 is widely used in ASIC prototyping because its 60,440 logic elements, 2.5 Mbits of embedded memory, and 334 I/O pins can map mid-complexity ASICs (5-10 M gates) via time-domain multiplexing across multiple FPGAs. The 484-FBGA package exposes abundant I/O for chip-to-chip interconnect, while the JTAG and passive-serial configuration modes simplify multi-FPGA chain setup with Altera programming hardware. Designers targeting ASIC verification benefit from Quartus II synthesis, gate-level simulation, and the Stratix II Design Handbook reference flows. The C3 speed grade balances timing closure margin with cost for prototype builds. For new prototyping projects, Stratix 10 or Agilex 7 offer much higher logic density per FPGA but at significantly higher cost.
Recommended
Industrial Control and Automation
The EP2S60F484C3 fits industrial control applications because it offers 334 user I/O pins for connecting to sensors, actuators, motor drivers, and fieldbuses (Profibus, CAN, EtherCAT) in a single chip. The Stratix II architecture supports soft-core processors (Nios II) for deterministic control loops, while the 12 PLLs synchronize multiple encoder inputs and PWM outputs. The commercial 0C to +85C operating range is suitable for factory-floor enclosures with adequate thermal management. The 484-FBGA package withstands industrial vibration when properly board-mounted with underfill or corner staking. For designs requiring wider temperature, the I4 industrial speed grade is available in the same package. Limitation: lead-free / RoHS status requires verification per the specific part number suffix.
Recommended
Aerospace and Defense Signal Processing
The EP2S60F484C3 is used in aerospace and defense applications because it provides 60,440 logic elements and 12 DSP blocks for radar signal processing, electronic warfare, and secure communications in legacy platforms. The 484-FBGA package with 1.0 mm pitch suits ruggedized PCB stack-ups common in avionics. The 90 nm process and Stratix II fabric have extensive deployed reliability data in long-lifecycle programs. For new programs, modern Microsemi/Microchip RTG4 or Xilinx Kintex UltraSpace provide radiation-hardened alternatives, but the EP2S60F484C3 remains a cost-effective option for sustainment and refresh of existing fielded systems. Trade-off: the obsolete lifecycle requires multi-year inventory planning and broker sourcing strategies.
Recommended
High-Speed Image and Video Processing
The EP2S60F484C3 fits high-speed image and video processing because its 2.5 Mbits of embedded memory buffer full-HD video frames in real time, and its 334 I/O pins support multiple camera inputs via LVDS, CameraLink, or HDMI. The 12 DSP blocks accelerate 2D convolution, edge detection, and JPEG/MJPEG compression. The 484-FBGA package exposes sufficient I/O bandwidth to drive 1080p60 video pipelines without external memory in many designs, with external DDR2 SDRAM available for frame buffering when needed. Quartus II provides video and image processing IP cores (VIP Suite) optimized for Stratix II. Limitation: 90 nm static power and 1.2 V core require a multi-rail power design with proper sequencing to avoid brown-out during video capture.
Recommended
Recommended Products Summary
Engineering reference data for EP2S60F484C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S60F484C4 | EP2S60F484C5 | EP2S60F484I4 | EP2S60F484C3N | EP2S60F484C4N | EP2S90F484C3 |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm, 1.0 mm pitch) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Altera (Intel FPGA) | Altera | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | C3 | C4 (faster) | C5 (fastest) | I4 (industrial) | C3 (same, Pb-free) | C4 (faster, Pb-free) | C3 |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 90,960 |
| Total RAM Bits | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 4,520,448 |
| User I/O Count | 334 | 334 | 334 | 334 | 334 | 334 | 308 |
| DSP Blocks | 12 | 12 | 12 | 12 | 12 | 12 | 16 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
Key Differentiators
- Balanced cost/performance in 60K-LE density class (vs EP2S90F484C3)
- Wide variant availability on the same footprint (vs EP2S60F484C3N)
- Stratix II architecture is mature and well-supported in Quartus II (vs EP3C5F256C8N (Cyclone III))
Design Notes
The EP2S60F484C3 requires multiple power rails: 1.2 V VCCINT for core logic, 1.2 V VCCD_PLL for PLLs, and per-bank VCCIO supplies (1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on I/O standard). Per the Stratix II Device Handbook, power-on sequencing requires VCCINT to ramp before or simultaneously with VCCIO to avoid latch-up. Use a multi-rail controller such as the TPS650243 or LTC3566 to enforce the sequence. Decoupling: place 0.1 uF and 10 uF X5R capacitors within 100 mil of every VCCINT and VCCIO pin pair, plus 4.7 uF bulk capacitors on each rail at the FPGA edge.
The 484-FBGA package has 1.0 mm ball pitch, which requires 0.5 mm via-in-pad with filled and capped plating for reliable BGA rework. Use a 6-layer PCB stack-up with 0.5 oz copper outer and 1 oz inner layers; route signals on the top and bottom layers only, and dedicate inner layers to ground and 1.2 V power planes. Matched-length clock traces (within 50 mil) are mandatory for DDR2/LVDS interfaces. Use the Altera Stratix II board design guidelines in the device handbook for impedance targets (50 ohm single-ended, 100 ohm differential).
Common pitfalls with the EP2S60F484C3 include: (1) mixing I/O standards in the same bank without consulting the I/O bank voltage compatibility table; (2) using too-slow configuration devices such as the EPCS4 with large Stratix II bitstreams (use EPCS16 or EPCS64 for designs above 2 Mbits); (3) failing to terminate LVDS pairs at the receiver, causing signal-integrity failures above 400 Mbps; (4) ignoring the MSL3 moisture-sensitivity requirement for the 484-FBGA - bake at 125C for 24 hours before assembly if the floor-life has been exceeded. Refer to AN 201: Stratix II Configuration Guidelines for the complete list of design considerations.
Estimated: at 100% logic utilization running a typical DSP workload, the EP2S60F484C3 dissipates approximately 4-6 W of static and dynamic power per the Stratix II PowerPlay early power estimator. The 484-FBGA with exposed thermal pad routes heat through the PCB; a 4-layer board with 1 sq inch of top-layer copper above the EPAD keeps junction-to-ambient thermal resistance around 18-22 C/W. For chassis-mounted applications, airflow of 200 LFM minimum is recommended. The commercial 0C to +85C junction range assumes the EPAD is properly soldered to the PCB thermal pad with thermal vias.
Compliance Information
Compliance information not provided in verified data. RoHS and lead-free status depend on part suffix (C3N/C4N variants are lead-free; C3/C4/C5 are legacy non-RoHS). For new designs, verify the specific part number with the manufacturer's compliance declaration.
