EP2SGX60F1508 - Stratix II GX FPGA, 60K LEs, 6.375Gbps XCVR | Altera
MPN: EP2SGX60F1508 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2450 | $2,450.00 |
| 10 | $2320 | $23,200.00 |
| 100 | $2180 | $218,000.00 |
| 500 | $2050 | $1,025,000.00 |
| 1,000 | $1920 | $1,920,000.00 |
EP2SGX60F1508 Overview
What is an FPGA with embedded transceivers? An FPGA (Field-Programmable Gate Array) is a reprogrammable digital logic device built around an array of configurable logic blocks, embedded memory, and routing resources that the user programs via HDL (VHDL/Verilog) and synthesis. Stratix II GX is the transceiver-augmented variant of the Stratix II family, adding multi-gigabit transceivers (MGTs) for serial protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G. Within the broader taxonomy, EP2SGX60F1508 sits in the hierarchy: FPGA -> programmable logic device -> logic IC -> semiconductor. These FPGAs replace fixed-function ASICs in low-to-medium volume designs by offering hardware-level parallelism plus serial-link capability on a single die.
Key features include 12 transceivers capable of 6.375 Gbps data rate, support for PCI Express x1/x4/x8 hard IP, an adaptive equalization receiver (CTLE + DFE), and 4 phase-locked loops (PLLs) plus 8 transmit PLLs dedicated to clocking the serial channels. The device also exposes 8 global clock networks, 4 regional clock networks per quadrant, and 16 dedicated clock pins. Hard IP blocks include embedded PCI Express, Serial RapidIO, and the GXB transceiver interface logic.
The architecture is built on a 90nm CMOS process with 1.2V core operation, leveraging Altera's adaptive logic module (ALM) structure that contains eight 4-input look-up tables (4-LUTs) per ALM, giving improved logic packing efficiency over the prior Stratix generation. The transceiver blocks support multiple serial protocols through a programmable PCS layer.
Typical applications include high-speed serial interface prototyping, PCIe Gen1/Gen2 endpoint or root-port designs, telecom backplane aggregation, video broadcast routing, and ASIC prototyping for protocols requiring 6.375 Gbps links. The wide transceiver count is the dominant value proposition versus general-purpose FPGAs of equivalent logic density.
When designing with EP2SGX60F1508, ensure the PCB has matched 100-ohm differential routing for all transceiver pairs with skew under 1 ps to preserve eye margin. The 1508-pin FBGA requires a multilayer PCB with microvia stack-ups because the 1.0mm pitch cannot be reliably fan-routed with through-hole vias on standard 4-layer boards.
This page synthesizes distributor stock, same-family Stratix II GX drop-in alternatives, and design notes (transceiver layout, power-rail sequencing) that the manufacturer datasheet alone does not consolidate for engineers evaluating this mature part.
Drop-in alternatives for EP2SGX60F1508 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60F1508 (same form factor and footprint) — differing in Package, Logic Elements, Family, Process Technology, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX60GF1508
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP2SGX130GF1508C3
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2S180F1508C3
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2S90F1508C3
✅ Drop-In✓ In Stock
$3719.39 / Unit
View Datasheet →EP2SGX60EF1152C3
✅ Drop-In✓ In Stock
$2210 / Unit
View Datasheet →EP2SGX60F1508 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 60,440 |
| Embedded Memory (M512/M4K/M-RAM) | 2,542,387 bits (TriMatrix) |
| DSP Blocks (18x18) | 144 (estimated from 60K LE tier) |
| DSP Performance | Up to 384 GMACs |
| Transceivers | 12 channels |
| Transceiver Data Rate | Up to 6.375 Gbps |
| PLLs (general purpose) | 4 |
| Transmit PLLs | 8 |
| Global Clock Networks | 8 |
| Package | 1508-pin FBGA (F1508), 1.0 mm pitch |
| Core Voltage | 1.2 V |
| Process Node | 90 nm CMOS |
| Hard IP Blocks | PCI Express x1/x4/x8, Serial RapidIO, GXB PCS |
| Operating Temperature (industrial) | -40C to +100C |
EP2SGX60F1508 1508-pin fbga (f1508), 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX60F1508 (1508-pin fbga (f1508), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60F1508.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60F1508 is suitable for 6 applications: PCI Express Gen1/Gen2 Endpoint Design, Serial RapidIO Switch / Bridge, Video Broadcast Router / SDI Aggregator, ASIC Prototyping Platform, Telecom Backplane Aggregation, High-Speed Test & Measurement Instrumentation.
PCI Express Gen1/Gen2 Endpoint Design
The EP2SGX60F1508's 12 transceivers at 6.375 Gbps with hard PCI Express IP support Gen1 (2.5 Gbps) and Gen2 (5.0 Gbps) endpoints without requiring external PHY chips. The 60,440 LEs and 144 DSP blocks accommodate PCIe Gen2 x4 endpoint logic, plus DMA engine, MSI-X table, and protocol-layer state machines. Placed as the device-side controller in a host adapter, storage controller, or instrument board; its 1.2V core plus dedicated PCIe refclk input simplify clock tree design. Trade-off: the part is NRND, so new PCIe Gen2 designs should consider Stratix IV/V GX families, but the F1508 remains a viable drop-in for existing boards.
Recommended
Serial RapidIO Switch / Bridge
Serial RapidIO (SRIO) requires 1.25-3.125 Gbps links, which the EP2SGX60F1508's transceivers handle natively with embedded 8b/10b encoding. The 60K LEs hold a 4-port SRIO switch with credit-based flow control and port arbitration, while 144 DSP blocks accelerate packet inspection logic. Deployed in wireless base-station baseband cards and DSP cluster interconnect boards; the F1508's 1508-ball package exposes sufficient user I/O for four SRIO ports plus a management Ethernet MAC. Performance: aggregate switch throughput exceeds 12 Gbps sustained, sufficient for backhaul aggregation nodes.
Recommended
Video Broadcast Router / SDI Aggregator
Broadcast video routers aggregate multiple SDI streams (SD/HD/3G-SDI up to 2.97 Gbps), and the EP2SGX60F1508's 12 transceivers cleanly map to 12 SDI input channels plus embedded SDI PHY support inside the transceiver PCS. The 2.5 Mbit TriMatrix memory buffers large uncompressed video frames, and 144 DSP blocks perform timing deskew, genlock, and ancillary-data extraction in real time. Used in mid-size broadcast routers (32x32 to 64x64); the 1508-ball package provides 480+ user I/Os for parallel GPIO control of downstream crosspoint switches. Compared to a discrete PHY-plus-FPGA design, the integrated transceiver approach reduces BOM by 30% and saves two PCB layers.
Recommended
ASIC Prototyping Platform
The EP2SGX60F1508's 60K LEs and 12 transceivers make it suitable as a logic prototyping vehicle for ASICs in the 200K-500K ASIC-gate range, where multi-FPGA partitioning is not required. Embedded TriMatrix memory serves as scratchpad and trace RAM, while the 144 DSP blocks let designers validate DSP-heavy ASIC blocks before tape-out. Used by ASIC design houses to validate PCIe, SRIO, and memory controller IP blocks; the 1508-ball package gives access to all transceivers for protocol compliance testing. Compared to ASIC simulation on an emulator, real-time FPGA prototyping runs at clock speeds close to the final ASIC, catching timing bugs that simulation misses.
Recommended
Telecom Backplane Aggregation
Telecom backplanes aggregate multiple serial links from line cards into a central switch fabric; the EP2SGX60F1508's 12 transceivers provide 12 ingress/egress links at up to 6.375 Gbps, supporting CPRI, OBSAI, and proprietary serial protocols. The 60K LEs handle protocol termination, queue management, and packet forwarding, while 144 DSP blocks accelerate forward-error-correction coding. Deployed in 3G/4G base-station controllers and metro Ethernet aggregation nodes; the F1508's 1508-ball package supports sufficient user I/O for backplane control and management interfaces. Performance benefit: integrating transceivers eliminates external PHY cost and reduces backplane connector pin count.
Recommended
High-Speed Test & Measurement Instrumentation
Test & measurement equipment (logic analyzers, protocol analyzers, bit-error-rate testers) requires real-time capture of multi-gigabit serial streams, which the EP2SGX60F1508's 12 transceivers at 6.375 Gbps support natively. The 2.5 Mbit TriMatrix memory captures traffic bursts for offline analysis, and the 60K LEs run pattern-matching, trigger logic, and protocol-decode state machines. Used in benchtop BERTs and protocol analyzers; the F1508's 1508-ball package provides enough I/O for front-panel display, trigger I/O, and external memory interfaces. Compared to discrete SERDES-based designs, the integrated approach simplifies calibration and reduces the analyzer's footprint.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60F1508 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60GF1508 | EP2SGX130GF1508 | EP2S180F1508 | EP2S90F1508 | EP2SGX60EF1152 |
|---|---|---|---|---|---|---|
| Package | 1508-pin FBGA (F1508) | 1508-pin FBGA (F1508) - same | 1508-pin FBGA (F1508) - same | 1508-pin FBGA (F1508) - same | 1508-pin FBGA (F1508) - same | 1152-pin FBGA (F1152) - smaller BGA |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | Stratix II GX | Stratix II GX | Stratix II GX | Stratix II (non-GX) | Stratix II (non-GX) | Stratix II GX |
| Logic Elements | 60,440 LEs | 60,440 LEs (same die) | 132,540 LEs (+120%) | 179,400 LEs (+197%) | 90,960 LEs (+51%) | 60,440 LEs (same die) |
| Transceivers | 12 ch @ 6.375 Gbps | 20 ch @ 6.375 Gbps (+67%) | 20 ch @ 6.375 Gbps (+67%) | 0 (no transceivers) | 0 (no transceivers) | 12 ch @ 6.375 Gbps (same) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Approx. Unit Price (qty 1) | USD 2,450 | USD 2,800-3,200 | USD 3,800-4,500 | USD 2,200-2,600 | USD 1,600-1,900 | USD 2,100-2,500 |
Key Differentiators
- Highest transceiver count among 60K LE Stratix II GX devices (vs EP2SGX60EF1152)
- Integrated transceivers at 6.375 Gbps versus non-GX variant (vs EP2S90F1508)
- Lower logic capacity but same package as EP2SGX130GF1508 (vs EP2SGX130GF1508)
Design Notes
The 1508-ball FBGA at 1.0 mm pitch cannot be fan-routed with through-hole vias on standard 4-layer FR4; use at least 6 layers with stacked microvias (laser-drilled or plated) on the top two layers. Per Altera Stratix II GX design guidelines, microvia stack-ups maintain the 1.0 mm pitch escape routing and keep transceiver differential pairs at 100 ohms +/-5%. Skew-matched routing for each transceiver pair must be within 1 ps to preserve eye margin at 6.375 Gbps.
EP2SGX60F1508 requires multiple supply rails (1.2V core, 1.5V/2.5V/3.3V I/O, 2.5V transceiver analog) sequenced with VCC core rising last to prevent latch-up. Estimated total power consumption with 12 transceivers active at 6.375 Gbps is 12-15W; design a copper pour of at least 10 sq cm on the top layer under the exposed pads for thermal dissipation. Use an isolated analog ground island for the transceiver supply pins to prevent switching noise from coupling into the 6.375 Gbps PLL.
Transceiver channel loss budget at 6.375 Gbps requires PCB trace insertion loss under 6 dB at 3.125 GHz. Use Megtron-6 or equivalent low-loss dielectric (Df ~0.004) for transceiver channels, and keep total trace length below 200 mm including package breakout. Each transceiver pair must have a 100-ohm differential impedance and intra-pair skew under 1 ps; AC-coupling capacitors must be 100 nF X7R placed symmetrically with trace length matching.
Do not leave any transceiver input floating: if a channel is unused, AC-ground the input through a 100 nF cap to prevent the input bias network from saturating. Do not exceed the maximum junction temperature of 100C; use the on-die thermal diode to monitor temperature in production. Finally, ensure the Quartus II software version supports the specific EP2SGX60F1508 silicon revision (verify the device ID in the Quartus programmer).
Compliance Information
RoHS/REACH/lead-free status not verified from the available web data; the part is mature Altera silicon from 2006-2007 era. AEC-Q100 not applicable for FPGAs.
