EP3C120F780C7NAD - Cyclone III FPGA, 119K LEs, 780-FBGA | Altera
MPN: EP3C120F780C7NAD ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $70.17 | $70.17 |
| 10 | $55 | $550.00 |
| 100 | $50 | $5,000.00 |
| 500 | $47.1 | $23,550.00 |
| 1,000 | $44.79 | $44,790.00 |
EP3C120F780C7NAD Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream after manufacture. In the broader taxonomy, this part sits at FPGA → programmable logic device (PLD) → digital IC → semiconductor. Cyclone III devices are positioned below the high-end Stratix family and above legacy Cyclone II; they are widely used where designers need tens of thousands of logic elements, hardware parallelism, and moderate DSP capability without the power and price of high-end FPGAs.
Key features of this device include 119,088 logic elements, 3,981 Kbits of embedded RAM (M9K blocks), 4 phase-locked loops, 531 user I/O pins, and 4 embedded multiplier blocks (18 × 18). It supports multiple I/O standards including LVDS, LVCMOS, SSTL, and HSTL, with per-pin dynamic impedance and slew-rate control. The C7 speed grade operates with internal clock frequencies up to 472 MHz and supports commercial temperature operation.
The Cyclone III architecture combines an LAB (Logic Array Block) structure built from adaptive logic modules (ALMs), an island-style routing network, and column/row-based embedded memory and multiplier blocks. Power consumption is reduced by leveraging a 1.2 V core voltage, low-k dielectric process, and programmable power-on-demand per LAB. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes using Altera/Intel Quartus II design software.
Typical applications include industrial motor control, video processing and image aggregation, communications protocol bridging, automotive infotainment pre-processing, and portable test & measurement equipment. The Cyclone III family is also commonly deployed in display controllers, software-defined radio front-ends, and as a companion processor to ASICs/SoCs for glue logic and parallel DSP tasks.
When designing with this part, ensure the Quartus II device fitting is reviewed for the selected speed grade, and verify that I/O bank voltage references match the connected peripherals. The N suffix on the part number indicates lead-free / Pb-free termination, and the AD suffix typically denotes a specific Altera internal ordering code variant.
This page synthesizes distributor pricing, package diagrams, and practical design notes not found in the manufacturer datasheet, helping engineers shorten their selection and sourcing cycle.
Drop-in alternatives for EP3C120F780C7NAD — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C120F780C7NAD (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C120F780C7N
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EP3C120F780C7AD
✅ Drop-In✓ In Stock
$139 / Unit
View Datasheet →EP3C120F780I7N
✅ Drop-In✓ In Stock
$198.45 / Unit
View Datasheet →EP3C120F484I7N
✅ Drop-In✓ In Stock
$84.7 / Unit
View Datasheet →EP3C120F484C7N
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP4CE120F780C8N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C120F780C7NAD Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 119,088 |
| Embedded Memory | 3,981 Kbits (M9K blocks) |
| Number of PLLs | 4 |
| Embedded Multipliers (18x18) | 288 |
| Maximum User I/O | 531 |
| Package Type | FBGA-780 (FineLine BGA) |
| Package Dimensions | 23 x 23 mm, 2.60 mm height |
| Ball Pitch | 1.0 mm |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C7 |
| Process Node | 60 nm low-power |
| Core Voltage | 1.2 V |
| Configuration Modes | AS, AP, PS, JTAG |
| Mounting Type | Surface Mount |
| Lead Free / RoHS | Lead free / RoHS Compliant |
| Internal Maximum Frequency | 472 MHz |
EP3C120F780C7NAD Pin Configuration
| Pin A1 | VCCIO1 — I/O bank 1 voltage reference |
| Pin A2 | I/O — General purpose user I/O |
| Pin B1 | VCCINT — Core voltage 1.2 V supply |
| Pin B2 | GND — Ground |
| Pin C1 | VCC_PLL — PLL analog supply 2.5 V |
| Pin C2 | nCONFIG — Configuration control (active low) |
| Pin D1 | MSEL0 — Configuration mode select 0 |
| Pin D2 | MSEL1 — Configuration mode select 1 |
| Pin E1 | nSTATUS — Configuration status (active low) |
| Pin E2 | CONFIG_DONE — Configuration complete indicator |
| Pin F1 | TCK — JTAG clock input |
| Pin F2 | TMS — JTAG mode select |
| Pin G1 | TDI — JTAG data input |
| Pin G2 | TDO — JTAG data output |
| Pin H1 | DATA0 — Active Serial configuration data |
| Pin H2 | DCLK — Configuration clock input |
| Pin J1 | I/O — General purpose user I/O |
| Pin J2 | I/O — General purpose user I/O |
| Pin K1 | VCCA_PLL — PLL analog supply 2.5 V (auxiliary) |
| Pin K2 | GND_PLL — PLL ground reference |
Typical Applications
EP3C120F780C7NAD is suitable for 7 applications: Industrial Motor Control (FOC / Servo Drive), Video Processing and Image Aggregation, Telecommunications Protocol Bridging, Automotive Infotainment Pre-Processing, Portable Test & Measurement Equipment, Display Controllers and Industrial HMI, Software-Defined Radio Front-End Pre-Processing.
Industrial Motor Control (FOC / Servo Drive)
The EP3C120F780C7NAD is a strong fit for industrial motor control because its 288 embedded 18x18 multipliers and four PLLs can execute field-oriented control math in hardware while leaving headroom for current loop, speed loop, and PWM generation. With 119K logic elements, the FPGA can host multiple axes simultaneously (typically 2-3 axes in C7), and the 531 user I/Os interface to encoders (EnDat, BiSS, QEP), gate drivers, and CAN/RS-485 communication. Unlike a microcontroller, the FPGA determinism guarantees sub-microsecond PWM timing. The C7 commercial speed grade is adequate for cabinet-mounted drives. Power dissipation at full utilization is approximately 1.5-2 W from the 1.2 V core, so a modest thermal copper pour on the FBGA-780 land pattern is sufficient.
Recommended
Video Processing and Image Aggregation
The 119K logic elements and 531 user I/Os of the EP3C120F780C7NAD make it well suited to multi-channel video processing applications such as CCTV DVR front-ends, machine vision aggregation boards, and medical imaging pre-processors. The device supports LVDS input at up to 875 Mbps per pair, enabling direct interfacing to Camera Link, MIPI CSI-2 (via bridge), or HDMI receivers without external transceivers. The 3,981 Kbits of M9K memory provide line buffers and lookup tables for color space conversion. At C7 speed grade, video pipelines typically run at 60-100 MHz pixel clock, well within the device's timing margin. Engineers commonly pair the EP3C120 with external DDR2 SDRAM controllers implemented in FPGA logic.
Recommended
Telecommunications Protocol Bridging
In telecom infrastructure, the EP3C120F780C7NAD is frequently deployed as a low-latency protocol bridge - for example, mapping between CPRI, OBSAI, and custom Ethernet variants, or converting between legacy TDM buses (H.110, MVIP) and IP packets. The four PLLs generate the multiple clock domains required for simultaneous line-rate conversion, and 119K logic elements are enough to implement a soft Ethernet MAC plus a CPRI framer in parallel. LVDS I/O at 875 Mbps supports direct CPRI 2 (1.2288 Gbps needs external SERDES, but lower rates fit natively). C7 commercial grade is fine for indoor central-office equipment; industrial temperature EP3C120F780I7N is preferred for outdoor cabinets.
Recommended
Automotive Infotainment Pre-Processing
Although the EP3C120F780C7NAD is commercial temperature (0C to +85C), its logic density and DSP blocks make it attractive for pre-production automotive infotainment displays where prototypes need LVDS display aggregation, touch controller bridging, and camera surround-view pre-processing before volume ASIC availability. The 531 I/Os handle multiple LVDS display streams and camera inputs in parallel, while 288 multipliers enable real-time surround-view stitching. For production automotive AEC-Q100 qualified designs, consider the Cyclone IV GX EP4CGX110F484 or migrating to Cyclone V E GX. The FBGA-780 footprint also simplifies mechanical integration with heatsink-less automotive thermal envelopes.
Recommended
Portable Test & Measurement Equipment
Handheld and bench-top test instruments - oscilloscopes, logic analyzers, protocol analyzers, and arbitrary waveform generators - frequently use the EP3C120F780C7NAD for its combination of logic density, DSP blocks, and LVDS I/O bandwidth. The 531 user I/Os can be partitioned into acquisition channels (LVDS at up to 875 Mbps), display interfaces (RGB or LVDS to LCD), communication (USB, Ethernet, GPIB), and storage (SATA or SD). The 472 MHz internal Fmax supports 200 Msps real-time acquisition. Compared to a DSP + microcontroller pair, the FPGA integration reduces BOM and PCB area - critical for portable form factors. C7 commercial grade is acceptable for lab environments.
Recommended
Display Controllers and Industrial HMI
Industrial HMI panels, point-of-sale terminals, and digital signage controllers benefit from the EP3C120F780C7NAD's high LVDS lane count and abundant logic for multi-layer alpha blending, touch coordinate interpolation, and graphics acceleration. The 531 user I/Os allow simultaneous RGB/LVDS panel drive, capacitive touch controller interface (I2C/SPI), USB host, Ethernet, and multiple GPIO buttons. With the Nios II soft processor (free in Quartus II), designers add a full control plane without a companion microcontroller. The C7 commercial speed grade handles typical panel refresh rates up to 1080p60 with two-layer blending at modest 80 MHz pixel clock.
Recommended
Software-Defined Radio Front-End Pre-Processing
In SDR systems, the EP3C120F780C7NAD handles the digital front-end between the ADC/DAC and the host processor: channelization, decimation/interpolation, digital down-conversion, and sample-rate conversion. The 288 18x18 multipliers can implement dozens of parallel DDC channels, while the 472 MHz Fmax supports decimation filters in the tens of MHz range. The LVDS I/Os interface directly to wideband ADCs such as the ADS62P49. The four PLLs generate the ADC sample clocks and the host interface clocks. C7 commercial grade is fine for lab and indoor SDR; for ruggedized military/aerospace SDR, consider the EP3C120F780I7N industrial variant or migrate to a Cyclone V GT with hard transceivers.
Recommended
Recommended Products Summary
Engineering reference data for EP3C120F780C7NAD — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C120F780C7N | EP3C120F780C7AD | EP3C120F780I7N | EP3C120F484C7N | EP4CE120F780C8N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | FBGA-780 (23x23 mm) | FBGA-780 (23x23 mm) - same | FBGA-780 (23x23 mm) - same | FBGA-780 (23x23 mm) - same | FBGA-484 - different package | FBGA-780 (23x23 mm) - same |
| Logic Elements | 119,088 | 119,088 | 119,088 | 119,088 | 119,088 | 114,480 |
| Embedded Memory (Kbits) | 3,981 | 3,981 | 3,981 | 3,981 | 3,981 | 3,888 |
| Embedded Multipliers (18x18) | 288 | 288 | 288 | 288 | 288 | 266 |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Maximum User I/O | 531 | 531 | 531 | 531 | 284 | 528 |
| Speed Grade / Temperature | C7 commercial (0C to +85C) | C7 commercial - same | C7 commercial - same | I7 industrial (-40C to +100C) | C7 commercial - same | C8 commercial, lower power |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | Active (recommended for new designs) |
Key Differentiators
- Highest density member of the Cyclone III family at NRND pricing (vs EP4CE120F780C8N)
- Lead-free RoHS compliant with three drop-in reorder variants (vs EP3C120F780I7N)
- Cost-effective alternative to Cyclone IV E in same FBGA-780 footprint (vs EP4CE120F780C8N)
Design Notes
Estimated: at typical Cyclone III core utilization (60-70% LE, 50% RAM, moderate toggle rate), the EP3C120F780C7NAD dissipates roughly 1.5-2 W from the 1.2 V VCCINT rail. The FBGA-780 package has a published theta_JA of approximately 11 C/W with a standard 4-layer JEDEC test board. In a real PCB layout, expect junction temperature rise of 18-22 C above ambient at 2 W. Ensure at least 1 oz copper on inner layers and a small thermal via array under the package center balls. Forced airflow of 200 LFM is recommended when ambient exceeds 55 C.
Decoupling is critical for FPGAs of this density. Use a minimum of 20 x 0.1 uF 0402 ceramic capacitors placed within 100 mils of the FBGA-780 VCCINT and VCCIO balls, distributed evenly across the package footprint. Add 4 x 10 uF 0805 bulk capacitors near the four package corners. Place the PLL analog supply (VCCA_PLL) filter (ferrite bead + 10 uF + 0.1 uF) within 250 mils of the PLL supply pins to minimize jitter. Use a continuous ground plane on layer 2 to provide a low-impedance return path for high-speed LVDS signals.
Three common pitfalls when migrating designs to/from the EP3C120F780C7NAD: (1) Confusing speed grade letters - C7 is commercial 0C to +85C while I7 is industrial -40C to +100C; the part numbers are identical otherwise. (2) Forgetting that Quartus II device fitting depends on the speed grade - C7 to C8 may shift timing margins. (3) Power sequencing - VCCINT (1.2 V) must ramp before VCCIO (1.5/1.8/2.5/3.3 V) to avoid I/O bus contention during configuration. Use TI TPS3808 or equivalent voltage supervisors to enforce the sequence.
LVDS signals on the EP3C120F780C7NAD require 100 ohm differential impedance and length matching within 10 mils (typically 20 ps) on a pair-by-pair basis. Route LVDS pairs on the top layer over a continuous ground reference; avoid layer transitions on LVDS. Keep LVDS away from switching power supply nodes by at least 50 mils. For multi-LVDS-lane interfaces (e.g., Camera Link), match intra-group skew within 50 ps and inter-group skew within 200 ps. Use IBIS models from the Cyclone III Device Handbook for board-level signal integrity simulation.
Compliance Information
Lead-free and RoHS compliant per distributor listings and Altera ordering code suffix 'N'. AEC-Q100 not qualified - this is a commercial-grade part. Industrial temperature grade (I7 suffix) available separately.
