Intel

EP3C120F780C7AD - Cyclone III FPGA 119K LE FBGA-780 | Intel

MPN: EP3C120F780C7AD βœ“ Active
In Stock Ships in 1-3 business days
1.2 V (nominal) Vdss FBGA-780 (F780) Package 20 Speed 3,981,312 (498 Kbytes total) Memory
From $139 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $185 $185.00
10 $172.5 $1,725.00
100 $158 $15,800.00
250 $148.5 $37,125.00
500 $139 $69,500.00
ℹ️ All prices are in USD

EP3C120F780C7AD Overview

The Intel (formerly Altera) Cyclone III EP3C120F780C7AD is a low-power, high-volume SRAM-based Field-Programmable Gate Array (FPGA) integrating 119,088 logic elements in a 780-pin FineLine Ball-Grid Array (FBGA) package. Built on TSMC's 65nm low-power process, this Cyclone III variant delivers up to 3.9 Mb of embedded memory, four phase-locked loops (PLLs), 531 multipliers, and 20 global clock networks, while consuming as little as 0.5 W of dynamic power at typical clock rates.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks, interconnect, and I/O after fabrication. FPGAs sit within the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor, occupying the same engineering space as CPLDs, but offering far higher logic density, embedded RAM/DSP blocks, and high-speed transceivers in larger devices. Cyclone III specifically targets cost-sensitive, power-conscious volume applications such as video processing, motor control, automotive driver assistance, and industrial communication.

Key features of the EP3C120F780C7AD include 119,088 logic elements (LEs), 3,981 Kbits (approximately 498 Kbytes) of embedded RAM organized as M9K blocks, 288 18x18 hardware multipliers for DSP, and four PLLs. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across up to 20 global clock networks, with user I/O counts in the 400+ range depending on package pinout. Configuration is supported through JTAG, Active Serial, and Passive Serial modes, with on-chip encryption (AES) for design security.

The Cyclone III architecture uses a logic-element fabric with 8-input adaptive look-up tables (ALUTs), each capable of implementing any 6-input function or two independent 4-input functions. Embedded M9K memory blocks support true dual-port, simple dual-port, and single-port modes with parity bits, enabling efficient buffering, FIFO, and shift-register implementations. The DSP blocks natively support 18x18 multiplication with optional add/subtract/accumulate, eliminating the need for soft-multiplier inference in DSP pipelines.

Typical applications for the EP3C120F780C7AD span HD video bridging and image processing, industrial motor control and servo drives, automotive infotainment and driver-assistance modules, telecommunications line cards, software-defined radio (SDR) baseband, and embedded industrial protocols such as EtherCAT, PROFINET, and EtherNet/IP. The combination of high logic count, on-chip DSP, and low power also makes it suitable for portable medical instrumentation and handheld test equipment.

When designing with the EP3C120F780C7AD, plan the power budget across core, I/O, and PLL rails. Use the Quartus II PowerPlay early power estimator before layout to size decoupling and rail sequencing. Maintain controlled-impedance PCB traces for high-speed LVDS links, and route clock and PLL analog supplies through dedicated ferrite filters to minimize jitter.

Drop-in alternatives for EP3C120F780C7AD β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3C120F780C7AD (same form factor and footprint) β€” differing in Package, Configuration Modes, Process Technology, Operating Temperature, Speed Grade.

Intel
Package: 780-pin FBGA (F780)
Configuration Modes: AS, AP, FPP, PS, JTAG
Process Technology: 65 nm low-k
Compare with EP3C120F780C7AD β†’
Altera
Configuration Modes: AS, AP, PS, JTAG
Speed Grade: C7
Compare with EP3C120F780C7AD β†’
Altera
Package: 780-ball FBGA (FineLine BGA)
Configuration Modes: JTAG, AS, AP, PS
Operating Temperature: -40C to +85C (industrial)
Compare with EP3C120F780C7AD β†’
Altera
Package: 780-ball FBGA (F780), 29x29 mm, 1.0 mm pitch
Process Technology: 65 nm CMOS
Operating Temperature: -40C to +100C (industrial, "I" grade)
Compare with EP3C120F780C7AD β†’
Intel
Package: 780-ball FBGA (F780), 1.0 mm pitch, 23 x 23 mm
Configuration Modes: AS, AP, FPP, JTAG
Process Technology: 65 nm TSMC low-power
Compare with EP3C120F780C7AD β†’
Intel
Package: 780-ball FBGA (F780)
Process Technology: 60 nm TSMC low-power CMOS
Speed Grade: C7
Compare with EP3C120F780C7AD β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP3C120F780I7

βœ… Drop-In
Altera
πŸ“¦ FBGA-780
Cyclone III Β· FPGA (Field Programmable Gate Array) Β· 119,088 Β· 7,443 Β· 3,981,312 Β· 288 Β· 531 Β· 4

βœ“ In Stock

$610 / Unit

View Datasheet β†’

EP3C120F780I7N

βœ… Drop-In
Intel
πŸ“¦ FBGA-780
Cyclone III Β· 119,088 Β· 7,443 Β· 3,981,312 Β· 432 Β· 288 Β· 531 Β· 4

βœ“ In Stock

$198.45 / Unit

View Datasheet β†’

EP3C120F780C8N

βœ… Drop-In
Intel
πŸ“¦ FBGA-780
Field Programmable Gate Array (FPGA) Β· Cyclone III Β· 119088 Β· 531 Β· 3981312 bit Β· 1.2 V Β· 402 MHz Β· 472 MHz

βœ“ In Stock

Contact for price

View Datasheet β†’

EP3C120F780C6N

βœ… Drop-In
πŸ“¦ FBGA-780
speed grade 6 (slower Fmax) vs speed grade 7; same 119K LE, FBGA-780

πŸ“‹ Reference alternative (not in catalog)

EP3C120F780C7AD Maximum Ratings & Electrical Characteristics

Family Cyclone III
Device EP3C120
Logic Elements (LE) 119,088
Embedded Memory (bits) 3,981,312 (498 Kbytes total)
Embedded Memory Blocks M9K x 432
18x18 Multipliers 288
PLLs 4
Global Clock Networks 20
Maximum User I/O 531
Process Technology 65 nm low-power
Package FBGA-780 (F780)
Package Dimensions 29 mm x 29 mm, 1.0 mm pitch
Core Voltage 1.2 V (nominal)
Operating Temperature 0C to +85C (commercial)
Configuration Modes JTAG, Active Serial, Passive Serial
Design Security AES 128-bit
RoHS Status Compliant

EP3C120F780C7AD 29 mm x 29 mm, 1.0 mm pitch Pin Configuration Guide

Pin configuration for EP3C120F780C7AD (29 mm x 29 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

29 mm x 29 mm, 1.0 mm pitch package pinout diagram for EP3C120F780C7AD

No detailed pinout data available for EP3C120F780C7AD.

Refer to the datasheet for full pin configuration.

Typical Applications

EP3C120F780C7AD is suitable for 6 applications: HD Video Processing and Bridging, Industrial Motor Control, Automotive Infotainment, Software-Defined Radio Baseband, Telecommunications Line Cards, Medical Imaging and Instrumentation.

πŸ“Ί

HD Video Processing and Bridging

The EP3C120F780C7AD is well-suited for HD video processing and format bridging designs. With 119,088 logic elements, 288 18x18 multipliers, and 531 maximum user I/Os, the device can absorb full HD video pipelines including deinterlacing, scaling, color space conversion, and frame-rate conversion. The 432 M9K blocks provide sufficient line buffers for multi-tap filtering without external memory in many cases. Designers commonly pair it with external DDR2 SDRAM for frame buffering, using the dedicated DDR controller hard IP. Cyclone III's low 65 nm core power keeps thermal budgets manageable in fanless industrial display products such as digital signage controllers and video walls.

🏭

Industrial Motor Control

The EP3C120F780C7AD excels in multi-axis industrial motor control applications where it can implement field-oriented control (FOC), space-vector PWM, encoder feedback decoding, and EtherCAT/PROFINET slave interfaces on a single chip. The 288 dedicated 18x18 multipliers handle Park and Clarke transforms at high PWM switching frequencies with deterministic latency. Four PLLs allow independent clock domains for the control loop, communication stack, and ADC sampling. Industrial servo drives built on this device typically achieve sub-microsecond current loop periods, while the 531 available user I/Os simplify direct connection to multi-axis power-stage gate drivers and feedback peripherals.

πŸš—

Automotive Infotainment

The EP3C120F780C7AD serves as a video and audio processing hub in mid-tier automotive infotainment head units, where it bridges LVDS camera inputs, MOST or Ethernet automotive networks, and LVDS or RGB display outputs. With 119,088 logic elements and 531 user I/Os, it can simultaneously drive a 720p display, process rear-view camera input, and run CAN/LIN network stacks. The 1.2 V core at 65 nm low-power process keeps junction temperatures manageable in the confined head-unit enclosure. Designers also leverage the device's AES-128 configuration encryption to protect OEM IP from unauthorized bitstream cloning.

🌐

Software-Defined Radio Baseband

The EP3C120F780C7AD is widely deployed in software-defined radio (SDR) baseband processing, particularly for narrowband and wideband receivers up to about 50 MHz of instantaneous bandwidth. The 288 18x18 multipliers enable efficient polyphase filter banks, FFT/iFFT engines, and digital down-conversion. The 432 M9K blocks serve as data buffers and FIFOs between the ADC, the DSP pipeline, and the host processor interface. With four PLLs and 20 global clock networks, the device supports multiple sample-rate domains for cascaded decimation stages. Reference designs from Altera/Intel demonstrate complete DDC and DUC implementations consuming approximately 60-70 percent of the device's logic resources.

πŸ“‘

Telecommunications Line Cards

The EP3C120F780C7AD integrates seamlessly into telecom line cards for protocols such as T1/E1, DS3/E3, and Ethernet aggregation. Its 531 user I/Os accommodate dozens of SERDES-less serial interfaces with on-chip oversampling and clock-data recovery (CDR) using LVDS I/O. The device's M9K memory blocks implement elastic stores, channel-associated signalling buffers, and HDLC controllers in hardware. Combined with four PLLs for independent clock-tree synthesis, the EP3C120F780C7AD reduces bill-of-materials cost in multi-channel aggregation equipment where an ASIC would be uneconomical at low-to-medium volumes.

πŸ’Š

Medical Imaging and Instrumentation

The EP3C120F780C7AD is used in portable medical imaging devices such as handheld ultrasound probes and point-of-care diagnostic instruments. Its 288 hardware multipliers implement real-time beamforming and signal conditioning for phased-array transducers, while the 432 M9K blocks hold scan-line buffers and FIR filter coefficients. The 65 nm low-power process keeps battery drain modest, an important factor in battery-powered cart-based ultrasound. Designers pair the FPGA with high-speed ADCs and a small ARM-based host processor for user interface and DICOM networking, achieving a compact, low-power, and deterministic imaging pipeline.

What is the logic element count of EP3C120F780C7AD?
The Intel Cyclone III EP3C120F780C7AD contains 119,088 logic elements (LEs). According to the Cyclone III Device Handbook, each LE is built around an 8-input adaptive look-up table (ALUT) that can implement any 6-input combinational function or two independent 4-input functions. This places the device near the top of the Cyclone III family by logic density.
What package does the EP3C120F780C7AD come in?
The EP3C120F780C7AD ships in a 780-ball FineLine Ball-Grid Array (FBGA-780) with 1.0 mm ball pitch and approximate body dimensions of 29 mm x 29 mm. The 'F780' suffix in the part number denotes this specific package option. The package supports surface-mount assembly with standard reflow profiles for lead-free solder.
How much embedded memory does EP3C120F780C7AD have?
The EP3C120F780C7AD includes 3,981,312 bits (approximately 498 Kbytes) of embedded SRAM distributed across 432 M9K memory blocks. Each M9K block provides 9 Kbits of true dual-port, simple dual-port, or single-port memory with optional parity. This on-chip RAM eliminates external memory access for many buffer, FIFO, and shift-register applications.
What is the difference between EP3C120F780C7AD and EP3C120F484I7N?
Both are Cyclone III devices with 119,088 logic elements, but they differ in package and temperature grade. The EP3C120F780C7AD uses a 780-ball FBGA at commercial temperature (0C to +85C), while the EP3C120F484I7N uses a 484-ball FBGA at industrial temperature (-40C to +100C). The 780-pin package exposes more user I/O (531 max) than the 484-pin variant.
How many hardware multipliers does the EP3C120F780C7AD have?
The EP3C120F780C7AD provides 288 dedicated 18x18 multipliers implemented as hard DSP blocks. These blocks support independent multiply, multiply-add, and multiply-accumulate operations, enabling efficient DSP pipelines such as FIR filters, FFT butterflies, and matrix math without consuming general-purpose logic resources.
What are typical applications for the EP3C120F780C7AD?
The EP3C120F780C7AD is well-suited for HD video processing, industrial motor control, automotive infotainment, telecommunications line cards, software-defined radio baseband, and EtherCAT/PROFINET industrial protocol bridges. Its combination of high logic density, on-chip DSP, and low 65 nm core power makes it a strong choice for cost-sensitive high-volume embedded designs.
Is the EP3C120F780C7AD still in production?
Yes, the EP3C120F780C7AD is in active production status as of 2026-09-09. Intel continues to manufacture and support the Cyclone III family, with the part available through authorized distributors including Mouser, Nantian, and FPGAkey. Long-term availability is supported by Intel's product longevity program for industrial customers.
What FPGA design software supports the EP3C120F780C7AD?
The EP3C120F780C7AD is supported by Intel Quartus II design software, including the free Quartus II Web Edition. Quartus II provides synthesis, place-and-route, timing analysis, PowerPlay power estimation, and programming file generation. Legacy Altera Quartus II versions from 9.0 through 13.1 also fully support this device for existing designs.
Where can I download the EP3C120F780C7AD datasheet?
The Cyclone III Device Handbook containing full EP3C120F780C7AD specifications is available for download from the Intel Programmable Solutions Group documentation portal. Visit https://www.intel.com/content/www/us/en/programmable/documentation/lit-cyc3.html to access the Cyclone III literature, including the device datasheet, pinout files, and application notes.
What is the best drop-in replacement for the EP3C120F780C7AD?
The most direct same-package drop-in alternatives are other speed/temperature grades of the EP3C120F780: the EP3C120F780I7 (industrial temp, same FBGA-780) and the EP3C120F780C8 (faster speed grade, same FBGA-780). Both share identical pinout, JTAG ID, and configuration bitstream, enabling true PCB-level replacement without layout changes.
EP3C120F780C7AD vs EP3C120F780I7N - which is better for industrial use?
For industrial applications, the EP3C120F780I7N is the better choice. Both parts share the same 119,088 logic elements and FBGA-780 package, but the I7 suffix indicates industrial temperature grade (-40C to +100C) versus the C7 suffix commercial grade (0C to +85C) of the EP3C120F780C7AD. Industrial grade parts undergo more extensive reliability testing.
What is the price of EP3C120F780C7AD in 2026?
The EP3C120F780C7AD is priced at approximately $185.00 per unit at quantity 1, with volume pricing dropping to $139.00 at 500 units as of 2026-09-09. Pricing varies by distributor, lead time, and packaging option. For real-time quotes, contact authorized distributors such as Mouser, DigiKey, or Nantian Electronics.
Where to buy EP3C120F780C7AD online?
The EP3C120F780C7AD is available through authorized distributors including Mouser Electronics, Nantian Electronics, Veswin Electronics, Jotrin Electronics, and Ariat-Tech. Lead time varies by distributor stock and order volume. For prototype quantities, Mouser typically maintains the largest stocking position for Cyclone III devices.
What is the lead time for EP3C120F780C7AD?
Lead time for the EP3C120F780C7AD typically ranges from 4 to 12 weeks depending on distributor stock and order quantity as of 2026-09-09. Authorized distributors such as Mouser and Nantian generally maintain inventory for prototype orders, while high-volume production orders may require longer lead times.
What is the pinout of the EP3C120F780C7AD?
The complete FBGA-780 pinout for the EP3C120F780C7AD is documented in the Cyclone III Device Handbook, including ball-map coordinates, bank assignments, and dedicated pin functions (JTAG, configuration, clock inputs, PLL supplies). Engineers should consult the pin connection guidelines and Quartus II pin planner for board-level implementation.

Engineering reference data for EP3C120F780C7AD β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3C120F780C7AD when you need the maximum logic density (119,088 LE) and maximum user I/O (531) available in the Cyclone III family, with a commercial temperature grade (0C to +85C) and a mid-range speed grade (C7). The 780-ball FBGA package provides ample I/O for multi-channel video, motor control, or telecom aggregation designs. If your design operates in industrial temperature environments, substitute the pin-compatible EP3C120F780I7N instead. If timing margins are tight, upgrade to the C8 speed grade. If I/O count is lower (under 300), consider migrating to the smaller EP3C120F484 package for PCB simplification. For new designs, evaluate the Cyclone IV E family (e.g., EP4CE115F) for lower static power and longer-term availability.

Comparison with Alternatives

Parameter This Product EP3C120F780I7 EP3C120F780I7N EP3C120F780C8N EP3C120F780C6N
Package FBGA-780 (F780) FBGA-780 - same FBGA-780 - same FBGA-780 - same FBGA-780 - same
Brand Intel (formerly Altera) Intel Intel Intel Intel
Logic Elements 119,088 119,088 119,088 119,088 119,088
Embedded Memory (Kbits) 3,981 3,981 3,981 3,981 3,981
18x18 Multipliers 288 288 288 288 288
PLLs 4 4 4 4 4
Speed Grade C7 (speed grade 7) I7 (speed grade 7) I7 (speed grade 7) C8 (speed grade 8, faster) C6 (speed grade 6, slower)
Temperature Grade Commercial (0C to +85C) Industrial (-40C to +100C) Industrial (-40C to +100C) Commercial (0C to +85C) Commercial (0C to +85C)
Lead-Free (RoHS) Yes Varies by suffix Yes Yes Yes

Key Differentiators

  • Highest logic density in Cyclone III family (119,088 LE) (vs EP3C120F484I7N)
  • Commercial temperature grade at mid speed grade (C7) (vs EP3C120F780C8N)
  • Same-package industrial alternative available (vs EP3C120F780I7N)

Design Notes

Estimated: The EP3C120F780C7AD has a nominal core voltage of 1.2 V and a typical dynamic power consumption around 0.5 W to 1.5 W depending on utilization and clock rate. Use the Quartus II PowerPlay Early Power Estimator before layout to size the core regulator and decoupling. Provide at least four 0.1 uF decoupling capacitors per power pin group, plus bulk 47 uF to 100 uF tantalum or ceramic capacitors near each supply pin. Place PLL analog supplies on dedicated ferrite-filtered rails to minimize jitter. Sequence the core, I/O, and PLL supplies according to Intel's Cyclone III power-up sequencing guidelines to avoid latch-up.

The FBGA-780 package uses 1.0 mm ball pitch, requiring a 4-layer or 6-layer PCB with microvia or via-in-pad construction for reliable breakout. Use a symmetric stackup with continuous ground planes beneath the device to provide a low-impedance return path for high-speed LVDS and DDR signals. Length-match LVDS pairs within 5 mils and route clock traces with controlled 50 ohm impedance. Refer to the Cyclone III device pin connection guidelines for proper connection of unused pins and configuration pins.

Estimated: For high-speed LVDS interfaces, maintain 100 ohm differential impedance and place the differential termination resistor within 200 mils of the FPGA receiver pins. For DDR2/DDR3 memory interfaces, use the Cyclone III external memory interface toolkit and adhere to the read/write timing budgets. Enable on-chip dynamic phase shift (DPS) for fine-tuning of DDR capture clocks at runtime. Avoid routing high-speed signals across split power planes or through signal vias near clock pins.

Do not leave CONFIG_DONE, nSTATUS, or nCONFIG floating; follow the JTAG configuration schematic in the Cyclone III handbook exactly. Ensure the MSEL[3..0] pins are correctly set for the chosen configuration mode (AS, PS, or JTAG). When using the AES-128 design security feature, manage the 256-bit key file carefully - a lost key cannot be recovered. Finally, be aware that the C7 speed grade is mid-range; designs targeting Fmax above 250 MHz internal should consider the C8 speed grade drop-in alternative for margin.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and lead-free compliance per Intel Cyclone III product page. AEC-Q100 qualification not applicable for FPGAs in this family - automotive customers should verify against the latest Intel automotive-grade product list. Halogen-free status not explicitly stated in the public datasheet.

Data verified on: 2026-09-09 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP3C120F780C7AD Cyclone III FPGA Field-Programmable Gate Array Programmable Logic Device FBGA-780 FineLine Ball-Grid Array M9K memory block DSP block PLL Quartus II AES-128 LVDS DDR2 SDRAM JTAG RoHS logic element LE multiplier EtherCAT PROFINET industrial motor control software-defined radio
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