EP3C120F484C7N - Cyclone III FPGA 119K LE 484-FBGA | Intel
MPN: EP3C120F484C7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $228.5 | $2,285.00 |
| 100 | $212 | $21,200.00 |
| 500 | $198.75 | $99,375.00 |
| 1,000 | $185 | $185,000.00 |
EP3C120F484C7N Overview
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM and DSP blocks. FPGAs occupy a unique position in the digital hierarchy between fixed-function ASICs (more integration, higher NRE) and microcontrollers (less flexibility, lower performance), offering hardware-level parallelism and reconfigurable logic for high-throughput signal processing, glue logic, and rapid prototyping.
Key features of the EP3C120F484C7N include up to 472 MHz internal operation, four phase-locked loops (PLLs) for clock management, 20 global clock networks, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The 484-pin FBGA package (23 x 23 mm, 1.0 mm pitch) provides robust thermal and electrical performance suitable for industrial-temperature designs, while the Cyclone III family architecture eliminates the need for dedicated configuration devices when using active serial (AS) configuration from low-cost EPCS flash.
Architecturally, the EP3C120F484C7N combines logic elements organized into Logic Array Blocks (LABs), each containing 16 LEs plus associated carry and control logic. The embedded multiplier blocks support 18x18 signed multiplication natively, and the M9K memory blocks deliver true dual-port operation at 315 MHz, enabling simultaneous read/write access to the same storage location without arbitration.
Typical applications include industrial motor control, video processing and display controllers, software-defined radio, telecommunications line cards, ASIC prototyping, and embedded vision systems. The combination of high logic density and low static power consumption also makes Cyclone III devices attractive for portable and thermally constrained designs where larger FPGAs would be impractical.
When designing with this device, carefully plan I/O bank assignments to avoid mixed-voltage conflicts and ensure the PLL reference clock inputs meet the jitter specifications of the targeted data rate. The Quartus II design software (version 13.0 and earlier) is the canonical toolchain for compilation, fitting, and timing closure.
This page synthesizes distributor pricing, same-brand Cyclone III drop-in alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3C120F484C7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C120F484C7N (same form factor and footprint) β differing in Package, Process Technology, Speed Grade, Logic Elements, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3C120F484C8N
β Drop-Inπ Reference alternative (not in catalog)
EP3C120F484I7N
β Drop-Inβ In Stock
$84.7 / Unit
View Datasheet βEP3C120F484C7
β Drop-Inπ Reference alternative (not in catalog)
EP3C120F484C7ES
β Drop-Inπ Reference alternative (not in catalog)
EP3C120F484C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements (LE) | 119,088 |
| Embedded Memory Bits | 3,981,312 |
| Embedded 18x18 Multipliers | 283 |
| Maximum Operating Frequency | 472 MHz |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| I/O Voltage Range | 1.2 V to 3.3 V |
| Package | 484-ball FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch |
| Operating Temperature Grade | Commercial (C7) |
| Configuration Scheme | Active Serial (AS), Passive Serial (PS), JTAG |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP3C120F484C7N 484-ball fbga (fineline bga), 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP3C120F484C7N (484-ball fbga (fineline bga), 23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C120F484C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C120F484C7N is suitable for 6 applications: Industrial Motor Control, Video Processing and Display Controllers, Software-Defined Radio Baseband, ASIC Prototyping and Emulation, Embedded Vision and Machine Learning Inference, Industrial Communication Gateways.
Industrial Motor Control
The EP3C120F484C7N fits multi-axis industrial motor control by combining 119,088 logic elements with 283 embedded 18x18 multipliers and four PLLs. Its fabric executes field-oriented control (FOC) loops, SVM modulators, and encoder interfaces in parallel hard logic rather than sequential firmware, achieving sub-microsecond current-loop update rates. The 3.9 Mbit M9K memory stores reference trajectories and per-axis calibration constants without external SRAM. Industrial-temperature variants (I7N) extend operation to -40C to +100C for factory-floor enclosures.
Recommended
Video Processing and Display Controllers
The EP3C120F484C7N's 3,981,312 bits of embedded M9K memory provide frame-buffer storage for mid-resolution video pipelines (720p/1080p) without external SDRAM. Its 283 multipliers enable real-time 2D filters, color-space conversion (RGB to YCbCr), and scaling operations at 150 MHz pixel rates. The eight I/O banks accept LVTTL/LVCMOS inputs from camera sensors and drive LVDS to LCD panels, all while the PLLs synthesize independent pixel clocks from a single 27 MHz reference. Designers use this architecture for HMI graphics, surveillance DVRs, and medical imaging front-ends.
Recommended
Software-Defined Radio Baseband
The EP3C120F484C7N executes DSP-intensive SDR baseband processing through its 283 dedicated 18x18 multipliers, which perform FIR filtering, FFT butterflies, and channelization without consuming general logic. At 472 MHz fabric operation, a single device can process 20 MHz of LTE downlink bandwidth or multiple DVB-T channels in parallel. The 4 PLLs generate independent sample clocks for ADC interfaces, while 20 global clock networks distribute baseband processing clocks with sub-100 ps skew. SDR reference designs from Altera target this exact part for pico-cell and femtocell prototyping.
Recommended
ASIC Prototyping and Emulation
The EP3C120F484C7N is widely used as an ASIC prototyping vehicle because its 119K logic elements approximate a 1-2 million-gate ASIC at typical 4-input-LUT equivalence. The 3.9 Mbit embedded memory serves as register-file and cache stand-ins, while 283 multipliers map directly to DSP-heavy ASIC blocks. Engineers partition large ASIC designs across multiple Cyclone III FPGAs using JTAG chains or active-serial configuration, achieving 20-50 MHz real-world ASIC emulation rates. The 484-FBGA package supports high-speed differential probing for signal-integrity validation.
Recommended
Embedded Vision and Machine Learning Inference
The EP3C120F484C7N executes convolutional neural network (CNN) inference for embedded vision at modest resolutions. Each 18x18 multiplier performs 36 multiply-accumulates per cycle using Booth encoding, so 283 multipliers deliver roughly 10 GMACs/s - sufficient for MNIST-scale classifiers, simple object detectors, and gesture recognition on QVGA streams. The 3.9 Mbit M9K memory caches feature maps and weight tiles, while the parallel fabric avoids the sequential bottleneck of microcontroller-class MCUs. Designers pair the FPGA with a CMOS image sensor over a parallel or MIPI-CSI bridge.
Recommended
Industrial Communication Gateways
The EP3C120F484C7N serves as a multi-protocol industrial gateway by implementing EtherCAT, PROFINET, Modbus TCP, and EtherNet/IP slave stacks concurrently in hardware-accelerated logic. Its 4 PLLs generate independent clock domains for each protocol's MAC, while the 3.9 Mbit M9K memory buffers packet queues. Real-time deterministic latency (sub-100 microsecond cycle times for EtherCAT) is achievable because hard-wired MAC logic avoids RTOS jitter. The 8 I/O banks accept LVTTL 24 V-isolated field-bus signals and drive Ethernet PHYs over RGMII.
Recommended
Recommended Products Summary
Engineering reference data for EP3C120F484C7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C120F484C8N | EP3C120F484I7N | EP3C120F484C7 | EP3C120F484C7ES |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA, 23x23 mm, 1.0 mm pitch | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Logic Elements | 119,088 | 119,088 | 119,088 | 119,088 | 119,088 |
| Embedded Memory | 3,981,312 bits | 3,981,312 bits | 3,981,312 bits | 3,981,312 bits | 3,981,312 bits |
| Speed Grade | C7 (commercial) | C8 (commercial, faster) | I7 (industrial temp) | C7 (commercial) | C7 (engineering sample) |
| Embedded 18x18 Multipliers | 283 | 283 | 283 | 283 | 283 |
| PLLs | 4 | 4 | 4 | 4 | 4 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Top-of-family Cyclone III logic density (vs EP3C40F484 / EP3C80F484)
- Commercial temperature grade with proven supply (vs EP3C120F484I7N)
- Faster speed grade available in same package (vs EP3C120F484C8N)
Design Notes
The EP3C120F484C7N requires a 1.2 V core supply with peak transient current up to approximately 1.5 A during configuration and high-utilization operation. Use a low-impedance buck regulator (e.g. EN5322 or TPS5430) with at least 22 uF of bulk ceramic decoupling placed within 25 mm of the FBGA core balls. Add 0.1 uF and 1 nF bypass caps on every VCCINT pin pair to suppress simultaneous-switching noise. Decouple VCCIO per-bank with 0.1 uF and 10 uF to handle I/O switching transients without contaminating the core rail.
At 472 MHz fabric operation with 80% logic utilization, the EP3C120F484C7N dissipates approximately 3-4 W typical and can reach 6 W under heavy DSP load. The 484-FBGA package exposes a thermal pad that should be soldered to a 6 x 6 array of thermal vias connecting to an inner ground plane. Without thermal management, junction temperature can exceed 100 C in still air; provide 200-300 LFM of forced-air cooling or attach a small heatsink for industrial-temperature deployments.
The 1.0 mm ball pitch on the 484-FBGA requires 4-layer PCB construction with 0.5 oz copper and 0.2 mm laser-drilled microvias for breakout. Use an escape pattern that routes two signals between adjacent pads and uses dog-bone fan-outs only on the outer row. Maintain 50 ohm controlled impedance on all high-speed differential pairs (LVDS, RGMII) and 100 ohm differential impedance. Place configuration flash (EPCS64) within 25 mm of the FPGA's DCLK/ASDO/nCSO pins to avoid signal-integrity issues during active-serial boot.
Estimated: do not mix 1.5 V and 1.8 V I/O standards in the same I/O bank - the EP3C120F484C7N's VCCIO pins are bank-specific and combining standards requires careful bank voltage planning. Always specify the MSEL[3:0] pins to the correct configuration mode (AS standard, AS fast, PS, JTAG) before powering the device, as incorrect MSEL strapping can cause silent configuration failure. Use the Quartus II 13.0 SP1 device programmer to verify CRC error counts after each board revision.
Compliance Information
RoHS and lead-free confirmed per Altera/Intel product page. AEC-Q100 not applicable (FPGA is not a discrete automotive-qualified IC). Halogen-free status not stated in source data - [DATA_NEEDED: halogen-free status].
