EP3C16F484I7N - 15408 LE Cyclone III FPGA, 484-FBGA | Altera (Intel)
MPN: EP3C16F484I7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $62.59 | $62.59 |
| 10 | $56.2 | $562.00 |
| 100 | $48.5 | $4,850.00 |
| 500 | $41.8 | $20,900.00 |
| 1,000 | $36.4 | $36,400.00 |
EP3C16F484I7N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines an array of configurable logic blocks (LEs), routing channels, and embedded memory/DSP into a single semiconductor. The taxonomy is: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Unlike ASICs, FPGAs are programmed in the field using HDL flows (Verilog/VHDL) and an SRAM configuration bitstream. FPGAs sit above microcontrollers and DSPs in flexibility but below ASICs in cost-per-volume, making them ideal for prototyping, low-volume production, and designs requiring parallel hardware acceleration.
Key features of the EP3C16F484I7N include 4 transceivers of 156 MHz / 437.5 MHz PLL support (no multi-gigabit transceivers, but ample general-purpose LVDS), 20 global clock networks, 56 embedded 18x18 multipliers for DSP, and Cyclone III's signature 1.2 V core that delivers roughly 50% lower dynamic power than Cyclone II. Configuration is via serial passive (PS), JTAG, or Altera Fast Passive Parallel modes using the cyclone programming cable or USB-Blaster.
The Cyclone III architecture uses an SRAM-based configuration cell backed by a multi-level routing hierarchy (L1/L2/L3/longlines), LAB-based logic array blocks containing 16 LEs each, and embedded M9K memory blocks (typically 56 blocks, 516 kbit total in this device). The 484-FBGA package is a 1.0 mm pitch BGA suitable for 4-6 layer PCBs, supporting high I/O count without demanding fine-line manufacturing.
Typical applications include industrial motor control and PLCs, video processing and image filtering, low-cost software-defined radio front-ends, factory automation and machine vision, telecom line cards, and embedded control with Nios II soft-core processors. The 56 hardware multipliers and abundant RAM make it well-suited to DSP pipelines, while the 346 I/Os support parallel bus and high-pin-count industrial protocols.
Design consideration: route configuration signals (nCONFIG, nSTATUS, CONF_DONE, MSEL, nCE) per Altera reference schematics and respect the JTAG chain. Use the Quartus II (or Quartus Prime Lite 18.x for legacy device support) software flow to compile, place-and-route, and generate the .sof/.pof bitstream. The 484-FBGA requires PCB fabrication with 0.4 mm via-in-pad or 0.6 mm dog-bone fanouts and impedance-controlled traces for LVDS.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3C16F484I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C16F484I7N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Configuration Modes, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C16F484I7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$58.1 / Unit
View Datasheet →EP3C16F484C8N
✅ Drop-In✓ In Stock
$29.95 / Unit
View Datasheet →EP3C16F484C7N
✅ Drop-In✓ In Stock
$30.1 / Unit
View Datasheet →EP3C16F484C6N
✅ Drop-In✓ In Stock
$38.4 / Unit
View Datasheet →EP3C16F484C6
✅ Drop-In✓ In Stock
$42.3 / Unit
View Datasheet →EP4CE15F484I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C16F484I7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Family | Cyclone III |
| Logic Elements (LE) | 15408 |
| Total Memory Bits | 516096 |
| Embedded Multipliers (18x18) | 56 |
| User I/O Pins | 346 |
| Global Clock Networks | 20 |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed/Grade | I7 (industrial, 7 speed grade) |
| Package | 484-FBGA (FineLine BGA, 1.0 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes (N suffix) |
| Configuration Mode | SRAM / JTAG / Passive Serial |
EP3C16F484I7N 484-fbga (fineline bga, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP3C16F484I7N (484-fbga (fineline bga, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C16F484I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C16F484I7N is suitable for 6 applications: Industrial Motor Control & PLCs, Video Image Processing Pipelines, Software-Defined Radio Front-Ends, Factory Automation & Machine Vision, Telecom Line Cards & Protocol Bridging, Embedded Control with Nios II Soft-Core.
Industrial Motor Control & PLCs
The EP3C16F484I7N fits industrial motor control because its 56 hardware 18x18 multipliers and 15408 logic elements deliver the DSP throughput needed for FOC (field-oriented control) and SVPWM algorithms on 3-phase motor drives. The 346 user I/Os drive parallel encoder interfaces (QEP), 16-bit ADC/DAC buses, and isolation-friendly 3.3 V LVCMOS GPIO. Cyclone III's 1.2 V core plus flexible I/O banking (1.2 V to 3.3 V) lets the same chip interface directly to industrial 24 V optocouplers via external level shifters. Industrial -40C to +100C temperature range supports factory-floor deployment, and the 484-FBGA's 1.0 mm pitch is compatible with standard 4-layer industrial PCB fabrication. Quartus II Qsys integrates Nios II soft-core for PLC ladder logic and EtherCAT slave IP stacks.
Recommended
Video Image Processing Pipelines
The EP3C16F484I7N serves video processing because it provides 56 embedded 18x18 multipliers, 516 kbit of M9K memory, and 346 user I/Os - sufficient resources for 720p line buffers, Sobel edge-detection, FIR noise filters, and color-space conversion in real time. The 1.2 V low-power core is critical for fanless embedded cameras and DVR designs. Pair the FPGA with a 1080p CMOS image sensor over a parallel DVP or LVDS bus; the device's flexible I/O standards include LVDS, SLVS, and LVCMOS at 1.5/1.8/2.5/3.3 V. Altera's VIP IP suite and DSP Builder blocks ship pre-validated for Cyclone III, and the Nios II soft-core handles housekeeping, I2C sensor init, and MIPI-CSI bridge glue logic.
Recommended
Software-Defined Radio Front-Ends
The EP3C16F484I7N is well-matched to SDR front-ends because Cyclone III's 56 hardware multipliers and abundant logic fabric implement digital down-conversion, channelization, and FFT cores up to several hundred MSPS, while the 516 kbit embedded RAM serves as data buffers between the ADC and host processor. The 346 I/Os accept parallel LVDS ADC data rates well above 100 MHz on multiple banks. Cyclone III has no multi-gigabit transceivers, but for narrowband or sub-100 MHz IF applications the parallel I/O path delivers equivalent throughput. SDR reference designs ship in the Quartus II DSP Library including polyphase filter banks and DDC IP for Cyclone III.
Recommended
Factory Automation & Machine Vision
The EP3C16F484I7N drives machine vision systems because its 15408 LEs plus 56 hardware 18x18 multipliers deliver the throughput needed for multi-camera inspection pipelines, pattern matching, and barcode decoding at line rates of 30-60 fps. The 346 user I/Os accept parallel data from Camera Link, LVDS, or MIPI-CSI bridges, while the 516 kbit of embedded RAM serves as image line buffers. Industrial -40C to +100C operation suits factory environments, and the 1.2 V core keeps the FPGA cool enough for sealed IP67 enclosures. Quartus II provides pre-built OpenCV-like IP for image preprocessing and Nios II soft-core for EtherCAT / PROFINET industrial network integration.
Recommended
Telecom Line Cards & Protocol Bridging
The EP3C16F484I7N fits telecom line cards because its 346 I/Os handle parallel TDM buses, glueless memory interfaces to DDR/DDR2/QDR SRAM, and standard telecom LVDS links. The 15408 LEs and 56 multipliers implement Reed-Solomon, Viterbi, and CRC engines for framer/encapsulation IP, while the 20 global clock networks support multiple independent telecom rates. Cyclone III has no integrated SERDES, so external PHYs are used for E1/T1, Ethernet, or OTN. Industrial temperature and the mature Cyclone III silicon make this FPGA a stable choice for legacy telecom infrastructure where long-term supply continuity matters more than peak performance.
Recommended
Embedded Control with Nios II Soft-Core
The EP3C16F484I7N fits Nios II soft-core embedded control because 15408 logic elements leave ample headroom for the processor plus custom peripherals, and 516 kbit embedded RAM supports instruction/data caches up to 64 KB each without external memory. The 346 user I/Os provide glueless access to UART, SPI, I2C, GPIO, and external parallel buses. Altera's Nios II/f (fast) core fits in roughly 1800 LEs at 100 MHz, leaving 13000+ LEs for custom accelerators. The 1.2 V core plus flexible I/O voltages simplify power tree design for 3.3 V sensor interfaces. Quartus II Qsys automatically integrates the soft-core, peripherals, and bridges.
Recommended
Recommended Products Summary
Engineering reference data for EP3C16F484I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C16F484I7 | EP3C16F484C8N | EP3C16F484C7N | EP3C16F484C6N | EP3C16F484C6 | EP4CE15F484I7N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-FBGA (1.0 mm pitch) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same (some balls redefined) |
| Logic Elements | 15408 | 15408 | 15408 | 15408 | 15408 | 15408 | 15408 (similar) |
| Embedded Memory (bits) | 516096 | 516096 | 516096 | 516096 | 516096 | 516096 | 516096 (Cyclone IV E equivalent) |
| Embedded Multipliers (18x18) | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
| User I/Os | 346 | 346 | 346 | 346 | 346 | 346 | 343 (slight reduction) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.0 V (Cyclone IV E lower) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | I7 (industrial, 7 ns) | I7 | C8 (slower) | C7 (matches I7) | C6 (faster) | C6 (faster) | I7 (Cyclone IV E timing) |
| RoHS Compliance | Yes (N suffix) | No (legacy, no N suffix) | Yes | Yes | Yes | No (legacy) | Yes |
Key Differentiators
- Industrial temperature range (-40C to +100C) for factory and outdoor deployment (vs EP3C16F484C8N)
- Mature 65 nm low-power process - lower dynamic power than Cyclone II (vs Cyclone II EP2C20F484)
- Highest-density drop-in for 484-FBGA footprint within Cyclone III family (vs EP3C10F484 / EP3C25F484)
Design Notes
The 484-FBGA package uses 1.0 mm ball pitch on a 22x22 array (with depopulated balls). For PCB fabrication, use 0.4 mm laser-drilled micro-vias with via-in-pad, or 0.6 mm dog-bone fanouts on 6 layers minimum. Match trace impedance to 50 ohm single-ended or 100 ohm differential for LVDS. Place 0.1 uF + 10 uF decoupling on every power ball within 100 mils; Cyclone III PowerPlay Estimator indicates roughly 60-80 decoupling caps total for the 484-FBGA variant. Exposed center balls are typically GND - tie to internal ground plane with at least 8 thermal vias under each ball cluster for heat dissipation (typical junction-to-ambient is 25 C/W with 4-layer PCB).
Cyclone III EP3C16F484I7N requires four independent supplies: VCCINT = 1.2 V (core), VCCAUX = 2.5 V (PLL/JTAG), VCCIO[1..8] = 1.2 V to 3.3 V per I/O bank, and VCCPD = 3.3 V (configuration). Use a 4-channel LDO or buck regulator per the Cyclone III reference schematic. Power-on sequence: VCCINT first, then VCCAUX, then VCCIO/VCCPD; a POR (power-on-reset) circuit or sequencer IC like the LTC2924 is recommended. Static current at room temp is roughly 70-100 mA; dynamic current scales with toggle rate. Do not allow VCCIO banks to be left floating - unused banks must be tied to VCCIO of an adjacent bank or a valid voltage through 10 kohm to prevent I/O bank damage.
Cyclone III EP3C16F484I7N is NRND - confirm long-term supply with Altera/Intel or authorized distributors before committing to new designs. JTAG configuration chains must include the 10 kohm pull-up on TCK and pull-down on TMS per IEEE 1149.1; missing pull resistors cause JTAG communication failures. Configuration mode pins MSEL[2..0] must be tied to valid logic levels (00 = AS, 01 = PS, 10 = JTAG, 11 = Fast Passive Parallel). Quartus II auto-detects device but the Quartus Prime Lite 18.0 is the last release with Cyclone III support; for newer Quartus Prime, Cyclone III device files are no longer included. NRND components may have longer lead times at smaller distributors - verify stock across multiple sources before placing production orders.
Route clock inputs on dedicated CLK pins (CLK[0..3], CLK[8..11] depending on bank) and avoid using regular I/O for clock inputs to minimize jitter. For LVDS signaling, pair each differential signal with matched-length routing (within 20 mil for data, within 100 mil for clock-to-data skew). Place the 50 MHz / 100 MHz oscillator within 200 mils of the FPGA clock pin and guard the trace with ground via fencing. Differential 100 ohm impedance must be maintained through vias; use back-drilling or via stubs less than 15 mil to avoid reflections at >500 Mbps. Cyclone III has no SERDES, so for serial protocols above 200 Mbps use external PHYs (e.g., TLK2711 for 1.6 Gbps).
Compliance Information
RoHS compliant per Altera/Intel product page (N suffix denotes lead-free). Not AEC-Q100 qualified - this is industrial/consumer grade, not automotive. Halogen-free and conflict-minerals status not explicitly stated in the verified web data.
