EP3C16F484C6N - Cyclone III FPGA 16K LE 346 I/O 484-FBGA | Intel
MPN: EP3C16F484C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $67.09 | $67.09 |
| 10 | $58.5 | $585.00 |
| 100 | $49.2 | $4,920.00 |
| 500 | $42.75 | $21,375.00 |
| 1,000 | $38.4 | $38,400.00 |
EP3C16F484C6N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacture to implement custom digital circuits. FPGAs sit in the programmable logic hierarchy between fixed-function ASICs (lower flexibility, lower per-unit cost at scale) and microcontrollers (sequential execution, lower parallel throughput). Cyclone III specifically targets the low-power, low-cost end of the FPGA market with TSMC's 65nm process technology.
Key features of the EP3C16F484C6N include four phase-locked loops (PLLs) for clock management, 20 global clock networks, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and configuration via JTAG, passive serial, or fast passive parallel modes. The device also provides dedicated hardware for PCI Express endpoint, gigabit Ethernet, and basic DSP functions.
The Cyclone III architecture uses adaptive logic modules (ALMs) rather than older 4-input LUT structures, achieving higher effective logic density per LE. The device supports commercial (0C to 85C) and industrial (-40C to 100C) temperature grades, with N suffix indicating lead-free, RoHS-compliant packaging suitable for high-volume manufacturing.
Typical applications include industrial motor control, video processing, wireline telecommunications, automotive driver assistance, and embedded DSP. Designers use the Quartus II or Quartus Prime design software for synthesis, place-and-route, and timing closure. The 484-FBGA package supports high-density PCB designs using standard 1.0mm ball pitch assembly processes.
When designing with this FPGA, ensure the PCB layout provides at least four PCB layers with dedicated power and ground planes for the core and I/O supplies. Decoupling capacitors must be placed as close as possible to each supply pin per Quartus power delivery guidelines, and unused I/O pins should be left floating or tied to ground per the configuration handbook.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3C16F484C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C16F484C6N (same form factor and footprint) — differing in Package, Process Technology, Core Voltage, Speed Grade, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C16F484C6
✅ Drop-In✓ In Stock
$42.3 / Unit
View Datasheet →EP3C16F484C7N
✅ Drop-In✓ In Stock
$30.1 / Unit
View Datasheet →EP3C16F484C8N
✅ Drop-In✓ In Stock
$29.95 / Unit
View Datasheet →EP3C16F484I7N
✅ Drop-In✓ In Stock
$36.4 / Unit
View Datasheet →EP3C16F484C6N Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone III |
| Logic Elements | 15,408 |
| Number of I/O | 346 |
| Embedded Memory | 504 Kbits |
| Embedded Multipliers (18x18) | 56 |
| Phase-Locked Loops (PLLs) | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.15 V to 1.25 V |
| Operating Temperature | 0C to +85C (commercial) |
| Package | 484-ball FineLine BGA (FBGA) |
| Mounting Type | Surface Mount |
| Process Technology | 65 nm TSMC low-power |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel |
| RoHS Status | Compliant |
| Lead-Free | Yes (N suffix) |
EP3C16F484C6N 484-ball fineline bga (fbga) Pin Configuration Guide
Pin configuration for EP3C16F484C6N (484-ball fineline bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C16F484C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C16F484C6N is suitable for 6 applications: Industrial Motor Control, Video Processing and Image Pipeline, Wireline Telecommunications, Embedded DSP and Signal Processing, Automotive Driver Assistance, Test and Measurement Instrumentation.
Industrial Motor Control
The EP3C16F484C6N suits industrial motor control with 56 embedded 18x18 multipliers enabling field-oriented control (FOC) and space-vector PWM generation. The 15,408 logic elements handle encoder decoding, current-loop PI controllers, and protection logic, while 504 Kbits embedded RAM buffers ADC samples. The 346 user I/O pins connect to Hall sensors, quadrature encoders, gate drivers, and isolated comms interfaces. Industrial-grade EP3C16F484I7N variants extend operation to -40C to +100C.
Recommended
Video Processing and Image Pipeline
The EP3C16F484C6N handles real-time video processing with sufficient logic density for 720p/1080p pipelines including scaling, color-space conversion, and overlay composition. The 346 I/O pins accept parallel ITU-R BT.656/1120 video buses and HDMI/DVI receive logic implemented in soft IP. Embedded multipliers accelerate 2D FIR filters and motion-compensation algorithms. The 484-FBGA package supports the high pin count needed for 24/30-bit parallel video.
Recommended
Wireline Telecommunications
The EP3C16F484C6N serves wireline telecom equipment including T1/E1 aggregation, framer/mapper devices, and protocol conversion cards. Its 4 PLLs generate multiple clock domains required for PDH/SDH line rates, while LVDS I/O banks directly interface to line transceivers. Embedded memory buffers payload data and the multipliers support Reed-Solomon or CRC error correction. The commercial temperature grade suits central-office controlled environments.
Recommended
Embedded DSP and Signal Processing
The EP3C16F484C6N implements embedded DSP functions including FIR/IIR filters, FFT engines, and modulation/demodulation for software-defined radio and instrumentation. The 56 embedded 18x18 multipliers deliver up to 168 GMACS at typical pipeline rates, while 504 Kbits RAM stores coefficient tables and sample buffers. Designers use Altera DSP Builder or HDL with the Quartus design flow. PLLs synthesize the multiple sample clocks required for mixed-rate signal chains.
Recommended
Automotive Driver Assistance
The EP3C16F484C6N, with its industrial temperature variants, supports automotive ADAS subsystems including rear-view camera processing, sensor fusion preprocessing, and CAN/LIN gateway functions. The 346 I/O connect to multiple CMOS image sensors, radar front-ends, and automotive networking transceivers. Embedded multipliers accelerate computer-vision kernels like Sobel edge detection and Hough transforms. Designers pair this FPGA with external SRAM for frame buffering.
Recommended
Test and Measurement Instrumentation
The EP3C16F484C6N is well-suited for bench-top test instruments including logic analyzers, pattern generators, and protocol analyzers. The 346 user I/O pins accept high-speed digital probes while the LVDS capability supports sub-nanosecond timing resolution. Embedded memory stores captured waveforms, and the 56 multipliers implement digital filters for noise reduction on acquired data. The 484-FBGA package supports dense PCB layouts needed for multi-channel instruments.
Recommended
Recommended Products Summary
Engineering reference data for EP3C16F484C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C16F484C6 | EP3C16F484C7N | EP3C16F484C8N | EP3C16F484I7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 |
| Speed Grade | C6 (fastest) | C6 | C7 | C8 | I7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| User I/O | 346 | 346 | 346 | 346 | 346 |
| Embedded Memory | 504 Kbits | 504 Kbits | 504 Kbits | 504 Kbits | 504 Kbits |
| Embedded Multipliers | 56 (18x18) | 56 | 56 | 56 | 56 |
Key Differentiators
- Fastest C6 speed grade in same package (vs EP3C16F484C7N)
- Commercial temperature grade optimized for cost (vs EP3C16F484I7N)
- Lowest-power 65nm Cyclone III generation (vs EP2S90F1020C5N (Stratix II))
Design Notes
The EP3C16F484C6N 484-ball FBGA uses 1.0mm ball pitch, which requires 4-layer PCB minimum with microvia or via-in-pad technology for reliable assembly. Per the Cyclone III Handbook, place at least 8 decoupling capacitors (0.1uF, 0.01uF, and bulk 10-100uF) per supply pin group. All four PLL analog supply pins (VCC_PLL) require isolated ferrite-bead filtered power from the digital core supply to minimize jitter.
Estimated: at typical Cyclone III utilization around 60 percent logic and 200 MHz internal clock, the EP3C16F484C6N core power dissipation is approximately 1.5-2W. The 484-FBGA package thermal resistance theta_JA is around 12 C/W with 4-layer JEDEC PCB, giving a junction temperature rise of roughly 24C above ambient at 2W. No heatsink required for commercial temperature range designs, but ensure adequate airflow for enclosed industrial chassis.
Critical configuration-mode pitfalls: MSEL pins must be tied to specific logic levels matching the desired configuration scheme (AS, PS, FPP, JTAG). The nCONFIG pin must be held low during power-up ramp and released only after all supplies reach nominal voltage. The CONF_DONE pin should be monitored to detect successful configuration. Common pitfalls include leaving MSEL floating, omitting the 25 ohm series resistor on the JTAG TCK line, and failing to provide a proper POR delay sequence.
Compliance Information
RoHS and lead-free compliance indicated by N suffix per Cyclone III datasheet. AEC-Q100 not formally qualified; industrial temperature EP3C16F484I7N supports extended automotive use cases.
