EP3C25Q240C8N - 25K LE Cyclone III FPGA | Intel
MPN: EP3C25Q240C8N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $160.4667 | $160.47 |
| 10 | $160.4667 | $1,604.67 |
| 100 | $160.4667 | $16,046.67 |
| 500 | $160.4667 | $80,233.35 |
| 1,000 | $160.4667 | $160,466.70 |
EP3C25Q240C8N Overview
A field-programmable gate array, or FPGA, is an integrated circuit containing configurable logic blocks, programmable interconnects, embedded memory, and input/output resources. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacture. It therefore occupies the semiconductor hierarchy between programmable logic devices and custom digital ICs, allowing engineers to implement interfaces, control logic, signal processing, and bus functions without a fabrication run.
The principal Cyclone III resource is 24,624 logic elements for combinational and sequential digital functions. The device also integrates 608,256 memory bits, giving designers capacity for FIFOs, lookup tables, buffering, and control-state storage. With 148 I/O, the EP3C25Q240C8N supports many board-level interfaces. The 240-pin BFQFP package uses through-hole leads rather than a fine-pitch surface-mount ball grid, which can simplify inspection, prototyping, and legacy assembly processes.
Architecture and technology determine the balance between programmable density, power, and performance. The listed 65 nm process and 1.2 V core supply characterize the Cyclone III generation, while the 402 MHz specification describes a maximum reference frequency rather than a guarantee for every customer design. Actual performance depends on logic placement, routing, clock resources, I/O standards, timing constraints, and power-supply integrity. The FPGA also supports boundary-scan testing, allowing pin connections to be checked without physical probes.
Typical applications include industrial control, legacy communication equipment, test and measurement hardware, motor-control interfaces, and embedded systems requiring replaceable or updateable logic. It is particularly relevant where a 240-pin through-hole FPGA is already designed in, such as an upgrade or lifecycle-support board. Engineers can use it to consolidate board functions, implement a custom peripheral, or reproduce obsolete interface behavior.
Design planning should begin with the target package, configured I/O count, required speed grade, available configuration interface, and supported power rails. Verify every pin, bank voltage, configuration mode, and timing constraint against the manufacturer documentation before schematic release. For production, assess configuration storage, JTAG access, decoupling, thermal behavior, and the availability of compatible design software and bitstream generation tools.
This product data combines the supplied manufacturer and distributor specifications, package constraints, verified commercial references, and a conservative cross-reference assessment. Because no verified pin-compatible drop-in alternative was identified, the replacement list is intentionally limited rather than padded with footprint-changing devices.
Drop-in alternatives for EP3C25Q240C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C25Q240C8N (same form factor and footprint) β differing in Package, Speed Grade, Maximum User I/O, Process Node, Logic Elements.
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No drop-in alternatives available for this product.
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| Product Type | Field Programmable Gate Array (FPGA) |
| Series | Cyclone III |
| Logic Elements | 24,624 |
| Total RAM Bits | 608,256 bits |
| Number of I/O | 148 |
| Maximum Frequency | 402 MHz |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm |
| Package | 240-BFQFP |
| Pin Count | 240 pins |
| Mounting Style | Through Hole |
| Speed Grade | C8 |
| Boundary-Scan Support | Supported |
| RoHS Compliance | unknown |
| REACH Compliance | unknown |
| AEC-Q100 Qualification | not_applicable |
EP3C25Q240C8N 240-bfqfp Pin Configuration Guide
Pin configuration for EP3C25Q240C8N (240-bfqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C25Q240C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C25Q240C8N is suitable for 6 applications: Industrial Control, Legacy Communication Equipment, Test and Measurement Hardware, Motor-Control Interface, Embedded System Peripherals, Legacy Board Repair and Lifecycle Support.
Industrial Control
EP3C25Q240C8N fits industrial-control systems that need configurable timing, state machines, and multiple board-level interfaces. The device provides 24,624 logic elements and 608,256 memory bits, while 148 I/O support communication with sensors, actuators, converters, and supervisory controllers. Its 1.2 V core supply and 65 nm Cyclone III architecture are useful for legacy designs that already depend on this FPGA family. The 240-pin BFQFP package is especially valuable for through-hole assembly, inspection, and replacement workflows. Use the FPGA for deterministic control, protocol conversion, pulse generation, or machine sequencing. Before release, verify temperature grade, I/O-bank voltages, clock distribution, timing constraints, and industrial reliability requirements in the manufacturer documentation.
Recommended
Legacy Communication Equipment
EP3C25Q240C8N is well suited to maintaining legacy communication equipment where a 240-pin Cyclone III FPGA is already installed. Its 24,624 logic elements can implement framing, protocol handling, channel coding, timing recovery support, and supervisory functions, while 608,256 memory bits can hold FIFOs and buffer data. The 148 I/O provide capacity for parallel buses and mixed-speed interfaces. The BFQFP package supports through-hole insertion and can simplify board repair compared with fine-pitch BGA replacement. System engineers should preserve the original configuration method, clock constraints, I/O assignments, and timing budget. Validate any replacement at the board level because the supplied cross-reference results do not identify a verified drop-in part.
Recommended
Test and Measurement Hardware
EP3C25Q240C8N can support configurable acquisition, triggering, sequencing, and data-routing functions in test and measurement hardware. The 24,624 logic elements allow implementation of counters, timing detectors, stimulus generators, and protocol monitors. The 608,256 memory bits are useful for capture buffers, circular FIFOs, and small waveform or event records. With 148 I/O, the FPGA can connect to parallel data converters, control ports, and test fixtures. The 402 MHz maximum-frequency reference provides a useful starting point, but actual performance depends on logic structure, placement, routing, and clock resources. The device's boundary-scan support also helps verify connections during manufacturing. Confirm pin assignments, I/O standards, timing closure, and configuration-file generation before production.
Recommended
Motor-Control Interface
EP3C25Q240C8N is a practical fit for motor-control interface logic, including encoder capture, PWM generation, protection sequencing, and command translation. Its 24,624 logic elements provide capacity for synchronized control functions, while 148 I/O allow connection to gate drivers, position sensors, analog-to-digital converters, and supervisory circuits. Embedded memory can implement command queues, timing tables, and diagnostic capture. The 1.2 V core supply supports a low-voltage digital core, but the complete power and I/O-bank requirements must be confirmed. The 240-pin BFQFP package is useful for legacy through-hole control boards and accessible assembly. For safe operation, validate isolation boundaries, fault behavior, switching timing, thermal conditions, and software-generated constraints rather than relying on the 402 MHz reference as a system-level guarantee.
Recommended
Embedded System Peripherals
EP3C25Q240C8N can act as a configurable peripheral and interface bridge in embedded systems. Its 24,624 logic elements support register interfaces, data packing, protocol conversion, DMA assistance, and custom control logic. The 608,256 memory bits provide enough capacity for small FIFOs and local buffers, while 148 I/O allow connection to processors, memory devices, sensors, and external buses. The 65 nm Cyclone III technology and 1.2 V core supply are appropriate for designs already standardized on this generation. Use the FPGA when software alone cannot meet latency or timing requirements, or when several fixed functions need to be consolidated. Verify configuration storage, JTAG access, reset behavior, clock domains, and I/O voltage compatibility before integrating it into a new embedded platform.
Recommended
Legacy Board Repair and Lifecycle Support
EP3C25Q240C8N is most directly valuable in legacy board repair and lifecycle-support programs that require a 240-pin BFQFP footprint. The device combines 24,624 logic elements, 608,256 memory bits, and 148 I/O in the original package form factor, making it suitable for maintaining equipment whose firmware, interface logic, or production test patterns are already defined. The through-hole BFQFP construction can aid visual inspection and rework. Maintain the original configuration file only after verifying that the replacement device is the same speed grade, package, voltage, and pinout. The supplied web results do not verify a true drop-in substitute, so redesign-level options should be treated separately from replacement options. Confirm authenticity, date code, stock, and assembly compatibility before procurement.
Recommended
Recommended Products Summary
Engineering reference data for EP3C25Q240C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | Intel/Altera |
| Package | 240-BFQFP |
| Logic Elements | 24,624 |
| RAM Bits | 608,256 bits |
| Number of I/O | 148 |
| Maximum Frequency | 402 MHz |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm |
Key Differentiators
- Through-hole 240-pin package for legacy assembly (vs EP3C25F324C7N)
- Balanced Cyclone III logic and memory resources (vs EP3C25E144C8)
- Established Cyclone III design environment (vs EP3C25E144C8)
Design Notes
Use the Cyclone III datasheet to define the complete power tree before layout. The verified data specifies a 1.2 V core supply, but it does not provide all rail voltages, current limits, or sequencing requirements. Place local ceramic decoupling at the FPGA supply pins, maintain a low-impedance ground return, and verify regulator transient response under simultaneous clock, configuration, and I/O activity. Keep noisy digital paths away from sensitive analog circuitry, and do not assume that a 402 MHz maximum-frequency reference represents total device power or guaranteed system performance.
Plan the 240-pin BFQFP land pattern directly from the manufacturer package drawing. Preserve escape routing for the complete pinout, power and ground pins, clock inputs, configuration interface, and JTAG signals. Use short, wide connections for power and ground where possible, and provide accessible test points for supply, reset, clock, and configuration monitoring. The supplied data identifies the package but does not expose the numbered pin table, so do not infer pin assignments from the ordering code. Compare the final symbol, schematic, and PCB footprint against the Cyclone III documentation before release.
The 148 available I/O make the device useful for parallel buses, but I/O timing and signal integrity depend on the selected I/O standard, drive strength, termination, loading, and clock topology. Identify the target frequency of every high-speed interface and constrain it during synthesis and place-and-route. Route clocks and critical differential or source-synchronous signals first, maintain reference-plane continuity, and avoid long uncontrolled stubs. Validate the design with post-route timing, board-level simulation where needed, and oscilloscope measurements on prototypes.
A package similarity or family-level alternative is not a safe drop-in replacement. The supplied comparison data shows that EP3C25E144C8 uses a 144-pin package and EP3C25F324C7N uses a 324-pin FBGA package, while the target uses 240 pins. Before any migration, verify package pin count, pin numbering, power rails, I/O-bank compatibility, configuration mode, JTAG behavior, thermal design, and software support. Regenerate timing constraints and programming files, and perform board-level functional and boundary-scan testing before production approval.
Compliance Information
The supplied web data does not provide verified RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements for EP3C25Q240C8N. The part is an FPGA; no AEC-Q100 qualification is stated in the supplied data.
