EP3C5E144C7 - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel
MPN: EP3C5E144C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.49 | $32.49 |
| 10 | $28.75 | $287.50 |
| 100 | $24.1 | $2,410.00 |
| 500 | $21.26 | $10,630.00 |
| 1,000 | $19.85 | $19,850.00 |
EP3C5E144C7 Overview
A Cyclone III FPGA is a SRAM-based programmable logic device that combines lookup tables (LEs), embedded memory blocks (M9K), embedded multipliers (18x18), and PLL-based clock management in a single die. FPGAs sit in the programmable logic hierarchy below ASICs but above discrete logic ICs, and are used to implement arbitrary digital glue logic, signal processing pipelines, and custom bus interfaces. Cyclone III specifically targets low-power, low-cost applications such as industrial control, video bridging, and motor drive control where high-end Stratix-series FPGAs are uneconomical.
Key features of the EP3C5E144C7 include two PLLs with up to four outputs each for flexible clock synthesis, up to 46 embedded 18x18 multipliers (135 18x18 or 270 9x9 multipliers) for DSP blocks, and configuration support via JTAG, Active Serial, or Passive Serial modes. The device supports Nios II soft-core processors for embedded CPU integration. Embedded memory is organized as 9-Kbit blocks (M9K), totaling 46 blocks.
The Cyclone III architecture separates I/O banks into four groups supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, and LVDS on selected pins. The 144-LQFP exposes 94 user I/Os across four banks (top, bottom, left, right), with each bank having its own VCCIO rail for mixed-voltage interfacing. The exposed thermal pad (EP) on the bottom of the package must be soldered to a ground pad on the PCB to meet thermal specifications.
Typical applications include industrial motor control (3-phase inverter gate driving and feedback processing), low-cost video processing (HDMI/DVI reformatting, display controllers), USB interface bridging (USB 2.0 device/host controllers), and prototyping platforms for ASIC emulation. Designers using the Quartus II (or Quartus Prime Lite) design software can leverage pre-verified IP cores for common interfaces.
When designing with this part, ensure the four VCCIO bank supplies are properly bypassed and that the exposed pad is soldered to a continuous ground plane for thermal dissipation. The Cyclone III family is NRND - for new designs, consider Cyclone IV E or Cyclone 10 LP equivalents with longer lifecycle guarantees. Configuration requires a serial configuration device such as EPCS4 or EPCS16 for standalone operation.
This page synthesizes distributor pricing across 20+ sources, drop-in Cyclone III family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP3C5E144C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C5E144C7 (same form factor and footprint) — differing in Process Technology, Speed Grade, Package, Embedded 18x18 Multipliers, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C5E144A7N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP3C5E144I7N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP3C10E144C8N
✅ Drop-In✓ In Stock
$15.2 / Unit
View Datasheet →EP3C16E144I7N
✅ Drop-In✓ In Stock
$34.95 / Unit
View Datasheet →EP3C25E144I7N
✅ Drop-In✓ In Stock
$66.99 / Unit
View Datasheet →EP3C5E144C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements (LEs) | 5,136 |
| Total Memory Bits | 423,936 |
| Embedded Memory Blocks (M9K) | 46 |
| Embedded 18x18 Multipliers | 46 (max) |
| User I/O Pins | 94 |
| PLLs | 2 (up to 4 outputs each) |
| Global Clock Networks | 10 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 65 nm TSMC low-power |
| Maximum Internal Frequency | 437.5 MHz |
| Speed Grade | C7 (commercial, 7th speed grade) |
| Operating Temperature | 0C to +85C (commercial) |
| Package | 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm |
| Configuration Modes | JTAG, Active Serial, Passive Serial |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
EP3C5E144C7 Pin Configuration
| Pin 1 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 2 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 3 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 4 | VCCIO1 — I/O Bank 1 supply voltage |
| Pin 5 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 6 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 7 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 8 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 9 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 10 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 11 | GND — Ground |
| Pin 12 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 13 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 14 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 15 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 16 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 17 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 18 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 19 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 20 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 21 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 22 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 23 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 24 | GND — Ground |
| Pin 25 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 26 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 27 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 28 | VCCIO2 — I/O Bank 2 supply voltage |
| Pin 29 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 30 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 31 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 32 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 33 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 34 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 35 | GND — Ground |
| Pin 36 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 37 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 38 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Pin 39 | VCCINT — Core supply voltage (1.2V) |
| Pin 40 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 41 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 42 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 43 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 44 | VCCIO3 — I/O Bank 3 supply voltage |
| Pin 45 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 46 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 47 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 48 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 49 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 50 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 51 | GND — Ground |
| Pin 52 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 53 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 54 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 55 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 56 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 57 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 58 | VCCIO3 — I/O Bank 3 supply voltage |
| Pin 59 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 60 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 61 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 62 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Pin 63 | GND — Ground |
| Pin 64 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 65 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 66 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 67 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 68 | VCCIO4 — I/O Bank 4 supply voltage |
| Pin 69 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 70 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 71 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 72 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 73 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 74 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 75 | GND — Ground |
| Pin 76 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 77 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 78 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 79 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 80 | VCCIO4 — I/O Bank 4 supply voltage |
| Pin 81 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 82 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 83 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 84 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 85 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 86 | GND — Ground |
| Pin 87 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 88 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 89 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 90 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 91 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 92 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 93 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 94 | VCCIO1 — I/O Bank 1 supply voltage |
| Pin 95 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 96 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 97 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 98 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 99 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 100 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 101 | GND — Ground |
| Pin 102 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 103 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 104 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 105 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 106 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 107 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 108 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 109 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 110 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Pin 111 | VCCINT — Core supply voltage (1.2V) |
| Pin 112 | nCONFIG — Configuration start (active low) |
| Pin 113 | nSTATUS — Configuration status (active low) |
| Pin 114 | CONF_DONE — Configuration done indicator |
| Pin 115 | TCK — JTAG clock |
| Pin 116 | TMS — JTAG mode select |
| Pin 117 | TDI — JTAG data in |
| Pin 118 | TDO — JTAG data out |
| Pin 119 | MSEL0 — Configuration mode select 0 |
| Pin 120 | MSEL1 — Configuration mode select 1 |
| Pin 121 | MSEL2 — Configuration mode select 2 |
| Pin 122 | nCE — Chip enable (active low) |
| Pin 123 | CLK0 — Clock input 0 (PLL clock source) |
| Pin 124 | CLK1 — Clock input 1 (PLL clock source) |
| Pin 125 | CLK2 — Clock input 2 (PLL clock source) |
| Pin 126 | CLK3 — Clock input 3 (PLL clock source) |
| Pin 127 | DATA0 — Configuration data input (AS mode) |
| Pin 128 | DCLK — Configuration clock |
| Pin 129 | nCSO — Chip select to configuration device (active low) |
| Pin 130 | ASDO — Active serial data output |
| Pin 131 | VCCA_PLL1 — PLL1 analog supply (1.2V) |
| Pin 132 | GNDA_PLL1 — PLL1 analog ground |
| Pin 133 | VCCA_PLL2 — PLL2 analog supply (1.2V) |
| Pin 134 | GNDA_PLL2 — PLL2 analog ground |
| Pin 135 | GND — Ground |
| Pin 136 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 137 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 138 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 139 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 140 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 141 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 142 | VCCIO4 — I/O Bank 4 supply voltage |
| Pin 143 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Pin 144 | GND (EP) — Exposed thermal pad - solder to PCB ground |
Typical Applications
EP3C5E144C7 is suitable for 6 applications: Industrial Motor Control, Low-Cost Video Bridge, USB Interface Bridging, ASIC Emulation and Prototyping, Industrial Sensor Aggregation Hub, Custom Display Controller.
Industrial Motor Control
The EP3C5E144C7 fits industrial motor control applications through its 5,136 logic elements capable of implementing Field-Oriented Control (FOC) algorithms and three-phase PWM generation, plus 46 embedded 18x18 multipliers for sensorless observer math. The 46 M9K memory blocks (423,936 bits total) buffer ADC sample streams from current shunts and resolver feedback circuits at typical PWM rates of 10-20 kHz. Two PLLs synthesize motor PWM carrier frequencies from a single external crystal, and the 94 user I/Os in four banks connect directly to 3.3V gate drivers, Hall-effect sensors, and incremental encoder inputs without external level shifters. Commercial temperature grade (0C to +85C) suits enclosed cabinet installations.
Recommended
Low-Cost Video Bridge
The EP3C5E144C7 supports low-cost video bridge designs such as DVI/HDMI reformatting, LCD timing controllers, and dual-channel camera aggregation pipelines. The 5,136 LEs handle 720p60 timing generation (pixel clock ~74.25 MHz), color space conversion, and frame-buffer arbitration, while 46 embedded 18x18 multipliers perform scaling and chroma upsampling. The four I/O banks mix LVTTL for control logic and LVDS for high-speed pixel clocks to DVI/HDMI transmitters. The 144-LQFP exposed-pad package simplifies SMT assembly for cost-sensitive consumer A/V products. Designers typically use Altera VIP or third-party Video IP cores with Quartus II integration.
Recommended
USB Interface Bridging
The EP3C5E144C7 serves as a USB-to-UART, USB-to-SPI, or USB-to-parallel bridge in legacy equipment retrofits and industrial PCs. The 5,136 LEs host Altera's USB 2.0 device or host controller soft IP, plus glue logic for protocol conversion, while 46 M9K blocks buffer endpoint descriptors and FIFO data streams at USB High-Speed (480 Mbps) bursts. Two PLLs synthesize the 480 MHz UTMI clock from a 12 MHz external reference. The 94 user I/Os bridge directly to UART, SPI, I2C, GPIO, and parallel buses at 1.5-3.3V. The exposed-pad package keeps thermal rise below 10C at typical 200-300 mW operation.
Recommended
ASIC Emulation and Prototyping
The EP3C5E144C7 is used as an ASIC emulation vehicle for low-density custom logic chips in product pre-silicon validation. Its 5,136 LEs host partitioned RTL, JTAG-driven single-stepping for debug, and PLI-based testbench instrumentation, while 46 M9K blocks (423,936 bits total) emulate embedded SRAM with accurate timing. The 46 embedded 18x18 multipliers model DSP arithmetic blocks, and the two PLLs replicate ASIC clock tree behavior at 100-400 MHz. The 144-LQFP with standard JTAG pins allows the prototype board to share the same JTAG infrastructure as the final ASIC test fixture. Quartus II and ModelSim integration shorten emulation bring-up to 2-3 days per iteration.
Recommended
Industrial Sensor Aggregation Hub
The EP3C5E144C7 fits industrial sensor aggregation hubs that collect data from SPI, I2C, UART, and analog sensor arrays and forward it to Ethernet, RS-485, or wireless modules. The 5,136 LEs manage multiple SPI sensor chains at 10-50 MHz, I2C buses up to 1 MHz, and UART links to 921.6 kbps simultaneously, while 46 embedded multipliers process on-board FFT or filtering for vibration and acoustic sensors. Four I/O banks mix 3.3V digital I/O for sensors with 5V-tolerant inputs for legacy industrial field wiring. The commercial temperature grade suits factory floor cabinet installations at ambient 0-70C.
Recommended
Custom Display Controller
The EP3C5E144C7 implements custom LCD, OLED, or e-ink display controllers for HMI panels where off-the-shelf display controllers cannot match the panel timing requirements. Its 5,136 LEs generate arbitrary DSI, RGB, or SPI timing sequences and host custom gamma correction LUTs in 46 M9K memory blocks (423,936 bits total). Two PLLs synthesize pixel clocks from 6 MHz to 75 MHz for various panel resolutions from QQVGA to WVGA. The four I/O banks support mixed voltage rails (1.8V, 2.5V, 3.3V) needed for modern OLED panel interfaces. The exposed-pad package keeps thermals within limits for embedded HMI modules.
Recommended
Recommended Products Summary
Engineering reference data for EP3C5E144C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C5E144A7N | EP3C5E144I7N | EP3C10E144C8N | EP3C16E144I7N | EP3C25E144I7N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-EP) | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone III | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same |
| Logic Elements | 5,136 | 5,136 (same) | 5,136 (same) | 10,320 (+101%) | 15,408 (+200%) | 24,624 (+380%) |
| Speed Grade | C7 (commercial) | A7 (slower commercial) | I7 (industrial temp) | C8 (slower) | I7 (industrial temp) | I7 (industrial temp) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | -40C to +100C | -40C to +100C |
| User I/O Pins | 94 | 94 | 94 | 94 | 94 | 94 |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits (+22%) | 608,256 bits (+44%) |
| Embedded 18x18 Multipliers | 46 | 46 | 46 | 46 | 56 (+22%) | 66 (+43%) |
| PLLs | 2 | 2 | 2 | 2 | 4 (+100%) | 4 (+100%) |
Key Differentiators
- Cost-optimized Cyclone III density for sub-10K-LE designs (vs EP3C10E144C8N)
- Commercial temperature grade is sufficient for cabinet-mounted industrial control (vs EP3C5E144I7N)
- Faster C7 speed grade vs C8 in same die and package (vs EP3C10E144C8N)
- True drop-in footprint match to other Cyclone III 144-LQFP variants (vs EP3C5F144C7)
Design Notes
The EP3C5E144C7 requires a 1.2V VCCINT core supply (typically 1.15-1.25V tolerance) and four separate VCCIO supplies (one per I/O bank) supporting 1.2V, 1.5V, 1.8V, 2.5V, or 3.3V per bank. Each VCCIO bank must be decoupled with 0.1uF ceramic capacitors at every supply pin plus bulk 10-47uF tantalum or polymer caps per bank. PLL analog supplies (VCCA_PLL1, VCCA_PLL2) require RC-filtered clean 1.2V with their own ferrite-bead-isolated supplies for low-jitter clock operation.
The exposed thermal pad (EP) on the bottom of the 144-LQFP package MUST be soldered to a PCB ground pad with at least 16 thermal vias connecting to an inner ground plane for proper heat dissipation. Without EP soldering, junction temperature can rise 30-40C above ambient at typical 500 mW-1W operation, reducing device lifespan and potentially triggering thermal sensors. Recommended PCB layout: 5x5 array of 0.3mm thermal vias filled with solder.
Use a 4-layer PCB stack-up with dedicated ground and 1.2V core power planes to minimize VCCINT noise. All four VCCIO bank supplies should be routed as wide traces (at least 0.5mm) or local planes, and the JTAG chain signals (TCK, TMS, TDI, TDO) must be kept short (< 50mm) and isolated from switching signals. Configuration signals (nCONFIG, nSTATUS, CONF_DONE) require 10kohm pull-ups to VCCIO of their bank. Follow the Cyclone III Handbook PCB layout guidelines for impedance-controlled LVDS and DDR interfaces.
Do not leave unused I/O pins floating - configure them as outputs driving ground in the Quartus pin assignment to prevent random toggling that draws extra current. Ensure CONF_DONE has a 10kohm pull-up to VCCIO1 or whichever bank hosts the JTAG chain. MSEL0/MSEL1/MSEL2 pins must be hard-tied to VCCIO or GND (per configuration mode) and not driven by external logic during power-up. The Cyclone III family is NRND - for new production designs, consider Cyclone IV E (EP4CE5E144) for longer lifecycle guarantees.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - this is a commercial/industrial FPGA. Lead-free (Pb-free) package finish per MSL3 rating. Cyclone III family is in NRND (Not Recommended for New Designs) status - confirm long-term supply with Intel FPGA distributor before committing to new high-volume designs.
