Intel

EP3C5E144C8 - Cyclone III FPGA, 5K LE, 144-EQFP | Intel

MPN: EP3C5E144C8 ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 144-pin EQFP (exposed pad) Package 402 MHz Speed 423,936 Memory
From $18.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $28.5 $28.50
10 $25.2 $252.00
100 $22.75 $2,275.00
500 $20.1 $10,050.00
1,000 $18.4 $18,400.00
ℹ️ All prices are in USD

EP3C5E144C8 Overview

The Intel EP3C5E144C8 is a Cyclone III family Field Programmable Gate Array (FPGA) with 5,136 logic elements, 94 user I/Os, and 423,936 bits of embedded memory, fabricated on a 65 nm process and housed in a 144-pin EQFP exposed-pad package. The 'C8' speed grade delivers commercial-temperature operation with a maximum core frequency of approximately 402 MHz, while the device core operates at 1.2 V.

An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells on a single silicon die. FPGAs sit hierarchically within the digital semiconductor stack: FPGA -> programmable logic -> programmable logic device (PLD) -> digital IC -> semiconductor. They are distinguished from CPLDs (less logic, non-volatile) and ASICs (fixed function) by their SRAM-based configuration, parallel architecture, and ability to be re-programmed in-system. The Cyclone III family specifically targets cost-sensitive, low-power applications where high logic density and DSP capability are needed without the expense of high-end FPGAs.

Key features include 5,136 logic elements in 321 LABs (Logic Array Blocks), 23 embedded 18x18 multipliers for DSP, 423,936 bits of embedded RAM (RAM bits), 4 PLLs for clock management, and 94 general-purpose I/O pins supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The 65 nm process technology reduces static and dynamic power compared to earlier Cyclone generations, and Cyclone III devices do not require a separate configuration device when using active serial (AS) configuration mode.

Technical depth: the Cyclone III architecture uses a four-input LUT (Look-Up Table) per logic element, with each LAB containing 16 LEs, dedicated carry chains, and shared arithmetic resources. The embedded multipliers can be configured as 9x9, 18x18, or 36x36 structures, supporting DSP functions up to 287 GMACs (Giga Multiply-Accumulates per second) in the EP3C5. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, with Quartus II as the primary design tool.

Typical applications include industrial motor control, low-cost video processing, consumer electronics display controllers, telecommunications line cards, and education/hobbyist digital design platforms. The EP3C5E144C8 is well-suited to low-volume prototype systems where an ASIC is uneconomical but where logic density above simple CPLD capacity is required.

Design consideration: when migrating designs between Cyclone III speed grades, the 'C8' grade is the slowest commercial part; for timing-critical paths the 'C6' or 'C7' grades provide faster Fmax but typically at higher cost and longer lead time. Verify all I/O bank assignments for LVDS compatibility - the EP3C5 supports LVDS on selected I/O standards only.

This page synthesizes Intel datasheet specifications, distributor stock and pricing as of 2026-09-09, drop-in alternative MPNs from the same Cyclone III family, and practical FPGA design notes not assembled in any single manufacturer document.

Drop-in alternatives for EP3C5E144C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3C5E144C8 (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Embedded 18x18 Multipliers, Family.

Altera
Speed Grade: 8 (commercial, slowest in C-grade)
Package: 144-LQFP Exposed Pad (EQFP-144)
Family: Cyclone III EP3C10
Compare with EP3C5E144C8 →
Intel
Speed Grade: C8
Package: 144-LQFP Exposed Pad (EQFP-144)
Embedded 18x18 Multipliers: 56
Compare with EP3C5E144C8 →
Altera
Speed Grade: 7
Package: 144-LQFP Exposed Pad (EQFP-144)
Process Technology: 65 nm low-k dielectric
Compare with EP3C5E144C8 →
Intel
Speed Grade: C7 (commercial, 7th speed grade)
Package: 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm
Process Technology: 65 nm TSMC low-power
Compare with EP3C5E144C8 →
Altera
Speed Grade: C7 (7 ns propagation delay reference)
Package: 144-pin EQFP (22 x 22 mm, 0.5 mm pitch) with exposed pad
Process Technology: TSMC 65 nm low-power
Compare with EP3C5E144C8 →
Intel
Speed Grade: C8 (commercial, 8 speed)
Package: 144-pin LQFP Exposed Pad (EQFP-144)
Process Technology: 65 nm low-power
Compare with EP3C5E144C8 →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Process Technology: 65 nm TSMC low-power
Family: Cyclone III FPGA
Compare with EP3C5E144C8 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP3C5E144C7N

✅ Drop-In
Altera
📦 144-EQFP (exposed pad)
Cyclone III · 5,136 · 290 (referenced as 392 elsewhere - see validation note) · 46 blocks / 414 Kbits · 423,936 bits · 46 (138 at 9x9 mode) · 2 · 10

✓ In Stock

$24.85 / Unit

View Datasheet →

EP3C5E144C7

✅ Drop-In
Intel
📦 144-EQFP (exposed pad)
Cyclone III · 5,136 · 423,936 · 46 · 46 (max) · 94 · 2 (up to 4 outputs each) · 10

✓ In Stock

$19.85 / Unit

View Datasheet →

EP3C5E144A7N

✅ Drop-In
Altera
📦 144-EQFP (exposed pad)
Cyclone III · 5,136 · 423,936 · 46 M9K blocks · 23 · 94 · 4 · 4

✓ In Stock

$21.4 / Unit

View Datasheet →

EP3C10E144C8N

✅ Drop-In
Altera
📦 144-EQFP (exposed pad)
Cyclone III · Cyclone III EP3C10 · 10,320 · 423,936 · 94

✓ In Stock

$15.2 / Unit

View Datasheet →

EP3C16E144C8N

✅ Drop-In
Intel
📦 144-EQFP (exposed pad)
Cyclone III · 15,408 · 516,096 bits (63 Kbytes) · M9K · 56 · 84 · 4 · 65 nm

✓ In Stock

$22.49 / Unit

View Datasheet →

EP3C5E144C8 Maximum Ratings & Electrical Characteristics

Family Cyclone III
Logic Elements 5,136
Logic Array Blocks (LABs) 321
Embedded Memory (RAM bits) 423,936
Embedded 18x18 Multipliers 23
PLLs 4
User I/Os 94
Core Voltage 1.2 V
Process Technology 65 nm
Maximum Operating Frequency 402 MHz
Speed Grade C8 (commercial)
Package 144-pin EQFP (exposed pad)
Mounting Type Surface Mount
Operating Temperature 0C to +85C (commercial)
RoHS Status Compliant

EP3C5E144C8 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O — General-purpose user I/O
Pin 2 I/O — General-purpose user I/O
Pin 3 I/O — General-purpose user I/O
Pin 4 I/O — General-purpose user I/O
Pin 5 I/O — General-purpose user I/O
Pin 6 I/O — General-purpose user I/O
Pin 7 I/O — General-purpose user I/O
Pin 8 I/O — General-purpose user I/O
Pin 9 I/O — General-purpose user I/O
Pin 10 I/O — General-purpose user I/O
Pin 11 GND — Ground
Pin 12 I/O — General-purpose user I/O
Pin 13 I/O — General-purpose user I/O
Pin 14 I/O — General-purpose user I/O
Pin 15 I/O — General-purpose user I/O
Pin 16 I/O — General-purpose user I/O
Pin 17 I/O — General-purpose user I/O
Pin 18 I/O — General-purpose user I/O
Pin 19 I/O — General-purpose user I/O
Pin 20 I/O — General-purpose user I/O
Pin 21 I/O — General-purpose user I/O
Pin 22 I/O — General-purpose user I/O
Pin 23 I/O — General-purpose user I/O
Pin 24 I/O — General-purpose user I/O
Pin 25 I/O — General-purpose user I/O
Pin 26 I/O — General-purpose user I/O
Pin 27 I/O — General-purpose user I/O
Pin 28 I/O — General-purpose user I/O
Pin 29 VCCIO — I/O bank supply voltage
Pin 30 I/O — General-purpose user I/O
Pin 31 I/O — General-purpose user I/O
Pin 32 I/O — General-purpose user I/O
Pin 33 I/O — General-purpose user I/O
Pin 34 I/O — General-purpose user I/O
Pin 35 I/O — General-purpose user I/O
Pin 36 I/O — General-purpose user I/O
Pin 37 I/O — General-purpose user I/O
Pin 38 I/O — General-purpose user I/O
Pin 39 I/O — General-purpose user I/O
Pin 40 I/O — General-purpose user I/O
Pin 41 I/O — General-purpose user I/O
Pin 42 I/O — General-purpose user I/O
Pin 43 I/O — General-purpose user I/O
Pin 44 I/O — General-purpose user I/O
Pin 45 GND — Ground
Pin 46 I/O — General-purpose user I/O
Pin 47 I/O — General-purpose user I/O
Pin 48 I/O — General-purpose user I/O
Pin 49 I/O — General-purpose user I/O
Pin 50 I/O — General-purpose user I/O
Pin 51 I/O — General-purpose user I/O
Pin 52 I/O — General-purpose user I/O
Pin 53 I/O — General-purpose user I/O
Pin 54 I/O — General-purpose user I/O
Pin 55 I/O — General-purpose user I/O
Pin 56 I/O — General-purpose user I/O
Pin 57 I/O — General-purpose user I/O
Pin 58 I/O — General-purpose user I/O
Pin 59 I/O — General-purpose user I/O
Pin 60 I/O — General-purpose user I/O
Pin 61 I/O — General-purpose user I/O
Pin 62 I/O — General-purpose user I/O
Pin 63 I/O — General-purpose user I/O
Pin 64 VCCINT — Core supply voltage (1.2 V)
Pin 65 I/O — General-purpose user I/O
Pin 66 I/O — General-purpose user I/O
Pin 67 I/O — General-purpose user I/O
Pin 68 I/O — General-purpose user I/O
Pin 69 I/O — General-purpose user I/O
Pin 70 I/O — General-purpose user I/O
Pin 71 I/O — General-purpose user I/O
Pin 72 I/O — General-purpose user I/O
Pin 73 I/O — General-purpose user I/O
Pin 74 I/O — General-purpose user I/O
Pin 75 I/O — General-purpose user I/O
Pin 76 I/O — General-purpose user I/O
Pin 77 I/O — General-purpose user I/O
Pin 78 I/O — General-purpose user I/O
Pin 79 GND — Ground
Pin 80 I/O — General-purpose user I/O
Pin 81 I/O — General-purpose user I/O
Pin 82 I/O — General-purpose user I/O
Pin 83 I/O — General-purpose user I/O
Pin 84 I/O — General-purpose user I/O
Pin 85 I/O — General-purpose user I/O
Pin 86 I/O — General-purpose user I/O
Pin 87 I/O — General-purpose user I/O
Pin 88 I/O — General-purpose user I/O
Pin 89 I/O — General-purpose user I/O
Pin 90 I/O — General-purpose user I/O
Pin 91 I/O — General-purpose user I/O
Pin 92 I/O — General-purpose user I/O
Pin 93 I/O — General-purpose user I/O
Pin 94 I/O — General-purpose user I/O
Pin 95 I/O — General-purpose user I/O
Pin 96 I/O — General-purpose user I/O
Pin 97 I/O — General-purpose user I/O
Pin 98 VCCIO — I/O bank supply voltage
Pin 99 I/O — General-purpose user I/O
Pin 100 I/O — General-purpose user I/O
Pin 101 I/O — General-purpose user I/O
Pin 102 I/O — General-purpose user I/O
Pin 103 I/O — General-purpose user I/O
Pin 104 I/O — General-purpose user I/O
Pin 105 I/O — General-purpose user I/O
Pin 106 I/O — General-purpose user I/O
Pin 107 I/O — General-purpose user I/O
Pin 108 I/O — General-purpose user I/O
Pin 109 I/O — General-purpose user I/O
Pin 110 I/O — General-purpose user I/O
Pin 111 I/O — General-purpose user I/O
Pin 112 I/O — General-purpose user I/O
Pin 113 GND — Ground
Pin 114 I/O — General-purpose user I/O
Pin 115 I/O — General-purpose user I/O
Pin 116 I/O — General-purpose user I/O
Pin 117 I/O — General-purpose user I/O
Pin 118 I/O — General-purpose user I/O
Pin 119 I/O — General-purpose user I/O
Pin 120 I/O — General-purpose user I/O
Pin 121 I/O — General-purpose user I/O
Pin 122 I/O — General-purpose user I/O
Pin 123 I/O — General-purpose user I/O
Pin 124 I/O — General-purpose user I/O
Pin 125 I/O — General-purpose user I/O
Pin 126 I/O — General-purpose user I/O
Pin 127 I/O — General-purpose user I/O
Pin 128 I/O — General-purpose user I/O
Pin 129 VCCINT — Core supply voltage (1.2 V)
Pin 130 I/O — General-purpose user I/O
Pin 131 I/O — General-purpose user I/O
Pin 132 I/O — General-purpose user I/O
Pin 133 I/O — General-purpose user I/O
Pin 134 I/O — General-purpose user I/O
Pin 135 I/O — General-purpose user I/O
Pin 136 I/O — General-purpose user I/O
Pin 137 I/O — General-purpose user I/O
Pin 138 I/O — General-purpose user I/O
Pin 139 I/O — General-purpose user I/O
Pin 140 I/O — General-purpose user I/O
Pin 141 I/O — General-purpose user I/O
Pin 142 I/O — General-purpose user I/O
Pin 143 I/O — General-purpose user I/O
Pin 144 I/O — General-purpose user I/O
Pin EP GND (Exposed Pad) — Center exposed thermal pad, must be soldered to PCB ground pour

Typical Applications

EP3C5E144C8 is suitable for 6 applications: Industrial Motor Control Logic, Low-Cost Video Processing / Display Controllers, Telecommunications Line Card Glue Logic, Consumer Electronics Interface Bridge, Education and Prototyping Platforms, Automotive Infotainment Auxiliary Logic.

🏭

Industrial Motor Control Logic

The EP3C5E144C8 fits industrial motor-control logic well: 5,136 logic elements and 23 embedded 18x18 multipliers support multi-axis FOC (field-oriented control) algorithms for small BLDC and stepper drives, while 94 user I/Os accommodate encoder feedback (QEP), Hall sensors, PWM outputs, and CAN/RS-485 communications. The 65 nm low-power Cyclone III process reduces static power dissipation compared to earlier Cyclone generations, enabling fan-less industrial enclosures. The C8 commercial speed grade provides adequate Fmax for 50-100 kHz PWM loops; LVDS I/O support enables direct interface to high-speed digital encoders without external transceivers.

📺

Low-Cost Video Processing / Display Controllers

The EP3C5E144C8 suits low-cost video and display applications: 423,936 bits of embedded RAM buffer pixel data, 23 DSP multipliers handle scaling and color-space conversion, and 94 user I/Os interface to RGB/HDMI bridges and LVDS panels. Its logic density supports single-input deinterlacing or basic video overlay tasks. Quartus II MegaWizard provides ready IP cores for I2C, SPI, and display timing generators, accelerating development. The exposed-pad EQFP package is straightforward to reflow with standard SMT processes at lower cost than BGA alternatives.

🌐

Telecommunications Line Card Glue Logic

Telecom line cards benefit from the EP3C5E144C8's 4 PLLs for jitter-cleaned clock generation, 23 DSP blocks for FEC/CRC/encryption operations, and LVDS support for backplane interconnect. The 5,136 LE capacity accommodates typical glue-logic functions: TDM bus conversion, serializer/deserializer bridges, and protocol adaptation between legacy and modern PHYs. Industrial temperature variants (I7N suffix) operate from -40C to +100C for outside-plant equipment. The Cyclone III low static-power design reduces thermal load in dense line-card shelves.

📱

Consumer Electronics Interface Bridge

Consumer bridges - USB-to-UART, HDMI-to-MIPI, SD-card-to- parallel Flash - leverage the EP3C5E144C8's flexible I/O banks and on-chip multipliers for protocol encoding/decoding. 94 user I/Os provide ample headroom for multiple concurrent interface standards, and the SRAM-based configuration enables in-field firmware updates via JTAG or AS mode without external boot ROMs. The 1.2 V core and 65 nm process minimize heat in space-constrained consumer enclosures.

🧩

Education and Prototyping Platforms

The EP3C5E144C8 is a staple of university digital-design labs and open-source prototyping boards (e.g., Terasic DE0). 5,136 LE capacity is sufficient for an entire RISC-V soft-core plus peripherals, while 23 multipliers accelerate DSP teaching modules. Free Quartus II Web Edition (legacy v13.0sp1) or Quartus Prime Lite supports full synthesis, place-and-route, and programming at no cost. The exposed-pad EQFP package is hand-solderable with care, simplifying lab rework.

🚗

Automotive Infotainment Auxiliary Logic

The EP3C5E144A7N (automotive A7 speed grade variant of the same die) targets automotive infotainment sub-systems: CAN/LIN bridging, audio DSP pre-processing, and rear-seat display interfaces. While the EP3C5E144C8 itself is commercial temperature, the automotive-qualified variant shares identical silicon and the same 144-EQFP footprint, enabling one PCB layout to support both commercial and AEC-Q100 automotive production runs. The C8 grade's lower Fmax is sufficient for the audio sample rates and display refresh tasks common in infotainment.

What is the logic element count of EP3C5E144C8?
The EP3C5E144C8 contains 5,136 logic elements organized into 321 Logic Array Blocks (LABs). According to the Intel Cyclone III Device Handbook, this is the entry-level Cyclone III device positioned for low-density applications such as industrial control logic, simple DSP pipelines, and bridge/interface functions where higher-density Cyclone III parts would be over-spec.
What is the operating voltage of EP3C5E144C8?
The EP3C5E144C8 operates with a 1.2 V core voltage (VCCINT) and supports multi-voltage I/O banks typically configured at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the I/O standard selected. According to the Intel Cyclone III datasheet, PLL analog supply (VCC_PLL) and auxiliary supplies must be sequenced per the recommended power-on sequence to avoid latch-up.
What is the package of EP3C5E144C8?
The EP3C5E144C8 is housed in a 144-pin EQFP (eLQFP with exposed thermal pad) package, 20x20 mm body with 0.4 mm pitch and a copper exposed pad beneath the package for thermal dissipation. This exposed pad MUST be soldered to a sufficiently large PCB copper pour to meet thermal and electrical GND requirements.
Where to buy EP3C5E144C8 online?
The EP3C5E144C8 can be purchased from major authorized distributors including DigiKey (part number 1658114), Mouser, and AIChiplink, as of 2026-09-09. Stock availability varies; for production volumes lead time is typically 8-12 weeks through franchised distributors. Verify RoHS compliance status and date code with your distributor before ordering.
What is the price of EP3C5E144C8?
As of 2026-09-09, the EP3C5E144C8 unit price is approximately USD 28.50 at qty 1, scaling down to USD 18.40 at qty 1000 on the open distributor market. Pricing for legacy Cyclone III parts has stabilized; lead-time authentication through authorized channels is recommended for production procurement.
What is the lead time for EP3C5E144C8?
As of 2026-09-09, lead time for the EP3C5E144C8 from authorized distributors is typically 8-12 weeks for factory-direct orders, with DigiKey and Mouser often carrying limited in-stock inventory. For long production runs, requesting a factory allocation through your Intel FPGA distributor is recommended to lock in supply.
Is EP3C5E144C8 in stock?
Stock of the EP3C5E144C8 varies by distributor; DigiKey typically lists several hundred units as of 2026-09-09, while Mouser and AIChiplink often stock lower quantities. For high-volume production, request a quote directly from an authorized Intel FPGA distributor to confirm factory allocation and lead time.
EP3C5E144C8 vs EP3C5E144C7N - which is better for prototyping?
The EP3C5E144C7N is the C7 speed grade variant with the lead-free (Pb-free, NiPdAu) finish, typically slightly faster Fmax than the C8 grade and preferred for new designs. According to the Intel ordering code guide, 'C7N' denotes a faster speed grade and lead-free terminal finish. Both share the same 144-EQFP package, so PCB layout is identical.
When should I choose EP3C5E144C8 over EP3C10E144C8N?
Choose EP3C5E144C8 when 5,136 logic elements are sufficient for your design and you need the lowest-cost Cyclone III option. Choose EP3C10E144C8N (in the Site MPN list) when your design requires approximately 10,320 logic elements, more DSP blocks, or additional RAM - the EP3C10 nearly doubles logic capacity at roughly 1.6x the price, and shares the same 144-EQFP footprint.
What is the best drop-in replacement for EP3C5E144C8?
The best drop-in replacements are same-package EP3C5 variants with different speed grades, such as the EP3C5E144C7N (C7 speed grade, lead-free) and the EP3C5E144C6N (C6 speed grade, fastest Fmax). All share the same 144-pin EQFP exposed-pad package footprint and pinout, allowing direct PCB reuse without rework. Cross-brand drop-in replacements are not available because Cyclone III is an Intel/Altera proprietary architecture.
Can EP3C5E144C7N replace EP3C5E144C8?
Yes, the EP3C5E144C7N is a true drop-in replacement for the EP3C5E144C8: same Cyclone III silicon die, same 144-EQFP exposed-pad package, same 5,136 logic elements, but a faster C7 speed grade (vs C8) and lead-free (Pb-free) terminal finish. The faster speed grade is generally beneficial; lead-free finish is required for RoHS-compliant products.
Where to download EP3C5E144C8 datasheet PDF?
The official EP3C5E144C8 datasheet is available from the Intel Cyclone III Device Handbook at the Intel FPGA documentation library. The document number is 'Cyclone III Device Handbook, Volume 1' (CIII5V1). For distributor-hosted PDFs, see DigiKey or Mouser product pages which link the same official document.
Where to find EP3C5E144C8 pinout?
The EP3C5E144C8 pinout for the 144-pin EQFP exposed-pad package is documented in the Intel Cyclone III Device Handbook, Chapter 6 (Pin-Out Information for Cyclone III Devices). The package is a 20x20 mm EQFP with 0.4 mm pitch and a 5x5 mm center exposed thermal pad that must be soldered to the PCB ground pour.
Is the EP3C5E144C8 RoHS compliant?
Yes, the EP3C5E144C8 is RoHS compliant per the Intel Cyclone III product environmental compliance documentation. The 'C8' suffix indicates commercial speed grade; the lead-free (Pb-free NiPdAu) terminal finish is indicated by an 'N' suffix in the part number. The EP3C5E144C7N variant is the lead-free-finish equivalent commonly specified for new designs.
What design software is needed for EP3C5E144C8?
The EP3C5E144C8 is supported by Intel Quartus Prime (the successor to Quartus II). Quartus Prime Lite Edition supports Cyclone III devices free of charge, providing synthesis, place-and-route, timing analysis, simulation, and programmer integration. The Quartus II Web Edition (legacy v13.0sp1) is the last officially supported version for Cyclone III and is still in widespread use.
What is the difference between EP3C5E144C8 and EP3C5F144C8?
The EP3C5E144C8 uses a 144-pin EQFP (eLQFP with exposed pad) package, while the EP3C5F144C8 uses a different package (the F suffix denotes FBGA or alternative footprint). Cyclone III devices with the same logic element count and speed grade but different package suffixes are NOT pin-compatible - they require different PCB layouts. Always verify the package code before substituting F for E variants.

Engineering reference data for EP3C5E144C8 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3C5E144C8 when your design fits within 5,136 logic elements and 23 multipliers, and you want the lowest-cost Cyclone III option in a 144-EQFP package with 94 user I/Os. The C8 commercial speed grade is suitable for typical industrial, consumer, and educational designs with moderate timing margins. For new RoHS-required designs, prefer the EP3C5E144C7N drop-in equivalent (same package, faster speed grade, Pb-free finish). For designs needing more logic capacity in the same 144-EQFP footprint, step up to EP3C10E144C8N (~2x LE) or EP3C16E144C8N (~3x LE). For industrial temperature range (-40C to +100C), choose an I7-suffixed variant. For automotive AEC-Q100 compliance, choose the EP3C5E144A7N.

Comparison with Alternatives

Parameter This Product EP3C5E144C7N EP3C5E144C7 EP3C5E144A7N EP3C10E144C8N EP3C16E144C8N
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Package 144-EQFP (exposed pad) 144-EQFP (exposed pad) - same 144-EQFP (exposed pad) - same 144-EQFP (exposed pad) - same 144-EQFP (exposed pad) - same 144-EQFP (exposed pad) - same
Logic Elements 5,136 5,136 5,136 5,136 10,320 (~2x) 15,408 (~3x)
Speed Grade C8 (commercial) C7 (faster Fmax) C7 (faster Fmax) A7 (automotive) C8 (same) C8 (same)
Embedded RAM (bits) 423,936 423,936 423,936 423,936 423,936 (same) 516,096
Embedded 18x18 Multipliers 23 23 23 23 23 (same) 56
PLLs 4 4 4 4 4 (same) 4 (same)
Lead-Free Finish (N suffix) No (C8 suffix) Yes (N suffix) No (C7 suffix) Yes (N suffix) Yes (N suffix) Yes (N suffix)

Key Differentiators

  • Lowest-cost Cyclone III device with 5,136 LE (vs EP3C10E144C8N)
  • Faster speed grade available in same package (vs EP3C5E144C7N)
  • Automotive-qualified variant in same package (vs EP3C5E144A7N)

Design Notes

The exposed thermal pad (EP) on the bottom of the 144-EQFP package MUST be soldered to a PCB ground pour of at least 1 square inch (645 mm^2) of copper to meet the package thermal resistance specification. Insufficient EP soldering will cause the junction temperature to exceed rated limits under typical Cyclone III operating loads. Per Intel Cyclone III Hardware Design Guidelines, thermal vias (0.3 mm diameter, 1.2 mm pitch) under the EP are recommended for thermal transfer to inner ground planes.

Cyclone III requires a specific power-up sequencing: VCCINT (1.2 V core) must be powered before or simultaneously with VCCIO (I/O bank supply). Per the Cyclone III datasheet section on Power-On Sequence, failure to follow the recommended sequencing can cause excessive inrush current and potentially latch-up. Use a multi-rail power IC (such as the TI TPS650250) with proper PGOOD sequencing. Decoupling: 100 nF ceramic at every VCCIO/VCCINT pin pair, plus 10 uF bulk per rail.

Common pitfalls with the EP3C5E144C8: (1) Confusing the 'E' suffix (EQFP package) with 'F' (FBGA) - they require different PCB layouts; (2) using a non-N suffix part in a RoHS-required design - the 'N' suffix denotes Pb-free terminal finish; (3) assuming all I/O banks support LVDS - only specific banks support true LVDS outputs, consult the device pinout file; (4) forgetting that Cyclone III configuration data is SRAM-based and must be reloaded on every power-up.

For LVDS signal integrity on the EP3C5E144C8, maintain 100 ohm differential impedance on the PCB traces and place LVDS pair traces with matched length (within 150 mil). The Cyclone III LVDS serializer/deserializer (SERDES) does not exist - LVDS is implemented via LVDS buffers driving the LVDS compatible I/O standard. Use the Quartus II pin planner to set the correct I/O standard and verify pin assignment against the device pin-out file before final compile.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
No
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS-compliant per Intel product environmental documentation. The EP3C5E144C8 itself is not lead-free terminal finish; the lead-free equivalent is the EP3C5E144C7N variant. Not AEC-Q100 qualified; choose EP3C5E144A7N for automotive applications.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

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