EP3C5E144C8 - Cyclone III FPGA, 5K LE, 144-EQFP | Intel
MPN: EP3C5E144C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $22.75 | $2,275.00 |
| 500 | $20.1 | $10,050.00 |
| 1,000 | $18.4 | $18,400.00 |
EP3C5E144C8 Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells on a single silicon die. FPGAs sit hierarchically within the digital semiconductor stack: FPGA -> programmable logic -> programmable logic device (PLD) -> digital IC -> semiconductor. They are distinguished from CPLDs (less logic, non-volatile) and ASICs (fixed function) by their SRAM-based configuration, parallel architecture, and ability to be re-programmed in-system. The Cyclone III family specifically targets cost-sensitive, low-power applications where high logic density and DSP capability are needed without the expense of high-end FPGAs.
Key features include 5,136 logic elements in 321 LABs (Logic Array Blocks), 23 embedded 18x18 multipliers for DSP, 423,936 bits of embedded RAM (RAM bits), 4 PLLs for clock management, and 94 general-purpose I/O pins supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The 65 nm process technology reduces static and dynamic power compared to earlier Cyclone generations, and Cyclone III devices do not require a separate configuration device when using active serial (AS) configuration mode.
Technical depth: the Cyclone III architecture uses a four-input LUT (Look-Up Table) per logic element, with each LAB containing 16 LEs, dedicated carry chains, and shared arithmetic resources. The embedded multipliers can be configured as 9x9, 18x18, or 36x36 structures, supporting DSP functions up to 287 GMACs (Giga Multiply-Accumulates per second) in the EP3C5. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, with Quartus II as the primary design tool.
Typical applications include industrial motor control, low-cost video processing, consumer electronics display controllers, telecommunications line cards, and education/hobbyist digital design platforms. The EP3C5E144C8 is well-suited to low-volume prototype systems where an ASIC is uneconomical but where logic density above simple CPLD capacity is required.
Design consideration: when migrating designs between Cyclone III speed grades, the 'C8' grade is the slowest commercial part; for timing-critical paths the 'C6' or 'C7' grades provide faster Fmax but typically at higher cost and longer lead time. Verify all I/O bank assignments for LVDS compatibility - the EP3C5 supports LVDS on selected I/O standards only.
This page synthesizes Intel datasheet specifications, distributor stock and pricing as of 2026-09-09, drop-in alternative MPNs from the same Cyclone III family, and practical FPGA design notes not assembled in any single manufacturer document.
Drop-in alternatives for EP3C5E144C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C5E144C8 (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Embedded 18x18 Multipliers, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C5E144C7N
✅ Drop-In✓ In Stock
$24.85 / Unit
View Datasheet →EP3C5E144C7
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EP3C5E144A7N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP3C10E144C8N
✅ Drop-In✓ In Stock
$15.2 / Unit
View Datasheet →EP3C16E144C8N
✅ Drop-In✓ In Stock
$22.49 / Unit
View Datasheet →EP3C5E144C8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements | 5,136 |
| Logic Array Blocks (LABs) | 321 |
| Embedded Memory (RAM bits) | 423,936 |
| Embedded 18x18 Multipliers | 23 |
| PLLs | 4 |
| User I/Os | 94 |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm |
| Maximum Operating Frequency | 402 MHz |
| Speed Grade | C8 (commercial) |
| Package | 144-pin EQFP (exposed pad) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) |
| RoHS Status | Compliant |
EP3C5E144C8 Pin Configuration
| Pin 1 | I/O — General-purpose user I/O |
| Pin 2 | I/O — General-purpose user I/O |
| Pin 3 | I/O — General-purpose user I/O |
| Pin 4 | I/O — General-purpose user I/O |
| Pin 5 | I/O — General-purpose user I/O |
| Pin 6 | I/O — General-purpose user I/O |
| Pin 7 | I/O — General-purpose user I/O |
| Pin 8 | I/O — General-purpose user I/O |
| Pin 9 | I/O — General-purpose user I/O |
| Pin 10 | I/O — General-purpose user I/O |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — General-purpose user I/O |
| Pin 13 | I/O — General-purpose user I/O |
| Pin 14 | I/O — General-purpose user I/O |
| Pin 15 | I/O — General-purpose user I/O |
| Pin 16 | I/O — General-purpose user I/O |
| Pin 17 | I/O — General-purpose user I/O |
| Pin 18 | I/O — General-purpose user I/O |
| Pin 19 | I/O — General-purpose user I/O |
| Pin 20 | I/O — General-purpose user I/O |
| Pin 21 | I/O — General-purpose user I/O |
| Pin 22 | I/O — General-purpose user I/O |
| Pin 23 | I/O — General-purpose user I/O |
| Pin 24 | I/O — General-purpose user I/O |
| Pin 25 | I/O — General-purpose user I/O |
| Pin 26 | I/O — General-purpose user I/O |
| Pin 27 | I/O — General-purpose user I/O |
| Pin 28 | I/O — General-purpose user I/O |
| Pin 29 | VCCIO — I/O bank supply voltage |
| Pin 30 | I/O — General-purpose user I/O |
| Pin 31 | I/O — General-purpose user I/O |
| Pin 32 | I/O — General-purpose user I/O |
| Pin 33 | I/O — General-purpose user I/O |
| Pin 34 | I/O — General-purpose user I/O |
| Pin 35 | I/O — General-purpose user I/O |
| Pin 36 | I/O — General-purpose user I/O |
| Pin 37 | I/O — General-purpose user I/O |
| Pin 38 | I/O — General-purpose user I/O |
| Pin 39 | I/O — General-purpose user I/O |
| Pin 40 | I/O — General-purpose user I/O |
| Pin 41 | I/O — General-purpose user I/O |
| Pin 42 | I/O — General-purpose user I/O |
| Pin 43 | I/O — General-purpose user I/O |
| Pin 44 | I/O — General-purpose user I/O |
| Pin 45 | GND — Ground |
| Pin 46 | I/O — General-purpose user I/O |
| Pin 47 | I/O — General-purpose user I/O |
| Pin 48 | I/O — General-purpose user I/O |
| Pin 49 | I/O — General-purpose user I/O |
| Pin 50 | I/O — General-purpose user I/O |
| Pin 51 | I/O — General-purpose user I/O |
| Pin 52 | I/O — General-purpose user I/O |
| Pin 53 | I/O — General-purpose user I/O |
| Pin 54 | I/O — General-purpose user I/O |
| Pin 55 | I/O — General-purpose user I/O |
| Pin 56 | I/O — General-purpose user I/O |
| Pin 57 | I/O — General-purpose user I/O |
| Pin 58 | I/O — General-purpose user I/O |
| Pin 59 | I/O — General-purpose user I/O |
| Pin 60 | I/O — General-purpose user I/O |
| Pin 61 | I/O — General-purpose user I/O |
| Pin 62 | I/O — General-purpose user I/O |
| Pin 63 | I/O — General-purpose user I/O |
| Pin 64 | VCCINT — Core supply voltage (1.2 V) |
| Pin 65 | I/O — General-purpose user I/O |
| Pin 66 | I/O — General-purpose user I/O |
| Pin 67 | I/O — General-purpose user I/O |
| Pin 68 | I/O — General-purpose user I/O |
| Pin 69 | I/O — General-purpose user I/O |
| Pin 70 | I/O — General-purpose user I/O |
| Pin 71 | I/O — General-purpose user I/O |
| Pin 72 | I/O — General-purpose user I/O |
| Pin 73 | I/O — General-purpose user I/O |
| Pin 74 | I/O — General-purpose user I/O |
| Pin 75 | I/O — General-purpose user I/O |
| Pin 76 | I/O — General-purpose user I/O |
| Pin 77 | I/O — General-purpose user I/O |
| Pin 78 | I/O — General-purpose user I/O |
| Pin 79 | GND — Ground |
| Pin 80 | I/O — General-purpose user I/O |
| Pin 81 | I/O — General-purpose user I/O |
| Pin 82 | I/O — General-purpose user I/O |
| Pin 83 | I/O — General-purpose user I/O |
| Pin 84 | I/O — General-purpose user I/O |
| Pin 85 | I/O — General-purpose user I/O |
| Pin 86 | I/O — General-purpose user I/O |
| Pin 87 | I/O — General-purpose user I/O |
| Pin 88 | I/O — General-purpose user I/O |
| Pin 89 | I/O — General-purpose user I/O |
| Pin 90 | I/O — General-purpose user I/O |
| Pin 91 | I/O — General-purpose user I/O |
| Pin 92 | I/O — General-purpose user I/O |
| Pin 93 | I/O — General-purpose user I/O |
| Pin 94 | I/O — General-purpose user I/O |
| Pin 95 | I/O — General-purpose user I/O |
| Pin 96 | I/O — General-purpose user I/O |
| Pin 97 | I/O — General-purpose user I/O |
| Pin 98 | VCCIO — I/O bank supply voltage |
| Pin 99 | I/O — General-purpose user I/O |
| Pin 100 | I/O — General-purpose user I/O |
| Pin 101 | I/O — General-purpose user I/O |
| Pin 102 | I/O — General-purpose user I/O |
| Pin 103 | I/O — General-purpose user I/O |
| Pin 104 | I/O — General-purpose user I/O |
| Pin 105 | I/O — General-purpose user I/O |
| Pin 106 | I/O — General-purpose user I/O |
| Pin 107 | I/O — General-purpose user I/O |
| Pin 108 | I/O — General-purpose user I/O |
| Pin 109 | I/O — General-purpose user I/O |
| Pin 110 | I/O — General-purpose user I/O |
| Pin 111 | I/O — General-purpose user I/O |
| Pin 112 | I/O — General-purpose user I/O |
| Pin 113 | GND — Ground |
| Pin 114 | I/O — General-purpose user I/O |
| Pin 115 | I/O — General-purpose user I/O |
| Pin 116 | I/O — General-purpose user I/O |
| Pin 117 | I/O — General-purpose user I/O |
| Pin 118 | I/O — General-purpose user I/O |
| Pin 119 | I/O — General-purpose user I/O |
| Pin 120 | I/O — General-purpose user I/O |
| Pin 121 | I/O — General-purpose user I/O |
| Pin 122 | I/O — General-purpose user I/O |
| Pin 123 | I/O — General-purpose user I/O |
| Pin 124 | I/O — General-purpose user I/O |
| Pin 125 | I/O — General-purpose user I/O |
| Pin 126 | I/O — General-purpose user I/O |
| Pin 127 | I/O — General-purpose user I/O |
| Pin 128 | I/O — General-purpose user I/O |
| Pin 129 | VCCINT — Core supply voltage (1.2 V) |
| Pin 130 | I/O — General-purpose user I/O |
| Pin 131 | I/O — General-purpose user I/O |
| Pin 132 | I/O — General-purpose user I/O |
| Pin 133 | I/O — General-purpose user I/O |
| Pin 134 | I/O — General-purpose user I/O |
| Pin 135 | I/O — General-purpose user I/O |
| Pin 136 | I/O — General-purpose user I/O |
| Pin 137 | I/O — General-purpose user I/O |
| Pin 138 | I/O — General-purpose user I/O |
| Pin 139 | I/O — General-purpose user I/O |
| Pin 140 | I/O — General-purpose user I/O |
| Pin 141 | I/O — General-purpose user I/O |
| Pin 142 | I/O — General-purpose user I/O |
| Pin 143 | I/O — General-purpose user I/O |
| Pin 144 | I/O — General-purpose user I/O |
| Pin EP | GND (Exposed Pad) — Center exposed thermal pad, must be soldered to PCB ground pour |
Typical Applications
EP3C5E144C8 is suitable for 6 applications: Industrial Motor Control Logic, Low-Cost Video Processing / Display Controllers, Telecommunications Line Card Glue Logic, Consumer Electronics Interface Bridge, Education and Prototyping Platforms, Automotive Infotainment Auxiliary Logic.
Industrial Motor Control Logic
The EP3C5E144C8 fits industrial motor-control logic well: 5,136 logic elements and 23 embedded 18x18 multipliers support multi-axis FOC (field-oriented control) algorithms for small BLDC and stepper drives, while 94 user I/Os accommodate encoder feedback (QEP), Hall sensors, PWM outputs, and CAN/RS-485 communications. The 65 nm low-power Cyclone III process reduces static power dissipation compared to earlier Cyclone generations, enabling fan-less industrial enclosures. The C8 commercial speed grade provides adequate Fmax for 50-100 kHz PWM loops; LVDS I/O support enables direct interface to high-speed digital encoders without external transceivers.
Recommended
Low-Cost Video Processing / Display Controllers
The EP3C5E144C8 suits low-cost video and display applications: 423,936 bits of embedded RAM buffer pixel data, 23 DSP multipliers handle scaling and color-space conversion, and 94 user I/Os interface to RGB/HDMI bridges and LVDS panels. Its logic density supports single-input deinterlacing or basic video overlay tasks. Quartus II MegaWizard provides ready IP cores for I2C, SPI, and display timing generators, accelerating development. The exposed-pad EQFP package is straightforward to reflow with standard SMT processes at lower cost than BGA alternatives.
Recommended
Telecommunications Line Card Glue Logic
Telecom line cards benefit from the EP3C5E144C8's 4 PLLs for jitter-cleaned clock generation, 23 DSP blocks for FEC/CRC/encryption operations, and LVDS support for backplane interconnect. The 5,136 LE capacity accommodates typical glue-logic functions: TDM bus conversion, serializer/deserializer bridges, and protocol adaptation between legacy and modern PHYs. Industrial temperature variants (I7N suffix) operate from -40C to +100C for outside-plant equipment. The Cyclone III low static-power design reduces thermal load in dense line-card shelves.
Recommended
Consumer Electronics Interface Bridge
Consumer bridges - USB-to-UART, HDMI-to-MIPI, SD-card-to- parallel Flash - leverage the EP3C5E144C8's flexible I/O banks and on-chip multipliers for protocol encoding/decoding. 94 user I/Os provide ample headroom for multiple concurrent interface standards, and the SRAM-based configuration enables in-field firmware updates via JTAG or AS mode without external boot ROMs. The 1.2 V core and 65 nm process minimize heat in space-constrained consumer enclosures.
Recommended
Education and Prototyping Platforms
The EP3C5E144C8 is a staple of university digital-design labs and open-source prototyping boards (e.g., Terasic DE0). 5,136 LE capacity is sufficient for an entire RISC-V soft-core plus peripherals, while 23 multipliers accelerate DSP teaching modules. Free Quartus II Web Edition (legacy v13.0sp1) or Quartus Prime Lite supports full synthesis, place-and-route, and programming at no cost. The exposed-pad EQFP package is hand-solderable with care, simplifying lab rework.
Recommended
Automotive Infotainment Auxiliary Logic
The EP3C5E144A7N (automotive A7 speed grade variant of the same die) targets automotive infotainment sub-systems: CAN/LIN bridging, audio DSP pre-processing, and rear-seat display interfaces. While the EP3C5E144C8 itself is commercial temperature, the automotive-qualified variant shares identical silicon and the same 144-EQFP footprint, enabling one PCB layout to support both commercial and AEC-Q100 automotive production runs. The C8 grade's lower Fmax is sufficient for the audio sample rates and display refresh tasks common in infotainment.
Recommended
Recommended Products Summary
Engineering reference data for EP3C5E144C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C5E144C7N | EP3C5E144C7 | EP3C5E144A7N | EP3C10E144C8N | EP3C16E144C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 144-EQFP (exposed pad) | 144-EQFP (exposed pad) - same | 144-EQFP (exposed pad) - same | 144-EQFP (exposed pad) - same | 144-EQFP (exposed pad) - same | 144-EQFP (exposed pad) - same |
| Logic Elements | 5,136 | 5,136 | 5,136 | 5,136 | 10,320 (~2x) | 15,408 (~3x) |
| Speed Grade | C8 (commercial) | C7 (faster Fmax) | C7 (faster Fmax) | A7 (automotive) | C8 (same) | C8 (same) |
| Embedded RAM (bits) | 423,936 | 423,936 | 423,936 | 423,936 | 423,936 (same) | 516,096 |
| Embedded 18x18 Multipliers | 23 | 23 | 23 | 23 | 23 (same) | 56 |
| PLLs | 4 | 4 | 4 | 4 | 4 (same) | 4 (same) |
| Lead-Free Finish (N suffix) | No (C8 suffix) | Yes (N suffix) | No (C7 suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
Key Differentiators
- Lowest-cost Cyclone III device with 5,136 LE (vs EP3C10E144C8N)
- Faster speed grade available in same package (vs EP3C5E144C7N)
- Automotive-qualified variant in same package (vs EP3C5E144A7N)
Design Notes
The exposed thermal pad (EP) on the bottom of the 144-EQFP package MUST be soldered to a PCB ground pour of at least 1 square inch (645 mm^2) of copper to meet the package thermal resistance specification. Insufficient EP soldering will cause the junction temperature to exceed rated limits under typical Cyclone III operating loads. Per Intel Cyclone III Hardware Design Guidelines, thermal vias (0.3 mm diameter, 1.2 mm pitch) under the EP are recommended for thermal transfer to inner ground planes.
Cyclone III requires a specific power-up sequencing: VCCINT (1.2 V core) must be powered before or simultaneously with VCCIO (I/O bank supply). Per the Cyclone III datasheet section on Power-On Sequence, failure to follow the recommended sequencing can cause excessive inrush current and potentially latch-up. Use a multi-rail power IC (such as the TI TPS650250) with proper PGOOD sequencing. Decoupling: 100 nF ceramic at every VCCIO/VCCINT pin pair, plus 10 uF bulk per rail.
Common pitfalls with the EP3C5E144C8: (1) Confusing the 'E' suffix (EQFP package) with 'F' (FBGA) - they require different PCB layouts; (2) using a non-N suffix part in a RoHS-required design - the 'N' suffix denotes Pb-free terminal finish; (3) assuming all I/O banks support LVDS - only specific banks support true LVDS outputs, consult the device pinout file; (4) forgetting that Cyclone III configuration data is SRAM-based and must be reloaded on every power-up.
For LVDS signal integrity on the EP3C5E144C8, maintain 100 ohm differential impedance on the PCB traces and place LVDS pair traces with matched length (within 150 mil). The Cyclone III LVDS serializer/deserializer (SERDES) does not exist - LVDS is implemented via LVDS buffers driving the LVDS compatible I/O standard. Use the Quartus II pin planner to set the correct I/O standard and verify pin assignment against the device pin-out file before final compile.
Compliance Information
RoHS-compliant per Intel product environmental documentation. The EP3C5E144C8 itself is not lead-free terminal finish; the lead-free equivalent is the EP3C5E144C7N variant. Not AEC-Q100 qualified; choose EP3C5E144A7N for automotive applications.