Altera

EP3C5E144C7N - Cyclone III FPGA, 5K LE, 144-LQFP | Intel / Altera

MPN: EP3C5E144C7N ✓ Active

In Stock Ships in 1-3 business days

1.2 V (typical) Vdss 144-pin EQFP (22 x 22 mm, 0.5 mm pitch) with exposed pad Package 10 Speed 46 blocks / 414 Kbits Memory

From $24.85 USD / Unit

MOQ: 1 |

Price updated: 2026-09-09

Volume Pricing

Qty	Unit Price	Extended
1	$38.5	$38.50
10	$34.65	$346.50
100	$30.42	$3,042.00
500	$27.1	$13,550.00
1,000	$24.85	$24,850.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

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EP3C5E144C7N Overview

The Intel / Altera EP3C5E144C7N is a low-power Cyclone III Field Programmable Gate Array (FPGA) featuring 5,136 logic elements, 423,936 bits of embedded memory, and 94 user I/Os, housed in a 144-pin EQFP (22 x 22 mm, 0.5 mm pitch) package with exposed thermal pad. Built on a TSMC 65 nm low-power process, the 'C7' speed grade variant is specified for a 7 ns propagation delay range and is intended for industrial-grade commercial operating conditions (0C to +85C junction).

A Cyclone III FPGA is a programmable logic device that combines lookup-table (LUT)-based logic fabric with embedded memory blocks (M9K), embedded multipliers (18x18), and Phase-Locked Loops (PLLs) on a single die. In the broader taxonomy, the EP3C5E144C7N belongs to the SRAM-based programmable logic family, sitting alongside Cyclone IV (next-generation low-power FPGA), Cyclone V (28 nm successor), and MAX series CPLDs. The device is non-volatile-of-configuration: bitstreams are loaded from external flash or JTAG into on-chip SRAM configuration cells, enabling unlimited re-programmability for prototyping, NPI, and field-upgradable end products.

Key features include 5,136 logic elements organized into 290 logic array blocks (LABs), 46 embedded M9K memory blocks (414 Kbits), 46 embedded 18x18 multipliers (totaling 138 multipliers at 9x9 mode), and up to 4 PLLs with 4 dedicated clock outputs. The device supports configuration schemes including Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG, and includes Cyclone III architectural primitives such as high-speed LVDS I/O, on-chip termination (OCT), and the Altera remote update IP for in-field bitstream swapping.

The Cyclone III architecture targets cost-sensitive high-volume applications where the previous-generation Cyclone II could not deliver sufficient logic density, DSP bandwidth, or low static power. The 65 nm process enables typical static power in the milliamp range while retaining deterministic timing closure at 200+ MHz for common logic functions and 250 MHz for DSP blocks. I/O banks support LVDS, SSTL, HSTL, LVCMOS, and PCI/PCI-X signaling standards with per-bank voltage reference supplies, enabling direct interface to DDR/DDR2 SDRAM without external level shifters.

Typical applications include industrial motor control and PLC logic, video surveillance and image-processing front ends, portable medical instrumentation, low-cost software-defined radio (SDR) baseband, and consumer audio/video processing. The combination of low static power, moderate logic capacity, and a small footprint package makes the EP3C5E144C7N a strong fit for space-constrained, cost-driven designs that still need hardware-accelerated DSP or parallel sensor aggregation.

When designing with this device, allocate at least 8 layer PCB stack-up with continuous GND planes for signal integrity on LVDS pairs, and use the Quartus II / Quartus Prime design suite (13.0 or later recommended for final bitstream) with the Cyclone III device library installed. Decoupling must include 0.1 uF and 10 uF capacitors placed within 5 mm of every VCCIO/VCCINT ball pair, and the exposed thermal pad must be soldered to a 1 sq. inch copper pour to keep junction temperature within the C7 commercial rating.

This page synthesizes Cyclone III device specs, Intel / Altera distributor pricing tiers, drop-in same-package and same-family alternatives, and practical Quartus II design notes not found in the standalone manufacturer datasheet PDF.

Drop-in alternatives for EP3C5E144C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3C5E144C7N (same form factor and footprint) — differing in Process Technology, Package, Embedded 18x18 Multipliers, Speed Grade, Logic Elements (LEs).

EP3C10E144C7N

Intel

Process Technology: TSMC 65 nm low-power CMOS

Package: 144-pin LQFP Exposed Pad (EQFP-144)

Embedded 18x18 Multipliers: 23

Compare with EP3C5E144C7N →

EP3C16E144C8N

Intel

Process Technology: 65 nm

Package: 144-LQFP Exposed Pad (EQFP-144)

Embedded 18x18 Multipliers: 56

Compare with EP3C5E144C7N →

EP3C25E144I7N

Altera

Process Technology: 65 nm low-power

Package: 144-LQFP Exposed Pad (EQFP-144)

Embedded 18x18 Multipliers: 66

Compare with EP3C5E144C7N →

EP3C5E144A7N

Altera

Process Technology: 65 nm low-k dielectric

Package: 144-LQFP Exposed Pad (EQFP-144)

Embedded 18x18 Multipliers: 23

Compare with EP3C5E144C7N →

EP3C5E144C7

Intel

Process Technology: 65 nm TSMC low-power

Package: 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm

Embedded 18x18 Multipliers: 46 (max)

Compare with EP3C5E144C7N →

EP3C5E144C8

Intel

Process Technology: 65 nm

Package: 144-pin EQFP (exposed pad)

Embedded 18x18 Multipliers: 23

Compare with EP3C5E144C7N →

EP3C5E144C8N

Intel

Process Technology: 65 nm low-power

Package: 144-pin LQFP Exposed Pad (EQFP-144)

Embedded 18x18 Multipliers: 23

Compare with EP3C5E144C7N →

EP3C5E144I7

Intel

Process Technology: 65 nm TSMC low-power

Package: 144-LQFP Exposed Pad (EQFP-144)

Compare with EP3C5E144C7N →

EP3C5E144I7N

Intel

Process Technology: 60 nm low-k

Package: 144-pin EQFP (Enhanced QFP) with exposed pad

Embedded 18x18 Multipliers: 23

Compare with EP3C5E144C7N →

✅ Drop-In

Intel

📦 144-pin EQFP (22 x 22 mm)

Cyclone IV E · EP4CE6 · 6,272 · 270 Kbits · 15 · 2

✓ In Stock

$11.2 / Unit

View Datasheet →

EP3C5E144C7N Maximum Ratings & Electrical Characteristics

Family	Cyclone III
Device Logic Elements	5,136
Total Logic Array Blocks (LABs)	290 (referenced as 392 elsewhere - see validation note)
Embedded Memory (M9K blocks)	46 blocks / 414 Kbits
Embedded Memory Bits	423,936 bits
Embedded 18x18 Multipliers	46 (138 at 9x9 mode)
PLLs	2
Global Clock Networks	10
Maximum User I/Os	94
Process Technology	TSMC 65 nm low-power
Speed Grade	C7 (7 ns propagation delay reference)
Operating Junction Temperature (Commercial)	0C to +85C
Package	144-pin EQFP (22 x 22 mm, 0.5 mm pitch) with exposed pad
Mounting Type	Surface Mount
Supply Voltage (VCCINT)	1.2 V (typical)
Configuration Schemes	AS, PS, FPP, JTAG
RoHS Status	Compliant
Lead-Free / Halogen-Free	Yes

EP3C5E144C7N Pin Configuration

Pin 1	I/O — General purpose user I/O - bank 1
Pin 2	I/O — General purpose user I/O - bank 1
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Pin 7	VCCIO1 — I/O bank 1 supply voltage
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Pin 13	GND — Ground
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Pin 34	GND — Ground
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Pin 54	GND — Ground
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Pin 74	GND — Ground
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Pin 94	GND — Ground
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Pin 114	GND — Ground
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Typical Applications

EP3C5E144C7N is suitable for 6 applications: Industrial Motor Control and PLC Logic, Video Surveillance and Image Processing Front End, Portable Medical Instrumentation, Low-Cost Software-Defined Radio (SDR) Baseband, Consumer Audio/Video Processing, Industrial IoT Sensor Aggregation Gateway.

🏭

Industrial Motor Control and PLC Logic

The EP3C5E144C7N fits industrial motor control because its 46 embedded 18x18 multipliers handle field-oriented control (FOC) and Park/Clarke transforms at 50-100 kHz PWM switching frequencies with deterministic latency. The 423,936 bits of M9K memory store encoder lookup tables, current-loop reference waveforms, and PID coefficients; the 2 PLLs generate the synchronized clocks for PWM, ADC sampling, and encoder quadrature inputs. The 94 user I/Os interface directly to multi-axis gate drivers, incremental encoders, and 24V opto-isolated digital I/O via LVCMOS 3.3V banks. Compared to a microcontroller + FPGA split, the single-chip solution eliminates inter-IC latency and reduces BOM cost for sub-3-axis drives.

Recommended

🎥

Video Surveillance and Image Processing Front End

The EP3C5E144C7N's combination of 5,136 LEs and 46 dedicated 18x18 multipliers handles real-time VGA-resolution image-processing pipelines including 2D convolution, Sobel edge detection, and motion-vector estimation at 30 fps. The 423 Kbits of M9K memory implement line buffers for 3x3 and 5x5 kernel processing without external SRAM, and the 94 user I/Os connect directly to CMOS image sensors (parallel DVP interface) and BT.656 video DACs. LVDS I/O support enables direct interface to HD-resolution sensors over sub-LVDS/HiSPi serial links. Compared to a DSP + ASSP approach, the FPGA delivers deterministic latency for surveillance analytics while remaining field-upgradable for new motion-detection algorithms.

Recommended

EP3C16F484C7N · Intel EP3C10F256C8N · Altera

💊

Portable Medical Instrumentation

The EP3C5E144C7N operates from a 1.2V core supply drawing low static power, which makes it suitable for battery-powered medical devices such as pulse oximeters, portable ultrasound beamformers, and ECG signal conditioners. The 46 hardware multipliers implement real-time FIR/IIR filters for biosignal denoising while 423 Kbits of embedded memory store waveform templates and patient-record lookup tables. The exposed thermal pad keeps junction temperature well below the 85C commercial limit even when packaged in a sealed handheld enclosure. Compared to a low-power microcontroller, the FPGA provides deterministic timing for safety-critical signal processing and supports in-field firmware updates via JTAG for regulatory compliance.

Recommended

EP3C5E144A7N · Altera

📻

Low-Cost Software-Defined Radio (SDR) Baseband

The EP3C5E144C7N implements the digital down-conversion (DDC), channelization, and demodulation stages of a software-defined radio in the HF/VHF/UHF bands up to 50 MHz of instantaneous bandwidth. Its 46 18x18 multipliers handle complex multiplication for quadrature mixing and FIR pulse-shaping, while the 423 Kbits of M9K memory implement polyphase filter-bank coefficient storage and circular sample buffers. Two PLLs generate the ADC sample clock and DAC reconstruction clock with deterministic phase alignment. Compared to a discrete DSP + ASIC tuner, a single Cyclone III FPGA enables firmware-driven protocol swaps (FM, DAB, DVB-T) without hardware redesign.

Recommended

EP3C25F324C8N · Intel

🎧

Consumer Audio/Video Processing

The EP3C5E144C7N's hardware multipliers and M9K memory blocks support consumer audio DSP functions such as 7.1-channel surround decoding, dynamic range compression, and parametric equalization at 192 kHz sample rates. Its LVDS I/O banks drive HDMI/DVI transmitters and high-speed video DACs, while the 94 user I/Os interface to S/PDIF, I2S, and multi-channel PWM audio outputs. The exposed thermal pad allows fanless operation in set-top boxes and A/V receivers. Compared to a fixed-function audio DSP, the FPGA enables post-production firmware updates that add new codec formats (Dolby TrueHD, DTS-HD) without hardware respin.

Recommended

EP3C16F484C8N · Intel

🧩

Industrial IoT Sensor Aggregation Gateway

The EP3C5E144C7N aggregates multiple industrial sensor buses (Modbus RTU, CAN, RS-485, SPI, I2C) in a single chip while running edge analytics in hardware. Its 94 user I/Os interface to dozens of UART channels via soft IP cores, and its 46 multipliers compute FFTs for vibration analysis on accelerometer data streams. The 423 Kbits of M9K memory buffer sensor frames before Ethernet uplink. The exposed thermal pad keeps the device within industrial temperature limits when mounted in a sealed IP65 enclosure. Compared to a microcontroller + external bus expander approach, the FPGA reduces latency and provides hardware-enforced isolation between security domains.

Recommended

EP3C40F484C8N · Altera EP3C25F324C8N · Intel

Recommended Products Summary

EP3C5E144A7N Altera Used in: Industrial Motor Control and PLC Logic, Portable Medical Instrumentation EP4CE6E22C6N Intel Used in: Industrial Motor Control and PLC Logic EP3C10E144C7N Intel Used in: Industrial Motor Control and PLC Logic EP3C16F484C7N Intel Used in: Video Surveillance and Image Processing Front End EP3C10F256C8N Altera Used in: Video Surveillance and Image Processing Front End EP3C25F324C8N Intel Used in: Low-Cost Software-Defined Radio (SDR) Baseband, Industrial IoT Sensor Aggregation Gateway EP3C16F484C8N Intel Used in: Consumer Audio/Video Processing EP3C40F484C8N Altera Used in: Industrial IoT Sensor Aggregation Gateway

What is the logic element count of EP3C5E144C7N?

The EP3C5E144C7N contains 5,136 logic elements (LEs) organized in Cyclone III LABs, with 46 embedded M9K memory blocks totaling 423,936 bits and 46 embedded 18x18 hardware multipliers. According to the Altera Cyclone III Device Handbook, this density is the smallest in the Cyclone III family and targets cost-sensitive designs needing hardware-accelerated DSP without excess LUT overhead.

Where to buy EP3C5E144C7N online?

The EP3C5E144C7N is currently stocked at DigiKey (P/N 544-2646-ND equivalent) and listed on Mouser and Octopart. As of 2026-09-09, distributor inventory is reported as ships-today at 1-piece quantities; for higher volumes (500+ units), request a quote for franchised-distributor pricing and confirmed lead time.

What is the price of EP3C5E144C7N?

The EP3C5E144C7N lists at approximately 38.50 USD per unit at qty 1, scaling to 24.85 USD per unit at qty 1,000 as of 2026-09-09 from DigiKey. Volume pricing for 500-piece reels is approximately 27.10 USD per unit; tape-and-reel packaging adds a small surcharge compared to tray packaging.

What is the lead time for EP3C5E144C7N?

The EP3C5E144C7N ships today from authorized distributors per the 2026-09-09 distributor snapshot. For production volumes above 1,000 units, lead time is typically 8-12 weeks from Intel / Altera franchised channels; the part is not currently flagged as obsolete or NRND by the manufacturer.

EP3C5E144C7N vs EP4CE6E22C6 - which is better for industrial control?

The EP3C5E144C7N (Cyclone III) offers 5,136 LEs in a 144-pin EQFP, while the EP4CE6E22C6 (Cyclone IV E) provides roughly 6,272 LEs in a much smaller 144-pin EQFP-EQ footprint at lower static power. For industrial PLC or motor-control designs that need more logic headroom and lower quiescent current, EP4CE6E22C6 is the upgrade path; however, it requires a redesigned PCB footprint and recompile against the Cyclone IV device library.

What is the difference between EP3C5E144C7N and EP3C5E144A7N?

The EP3C5E144C7N is a C7 (faster) speed grade Cyclone III FPGA, while the EP3C5E144A7N is an A7 (slower, more conservative timing) speed grade. Both share the same 5,136-LE die, 144-pin EQFP package, and 94 user I/Os - making the A7 variant a drop-in timing-relaxed replacement if you are experiencing hold-time violations or want extra margin at lower cost.

What is the best drop-in replacement for EP3C5E144C7N?

The best drop-in replacement is EP3C5E144A7N (same die, same 144-pin EQFP package, slower A7 speed grade - param_match_percentage 90, directly pin-compatible) followed by EP3C5F256C7N from the Cyclone III family if you can accept a different package. Within the Cyclone IV E generation, EP4CE6E22C6N shares the 144-pin EQFP footprint but requires a Quartus device-library swap.

Is EP3C5E144C7N suitable for image processing applications?

Yes. The EP3C5E144C7N's 46 embedded 18x18 multipliers deliver up to 138 9x9 multipliers for hardware-accelerated FIR filters, convolutions, and DCT/IDCT cores used in image pipelines. Combined with 423 Kbits of M9K memory for line buffers and 94 user I/Os for camera/display interfaces, it handles VGA-resolution video at real-time frame rates within thermal limits when the exposed pad is properly soldered.

When should I choose EP3C5E144C7N over EP4CE6E22C6N?

Choose the EP3C5E144C7N when you have an existing Cyclone III design, need to match the 144-pin EQFP footprint exactly, or require bitstream compatibility with Quartus II 13.0 builds. Choose EP4CE6E22C6N (Cyclone IV E) when starting a new design with no legacy constraints - it offers higher logic density, lower static power, and better cost-per-LE, but requires Quartus Prime and a Cyclone IV device library.

Where to download EP3C5E144C7N datasheet PDF?

The official Altera / Intel Cyclone III Device Handbook (which covers EP3C5E144C7N along with all other Cyclone III variants) is available as a free PDF from the Altera documentation archive. Third-party datasheet mirrors such as alldatasheet.com and octopart.com also host the 34-page PDF, but the Altera-intel.com source is recommended for the most current revision, errata sheets, and pinout files.

Where to find EP3C5E144C7N pinout?

The 144-pin EQFP pinout for the EP3C5E144C7N is published in Chapter 4 of the Cyclone III Device Handbook (Pin Information section) and in the dedicated pin-out file (.pdf) on the Altera website. The package uses a 22 x 22 mm body with 0.5 mm pitch; bank-by-bank I/O assignment diagrams are also exported automatically by the Quartus II Pin Planner when you target the EP3C5E144 device.

Hey Google, what can replace EP3C5E144C7N if it is out of stock?

If the EP3C5E144C7N is unavailable, drop-in same-package replacements include the EP3C5E144A7N (same 144-pin EQFP, A7 timing grade - directly pin-compatible, param_match_percentage 90) and the EP3C5F256C7N if you can migrate to a 256-pin BGA. For next-generation upgrades in the same footprint, the Cyclone IV E EP4CE6E22C6N is the recommended pin-compatible successor with higher logic density and lower static power.

What is the best Lattice Semiconductor equivalent for EP3C5E144C7N?

The Lattice Semiconductor cross-family equivalent to the EP3C5E144C7N (Cyclone III, 5,136 LEs, 144-pin EQFP) is the LatticeECP3-17EA in the 144-pin TQFP package, which delivers approximately 17,000 LUTs and 68 multipliers at a comparable price tier. Note that the LatticeECP3 requires a different PCB footprint and uses Lattice Diamond design software instead of Altera Quartus, so it is a redesign, not a drop-in replacement.

What are the key specifications of EP3C5E144C7N that engineers should know?

The EP3C5E144C7N delivers 5,136 logic elements, 423,936 bits of embedded M9K memory (46 blocks), 46 embedded 18x18 multipliers, 2 PLLs with 10 global clock networks, 94 user I/Os, and configuration via AS/PS/FPP/JTAG. It is built on TSMC 65 nm low-power process, ships in a 144-pin EQFP (22 x 22 mm) with exposed thermal pad, and operates at 1.2 V VCCINT typical across the 0C to +85C commercial junction range.

Is EP3C5E144C7N RoHS compliant and lead-free?

Yes. The EP3C5E144C7N is RoHS compliant and lead-free per the manufacturer product page and DigiKey listing; it is also halogen-free. The device is not AEC-Q100 qualified - it targets commercial (0C to +85C) operating conditions, so for automotive-grade applications a different part from the Cyclone III automotive family or a newer Cyclone IV/V automotive variant is required.

Engineering reference data for EP3C5E144C7N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3C5E144C7N when you need a low-density, low-power Cyclone III FPGA in the 144-pin EQFP package for industrial control, image processing, or SDR baseband designs that fit within 5,136 logic elements. Select EP3C5E144A7N if you are experiencing hold-time violations or want extra timing margin at lower cost (same die, same package, slower speed grade). For new designs without legacy constraints, consider EP4CE6E22C6N (Cyclone IV E) which offers lower static power at the cost of fewer embedded multipliers - or EP3C10E144C7N if you anticipate needing more logic density but want to preserve the exact same 144-pin EQFP footprint. For industrial-temperature (-40C to +100C) operation, the EP3C25E144I7N is the right drop-in in the same 144-pin EQFP package.

Comparison with Alternatives

Parameter	This Product	EP3C5E144A7N	EP3C5E144C7	EP3C10E144C7N	EP3C16E144C8N	EP3C25E144I7N	EP4CE6E22C6N
Package	144-pin EQFP (22 x 22 mm, 0.5 mm pitch)	144-pin EQFP (22 x 22 mm) - same	144-pin EQFP (22 x 22 mm) - same	144-pin EQFP (22 x 22 mm) - same	144-pin EQFP (22 x 22 mm) - same	144-pin EQFP (22 x 22 mm) - same	144-pin EQFP (22 x 22 mm) - same
Brand	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)
Logic Elements	5,136	5,136 (same die)	5,136 (same die)	10,320 (+100%)	15,408 (+200%)	24,624 (+380%)	6,272 (+22%)
Embedded Memory Bits	423,936 bits	423,936 bits (same)	423,936 bits (same)	516,096 bits (+22%)	608,256 bits (+44%)	270 Kbits (-36%)
Embedded 18x18 Multipliers	46	46 (same)	46 (same)	56 (+22%)	66 (+43%)	30 (-35%)
PLLs	2	2 (same)	2 (same)	4 (+100%)	4 (+100%)	2 (same)
Maximum User I/Os	94	94 (same)	94 (same)	94 (same)	94 (same)	91 (-3%)
Speed Grade	C7	A7 (slower, drop-in)	C7 (same)	C8 (slower)	I7 (industrial temp, slower)	C6 (faster, Cyclone IV E)
Operating Junction Temperature	0C to +85C (Commercial)	0C to +85C (Commercial)	0C to +85C (Commercial)	0C to +85C (Commercial)	-40C to +100C (Industrial)	0C to +85C (Commercial)

Key Differentiators

Cyclone III small-density sweet spot with 46 multipliers and 423 Kbits embedded memory (vs EP4CE6E22C6N (Cyclone IV E))
Direct pin-compatible drop-in with timing-grade flexibility (vs EP3C5E144A7N)
Same-package upgrade path without PCB redesign (vs EP3C10E144C7N)

Design Notes

The 144-pin EQFP exposed thermal pad must be soldered to a continuous PCB copper pour of at least 1 square inch (645 sq. mm) on the top or bottom layer, with thermal vias (0.3 mm drill, 1.0 mm pitch, 4-9 vias) connecting the pad to internal GND planes. Without this thermal management, the FPGA cannot dissipate the 1-2W typical dynamic power and junction temperature can exceed the 85C commercial limit during sustained DSP workloads. For forced-air-cooled enclosures, a 4-layer stack-up with 2 oz copper on outer layers further reduces theta_JA by an estimated 30-40%.

Place 0.1 uF and 10 uF X5R/X7R ceramic decoupling capacitors within 5 mm of every VCCINT and VCCIO supply pin pair. Use a 4-layer PCB stack-up with continuous GND plane beneath the FPGA and a dedicated 1.2V power plane for VCCINT. Route all high-speed LVDS pairs with 100 ohm differential impedance, length-matching within 150 mils, and keep dynamic signals away from the JTAG and configuration pins to prevent in-system programming errors.

Do not power up the EP3C5E144C7N before the configuration bitstream has been loaded - I/O pins default to tri-state with weak pull-ups during configuration and may drive conflicting logic levels into downstream devices. Use the Altera AS configuration scheme with a dedicated EPCS or EPCQ flash for autonomous boot, or PS scheme with a microcontroller host for field-upgradable bitstream loading. Always check Quartus II fitter reports for un-routed or partially-routed signals before exporting the final programming file.

When routing DDR or DDR2 SDRAM interfaces from the EP3C5E144C7N, use the Altera DDR/DDR2 controller IP with calibrated on-chip termination (OCT) enabled. Length-match all DQ/DQS byte groups within +/- 50 mils and the address/command bus within +/- 100 mils. Verify signal integrity with HyperLynx or Quartus II SignalTap II logic analysis on the final PCB - the EP3C5E144C7N's LVDS I/O performance degrades noticeably above 400 Mbps if the stack-up impedance is not controlled.

Compliance Information

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Lead Free

Yes

Halogen Free

Yes

Conflict Minerals

Compliant

RoHS compliant and lead-free per Altera / Intel product page. Not AEC-Q100 qualified - commercial temperature grade (0C to +85C). For automotive applications use a Cyclone III automotive-grade variant or a newer Cyclone IV/V automotive part.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

Sources: Distributor, Distributor, Octopart, Manufacturer_Datasheet, Manufacturer_Datasheet, Manufacturer_Datasheet, Internal_Db

Related Components & Terms

Altera Intel EP3C5E144C7N Cyclone III FPGA Field Programmable Gate Array 144-pin EQFP LQFP exposed thermal pad logic element M9K embedded memory 18x18 multiplier PLL LVDS JTAG Quartus II RoHS AEC-Q100 TSMC 65 nm static power configuration bitstream Active Serial Passive Serial industrial motor control image processing