EP3C5M164I7N - Cyclone III FPGA, 5K LE, 164-MBGA | Intel
MPN: EP3C5M164I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $31.83 | $31.83 |
| 10 | $29.95 | $299.50 |
| 100 | $26.5 | $2,650.00 |
| 500 | $23.8 | $11,900.00 |
| 1,000 | $21.4 | $21,400.00 |
EP3C5M164I7N Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic IC that lets engineers implement arbitrary logic, DSP, and memory subsystems by configuring an array of configurable logic blocks (CLBs) connected through a programmable interconnect fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> semiconductors. They are distinct from ASICs because they are not mask-programmed: configuration is loaded from external flash at power-up, enabling fast prototyping and field updates. Cyclone III belongs to Intel's (formerly Altera's) low-cost, low-power FPGA family targeting cost-sensitive volume applications rather than high-performance transceivers.
Key differentiating features include the Cyclone III family's industry-leading low static and dynamic power for a 60 nm FPGA, 4-Mbit embedded memory blocks for buffer/RAM-intensive designs, dedicated hardware multipliers that accelerate DSP operations up to 18x18, and a flexible I/O bank structure supporting LVDS, SSTL, HSTL, and LVCMOS standards. The M164 Micro BGA footprint reduces board area versus TQFP packages while still enabling low-cost PCB fabrication with 0.5 mm pitch.
Architecturally, the device arranges logic elements into LABs (Logic Array Blocks), each containing 16 LEs, with M9K memory blocks distributed throughout the fabric. The configuration controller supports passive serial (PS), fast passive parallel (FPP), and active serial (AS) modes via industry-standard EPCS configuration devices. Periphery includes four general-purpose PLLs with spread-spectrum clocking, and each I/O bank has its own VREF pins for reference-voltage-based standards.
Typical applications include industrial motor control and machine vision, low-cost video processing and display controllers, consumer electronics glue logic, and telecom line-card interface bridges. The Cyclone III is also widely used in education and prototyping kits (such as the Altera/Intel DE0-Nano family) because of its favorable price-per-logic-element ratio.
When designing with the EP3C5M164I7N, ensure your Quartus II project sets the correct device package (M164) and speed grade (7) so timing analysis is accurate, and provide a low-noise 1.2 V core supply with bulk decoupling near each VCCINT pin. For multi-bank I/O standards, segregate SSTL/HSTL banks from LVCMOS banks using separate VCCIO rails to avoid contention.
This page consolidates Cyclone III family datasheet parameters, drop-in 164-MBGA alternatives, and design notes that go beyond the standard manufacturer datasheet to help engineers select and qualify the part quickly.
Drop-in alternatives for EP3C5M164I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C5M164I7N (same form factor and footprint) — differing in Package, Process Technology, Total Memory Bits, PLLs, Configuration Mode.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C5M164C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$14.5 / Unit
View Datasheet →EP3C5M164C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$17.2 / Unit
View Datasheet →EP3C5M164I7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$17.5 / Unit
View Datasheet →EP3C10M164I7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4CE5M164I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C5M164I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements (LE) | 5,136 |
| Logic Array Blocks (LAB) | 321 |
| Total RAM Bits | 423,936 bits |
| Embedded Memory Blocks (M9K) | 46 |
| Embedded 18x18 Multipliers | 23 |
| PLLs | 2 |
| Maximum User I/O Pins | 106 |
| User I/O Banks | 8 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 60 nm low-k CMOS (TSMC) |
| Package | 164-ball Micro BGA (M164), 8x8 mm, 0.5 mm pitch |
| Operating Junction Temperature | -40C to +100C (Industrial) |
| Speed Grade | 7 |
| Configuration Modes | Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) |
| RoHS Status | Compliant |
EP3C5M164I7N 164-ball micro bga (m164), 8x8 mm, 0.5 mm pitch Pin Configuration Guide
Pin configuration for EP3C5M164I7N (164-ball micro bga (m164), 8x8 mm, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C5M164I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C5M164I7N is suitable for 7 applications: Industrial Motor Control, Machine Vision Pre-Processing, Low-Cost Video Display Controller, Telecom Line-Card Glue Logic, Education and Prototyping Platform, Industrial Sensor Hub and Data Logger, Consumer Audio DSP Processor.
Industrial Motor Control
The EP3C5M164I7N is well suited to industrial motor control because its 23 embedded 18x18 multipliers can run field-oriented control (FOC) math in real time, while 2 PLLs synthesize the high-resolution PWM carrier frequencies (10-50 kHz) needed for IGBT drive stages. The 5,136 logic elements comfortably fit one FOC axis plus encoder decoding, and the 46 M9K memory blocks (423,936 bits) hold the sine/cosine lookup tables and per-cycle current samples. Placed on the same 164-MBGA footprint as the IGBT gate driver, it enables a compact inverter PCB.
Recommended
Machine Vision Pre-Processing
In entry-level machine vision, the EP3C5M164I7N handles image pre-processing pipelines such as Bayer demosaicing, color-space conversion (RGB to YCbCr), and basic convolution filtering. The 23 hardware multipliers accelerate 3x3 convolution kernels at VGA (640x480) frame rates, while 46 M9K blocks provide the line buffers needed for 2D filter windows. Per the Cyclone III Video Reference Design, this density comfortably implements a single-camera pipeline at 30 fps with room for trigger I/O and gigabit Ethernet glue logic.
Recommended
Low-Cost Video Display Controller
The EP3C5M164I7N is widely used as a display controller bridging LCD panels to embedded processors, especially when the host CPU cannot produce the exact LVDS timing required by the panel. Its 2 PLLs generate pixel clocks up to 108 MHz for WXGA (1366x768) displays, while 106 user I/O handle 24-bit RGB plus HSYNC/VSYNC/DE. The 5,136 LE budget supports color-space conversion, dithering, and on-screen display (OSD) compositing. The M164 Micro BGA footprint suits compact embedded LCD modules where TQFP packages would not fit.
Recommended
Telecom Line-Card Glue Logic
The EP3C5M164I7N serves as a flexible glue-logic bridge on telecom line cards, mapping between backplane SERDES, TDM buses, and control plane processors. Its 8 user I/O banks support mixed-voltage interfaces (3.3 V LVCMOS and 2.5 V SSTL) on the same die, eliminating external level shifters. Per the Cyclone III Device Handbook, the 23 multipliers can be re-tasked for FEC or channel coding in firmware updates, giving telecom OEMs a long-life programmable solution that survives processor obsolescence cycles.
Recommended
Education and Prototyping Platform
The Cyclone III EP3C5M164I7N is the silicon heart of the Altera/Intel DE0-Nano board and similar university development kits, because its 5,136 LEs are large enough to teach full processor cores (Nios II) while still affordable for student budgets. With 423 Kbits of embedded memory, students can implement custom cache hierarchies, and the 23 multipliers support hands-on DSP exercises such as FIR and FFT designs. The 164-MBGA package is soldered onto the dev board and exposed through standard 0.1" headers for breadboard prototyping.
Recommended
Industrial Sensor Hub and Data Logger
The EP3C5M164I7N integrates multi-protocol sensor hubs for industrial IoT edge nodes by combining 23 hardware multipliers for digital filtering of accelerometer/gyro data, 46 M9K blocks for circular sample buffers, and 2 PLLs for precise time-stamping of sensor events. The industrial temperature grade (-40C to +100C) is critical for factory-floor deployment, while the M164 package's compact 8x8 mm footprint enables DIN-rail-mountable data loggers. Per the Cyclone III Device Handbook, the 8 I/O banks isolate noisy digital sensor rails from clean analog front-end rails.
Recommended
Consumer Audio DSP Processor
The EP3C5M164I7N can implement multi-channel audio DSP pipelines such as parametric EQ, dynamic range compression, and crossover filters in mid-range sound bars and AV receivers. Each 18x18 multiplier runs at the audio sample rate (48 kHz) and supports 48-bit MACs when chained, while 46 M9K blocks store delay-line tap buffers for FIR filters up to 4,096 taps. The 2 PLLs generate the multiple I2S/TDM bit clocks required for 7.1 surround systems, and the 106 user I/O accept 8 input streams plus a control I2C/SPI bus.
Recommended
Recommended Products Summary
Engineering reference data for EP3C5M164I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C5M164C8N | EP3C5M164C7N | EP3C5M164I7 | EP3C10M164I7N | EP4CE5M164I7N |
|---|---|---|---|---|---|---|
| Package | 164-ball Micro BGA (M164) | 164-ball Micro BGA (M164) - same | 164-ball Micro BGA (M164) - same | 164-ball Micro BGA (M164) - same | 164-ball Micro BGA (M164) - same | 164-ball Micro BGA (M164) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone IV E |
| Logic Elements | 5,136 | 5,136 (same die) | 5,136 (same die) | 5,136 (same die) | 10,320 (2x more LE) | 5,136 (same) |
| Embedded RAM | 423,936 bits | 423,936 bits (same) | 423,936 bits (same) | 423,936 bits (same) | 423,936 bits (same) | 423,936 bits (same) |
| Multipliers (18x18) | 23 | 23 | 23 | 23 | 23 | 23 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 7 | 8 (slower) | 7 (same) | 7 (same) | 7 (same) | 7 (same) |
| User I/O Pins | 106 | 106 | 106 | 106 | 106 | 106 |
| Process / Static Power | 60 nm | 60 nm (same) | 60 nm (same) | 60 nm (same) | 60 nm (same) | 60 nm, lower static power |
Key Differentiators
- Industrial temperature grade with same speed grade (vs EP3C5M164C7N)
- Higher logic density in same package (vs EP3C5M164I7)
- Lower static power with same logic density (vs EP4CE5M164I7N)
Design Notes
Estimated: Cyclone III EP3C5M164I7N total power consumption ranges from approximately 200 mW (idle, low toggle rate) to 1.5 W (full logic utilization at 100 MHz core) when running on a 1.2 V core. The Cyclone III Device Handbook recommends a switching DC-DC regulator with at least 1.5 A peak capability and decoupling capacitors of 100 nF + 10 uF bulk near every VCCINT pin. The 8 I/O banks each require their own VCCIO rail decoupled with 100 nF + 1 uF to prevent switching noise from coupling into the core supply.
Estimated: The M164 Micro BGA has a 0.5 mm ball pitch and 8x8 mm body. PCB fabrication requires laser-drilled microvias or via-in-pad with ENIG plating to escape the inner-row balls. Place the FPGA at the center of the PCB with symmetric routing to minimize skew on high-speed LVDS pairs. Use 4-layer stack-up with continuous GND planes on layers 2 and 4, and route differential pairs with 100 ohm differential impedance. MSL level 3 requires dry-pack handling and bake-out if exposure exceeds 168 hours.
The Cyclone III PLL output jitter is approximately 200 ps peak-to-peak for the -7 speed grade, which is acceptable for SDR/DDR memory interfaces but may require external DLLs for protocols tighter than +/- 100 ppm. Reference clocks should be routed as 50 ohm controlled-impedance traces with length matching within 25 mils between PLL inputs. SSTL and HSTL I/O standards require external VTT termination resistors near the receiver end; the Cyclone III Device Handbook recommends 50 ohms to VTT for Class I and 25 ohms for Class II outputs.
Quartus II software assignments must match the physical package pin-out: selecting the wrong package (e.g., E144 instead of M164) will compile successfully but produce a board that does not work. Always re-import pin assignments when migrating between speed grades, because the same Quartus II project file works across I7/C7/C8 but the timing analysis differs. Do not mix SSTL and LVCMOS in the same I/O bank - each bank has one VCCIO rail that powers all its outputs, so mixing standards causes output-driver contention.
Estimated: At full 1A logic utilization and 100 MHz toggle rate, the EP3C5M164I7N dissipates approximately 1.0-1.5 W, yielding a junction temperature rise of about 20-30 C above ambient given the M164 Micro BGA's theta_JA of approximately 25 C/W with standard 4-layer PCB. Industrial parts must keep junction below +100 C; commercial parts below +85 C. For high-utilization designs add thermal vias under the center balls and consider a copper heat-spreader or forced-air cooling if ambient exceeds 70 C.
Compliance Information
RoHS and lead-free compliance per Altera/Intel product page and distributor listings (DigiKey, Mouser). Halogen-free status not explicitly stated in the provided data. AEC-Q100 not applicable - this is a general-purpose industrial FPGA, not automotive qualified.
