EP3C5M164I7 - Cyclone III FPGA, 5K LE, 164-MBGA | Intel
MPN: EP3C5M164I7 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.8 | $9,900.00 |
| 1,000 | $17.5 | $17,500.00 |
EP3C5M164I7 Overview
A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O behavior can be programmed after manufacture. Within the broader semiconductor taxonomy, the EP3C5M164I7 sits in the programmable logic device (PLD) hierarchy: FPGA -> PLD -> logic IC -> integrated circuit. Cyclone III specifically targets cost- and power-sensitive applications that need DSP, memory buffering, and parallel I/O without the cost of high-end Stratix-class FPGAs.
Key features include 5,136 logic elements (LEs), 423,936 bits (approximately 50 Kbyte) of embedded SRAM distributed in M9K blocks, up to 23 dedicated 18x18 multipliers for DSP operations, and 4 PLLs for clock management. The 164-MBGA package offers a compact 8x8 mm footprint, ideal for space-constrained boards. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability and supports configuration via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes.
Typical applications include industrial motor control, video bridging, sensor aggregation, low-cost DSP front-ends, and I/O expansion for microcontrollers. The 164-ball BGA provides sufficient I/O count for parallel RGB video capture, multi-channel UART/SPI bridging, and high-speed ADC/DAC interfacing. Designers favor Cyclone III for price-sensitive production runs where the legacy Altera toolchain (Quartus II) and IP libraries are already in use.
When designing with this FPGA, plan for 1.2 V core and 2.5 V/3.3 V I/O supply rails with proper decoupling (100 nF + 10 uF near each supply pin). The MBGA package requires careful PCB stack-up with microvia technology for breakout; verify thermal performance at full DSP utilization since the 65 nm process can dissipate 0.5-1 W under heavy logic toggling.
This page synthesizes current distributor stock and pricing, drop-in same-family alternatives from the Cyclone III family, and practical design notes not aggregated on a single manufacturer page, including PCB layout, configuration, and thermal guidance for the 164-MBGA package.
Drop-in alternatives for EP3C5M164I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C5M164I7 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Total Memory Bits, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C5M164C7N
✅ Drop-In✓ In Stock
$17.2 / Unit
View Datasheet →EP3C5M164C8N
✅ Drop-In✓ In Stock
$14.5 / Unit
View Datasheet →EP3C5F256I7N
✅ Drop-In✓ In Stock
$24 / Unit
View Datasheet →EP3C5E144I7N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP3C5M164I7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Logic Elements | 5,136 |
| Total Memory Bits | 423,936 (approx. 50 Kbyte) |
| Embedded Memory Blocks | M9K (9 Kbit blocks) |
| Embedded 18x18 Multipliers | Up to 23 |
| PLLs | 4 |
| Maximum User I/O | 106 |
| Process Technology | 65 nm low-power |
| Package | 164-MBGA (FineLine BGA), 8x8 mm |
| Operating Temperature (Junction) | -40C to +100C (Industrial) |
| Supply Voltage - Core | 1.2 V |
| Configuration Modes | JTAG, AS, PS, FPP |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP3C5M164I7 164-mbga (fineline bga), 8x8 mm Pin Configuration Guide
Pin configuration for EP3C5M164I7 (164-mbga (fineline bga), 8x8 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C5M164I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C5M164I7 is suitable for 6 applications: Industrial Motor Control, Video Bridging and Display Processing, Sensor Aggregation and I/O Expansion, Low-Cost DSP Front-End, Custom SoC with Nios II Soft Processor, Communication Protocol Bridging.
Industrial Motor Control
The EP3C5M164I7 is well suited for industrial motor control and variable-frequency drive front-ends. Its 5,136 logic elements and 23 dedicated 18x18 multipliers provide sufficient DSP headroom for field-oriented control (FOC) algorithms, SVPWM generation, and PI loop closures. The 106 user I/O of the 164-MBGA package can drive multi-axis encoder inputs (QEP), gate-driver enable signals, and isolated communication interfaces (RS-485, CAN). The industrial -40C to +100C junction temperature grade (denoted by I7) is essential for factory-floor deployments. Nios II/f soft-core offload can supervise safety logic while dedicated logic handles real-time commutation. Cyclone III's low static power (<0.5 W typical at 1.2 V) suits enclosed IP54 cabinet designs where cooling is constrained.
Recommended
Video Bridging and Display Processing
The EP3C5M164I7 handles low-resolution video bridging tasks such as RGB-to-LVDS conversion, frame-rate conversion, and on-screen display (OSD) overlay for industrial HMIs and digital signage. The 106 user I/O can accept parallel ITU-R BT.656 or VGA-style RGB inputs while the LVDS-capable I/O banks drive flat-panel displays. The 23 hardware multipliers accelerate scaling and color-space conversion math. The 423,936 bits of M9K block RAM buffer at least one full VGA frame (640x480x16bpp) for double-buffering. The compact 8x8 mm 164-MBGA footprint suits slim HMI panels. Nios II/e can run a lightweight uClinux or RTOS for protocol handling.
Recommended
Sensor Aggregation and I/O Expansion
The EP3C5M164I7 is widely used as a programmable I/O expander and protocol bridge for microcontrollers that lack sufficient UART, SPI, I2C, or GPIO resources. The 106 user I/O support 3.3 V LVTTL/LVCMOS as well as 2.5 V and 1.8 V I/O standards, allowing direct interfacing to modern low-voltage sensors and legacy 5 V peripherals (with level shifters). Hardware IP cores available in Quartus II implement I2C master/slave, SPI, UART, and even Modbus RTU. The 23 multipliers accelerate basic DSP front-ends for accelerometer and gyroscope fusion. Nios II/e supervises complex state machines, offloading real-time protocol work from a host CPU.
Recommended
Low-Cost DSP Front-End
The EP3C5M164I7's 23 dedicated 18x18 hardware multipliers support up to 23 multiply-accumulate (MAC) operations per clock cycle, ideal for FIR filters, IIR filters, and small FFT implementations. The 423 Kbit M9K memory buffers filter taps and intermediate samples, while the 4 PLLs generate multiple sample-rate clocks from a single reference. Typical applications include audio processing (sample-rate conversion, EQ, dynamics), instrumentation signal conditioning, and software-defined radio (SDR) baseband processing for narrowband protocols. Nios II/f can supervise filter coefficient updates and parameter changes without external CPU intervention.
Recommended
Custom SoC with Nios II Soft Processor
The EP3C5M164I7 is a popular host for the Nios II soft-core processor, enabling custom system-on-chip designs that combine user logic, peripherals, and a 32-bit RISC CPU on a single die. A Nios II/e core uses roughly 600-700 LEs, leaving over 4,400 LEs for custom accelerators and peripherals. Designers add custom Avalon-MM or Avalon-ST peripherals such as PWM generators, capture timers, DMA engines, and proprietary interfaces. Industrial 0C-100C operating junction temperature makes the part deployment-ready for unattended edge nodes. The 164-MBGA package provides enough I/O for memory (SRAM, SDRAM) and multiple external peripherals.
Recommended
Communication Protocol Bridging
The EP3C5M164I7's 106 user I/O and 5,136 logic elements make it a strong fit for protocol-bridging applications such as UART-to-SPI, I2C-to-CAN, Ethernet-to-serial, and proprietary industrial bus gateways. The Cyclone III device family supports hard IP cores for 10/100 Ethernet MAC and PCI Express via licensing, while the abundant logic implements soft UART, SPI, I2C, and Modbus cores. The 4 PLLs provide independent clocks for each interface, eliminating the need for external clock buffers. Cyclone III's low power suits always-on industrial gateways. Designers can field-update the FPGA bitstream to add new protocols post-deployment.
Recommended
Recommended Products Summary
Engineering reference data for EP3C5M164I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C5M164C7N | EP3C5M164C8N | EP3C5F256I7N | EP3C5E144I7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 164-MBGA (8x8 mm) | 164-MBGA (8x8 mm) - same | 164-MBGA (8x8 mm) - same | 164-MBGA - same | 144-EQFP - different |
| Logic Elements | 5,136 | 5,136 (same die) | 5,136 (same die) | 5,136 (same die) | 5,136 (same die) |
| Memory Bits | 423,936 | 423,936 | 423,936 | 423,936 | 423,936 |
| 18x18 Multipliers | 23 | 23 | 23 | 23 | 23 |
| Max User I/O | 106 | 106 | 106 | 106 | 94 (EQFP has fewer pins) |
| Operating Temperature (Junction) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | 7 (I7 suffix) | 7 (C7 suffix) | 8 (C8 suffix) | 7 (I7 suffix) | 7 (I7 suffix) |
| PLLs | 4 | 4 | 4 | 4 | 4 |
Key Differentiators
- Industrial temperature grade in 164-MBGA package (vs EP3C5M164C7N)
- 7 ns speed grade for tightest timing closure (vs EP3C5M164C8N)
- MBGA package maximizes I/O density in compact footprint (vs EP3C5E144I7N)
Design Notes
The EP3C5M164I7 requires three supply rails: 1.2 V core (VCCINT), 2.5 V analog PLL (VCCA), and 2.5 V-3.3 V I/O (VCCIO, bank-dependent). Decoupling must include 100 nF X7R ceramic capacitors within 5 mm of every VCC pin plus 10 uF bulk capacitors on each rail. The PLL analog supply requires an LC filter (ferrite bead + 10 uF + 100 nF) to isolate switching noise from the digital core. Estimated: under typical conditions the EP3C5 core draws 200-400 mA at 1.2 V plus I/O current proportional to switching activity.
The 164-MBGA package uses a 0.5 mm ball pitch and requires PCB microvia technology (laser-drilled or staggered microvias) for breakout. A 4-layer stack-up with 0.5 oz copper on outer layers and 1 oz on inner power planes is recommended. Place a continuous ground plane on layer 2 directly under the BGA to provide a low-impedance return path. Fan-out from the BGA with dog-bone or via-in-pad pattern. Keep all BGA balls connected - even unused I/O balls should be tied to ground or a defined rail to prevent floating-input leakage.
The 164-MBGA package has a thermal resistance theta_JA of approximately 20-25 C/W on a 4-layer JEDEC test board. Under worst-case DSP utilization with high toggle rates, the EP3C5 can dissipate 0.5-1 W, producing a junction temperature rise of 10-25 C above ambient. In sealed enclosures without airflow, derate to industrial temperature grade (I7, +100C max junction) by ensuring ambient stays below +75C. Thermal vias under the exposed die pad (if present) reduce theta_JA further; consult the package thermal model for exact values.
Do not leave MSEL[2:0] configuration-mode-select pins floating - they must be tied to VCCIO or GND through 1-10 kohm resistors to select the desired configuration mode (AS, PS, FPP, JTAG). The CONF_DONE, nSTATUS, and nCONFIG pins require 10 kohm pull-ups to VCCIO_3p3. The JTAG TCK pin needs a 10 kohm pull-down if not used. Failure to properly bias these pins causes unreliable configuration or boot failures. Also ensure the configuration flash (EPCS) shares a clean ground with the FPGA ground plane to avoid configuration corruption.
Compliance Information
RoHS and REACH compliant per Intel/Altera product declaration. Not AEC-Q100 qualified - for automotive applications, use the automotive-grade Cyclone III variants or migrate to Cyclone IV Auto / Cyclone 10 LP Auto families.
