EP3SL150F1152C2N - 142.5K LE Stratix III L FPGA 1152-BGA | Altera
MPN: EP3SL150F1152C2N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1410 | $705,000.00 |
| 1,000 | $1280 | $1,280,000.00 |
EP3SL150F1152C2N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> logic ICs -> integrated circuits, and are commonly used for high-throughput digital signal processing, protocol bridging, and ASIC prototyping where fixed-function ASSPs cannot meet performance or flexibility requirements.
Key specifications include 600 MHz maximum operating frequency, 1.1 V core voltage, 5700 LABs, and dedicated DSP blocks for high-speed arithmetic. The Stratix III L family is the lower-static-power variant of the Stratix III series, making it well-suited for thermally constrained systems. Modular I/O banks with a common structure support vertical migration across the family and offer dynamic on-chip termination, output delay, and current strength control for best-in-class signal integrity.
Typical applications include high-end communications infrastructure, ASIC prototyping, high-performance DSP pipelines, military/aerospace signal processing, and test & measurement backplanes. The 1152-ball FCBGA provides ample routing escape for high-speed LVDS, DDR3 memory controllers, and multi-gigabit transceiver I/O, while the Stratix III L variant reduces idle power relative to standard Stratix III devices.
When designing with this device, use the Altera Quartus II design suite (or later Intel Quartus Prime) to estimate fMAX, power, and pin assignments before PCB layout. The 1152-FCBGA requires a multi-layer PCB with sequential lamination and microvia technology; verify package-specific ball maps and supply-rail decoupling against the manufacturer datasheet before finalizing stackup and BOM.
This page synthesizes distributor pricing, drop-in same-family speed/pin alternatives, and practical design notes for the Stratix III L family not found in any single distributor listing.
Drop-in alternatives for EP3SL150F1152C2N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL150F1152C2N (same form factor and footprint) β differing in RoHS Status, Family, Series, Speed Grade, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL150F1152C4N
β Drop-Inβ In Stock
$2150 / Unit
View Datasheet βEP3SL150F1152C2G
β Drop-Inπ Reference alternative (not in catalog)
EP3SL150F1152C3N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP3SL150F1152C4LN
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP3SE260F1152C2N
β Drop-Inβ In Stock
$11000 / Unit
View Datasheet βEP3SE260F1152C2G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$2050 / Unit
View Datasheet βEP3SL150F1152C2N Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Logic Elements | 142,500 |
| LABs (Logic Array Blocks) | 5,700 |
| Total Memory Bits | 6,543,360 |
| Maximum User I/O | 744 |
| Operating Frequency (max) | 600 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage (VCCINT) | 1.1 V |
| Number of Ball/Pin Count | 1152 |
| Package Type | 1152-BBGA, FCBGA (FineLine) |
| Mounting Type | Surface Mount |
| Speed Grade | C2 (Commercial) |
| Operating Temperature | 0C to +85C (Commercial) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP3SL150F1152C2N Pin Configuration
| Pin Bank 7A | User I/O Bank 7A β Top-left I/O bank, LVDS-capable |
| Pin Bank 7B/7C | User I/O Banks 7B/7C β Top I/O banks, mixed-voltage capable |
| Pin Bank 8A | User I/O Bank 8A β Top-right I/O bank, LVDS-capable |
| Pin Bank 1A | User I/O Bank 1A β Right I/O bank, mixed-voltage capable |
| Pin Bank 1B/1C | User I/O Banks 1B/1C β Right I/O banks, LVDS-capable |
| Pin Bank 2A | User I/O Bank 2A β Bottom-right I/O bank, LVDS-capable |
| Pin Bank 2B/2C | User I/O Banks 2B/2C β Bottom I/O banks, mixed-voltage capable |
| Pin Bank 3A | User I/O Bank 3A β Bottom-left I/O bank, LVDS-capable |
| Pin Bank 4A | User I/O Bank 4A β Left I/O bank, LVDS-capable |
| Pin Bank 5A | User I/O Bank 5A β Left-center I/O bank, LVDS-capable |
| Pin Bank 6A | User I/O Bank 6A β Left-top I/O bank, LVDS-capable |
| Pin VCCINT | Core Supply β 1.1 V core voltage supply balls |
| Pin VCCIO | I/O Supply β Bank I/O voltage supply balls (per-bank) |
| Pin VCCPGM | Configuration Supply β Configuration RAM programming supply |
| Pin VCCA | PLL Analog Supply β PLL analog voltage supply |
| Pin GND | Ground β Ground reference balls (many) |
| Pin CLKIN | Clock Inputs β Dedicated clock input pins |
| Pin TMS/TCK/TDI/TDO | JTAG Pins β JTAG boundary-scan test pins |
| Pin MSEL | Mode Select β Configuration mode select pins |
| Pin nCONFIG/nSTATUS | Configuration Control β Configuration control and status pins |
| Pin DCLK | Configuration Clock β Configuration clock input |
| Pin DATA | Configuration Data β Configuration data input pins |
Typical Applications
EP3SL150F1152C2N is suitable for 6 applications: High-End Communications Infrastructure, ASIC Prototyping and Emulation, High-Performance DSP Pipelines, Military and Aerospace Signal Processing, Test and Measurement Backplanes, Industrial Automation and Machine Vision.
High-End Communications Infrastructure
The EP3SL150F1152C2N's 142,500 logic elements, 6.5 Mbit embedded memory, and 744 user I/Os make it an ideal fabric for line-card packet processing in carrier-grade routers, OTN framer/mapper designs, and multi-10G Ethernet aggregation. The Stratix III L variant's reduced static power versus the standard Stratix III helps meet the thermal budgets of sealed outdoor enclosures. Modular I/O banks support SFI-5.1, XAUI, and Interlaken interfaces without external bridging PHYs. Place-and-route in Quartus II achieves timing closure on 312 MHz LVDS DDR2 controllers while leaving headroom for hitless OAM updates and on-chip traffic management.
Recommended
ASIC Prototyping and Emulation
The EP3SL150F1152C2N delivers 142.5K logic elements across 5,700 LABs with 6.5 Mbit block RAM, providing the capacity to prototype ASICs up to ~3M gates in a single device. The 600 MHz fMAX supports emulation of synchronous logic at near-real-time rates for SoC validation, while modular I/O banks expose hundreds of general-purpose pins for bring-up test access. Quartus II incremental compilation enables multi-engineer team workflows typical of multi-million-gate ASICs. The 1152-FCBGA footprint provides ample debug access and supports daughter-card FPGA expansion for multi-FPGA partitioning.
Recommended
High-Performance DSP Pipelines
The Stratix III L family integrates dedicated DSP blocks alongside 142.5K logic elements, enabling high-throughput signal processing for radar baseband, software-defined radio, and medical imaging front-ends. The 600 MHz fabric supports multi-Gigasample/sec FIR filters and FFT pipelines, while 6.5 Mbit embedded memory buffers complex samples without external SRAM. Modular I/O banks with dynamic on-chip termination and current strength control preserve signal integrity on ADC/DAC interfaces up to 1 Gsps. Reduced static power versus standard Stratix III simplifies thermal design in sealed enclosures.
Recommended
Military and Aerospace Signal Processing
The EP3SL150F1152C2N in a 1152-ball FCBGA is well-suited for radar, electronic warfare, and secure-communications subsystems where high logic density meets the need for MIL-STD-810 thermal and vibration tolerance. Stratix III L's reduced static power extends mission endurance on power-constrained platforms. The 6.5 Mbit embedded memory supports large pulse-compression buffers, while 744 user I/Os enable multi-channel ADC/DAC fan-out. Designers should select the industrial or military screening variant and validate the package's mechanical robustness against shock and vibration profiles per MIL-STD-810.
Recommended
Test and Measurement Backplanes
The EP3SL150F1152C2N's 744 user I/Os and high logic density enable multi-channel protocol analyzer backplanes, BERT (bit-error-rate tester) cores, and arbitrary waveform generator DSP. The Stratix III L family supports 1.4 Gbps LVDS and DDR3 memory interfaces via modular I/O banks, simplifying real-time capture of multi-lane serial buses. Quartus II place-and-route on a 1152-FCBGA accommodates dense pin assignments across multiple test channels. Lower static power versus standard Stratix III reduces cooling requirements in rack-mounted instruments with high channel counts.
Recommended
Industrial Automation and Machine Vision
The EP3SL150F1152C2N's logic capacity and embedded memory support real-time machine vision pipelines, multi-axis motion control, and high-speed industrial protocol bridging in factory automation. The 744 user I/Os fan out to GigE Vision, CoaXPress, and Camera Link interfaces without external bridge chips, while 6.5 Mbit embedded memory buffers frames between sensor and host. The lower-static-power Stratix III L variant simplifies sealed enclosure thermal design. Quartus II supports Qsys system integration for rapid assembly of vision-processing IPs alongside deterministic real-time control logic.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL150F1152C2N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL150F1152C4N | EP3SL150F1152C2G | EP3SE260F1152C2N |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Package | 1152-BBGA FCBGA | 1152-BBGA FCBGA - same | 1152-BBGA FCBGA - same | 1152-BBGA FCBGA - same |
| Logic Elements | 142,500 | 142,500 - same | 142,500 - same | 254,000 (+78%) |
| Embedded Memory (bits) | 6,543,360 | 6,543,360 - same | 6,543,360 - same | 14,688,000 (+124%) |
| Speed Grade | C2 | C4 (slower) | C2 - same | C2 - same |
| Maximum User I/O | 744 | 744 - same | 744 - same | 744 - same |
| Core Voltage | 1.1 V | 1.1 V - same | 1.1 V - same | 1.1 V - same |
| Process Technology | 65 nm | 65 nm - same | 65 nm - same | 65 nm - same |
| Family Variant | Stratix III L (low-power) | Stratix III L - same | Stratix III L - same | Stratix III E (enhanced) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- Lowest-static-power variant in the Stratix III family (vs EP3SE260F1152C2N (Stratix III E))
- Higher logic and memory density than older Stratix II family (vs EP2S90F1508C5N (Stratix II 90K LE))
- Industry-leading I/O count in 65 nm generation (vs Xilinx Virtex-5 LX110T (XC5VLX110T))
- C2 speed grade delivers the highest fMAX in Stratix III L (vs EP3SL150F1152C4N (C4 grade))
Design Notes
Estimated: based on Stratix III family power calculator (Quartus II PowerPlay), a fully loaded EP3SL150F1152C2N design at 600 MHz fMAX with typical utilization (~70% LE, ~50% block RAM, moderate DSP) can dissipate 6-9 W dynamic + 1-2 W static. Use the Quartus II Early Power Estimator before final PCB design to budget for the 1.1 V VCCINT regulator (recommend 12-15 W capacity for design headroom). Decouple each VCCINT ball with a 0.1 uF X7R capacitor within 100 mils of the package, and place 22 uF bulk capacitors around the BGA perimeter.
The 1152-ball FCBGA requires a multilayer PCB (typically 8-12 layers) with sequential lamination and laser-drilled microvias for inner-row breakout. Use 1.0 mm ball pitch with 0.5 mm via-in-pad or dog-bone fan-out; verify with your PCB vendor that the stackup supports microvia reliability per IPC-6012 Class 3 for production. Match differential pair lengths to within 5 mils and route 50 ohm single-ended / 100 ohm differential controlled-impedance traces per Altera's pin connection guidelines.
Estimated: the 1152-FCBGA has a typical theta_JA of approximately 5-8 C/W with a properly designed 4-layer PCB and adequate airflow. For sealed enclosures without airflow, derate by 50% and consider a heatsink bonded to the package top with thermal interface material. Use on-die temperature sensing diodes (built into Stratix III) routed to a TMP411 or equivalent to monitor junction temperature during characterization, and validate thermal headroom against the worst-case power consumption from the Early Power Estimator.
Place configuration and clock pins (CLKIN, nCONFIG, nSTATUS, MSEL, JTAG) on board edges accessible to the configuration device and JTAG header. Route all VCCINT/VCCIO/VCCA power rails as wide planes in inner layers, and place ferrite beads or pi-filters on each PLL VCCA pair to isolate analog supplies from digital switching noise. Reserve floorplan channels for memory interfaces (DDR3) to keep matched-length traces short; reference Altera's external memory interface pin tables in the device handbook.
Do not mix MSEL pull-ups/pull-downs across configuration modes without verifying the configuration device's expected MSEL pattern - incorrect MSEL prevents boot. Ensure all VCCIO banks have the correct I/O standard voltage (1.2V, 1.5V, 1.8V, 2.5V, 3.3V) before driving signals, since LVDS and LVTTL cannot share a bank without specific multiplexing. For NRND designs, plan an obsolescence mitigation path (Stratix IV, Stratix V, or Cyclone V migration) and verify firmware portability before committing to long-lead inventory.
Compliance Information
RoHS and lead-free status confirmed via Altera/Intel product page and authorized distributor listings (DigiKey, Mouser). AEC-Q100 not applicable for FPGAs. Halogen-free status not stated in available data.
