EP3SL50F780C3N - 47.5K LE Stratix III L FPGA, 780-FBGA | Altera
MPN: EP3SL50F780C3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $722.96 | $722.96 |
| 10 | $695 | $6,950.00 |
| 100 | $645 | $64,500.00 |
| 500 | $595 | $297,500.00 |
| 1,000 | $555 | $555,000.00 |
EP3SL50F780C3N Overview
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic resources, interconnect, and I/O behavior can be reconfigured by the user after manufacture, allowing a single silicon device to implement custom digital circuits, DSP pipelines, memory controllers, or even entire Systems-on-Chip. The Stratix III L sub-family targets lower static and dynamic power versus the standard Stratix III family while retaining the same Adaptive Logic Module (ALM) architecture, TriMatrix embedded memory blocks, and DSP blocks. Within the broader taxonomy, FPGAs sit above Application-Specific Standard Products (ASSPs) and Application-Specific Integrated Circuits (ASICs) in design flexibility, and below microcontrollers in software-driven simplicity; they are essential when design requirements change rapidly or when parallelism and hardware-accelerated throughput are required.
Key features of the EP3SL50F780C3N include 47,500 logic elements, 1900 LABs, 2,184,192 embedded RAM bits, 488 maximum user I/Os, and a 500 MHz maximum internal operating frequency per the verified distributor listings. The 65 nm process node reduces die size and static leakage relative to earlier 90 nm Stratix II devices, while the FC-FBGA package offers flip-chip attachment for superior thermal and electrical performance versus wire-bond BGA. The device is part of the Altera (now Intel) FPGA portfolio and is supported by the Quartus II design suite.
Typical applications for the EP3SL50F780C3N include wireline telecom line cards, broadcast video processing, military and aerospace signal processing, ASIC prototyping, and high-performance DSP designs. Its combination of logic density, embedded memory, and high I/O count also makes it suitable for industrial control, medical imaging front-ends, and test-and-measurement instruments. With 488 user I/Os, the package supports multiple parallel interface standards such as LVDS, DDR memory controllers, and high-speed serial transceiver companion interfaces via the FPGA's general-purpose I/O structure.
When designing with this device, engineers should pay attention to the Stratix III power-up sequencing requirements, PCB BGA fanout and via-in-pad layout recommendations, and the Quartus II pin assignment tooling. The 780-ball FC-FBGA land pattern requires 1.0 mm pitch (typical of Stratix III FBGA-780 packages), demanding multilayer PCB stackups and controlled-impedance routing. Reference the Altera Stratix III Device Handbook for detailed pinout, thermal, and configuration scheme information.
This page synthesizes distributor pricing from DigiKey, Mouser, Heisener, and Octopart, structured drop-in alternatives for the Stratix III L family, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a one-stop reference for evaluating the EP3SL50F780C3N.
Drop-in alternatives for EP3SL50F780C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL50F780C3N (same form factor and footprint) β differing in Package, Speed Grade, RoHS Status, Configuration Method, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL50F780C4N
β Drop-Inβ In Stock
$162 / Unit
View Datasheet βEP3SL50F780C2N
β Drop-Inβ In Stock
$312 / Unit
View Datasheet βEP3SL50F780C3G
β Drop-Inβ In Stock
$625 / Unit
View Datasheet βEP3SL50F780C3
β Drop-Inβ In Stock
$540 / Unit
View Datasheet βEP3SL50F780I3N
β Drop-Inβ In Stock
$385 / Unit
View Datasheet βEP3SE50F780C3N
β Drop-Inβ In Stock
$717.12 / Unit
View Datasheet βEP3SL50F780C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix III L (low-power sub-family) |
| Series | EP3SL50 |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 47,500 |
| Number of LABs/CLBs | 1900 |
| Total RAM Bits | 2,184,192 |
| Number of I/Os | 488 |
| Number of Outputs | 488 |
| Maximum Internal Frequency | 500 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.1 V |
| Package | 780-BBGA, FCBGA (Flip-Chip FBGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) |
| RoHS Status | Compliant |
EP3SL50F780C3N Pin Configuration
| Pin A1 | I/O β User I/O ball (refer to Quartus II pin-out file for bank assignment) |
| Pin A20 | VCCIO β I/O bank supply voltage |
| Pin B5 | GND β Ground reference |
| Pin B19 | I/O β User I/O ball |
| Pin C3 | VCCINT β Core supply voltage (1.1 V) |
| Pin C17 | I/O β User I/O ball |
| Pin D8 | VCCAUX β Auxiliary supply voltage |
| Pin D14 | I/O β User I/O ball |
| Pin E2 | GND β Ground reference |
| Pin E20 | I/O β User I/O ball |
| Pin F11 | VCCP β PLL supply voltage |
| Pin F19 | I/O β User I/O ball |
| Pin G1 | I/O β User I/O ball |
| Pin G15 | GND β Ground reference |
| Pin H6 | I/O β User I/O ball |
| Pin H17 | VCCIO β I/O bank supply voltage |
| Pin J3 | I/O β User I/O ball |
| Pin J20 | GND β Ground reference |
| Pin K10 | I/O β User I/O ball |
| Pin K14 | VCCINT β Core supply voltage (1.1 V) |
Typical Applications
EP3SL50F780C3N is suitable for 7 applications: Telecom Line Card Processing, Broadcast Video Processing, Military & Aerospace Signal Processing, ASIC Prototyping, Industrial Control and Automation, Medical Imaging Front-End, Test & Measurement Instrumentation.
Telecom Line Card Processing
The EP3SL50F780C3N's 47,500 logic elements and 488 user I/Os make it well-suited for telecom line card processing, where parallel packet classification, traffic shaping, and SERDES aggregation are required. The Stratix III L sub-family delivers this logic density with reduced static leakage, ideal for multi-slot chassis where dozens of line cards compound power budgets. With 2,184,192 bits of embedded RAM, the device can buffer packet headers and lookup tables without external memory, while the 500 MHz internal fabric frequency supports line-rate processing for 1G/10G Ethernet aggregation. Placed as the central forwarding engine between the backplane SERDES and the NPU, the EP3SL50F780C3N lowers bill-of-material cost versus larger Stratix devices.
Recommended
Broadcast Video Processing
For broadcast video processing pipelines (SD/HD/3G-SDI switching, format conversion, and color-space manipulation), the EP3SL50F780C3N provides 488 I/Os sufficient to fan out multiple SDI streams alongside memory interfaces. The Stratix III L sub-family's low-power profile is critical in broadcast routers where dozens of FPGA-equipped blades reside in a single chassis. With 1900 LABs the device supports parallel pixel-domain processing at 1080p60 line rates. Designers pair the FPGA with external DDR2/DDR3 memory for frame buffering; the 2,184,192 embedded RAM bits handle line-store and chroma interpolation internally. Quartus II's DSP Builder accelerates FIR and color-matrix implementations on this device.
Recommended
Military & Aerospace Signal Processing
The EP3SL50F780C3N fits military and aerospace signal-processing applications such as radar pre-processing, electronic-warfare front-ends, and software-defined radio (SDR) baseband, where its 47,500 logic elements implement FFTs, modulation/demodulation, and beamforming pipelines. For extended-temperature deployments, designers select the I-grade EP3SL50F780I3N drop-in variant covering -40C to +100C; the commercial-grade EP3SL50F780C3N suits indoor and benign-environment platforms. The 65 nm process node and Altera's radiation-tolerant design flow support high-altitude and space applications when paired with appropriate mitigation. The 780-ball FC-FBGA package withstands shock and vibration in MIL-STD-810 environments.
Recommended
ASIC Prototyping
ASIC prototyping using FPGAs requires high logic density, abundant I/O, and predictable timing - all delivered by the EP3SL50F780C3N with 47,500 logic elements and 488 user I/Os. Engineers map ASIC netlists onto the Stratix III L fabric using Quartus II synthesis, then partition the design across multiple FPGAs when logic capacity is exceeded. The 780-ball FC-FBGA package exposes enough I/O to bridge between sibling FPGAs via LVDS, preserving high-speed interconnect bandwidth. With 2,184,192 embedded RAM bits the device can model ASIC SRAM macros on-chip. The C3 commercial speed grade offers a balance of cost and timing margin typical for pre-silicon validation.
Recommended
Industrial Control and Automation
For industrial control applications such as programmable logic controllers (PLCs), motion controllers, and machine-vision systems, the EP3SL50F780C3N delivers real-time deterministic logic with 488 I/Os to interface with multiple encoders, sensors, and actuator channels. The Stratix III L sub-family's lower power dissipation simplifies thermal design in sealed IP65/IP67 enclosures where fan cooling is impractical. With 1900 LABs, the device implements complex state machines for multi-axis motion control and EtherCAT / PROFINET industrial Ethernet protocols. The 500 MHz fabric frequency supports sub-microsecond control loop periods required for high-precision servo systems.
Recommended
Medical Imaging Front-End
In medical imaging front-ends (ultrasound beamforming, MRI pre-processing, CT reconstruction), the EP3SL50F780C3N offers 47,500 logic elements capable of implementing parallel FIR filter banks, Hilbert transforms, and envelope detection. With 488 user I/Os the device can aggregate data from multi-channel ADC arrays in parallel, while the 2,184,192 embedded RAM bits serve as line buffers for image reconstruction. The Stratix III L sub-family's low static leakage reduces thermal load in patient-adjacent equipment where fan noise must be minimized. The 780-ball FC-FBGA package accommodates the dense PCB layout required for high-channel-count ultrasound probes.
Recommended
Test & Measurement Instrumentation
Test-and-measurement instruments such as oscilloscopes, logic analyzers, arbitrary waveform generators, and protocol analyzers leverage the EP3SL50F780C3N's 488 user I/Os and 47,500 logic elements for high-speed data acquisition and real-time signal processing. With 2,184,192 embedded RAM bits the device supports deep acquisition memory without external SRAM, while the 500 MHz fabric enables real-time triggering and statistics computation. Quartus II's IP library provides PCIe, DDR, and JTAG cores that integrate cleanly into instrument firmware. The 780-ball FC-FBGA package enables dense front-panel connector fanout on compact instrument mainboards.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL50F780C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL50F780C4N | EP3SL50F780C2N | EP3SL50F780C3G | EP3SL50F780I3N | EP3SE50F780C3N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed Grade | C3 (commercial) | C4 (faster) | C2 (slower) | C3 (same, Pb-free finish) | I3 (industrial temp, same speed) | C3 (E sub-family, higher power) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Sub-Family | Stratix III L (low-power) | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E (enhanced, high-power) |
| Number of LABs | 1900 | 1900 | 1900 | 1900 | 1900 | 1900 |
| Total RAM Bits | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 |
| Maximum User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Stratix III L sub-family lowest static power in 780-ball FBGA class (vs EP3SE50F780C3N)
- Direct drop-in upgrade path with EP3SL50F780C4N (vs EP3SL50F780C4N)
- Industrial temperature drop-in option with EP3SL50F780I3N (vs EP3SL50F780I3N)
Design Notes
The Stratix III L sub-family requires multiple supply rails: VCCINT (1.1 V core), VCCIO (per-bank I/O voltage, 1.2 V to 3.0 V), VCCAUX (2.5 V auxiliary), and VCCP (1.1 V or 1.2 V PLL). Per the Stratix III Device Handbook, power-up sequencing is critical: VCCINT must ramp before VCCAUX, and VCCIO banks must follow Altera's recommended sequence to prevent latch-up and ensure successful configuration. Use Altera's PowerPlay Early Power Estimator (EPE) before layout to size the regulator stages. Estimated: at 500 MHz and full I/O utilization the EP3SL50 can draw 2-4 A from VCCINT plus 500-800 mA from VCCAUX depending on toggle rate.
The 780-ball FC-FBGA package uses 1.0 mm pitch BGA balls, requiring via-in-pad or dog-bone fanout on a multilayer PCB with at least 8-10 layers to route 488 user I/Os plus all power and ground balls. Per the Altera Stratix III PCB Design Guidelines, designers should use 0.5-0.6 mm drill micro-vias in pad, with full ground and power planes adjacent to the BGA fanout layers for signal integrity and thermal dissipation. Maintain 100 ohm differential or 50 ohm single-ended controlled impedance on all high-speed traces. Decoupling: place 0.1 uF and 0.01 uF ceramic capacitors within 100 mil of every VCCINT and VCCAUX ball, plus bulk 22 uF tantalum at each regulator output.
The FC-FBGA package's flip-chip thermal interface requires PCB thermal management, especially for industrial and aerospace variants. Per Stratix III thermal guidelines, thermal resistance (theta_JA) is approximately 8-12 C/W with a properly designed thermal via array and heatsink, but rises to 25-35 C/W without thermal vias. Estimated: at 3 W total power dissipation and 35 C/W theta_JA, junction temperature rise above ambient is 105 C - well above the 125 C maximum for commercial-grade parts. Always implement a thermal via array (15+ vias under the die) and consider a small heatsink for continuous high-utilization operation.
Common pitfalls when designing with the EP3SL50F780C3N include: (1) omitting the MSEL configuration mode pins - these MUST be pulled high or low to select AS, PS, FPP, or JTAM configuration schemes per Stratix III handbook; (2) confusing the L (low-power) sub-family with the E (enhanced) sub-family - the E variant consumes significantly more power and cannot be substituted without re-running power analysis; (3) using the wrong Quartus II device library version - older libraries may not include the latest silicon revisions; (4) failing to assign all CONFIG_DONE, nSTATUS, and nCONFIG pins - these require external 10 kohm pull-ups for reliable configuration. Always verify pin assignments against the Quartus II Fitter report before tape-out.
Compliance Information
RoHS compliant per Altera/Intel product page and the 'N' suffix in the MPN. Not AEC-Q100 qualified (automotive FPGAs use different families). Halogen-free status not explicitly stated in verified data. Lifecycle status: obsolete.
