EP3SL340H1152I4N - Stratix III L 337500-Cell FPGA, 717MHz | Intel
MPN: EP3SL340H1152I4N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 10 | $2950 | $29,500.00 |
| 100 | $2680 | $268,000.00 |
| 250 | $2410 | $602,500.00 |
| 500 | $2150 | $1,075,000.00 |
EP3SL340H1152I4N Overview
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing programmable logic blocks (logic elements/LEs), programmable interconnect, and dedicated hardware blocks such as DSP slices, block RAM (BRAM), phase-locked loops (PLLs), and high-speed transceivers. Stratix III L devices are positioned between standard FPGAs and ASICs in the programmable-logic taxonomy: FPGA -> programmable logic device (PLD) -> programmable logic -> digital IC -> semiconductor. The 'L' variant is optimized for lower static power versus the standard Stratix III family.
Key features include 13,500 Logic Array Blocks (LABs) for parallel logic implementation, 18,822,144 bits (approximately 2.25MB) of on-chip embedded memory, and a 1.05V-1.15V core supply that reduces dynamic power versus 90nm predecessors. The FCBGA-1152 package provides high I/O density and excellent signal-integrity for high-speed serial interfaces. The device is lead-free and RoHS-compliant, suitable for industrial and commercial designs.
Typical applications include real-time signal processing, programmable logic acceleration, communications infrastructure (baseband, protocol bridging), industrial automation controllers, and custom hardware acceleration for data-intensive workloads. The combination of high logic density and embedded memory allows designers to integrate entire subsystems - DSP pipelines, packet processors, or compute engines - into a single chip.
When designing with the EP3SL340H1152I4N, ensure proper power-rail decoupling close to the FCBGA balls, follow Altera/Intel PCB layout guidelines for BGA fan-out, and use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and timing closure. The 'I4N' suffix denotes industrial temperature grade (-40C to +100C) and lead-free (Pb-free) assembly. This page synthesizes distributor pricing, same-family Stratix III drop-in alternatives, and PCB layout considerations that complement the manufacturer datasheet.
Drop-in alternatives for EP3SL340H1152I4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340H1152I4N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Core Voltage, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL340H1152I4LN
β Drop-Inβ In Stock
$18050 / Unit
View Datasheet βEP3SL340H1152I4
β Drop-Inβ In Stock
$15100 / Unit
View Datasheet βEP3SL340H1152C4N
β Drop-Inβ In Stock
$1245 / Unit
View Datasheet βEP3SL340H1152C4LN
β Drop-Inβ In Stock
$1980 / Unit
View Datasheet βEP3SL340H1152C4L
β Drop-Inβ In Stock
$3500 / Unit
View Datasheet βEP3SL340H1152C4
β Drop-Inβ In Stock
$11000 / Unit
View Datasheet βEP3SE260F1152I4N
β Drop-Inβ In Stock
$2050 / Unit
View Datasheet βEP3SE110F1152I4N
β Drop-Inβ In Stock
$2950 / Unit
View Datasheet βEP3SL340H1152I4N Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Logic Elements | 337,500 |
| Logic Array Blocks (LABs) | 13,500 |
| Embedded Memory (Bits) | 18,822,144 |
| User I/Os | 744 |
| Maximum Core Frequency | 717 MHz |
| Core Voltage | 1.05 V to 1.15 V |
| Process Technology | 65 nm CMOS |
| Package | 1152-ball FCBGA / HBGA-1152 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Lead Free / RoHS | Yes / Compliant |
EP3SL340H1152I4N 1152-ball fcbga / hbga-1152 Pin Configuration Guide
Pin configuration for EP3SL340H1152I4N (1152-ball fcbga / hbga-1152 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340H1152I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340H1152I4N is suitable for 6 applications: Real-Time Signal Processing (DSP / Baseband), Communications Infrastructure (MAC / Protocol Bridging), Industrial Automation & Machine Control, Custom Hardware Acceleration (Compute Engine), Test & Measurement Instrumentation, Aerospace / Defense Signal Processing (Eng-Grade Equivalent).
Real-Time Signal Processing (DSP / Baseband)
The EP3SL340H1152I4N is well matched to real-time signal processing because its 337,500 logic elements and 18,822,144 embedded-memory bits can host parallel multi-channel DSP pipelines with dedicated 18x18 multiplier blocks. The 717MHz fabric clock per the Stratix III family datasheet supports FFT, FIR, and channelization routines used in radar, software-defined radio, and baseband processing. Embedded block RAM (M9K/M144K) acts as sample-line or window buffers directly adjacent to the DSP columns, reducing routing delay versus external SRAM. Designers typically instantiate multiple parallel processing engines per channel and use the high user-IO count (744) to feed high-speed ADC/DAC interfaces. Compared to a discrete DSP + ASIC approach, integrating onto this FPGA shrinks BOM, simplifies timing closure, and allows algorithm updates via bitstream reload.
Recommended
Communications Infrastructure (MAC / Protocol Bridging)
Communications equipment - Ethernet switches, protocol bridges, and base-station controllers - benefits from the EP3SL340H1152I4N's high logic density and 744 user I/Os. The FCBGA-1152 package supports numerous multi-gigabit transceivers that map directly to SFP+, PCIe Gen1/Gen2, and CPRI interfaces per the Stratix III transceiver user guide. With 337,500 logic elements, designers can implement multi-port MACs, classification engines, and traffic-shaping algorithms in a single device. The industrial temperature grade (-40C to +100C) and lead-free finish make it suitable for outdoor or fan-less telecom cabinets. The on-chip block RAM (18,822,144 bits) provides packet-buffer storage that minimizes external memory transactions, lowering latency and BOM cost for line-rate processing.
Recommended
Industrial Automation & Machine Control
In factory-automation designs, the EP3SL340H1152I4N provides the logic and IO resources required for motion controllers, PLCs, and machine-vision pre-processors. Its 744 user I/Os accommodate hundreds of quadrature-encoder inputs, solenoid drivers, and isolated serial links. Industrial temperature grade (-40C to +100C) per the device suffix ('I4N') supports 24/7 factory-floor operation, while the lead-free FCBGA-1152 package withstands the thermal-cycling demands of industrial enclosures. The 337,500 logic elements allow designers to integrate PID loops, trajectory planners, and EtherCAT/PROFINET MACs in one chip. Embedded memory (18.8Mbit) buffers image frames for inline inspection, and the 717MHz fabric clock enables deterministic cycle times for multi-axis control without resorting to a discrete DSP or ASIC.
Recommended
Custom Hardware Acceleration (Compute Engine)
For compute-acceleration workloads (cryptography, AI inference at the edge, genomics), the EP3SL340H1152I4N delivers 337,500 logic elements paired with high embedded-memory bandwidth, enabling designers to build wide SIMD or systolic-array accelerators that outperform general-purpose CPUs on per-watt metrics. The 65nm Stratix III L process is optimized for lower static power versus the standard Stratix III, critical for thermally constrained edge appliances. Designers use Quartus II/Quartus Prime with OpenCL SDK to compile C kernels directly to FPGA fabric, accelerating workloads like AES, RSA, or sparse-matrix multiplication. The FCBGA-1152 package provides the IO bandwidth required to attach DDR3 SODIMMs for working-set memory, while 744 user I/Os support PCIe x8 Gen2 host links per the Stratix III transceiver user guide.
Recommended
Test & Measurement Instrumentation
Test and measurement equipment - oscilloscopes, logic analyzers, protocol testers, and arbitrary waveform generators - leverage the EP3SL340H1152I4N's combination of high logic density, fast fabric clock, and large embedded memory to implement acquisition memory, triggering engines, and on-board DSP signal conditioning. The 744 user I/Os permit multi-channel sampling from banks of ADCs, while the 18,822,144 bits of block RAM buffer deep captures directly on-chip without external memory round-trips. Industrial temperature grade supports lab and field-deployed test gear. The 717MHz fabric clock per the Stratix III datasheet, paired with DSP slices, enables real-time filtering, decimation, and FFT pre-processing. Designers often pair the FPGA with a host CPU over PCIe or USB, offloading acquisition and DSP to keep the host responsive.
Recommended
Aerospace / Defense Signal Processing (Eng-Grade Equivalent)
Although the EP3SL340H1152I4N is industrial-grade, its architecture is widely used in defense signal-processing subsystems where radiation-tolerant packaging or screen parts are added externally. The 337,500 logic elements and 18,822,144 embedded memory bits support radar pulse compression, electronic-warfare channelization, and software-defined-radio DSP at line rate. The 717MHz fabric clock enables multi-channel I/Q demodulation with deterministic timing closure. Designers rely on Quartus II to implement timing-driven synthesis, place-and-route, and bitstream generation, with the FCBGA-1152 package providing the IO bandwidth required to attach high-speed converters and DDR3 memories. Compared with prior-generation Stratix II designs, the L variant delivers lower static power, which is critical for sealed defense enclosures where conduction cooling limits heat rejection.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340H1152I4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340H1152I4LN | EP3SL340H1152I4 | EP3SL340H1152C4N | EP3SL340H1152C4LN | EP3SL340H1152C4L | EP3SL340H1152C4 | EP3SE260F1152I4N | EP3SE110F1152I4N |
|---|---|---|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA (H1152) | 1152-BBGA, FCBGA (H1152) | 1152-BBGA, FCBGA (H1152) | 1152-BBGA, FCBGA (H1152) | 1152-BBGA, FCBGA (H1152) | 1152-BBGA, FCBGA (H1152) | 1152-BBGA, FCBGA (H1152) | 1152-BBGA, FCBGA (F1152) | 1152-BBGA, FCBGA (F1152) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | ~260,000 | ~110,000 |
| Core Voltage | 1.05 V to 1.15 V | 1.05 V to 1.15 V | 1.05 V to 1.15 V | 1.05 V to 1.15 V | 1.05 V to 1.15 V | 1.05 V to 1.15 V | 1.05 V to 1.15 V | 1.05 V to 1.15 V | 1.05 V to 1.15 V |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Series / Variant | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E (more DSP) | Stratix III E (smaller density) |
Key Differentiators
- Highest logic density of the Stratix III L family (vs EP3SE260F1152I4N)
- Lower static power via 'L' (low-power) designation (vs Standard Stratix III (non-L))
- 744 user I/Os in a single 1152-ball BGA (vs EP3SL200F1152I4N)
Design Notes
The FCBGA-1152 package of the EP3SL340H1152I4N dissipates 5-15W under typical workloads per the Stratix III power-play estimator. A high-density multilayer PCB with full GND/power planes and 1oz or 2oz copper on outer layers is required for heat-spreading. A heatsink or heat-spreader lid is recommended for ambient temperatures above 60C or for sustained 100% utilization. Keep the top-side copper clear under any heatsink footprint so the thermal solution makes direct contact with the package lid.
Decouple every VCCINT, VCCPD, VCCPGM, and VCCAUX ball with at least one 0.1uF MLCC within 100 mil of the BGA ball, plus a bulk 10uF-22uF tantalum or polymer cap per pin group per the Stratix III pin-connection guidelines. Multiple voltage rails (1.0V core, 1.05V-1.15V VCCINT, 2.5V/3.3V I/O) require careful sequencing. Use a multi-rail PMIC such as the LTC3612 / EN6347QI / LTM4644 to provide soft-start and prevent large inrush currents that could trigger latch-up.
The FCBGA-1152 uses a 1.0mm pitch (verify in Stratix III package specification). Use a microvia/staggered-via PCB stack-up with at least 4-6 layers. Escape routing on the top layer should be fan-out into an inner high-density-interconnect (HDI) layer. Maintain 50-ohm controlled impedance for high-speed transceiver lanes and 90-ohm differential for LVDS pairs. Reference the Altera Stratix III board design guidelines for trace widths and via-in-pad recommendations.
Common pitfalls when designing with the EP3SL340H1152I4N include: (1) selecting the wrong speed grade ('I4' = industrial speed grade 4) which limits Fmax, (2) failing to program the configuration PROM (EPCS16/EPCS64) properly - leaving the FPGA in AS mode without a valid image will not produce user I/O, and (3) misassigning I/O bank voltages (VCCIO must match each bank's IO standard - mixing 1.5V and 2.5V on the same bank is illegal). Always run the Quartus Pin Planner early in the schematic design.
Compliance Information
RoHS compliant per FindIC catalog entry ('LEAD FREE' tag). Lead-free finish (Pb-free) per the 'I4N' suffix. AEC-Q100 not applicable - this is a logic device, not an automotive analog IC. Halogen-free status not in verified data.
