EP3SL50F780C2N - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
MPN: EP3SL50F780C2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $432 | $4,320.00 |
| 25 | $395 | $9,875.00 |
| 100 | $355 | $35,500.00 |
| 500 | $312 | $156,000.00 |
EP3SL50F780C2N Overview
What is a Stratix III L FPGA? The Stratix III family is Intel's (formerly Altera's) third-generation 65 nm high-performance FPGA architecture, optimized for logic-rich applications that require high I/O counts, large embedded memory, and high-speed transceivers. The 'L' sub-family targets the lowest static and dynamic power consumption within the Stratix III generation while preserving the same logic, memory, and DSP resources as the standard Stratix III devices, placing it in the broader hierarchy of programmable logic devices (PLD) -> FPGA -> high-density FPGA -> Stratix series -> Stratix III L.
Key features of the EP3SL50F780C2N include up to 800 MHz internal fabric operation, 1,900 Configurable Logic Blocks (CLBs / LABs), 488 user I/Os supporting multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL), dedicated embedded multiplier blocks for DSP, and TriMatrix on-chip SRAM with true dual-port memory options. The 'C2' speed grade is the mid-range performance bin, balancing timing margin against cost. The 780-FBGA package provides extensive I/O for memory and high-speed parallel interfaces typical in telecom, video, and high-performance computing platforms.
Typical applications include ASIC prototyping, high-throughput DSP pipelines, video processing and broadcast equipment, telecom baseband and switching fabrics, military/aerospace signal processing, and high-speed data-acquisition systems. When designing with this part, plan power-rail sequencing carefully because Stratix III requires multiple supply rails (VCC, VCCPT, VCCIO, VCCAUX, VCCPGM) with specific ramp-order constraints, and consult Intel's pin connection guidelines for unused and high-speed pins to avoid in-rush current or signal-integrity issues.
Drop-in alternatives for EP3SL50F780C2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL50F780C2N (same form factor and footprint) — differing in Package, Family, Operating Temperature, Speed Grade, Embedded Memory.
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View Datasheet →EP3SL50F780C2N Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 47,500 |
| Configurable Logic Blocks (LABs) | 1,900 |
| Embedded Memory | 2,184,192 bits |
| User I/Os | 488 |
| Package | 780-ball FBGA (FCBGA) |
| Internal Fabric Frequency (max) | 800 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 0.9 V |
| Speed Grade | C2 |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lifecycle Status | Not Recommended for New Designs (NRND) |
EP3SL50F780C2N 780-ball fbga (fcbga) Pin Configuration Guide
Pin configuration for EP3SL50F780C2N (780-ball fbga (fcbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL50F780C2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL50F780C2N is suitable for 6 applications: ASIC Prototyping and Emulation, High-Throughput DSP Pipelines, Video Processing and Broadcast Equipment, Telecom Baseband and Switching Fabrics, High-Speed Data Acquisition Systems, Military and Aerospace Signal Processing.
ASIC Prototyping and Emulation
The EP3SL50F780C2N is well suited to ASIC prototyping thanks to its 47,500 logic elements and 2,184,192 bits of embedded memory, which provide enough capacity to map medium-complexity ASICs at near-real-time operating frequencies. The 488 user I/Os in the 780-FBGA package support wide parallel buses needed to emulate external ASIC interfaces. Quartus II synthesis and TimeQuest timing analysis let designers partition and verify ASIC RTL on this device. Compared with gate-array emulation, the Stratix III L fabric also enables rapid design iterations without re-spinning masks.
Recommended
High-Throughput DSP Pipelines
The EP3SL50F780C2N integrates dedicated 18x18 multiplier blocks alongside general logic, enabling FIR filters, FFTs, and channelization to run at hundreds of MSPS while leaving logic resources free for control and buffering. Its 800 MHz internal fabric and abundant TriMatrix memory with true dual-port modes support parallel sample-domain processing without external SRAM contention. For telecom baseband and radar front-ends, this combination allows several DSP channels to be processed per device, reducing board area compared with discrete DSP chips.
Recommended
Video Processing and Broadcast Equipment
The EP3SL50F780C2N's 488 user I/Os and 800 MHz fabric make it a strong fit for broadcast video routers, format converters, and real-time image processing. Its embedded memory depth supports multi-line video buffers at HD and 4K resolutions, while LVDS and HSTL I/O standards drive high-speed video ADCs and DACs directly. Compared with ASSP video processors, the FPGA offers reconfigurable pipeline architecture that adapts to evolving codec standards such as H.265 and proprietary broadcast formats.
Recommended
Telecom Baseband and Switching Fabrics
The EP3SL50F780C2N is widely deployed in telecom baseband and packet-switching line cards where its 47.5K logic elements, large embedded SRAM, and 488 I/Os combine to implement SERDES framer logic, packet classification engines, and traffic managers. The low-power Stratix III L sub-family is especially attractive for line cards where thermal budget is constrained. Compared with merchant NPU/ASIC solutions, the FPGA provides flexibility to support evolving protocols such as OTN, FlexE, and 5G fronthaul without respinning silicon.
Recommended
High-Speed Data Acquisition Systems
The EP3SL50F780C2N excels in high-speed data-acquisition systems where its LVDS I/O and abundant logic handle parallel ADC aggregation at hundreds of MSPS. Its 2,184,192 bits of embedded memory serve as deep capture buffers, and the fabric can implement triggering, decimation, and DMA to host processors in real time. Per the Stratix III Device Handbook, the LVDS rate and I/O bank architecture support multi-GSPS aggregate sample rates when paired with interleaved ADC channels, replacing multiple smaller FPGAs with a single device.
Recommended
Military and Aerospace Signal Processing
The EP3SL50F780C2N's commercial 0-85 °C operating range and 780-FBGA ruggedized package suit a wide variety of ruggedized signal-processing platforms when paired with industrial-grade uprating. The 47.5K logic elements support cryptographic, radar, and electronic-warfare pre-processing algorithms; the embedded TriMatrix memory holds pulse-compression tables and windowing coefficients. For harsh-environment deployments, designers should pair this device with companion industrial-temp memory and power conditioning; the NRND status means long-term availability planning is essential.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL50F780C2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL50F780C2 | EP3SL50F780C2G | EP3SL50F780C4N | EP3SE50F780C2N | EP3SL200H780C2N |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (FCBGA) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Series / Sub-Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E | Stratix III L |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 200,000 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C2 | C2 | C2 | C4 | C2 | C2 |
| Operating Temperature | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
Key Differentiators
- Lowest-power Stratix III sub-family at this logic density (vs EP3SE50F780C2N)
- Same 780-FBGA footprint as higher-density siblings (vs EP3SL200H780C2N)
- Established 65 nm process with mature Quartus II tool flow (vs EP3SL340F1760C2N)
Design Notes
The EP3SL50F780C2N requires multiple power rails (VCC, VCCPT, VCCIO, VCCAUX, VCCPGM, VCCBAT) with specific ramp-order and sequencing constraints per the Stratix III Device Handbook. Designers must use a power-supply sequencer or SmartVID controller (e.g., Intel's EN5360QI or LTM4620 family) to meet the monotonic-ramp requirement. Exceeding the maximum VCC of 1.05 V during transient or reverse-ramp events can permanently damage the device or cause in-rush currents that trip upstream protection.
The 780-FBGA package uses a 1.0 mm ball pitch, requiring high-density PCB fabrication (8 or more layers with microvias or stacked vias). Route all high-speed differential pairs (LVDS, SSTL) with 100 Ω differential impedance, length-matched within 150 mil. Place decoupling capacitors (0.1 µF + 10 µF bulk) within 100 mil of every VCC/VCCPT pin to suppress switching noise. Per Intel's Stratix III board design guidelines, an unbroken VCC reference plane is mandatory to avoid power-integrity resonances.
Stratix III LVDS receivers require an external 100 Ω differential termination resistor as close to the FPGA pin as possible. Unused LVDS pins should be disabled in the Quartus II pin planner and tied to a known state to avoid floating-input oscillation. According to the Stratix III Device Handbook, HSTL Class II and SSTL II inputs require on-die termination (OCT) enabled via the Quartus pin planner; otherwise external VTT termination must be supplied.
Do not assume that EP3SL50F780C2N configuration bitstreams are compatible with EP3SE50F780C2N even though they share the same package - the L and E sub-families have different POR (power-on-reset) thresholds and JTAG instructions. Configuration memory size matters: a Quartus II SOF file must fit in the chosen EPCS/EPCQ serial flash, with headroom for optional dual-boot images. Always include a CRC error check in the Quartus .cof file so the FPGA falls back to a known-good image if the primary bitstream is corrupted.
Compliance Information
RoHS compliant per Intel product page (lead-free 'N' suffix). Reach and halogen-free status not explicitly stated in public listings; refer to Intel's material declaration for confirmation. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified part.
