EP3SL70F484I4L - Stratix III L FPGA, 67.5K LE, 484-FBGA | Altera
MPN: EP3SL70F484I4L ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1385.22 | $1,385.22 |
| 10 | $1320 | $13,200.00 |
| 100 | $1195 | $119,500.00 |
| 100 | $1100 | $110,000.00 |
| 500 | $980 | $490,000.00 |
EP3SL70F484I4L Overview
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected via a programmable routing fabric. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting hierarchically between standard logic ICs and ASICs. The Stratix III L family specifically trades some absolute logic capacity for substantially reduced static and dynamic power versus the Stratix III standard variant.
Key features of the EP3SL70F484I4L include up to 450 MHz core performance, 1.1 V core operation, dedicated DSP blocks for fixed- and floating-point arithmetic, embedded RAM with optional ECC, programmable I/O supporting LVDS, HSTL, SSTL and other standards, and support for high-speed external memory interfaces including DDR3. The device integrates PLLs for clock management and is suitable for PCIe hard IP and multi-gigabit serial links via its transceiver blocks.
The architecture combines a 65 nm process node with Altera's Programmable Power Technology, which allows unused logic and routing resources to be selectively powered down. This makes the L variant particularly attractive for power-sensitive designs such as wireline telecom line cards, software-defined radio basestations, and high-throughput image processing pipelines where the 67.5K LE capacity is sufficient but absolute maximum logic density is not required.
Typical applications include high-end communication infrastructure, ASIC prototyping, high-performance DSP, and broadcast video processing. When designing with this device, verify that Quartus II design software supports the specific transceiver and I/O features required, and confirm thermal dissipation under worst-case utilization using the device's published thermal model.
Drop-in alternatives for EP3SL70F484I4L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL70F484I4L (same form factor and footprint) — differing in Family, Operating Temperature, Package, Speed Grade, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL70F484I4N
✅ Drop-In✓ In Stock
$855 / Unit
View Datasheet →EP3SL70F484I4G
✅ Drop-In✓ In Stock
$901.31 / Unit
View Datasheet →EP3SL70F484I4
✅ Drop-In✓ In Stock
$925.1 / Unit
View Datasheet →EP3SL70F484I3N
✅ Drop-In✓ In Stock
$995.4 / Unit
View Datasheet →EP3SL70F484C4N
✅ Drop-In✓ In Stock
$580 / Unit
View Datasheet →EP3SL70F484C4L
✅ Drop-In✓ In Stock
$985 / Unit
View Datasheet →EP3SL70F484I4L Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Family | Stratix III L FPGA |
| Logic Elements (LE) | 67,500 |
| Logic Array Blocks (LABs) | 2,700 |
| Embedded Memory | 2,699,264 bits |
| Maximum User I/O | 296 |
| Core Voltage | 1.1 V |
| Maximum Core Frequency | 450 MHz |
| Process Technology | 65 nm |
| Package Type | 484-Ball FC-FBGA |
| Pin/Package Code | F484 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I4 |
| Power Variant | L (low-power) |
| RoHS Status | Compliant |
EP3SL70F484I4L Pin Configuration
| Pin AB12 | I/O Bank 1A — User I/O / configuration pin (refer to .pin file) |
| Pin AB14 | I/O Bank 1A — User I/O / configuration pin (refer to .pin file) |
| Pin AB16 | I/O Bank 1A — User I/O / configuration pin (refer to .pin file) |
| Pin AB18 | I/O Bank 1A — User I/O / configuration pin (refer to .pin file) |
| Pin AB20 | I/O Bank 1A — User I/O / configuration pin (refer to .pin file) |
| Pin AB22 | I/O Bank 1A — User I/O / configuration pin (refer to .pin file) |
| Pin AB24 | GND — Ground |
| Pin AC11 | VCCIO1A — I/O bank 1A supply |
| Pin AC13 | I/O Bank 1A — User I/O |
| Pin AC15 | I/O Bank 1A — User I/O |
| Pin AC17 | I/O Bank 1A — User I/O |
| Pin AC19 | I/O Bank 1A — User I/O |
| Pin AC21 | I/O Bank 1A — User I/O |
| Pin AC23 | I/O Bank 1A — User I/O |
| Pin AD12 | I/O Bank 1A — User I/O |
| Pin AD14 | I/O Bank 1A — User I/O |
| Pin AD16 | I/O Bank 1A — User I/O |
| Pin AD18 | I/O Bank 1A — User I/O |
| Pin AD20 | I/O Bank 1A — User I/O |
| Pin AD22 | I/O Bank 1A — User I/O |
| Pin AD24 | GND — Ground |
Typical Applications
EP3SL70F484I4L is suitable for 6 applications: Wireline Telecom Line Card, ASIC Prototyping Platform, Software Defined Radio (SDR) Basestation, Broadcast Video Processing, High-Performance Image Processing Pipeline, Mil/Aero Ruggedized Computing.
Wireline Telecom Line Card
The EP3SL70F484I4L fits wireline telecom line cards because its 67.5K logic elements support packet classification, traffic shaping, and SAR/PWE processing, while its 2,699,264 bits of embedded RAM provide the on-chip buffering needed for queue management. The 1.1 V core and Stratix III L low-power architecture reduce per-port power, critical in high-density chassis where hundreds of line cards are deployed. The 484-ball FBGA's 296 user I/O connect to multiple external SFP+/QSFP cages and backplane SERDES links. The FPGA's dedicated DSP blocks accelerate Reed-Solomon and FEC computations for OTN framers without consuming general logic.
Recommended
ASIC Prototyping Platform
The EP3SL70F484I4L is widely used for ASIC prototyping because its 67.5K logic elements, combined with 2.7 Mbit embedded memory and 296 user I/O, emulate full SoC subsystems in a single device. The Stratix III L low-power architecture allows multi-FPGA partition prototypes to operate in standard lab environments without exotic cooling. Quartus II design software supports TimeQuest timing closure and incremental compilation flows used in ASIC-to-FPGA porting. Industrial temperature grade (-40C to +100C) suits chassis-based bring-up racks in data centers.
Recommended
Software Defined Radio (SDR) Basestation
The EP3SL70F484I4L suits SDR basestation designs where its 67.5K logic elements implement multi-carrier LTE/5G PHY pipelines while its embedded memory holds symbol buffers and channel estimates. The 296 user I/O enable simultaneous interfacing to multiple ADC/DAC chips, CPRI/OBSAI fronthaul SERDES, and backhaul Ethernet. DSP blocks accelerate FFT/iFFT and matrix algebra at sample rates beyond 200 MHz. The Stratix III L power architecture keeps per-antenna power within the strict budgets of dense MIMO radio units.
Recommended
Broadcast Video Processing
The EP3SL70F484I4L supports broadcast video processing applications such as multi-stream SD/HD/3G-SDI routers, video format converters, and on-air graphics overlays. Its 296 user I/O connect to multiple SDI transceivers via HSTL/LVDS I/O standards, while the embedded RAM provides line buffers and frame stores. DSP blocks accelerate deinterlacing, scaling, and chroma keying operations in real time. The industrial temperature grade ensures reliable operation in 24/7 broadcast facility racks. Quartus II supports Video and Image Processing Suite IP that maps efficiently to the Stratix III L architecture.
Recommended
High-Performance Image Processing Pipeline
The EP3SL70F484I4L fits high-throughput image processing pipelines used in industrial inspection, medical imaging, and machine vision. Its 67.5K logic elements implement real-time convolution, morphological operations, and feature extraction at multi-megapixel sensor rates. The 2.7 Mbit embedded memory provides line, tile, and frame buffers, while 296 user I/O connect to Camera Link, CoaXPress, or LVDS-based sensor interfaces. The Stratix III L DSP blocks accelerate fixed-point and single-precision floating-point filters at line rates above 200 MHz.
Recommended
Mil/Aero Ruggedized Computing
The EP3SL70F484I4L serves ruggedized computing applications in mil/aero platforms where its industrial temperature range (-40C to +100C) and 484-ball FC-FBGA package withstand vibration and thermal cycling. Its 67.5K logic elements implement sensor I/O aggregation, signal conditioning, and MIL-STD-1553/ARINC-429 interfaces. The low-power Stratix III L architecture reduces cooling burden in sealed enclosures. Altera Quartus II supports Design Security and Tamper Protection features for sensitive aerospace IP, and the device is supported by military lifecycle programs.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL70F484I4L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL70F484I4N | EP3SL70F484I4G | EP3SL70F484I4 | EP3SL70F484I3N | EP3SL70F484C4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-Ball FC-FBGA (F484) | 484-Ball FC-FBGA (F484) - same | 484-Ball FC-FBGA (F484) - same | 484-Ball FC-FBGA (F484) - same | 484-Ball FC-FBGA (F484) - same | 484-Ball FC-FBGA (F484) - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 |
| User I/O Count | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | I4 (industrial, grade 4) | I4 (industrial, grade 4, N-bin) | I4 (industrial, grade 4, G-bin) | I4 (industrial, grade 4, baseline) | I3 (industrial, grade 3) | C4 (commercial, grade 4) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Power Variant | L (low-power) | L (low-power) | L (low-power) | L (low-power) | L (low-power) | L (low-power) |
Key Differentiators
- Low-power L variant within Stratix III family (vs EP3SL70F484I4N)
- Industrial temperature range vs commercial baseline (vs EP3SL70F484C4N)
- Speed-grade I4 (faster) vs I3 (slower) (vs EP3SL70F484I3N)
Design Notes
Estimated: based on the Stratix III L 1.1 V core rail at typical 67.5K LE utilization (~70% logic + 50% RAM + 20% DSP toggle rate), the device draws approximately 4-7 W on the VCC core rail, plus 0.5-1.5 W per active transceiver channel on VCCE and per-bank VCCIO. Provide at least four low-impedance 0.1 uF MLCC decoupling capacitors per VCCIO bank plus 22 uF bulk capacitors near the VCC and VCCA pins. Use a star-ground topology tying GND planes to the BGA's central balls to minimize switching-current return-path inductance.
The 484-ball FC-FBGA package has a published junction-to-ambient thermal resistance of approximately 9 C/W with a standard 1 oz copper 12-layer PCB. At 7 W dissipation, the junction rises ~63 C above ambient, requiring thermal management above 4 W sustained. Provide a continuous top-side copper heatsink pad, thermal vias to internal planes, and forced airflow of at least 200 LFM for typical design margins. Designers must re-derive theta_JA for their specific PCB stackup using Altera's Thermal Modeling tool.
The F484 FC-FBGA uses 1.0 mm ball pitch with a 22-by-22 ball grid. PCB breakout requires HDI (microvia) stackup with at least 1-2-1 or 1-2-2-1 layer routing. Match differential pairs (LVDS, HSTL) to within 10 mil length tolerance and route transceiver channels with continuous reference ground on layer 2 below the microvia. Maintain 100 ohm differential impedance for SERDES lanes and 50 ohm single-ended for general I/O. Use the Altera Board Design Guidelines for Stratix III as the layout reference.
Three pitfalls common to Stratix III L designs: (1) Configuring the device from a flash memory without CRC checking may load corrupted bitstreams silently; always enable CRC and design-security features in Quartus II. (2) Operating transceiver channels above their supported data rate causes PLL unlock; consult the Stratix III Device Handbook for the supported data-rate matrix per speed grade. (3) Mixing 1.5 V and 1.8 V VCCIO within the same I/O bank damages I/O buffers; group I/O standards into banks per the Quartus II pin-planner grouping.
Compliance Information
RoHS compliant per Altera (Intel) product specifications. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC. Lead-free F484 FC-FBGA package. Halogen-free laminate per JEDEC JESD709.
