EP3SL70F484I4LG - Stratix III L FPGA, 67.5K LE, 484-FCBGA | Intel
MPN: EP3SL70F484I4LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $845 | $845.00 |
| 10 | $798.5 | $7,985.00 |
| 100 | $712 | $71,200.00 |
| 500 | $655 | $327,500.00 |
| 1,000 | $598 | $598,000.00 |
EP3SL70F484I4LG Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (CLBs), programmable routing, dedicated block memory, DSP slices, and high-speed transceiver blocks into a single silicon die. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs, and occupy the high-density, high-performance tier of the semiconductor logic hierarchy. Modern FPGAs are routinely used as integration platforms that replace discrete ASICs, DSPs, and microcontrollers in parallel processing, signal processing, and high-bandwidth I/O applications.
Key feature highlights of the EP3SL70F484I4LG include 27,000 Adaptive Logic Modules (ALMs), 2.57 Mbit of embedded block RAM, integrated DSP blocks for high-throughput arithmetic, dedicated clock networks and PLLs, and support for external memory interfaces including DDR2/DDR3. The 484-ball FCBGA package provides ample signal margin for high-speed serial protocols and supports up to 296 user I/Os distributed across multiple I/O banks. The 'I4' speed grade and 'L' (low-power) suffix denote the low-static-power variant with the -4 speed bin, optimized for systems where thermal envelope and battery or conduction-cooled operation are critical.
The architecture leverages Altera's classic Stratix III fabric with adaptive logic modules, MLAB memory, and dedicated multiplier/adder DSP blocks. A multi-tier clocking backbone with up to 12 PLLs supports complex timing requirements, while the device's high-speed serial transceivers (when populated on the silicon) enable multi-gigabit serial connectivity. Industrial temperature grade and Pb-free FCBGA assembly make the EP3SL70F484I4LG suitable for harsh-environment embedded systems.
Typical applications for the EP3SL70F484I4LG span defense and avionics, industrial automation and machine vision, medical imaging pipelines, broadcast video processing, telecom baseband processing, and high-performance test and measurement instrumentation. The low-static-power fabric also makes it attractive for portable or ruggedized computing platforms where heat dissipation is constrained.
When designing with the EP3SL70F484I4LG, ensure the Quartus II / Quartus Prime design toolchain is set to the correct device variant and that the board provides the multi-rail power sequencing required by Stratix III (1.1 V core plus VCCIO/VCCPD/VCCR/VCCA/VCCPT). Use the Altera (now Intel) Pin Planner and the device handbook's pinout file to assign banks and verify signal integrity on high-speed lanes.
This page synthesizes distributor pricing, drop-in alternative options, and practical design notes that are not collected in the manufacturer datasheet, including parametric proximity scoring against verified same-family and cross-brand equivalents.
Drop-in alternatives for EP3SL70F484I4LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL70F484I4LG (same form factor and footprint) — differing in Speed Grade, Family, Operating Temperature, Package, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL70F484I4L
✅ Drop-In✓ In Stock
$980 / Unit
View Datasheet →EP3SL70F484I4G
✅ Drop-In✓ In Stock
$901.31 / Unit
View Datasheet →EP3SL70F484I4
✅ Drop-In✓ In Stock
$925.1 / Unit
View Datasheet →EP3SL70F484I3N
✅ Drop-In✓ In Stock
$995.4 / Unit
View Datasheet →EP3SL70F484I3G
✅ Drop-In✓ In Stock
$305 / Unit
View Datasheet →EP3SL70F484I3
✅ Drop-In✓ In Stock
$1013.66 / Unit
View Datasheet →EP3SL70F484C4N
✅ Drop-In✓ In Stock
$580 / Unit
View Datasheet →EP3SL70F484C4LG
✅ Drop-In✓ In Stock
$1450 / Unit
View Datasheet →EP3SL70F484I4LG Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Family | Stratix III (low-static-power variant) |
| Process Node | 40 nm |
| Logic Elements (LE) | 67,500 |
| Adaptive Logic Modules (ALM) | 27,000 |
| Embedded Memory (Bits) | 2,699,264 |
| Embedded Block RAM | 2.57 Mbit |
| Number of User I/Os | 296 |
| Package | 484-BBGA, FCBGA |
| Operating Supply Voltage (Core) | 1.1 V |
| Operating Temperature | -40 C to +100 C (Industrial) |
| Mounting Style | SMD/SMT |
| Speed Grade | I4 (industrial, -4 speed bin) |
| RoHS Status | Compliant (lead-free FCBGA) |
| Programming Toolchain | Quartus II / Quartus Prime (Intel FPGA) |
EP3SL70F484I4LG 484-bbga, fcbga Pin Configuration Guide
Pin configuration for EP3SL70F484I4LG (484-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL70F484I4LG.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL70F484I4LG is suitable for 7 applications: Defense & Avionics Signal Processing, Industrial Machine Vision & Inspection, Medical Imaging & Diagnostics, Telecom Baseband & Protocol Processing, Broadcast Video Processing & Routing, Test & Measurement Instrumentation, Aerospace Embedded Computing.
Defense & Avionics Signal Processing
The EP3SL70F484I4LG is well matched to defense and avionics signal-processing platforms because its 67,500 logic elements and 2.57 Mbit embedded block RAM can host multi-channel DSP pipelines for radar, electronic-warfare, and avionics databus processing. The industrial -40 C to +100 C operating range and Pb-free 484-FCBGA package make it suitable for ruggedized, conduction-cooled enclosures where commercial-grade parts would derate. The device's high-speed I/O banks support LVDS and differential interfaces common to military datalinks, and the dedicated DSP blocks accelerate FFT and FIR operations typical of beamforming and channelization. Pair with a companion TI DSP or ADC family for high-bandwidth RF digitization, and verify timing closure under worst-case military temperature corners.
Recommended
Industrial Machine Vision & Inspection
The EP3SL70F484I4LG supports industrial machine vision by integrating camera-link, CoaXPress, or GigE Vision interface IP alongside on-chip image-processing pipelines. Its 27,000 ALMs and dedicated DSP blocks provide the parallelism needed for real-time blob detection, edge filtering, and pattern matching at line rates up to several hundred megapixels per second. The 296 user I/Os in the 484-FCBGA package support multiple sensor lanes plus GPIO for trigger, lighting, and conveyor-encoder inputs. Industrial temperature grade allows deployment on factory floors without active cooling. The device pairs naturally with high-speed ADCs and external DDR3 memory for frame buffering, while the Quartus Prime toolchain accelerates IP integration for Camera Link and CoaXPress reference designs.
Recommended
Medical Imaging & Diagnostics
The EP3SL70F484I4LG fits medical imaging platforms including ultrasound beamformers, CT reconstruction pipelines, and MRI RF transmit/receive controllers where deterministic DSP throughput is critical. The 27,000 ALMs and dedicated multiplier blocks deliver the parallel MACs required for 2D/3D image reconstruction in real time, while 2.57 Mbit embedded block RAM buffers beamformed sample streams. Industrial temperature rating plus Pb-free assembly satisfies medical IEC 60601-1 reliability expectations when paired with proper isolation and supply design. The 484-FCBGA package supports enough I/O for multi-channel ADC interfaces (LVDS) and dedicated trigger lines. Designers should validate long-term availability before committing to multi-year medical programs because Stratix III is a mature, legacy node.
Recommended
Telecom Baseband & Protocol Processing
The EP3SL70F484I4LG is well suited to telecom baseband and protocol-processing applications because its 67.5K LE and rich DSP slices handle multi-standard channel coding, modulation, and ciphering for wireless backhaul and small-cell platforms. The 484-FCBGA package exposes 296 user I/Os plus high-speed transceivers (where populated on silicon) for CPRI, OBSAI, or JESD204B links to RFICs. Industrial temperature rating and low-static-power silicon help in outdoor, fanless small-cell enclosures. Quartus Prime includes reference designs for CPRI and JESD204B IP that accelerate time-to-prototype. The device is a good fit when system architects need Stratix III toolchain familiarity without committing to newer, lower-power Intel Agilex or Cyclone families.
Recommended
Broadcast Video Processing & Routing
The EP3SL70F484I4LG supports broadcast video processing and routing matrices by providing the LE capacity and I/O bandwidth needed for SDI, HDMI, and DisplayPort aggregation, color-space conversion, and frame-rate conversion at 4K/UHD resolutions. Its 296 user I/Os across the 484-FCBGA package accommodate multiple SDI/HD-SDI/3G-SDI links plus GPIO for control planes, while on-chip block RAM buffers line/frame data with predictable latency. The Stratix III L silicon variant balances performance against thermal envelope in enclosed broadcast racks. Designers can pair the FPGA with external HDMI retimers and audio CODECs to build full broadcast switchers, and reuse Quartus Prime IP for SDI scrambling/descrambling, embedding, and ancillary data handling.
Recommended
Test & Measurement Instrumentation
The EP3SL70F484I4LG fits high-end test and measurement instrumentation such as protocol analyzers, mixed-signal oscilloscopes, and arbitrary waveform generators, where the FPGA serves as the central timing and DSP engine. Its 27,000 ALMs and DSP blocks accelerate real-time FFTs, decimation filters, and trigger detection, while the 2.57 Mbit block RAM supports deep sample buffers. The 484-FCBGA package's 296 user I/Os handle LVDS ADC/DAC lanes and front-panel connectors. Industrial temperature grade and Pb-free assembly are well suited to lab and production-floor instrumentation. Designers can leverage Quartus Prime IP for JESD204B/C and LVDS interfaces, plus reference designs for arbitrary waveform generation and protocol-aware triggering.
Recommended
Aerospace Embedded Computing
The EP3SL70F484I4LG is well suited to aerospace embedded computing platforms such as flight-control co-processors, mission computers, and data-acquisition units that must operate across the full industrial -40 C to +100 C envelope. Its 67,500 logic elements and 2.57 Mbit embedded block RAM provide the headroom for safety-critical state machines, sensor-fusion kernels, and MIL-STD-1553 or ARINC 429 interface IP. The Pb-free 484-FCBGA package withstands typical aerospace soldering and rework profiles, and the low-static-power Stratix III L silicon reduces thermal load in conduction-cooled line-replaceable modules. Designers should validate availability through aerospace-qualified distributors and consider long-term obsolescence planning for sustained aerospace programs.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL70F484I4LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL70F484I4L | EP3SL70F484I3N | EP3SL70F484C4LG |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 484-FCBGA | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 |
| Adaptive Logic Modules (ALM) | 27,000 | 27,000 | 27,000 | 27,000 |
| Embedded Memory (Mbit) | 2.57 | 2.57 | 2.57 | 2.57 |
| User I/Os | 296 | 296 | 296 | 296 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Speed Grade | I4 (industrial, -4) | I4 (industrial, -4) | I3 (industrial, -3) - slower | C4 (commercial, -4) |
| Operating Temperature | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C | 0 C to +85 C - lower range |
Key Differentiators
- Higher density than EP3SL50 in identical package (vs EP3SL50F484I4LG)
- Faster -4 speed grade vs -3 alternative (vs EP3SL70F484I3N)
- Industrial temperature vs commercial sibling (vs EP3SL70F484C4LG)
Design Notes
Stratix III requires multiple supply rails: 1.1 V VCCINT (core), VCCIO (per-bank I/O), VCCPD, VCCR, VCCA, and VCCPT. Sequence them per the Stratix III device handbook to avoid latch-up at power-up. The 'L' (low-static-power) variant reduces static Icc but core dynamic power scales with toggle rate and clock frequency, so estimate worst-case power with the Quartus PowerPlay Analyzer before finalizing the thermal solution.
The 484-FCBGA package has limited top-side heat dissipation; use a multi-layer PCB with a continuous ground/power plane stack-up to spread heat through the BGA balls. Industrial operation up to +100 C requires the junction temperature to stay below the device maximum under worst-case utilization. Apply conservative thermal derating if the design drives a high percentage of logic or runs near the speed-grade limit, and verify with on-board thermistors or the FPGA's built-in temperature-sensing diode.
Use the official Stratix III 484-FCBGA land pattern with NSMD pads, microvia-in-pad where feasible, and a 1.0 mm or 1.27 mm pitch BGA escape per the Altera/Intel layout guidelines. Match trace lengths within a bank for source-synchronous interfaces (DDR2/DDR3, LVDS) and keep high-speed transceiver lanes away from noisy rails. Place decoupling capacitors on the bottom side directly under the BGA, with vias short and wide to minimize inductance.
Do not assume a Stratix III design compiled for EP3SL70F484I4LG will run unmodified on the EP3SL70F484I3N drop-in alternative - the -3 speed grade is ~25% slower and will fail timing closure on aggressive paths. Similarly, do not substitute a 'C' (commercial) variant into an industrial product, because the upper temperature limit drops from +100 C to +85 C and will derate reliability. Always revalidate timing and temperature margins when changing suffixes.
Stratix III LVDS and high-speed I/O require controlled-impedance routing (typically 50 ohm single-ended, 100 ohm differential) and length matching per the device handbook. For DDR2/DDR3 interfaces, follow the read/write capture and leveling calibration flows in Quartus Prime to compensate for board skew. Use IBIS models from Intel to simulate signal integrity before layout tape-out, especially for >400 Mbps LVDS or multi-lane source-synchronous buses.
Compliance Information
Lead-free FCBGA per Intel/Altera product page. Not AEC-Q100 qualified (FPGA is not an automotive-grade IC in this context). REACH and RoHS compliance carried by Intel FPGA documentation.
