EP3SL70F484I4LN - Stratix III L FPGA, 67.5K Logic Elements | Intel
MPN: EP3SL70F484I4LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $408 | $4,080.00 |
| 100 | $372 | $37,200.00 |
| 500 | $338 | $169,000.00 |
| 1,000 | $305 | $305,000.00 |
EP3SL70F484I4LN Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacture through configuration bitstream loading. FPGAs occupy a unique position in the digital design hierarchy: more flexible than Application-Specific Integrated Circuits (ASICs), faster to prototype than software running on a microcontroller, and able to exploit massive parallel datapath architectures. Within Intel's portfolio, the Stratix III family sits between the low-cost Cyclone series and the high-performance Stratix V series, optimized for ASIC-prototyping, signal processing, and high-throughput datapath designs.
Key features of the EP3SL70F484I4LN include 2,700 LABs (Logic Array Blocks) supporting 67,500 logic elements, 2,699,264 embedded RAM bits for on-chip buffering, integrated 18x18 multipliers for DSP operations, and 296 general-purpose user I/Os distributed across eight I/O banks. The 65 nm process node combined with Stratix III L power optimization delivers substantially lower static power than earlier Stratix II devices, while the industrial temperature grade (-40C to +100C for the I4 speed grade) supports harsh-environment deployments.
The Stratix III L architecture employs an adaptive logic module (ALM) that can implement up to 6-input LUTs with shared arithmetic, alongside dedicated DSP blocks, embedded M9K memory blocks, and high-speed transceivers. The device supports configuration via JTAG, Active Serial, Passive Serial, and Fast Passive Parallel modes, allowing flexible boot in production systems.
Typical applications include ASIC prototyping, high-speed data acquisition, digital signal processing, software-defined radio (SDR) baseband processing, video and image processing pipelines, and industrial control systems requiring deterministic parallel computation. The 484-ball FC-FBGA package with 1.0 mm pitch is suitable for multi-layer PCBs.
Designers should plan for proper decoupling of the 0.9 V core supply (typically 100 uF bulk plus 0.1 uF/0.01 uF ceramics per bank), thermal dissipation through the exposed die paddle, and consideration of the configuration scheme during PCB layout. Speed-grade I4 targets mid-tier performance balancing timing margin and power consumption.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III L family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP3SL70F484I4LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL70F484I4LN (same form factor and footprint) — differing in Operating Temperature, Package, Family, Speed Grade, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL70F484I4L
✅ Drop-In✓ In Stock
$980 / Unit
View Datasheet →EP3SL70F484I4LG
✅ Drop-In✓ In Stock
$598 / Unit
View Datasheet →EP3SL70F484I4G
✅ Drop-In✓ In Stock
$901.31 / Unit
View Datasheet →EP3SL70F484I4
✅ Drop-In✓ In Stock
$925.1 / Unit
View Datasheet →EP3SL70F484I3N
✅ Drop-In✓ In Stock
$995.4 / Unit
View Datasheet →EP3SL70F484C4LN
✅ Drop-In✓ In Stock
$380 / Unit
View Datasheet →EP3SL70F484I4LN Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Series | Stratix III L |
| Logic Elements | 67,500 |
| LABs (Logic Array Blocks) | 2,700 |
| Total RAM Bits | 2,699,264 |
| Maximum User I/O | 296 |
| Operating Frequency | 375 MHz |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| Package | 484-ball FC-FBGA (1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Speed Grade | I4 |
| Operating Temperature | -40C to +100C (industrial) |
| Configuration Modes | JTAG, AS, PS, FPP |
| RoHS Status | Compliant |
EP3SL70F484I4LN 484-ball fc-fbga (1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP3SL70F484I4LN (484-ball fc-fbga (1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL70F484I4LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL70F484I4LN is suitable for 7 applications: ASIC Prototyping, High-Speed Data Acquisition, Software-Defined Radio (SDR) Baseband Processing, Video and Image Processing Pipelines, Industrial Control and Motion Systems, Test and Measurement Instrumentation, Communications Infrastructure (Wired Backhaul).
ASIC Prototyping
The EP3SL70F484I4LN delivers 67,500 logic elements and 2.7 Mbits of embedded RAM, making it ideal for ASIC prototyping where engineers must validate mid-complexity SoC designs before committing to mask sets. The 484-ball FC-FBGA package supports standard high-density PCB fabrication, while the I4 industrial speed grade provides deterministic timing closure. Designers can partition the FPGA into multiple clock-domain islands to emulate the ASIC clock tree. The 296 user I/Os accommodate verification of wide external memory buses, and the JTAG/AS/PS/FPP configuration chain enables production-style bitstream loading.
Recommended
High-Speed Data Acquisition
With 296 user I/Os and dedicated 18x18 multipliers, the EP3SL70F484I4LN suits high-speed data acquisition systems aggregating multiple ADC channels at sample rates up to hundreds of MSPS. The 2.7 Mbit embedded RAM provides per-channel buffering for sample storage before DMA transfer to host processors. The 0.9 V core with industrial temperature range ensures stable operation in lab and field-deployed instrumentation. Eight I/O banks support mixed-voltage signaling (LVTTL, LVDS, LVCMOS) for direct ADC/DAC interface without external translators.
Recommended
Software-Defined Radio (SDR) Baseband Processing
The EP3SL70F484I4LN's 67,500 logic elements, embedded DSP blocks with 18x18 multipliers, and 296 I/Os make it well-suited for SDR baseband digital signal processing - including channelization, FFT/iFFT, modulation/demodulation, and FEC decoding. The 0.9 V core rail plus I4 industrial speed grade support the deterministic timing margins required for sample-rate conversion and polyphase filter banks. The 2.7 Mbit embedded RAM enables per-channel sample buffering and coefficient storage for FIR/CIC filter chains running alongside multi-carrier LTE/Wi-Fi waveforms.
Recommended
Video and Image Processing Pipelines
The EP3SL70F484I4LN supports real-time video and image processing pipelines - including Bayer demosaicing, 2D FIR filtering, motion estimation, and H.264/HEVC acceleration pre-processing. The 296 I/Os handle multi-lane LVDS camera interfaces at gigabit rates, while the 2.7 Mbit embedded RAM buffers line-scan and frame data. The 65 nm process and 0.9 V core deliver sustained throughput for 1080p60 pipelines with low static power, which is critical in broadcast and surveillance applications.
Recommended
Industrial Control and Motion Systems
The EP3SL70F484I4LN's industrial temperature range (-40C to +100C) and 296 user I/Os suit industrial PLC, CNC machine controller, and motion-control systems requiring deterministic parallel computation. Its logic density supports multiple servo-loop closures at microsecond period, while the embedded RAM buffers trajectory data without external SRAM. The 484-ball FC-FBGA package withstands vibration and thermal cycling typical of factory-floor deployments, and the I4 industrial speed grade guarantees timing margin across the full temperature range.
Recommended
Test and Measurement Instrumentation
The EP3SL70F484I4LN serves test-and-measurement equipment such as logic analyzers, protocol testers, and arbitrary waveform generators. The 296 user I/Os accommodate high-channel-count probe interfaces, while the embedded DSP blocks handle FFT-based spectrum analysis, jitter decomposition, and pattern generation in real time. The 0.9 V core plus I4 industrial speed grade deliver low-jitter timing accuracy needed for high-precision T&M equipment. Eight I/O banks support mixed-voltage stimulus/response channels for backward compatibility with legacy DUT interfaces.
Recommended
Communications Infrastructure (Wired Backhaul)
The EP3SL70F484I4LN fits wired-communications backhaul equipment - including Ethernet switch fabrics, OTN framer/mapper, and packet-processing accelerators at edge routers. Its 67,500 logic elements handle multi-gigabit MAC/PCS blocks, while 2.7 Mbit embedded RAM buffers packet segments at line-rate. The 296 I/Os support SGMII/XAUI interfaces to external PHYs, and the I4 industrial speed grade ensures deterministic latency for QoS-critical traffic. The 0.9 V core minimizes per-port power in high-port-count chassis.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL70F484I4LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL70F484I4L | EP3SL70F484I4LG | EP3SL70F484I4G | EP3SL70F484I4 | EP3SL70F484I3N | EP3SL70F484C4LN |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FC-FBGA | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Embedded RAM (bits) | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 |
| User I/Os | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | I4 | I4 | I4 | I4 | I4 | I3 (-15% timing margin) | C4 (commercial temp) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (commercial) |
| Process / Core Voltage | 65 nm / 0.9 V | 65 nm / 0.9 V | 65 nm / 0.9 V | 65 nm / 0.9 V | 65 nm / 0.9 V | 65 nm / 0.9 V | 65 nm / 0.9 V |
| Assembly / Compliance | Lead-free (N suffix) | Lead-free (no N) | Lead-free + halogen-free (LG) | Lead-free (G) | Lead-free (no suffix) | Lead-free (N) | Lead-free + commercial temp |
Key Differentiators
- Lowest-power 67.5K-LE Stratix III variant (vs EP3SE50F484I4N)
- Industrial temperature grade I4 (vs EP3SL70F484C4LN)
- Identical 296-I/O capacity in same 484-ball FC-FBGA (vs EP3SL50F484I4N)
Design Notes
The EP3SL70F484I4LN requires a clean 0.9 V core rail sourced through a multi-phase buck regulator with at least 100 uF bulk polymer capacitance plus 0.1 uF / 0.01 uF ceramic decoupling distributed within 5 mm of each bank. I/O banks require separate supplies selectable per bank (1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V); sequence the core rail first, then I/O rails during power-up to avoid I/O-to-core latch-up. PLLs need a quiet 2.5 V analog supply derived from an LDO and isolated by ferrite beads from the digital 2.5 V rail.
Estimated: at 0.9 V core and 375 MHz operation driving 50% of the 67,500 logic elements with typical toggle activity, total device dissipation is approximately 3-5 W. The 484-ball FC-FBGA exposes a die-attached thermal pad; recommend at least 9 thermal vias (0.3 mm pitch) under the paddle connecting to an inner copper pour. Without adequate thermal relief the junction may exceed 100C under industrial upper temperature, derating timing margin.
Use a high-density interconnect (HDI) PCB stack-up with microvias for the 1.0 mm-pitch BGA escape routing. Match all differential pair lengths within 150 mil to preserve LVDS signal integrity. Maintain continuous reference planes (GND for signals) on adjacent layers to control characteristic impedance to 100 ohm differential and 50 ohm single-ended. JTAG pinout should follow Altera's 10-pin or 20-pin header convention with TCK pulled low through 1 kohm and TMS/TDI pulled high through 10 kohm resistors.
Do not hot-swap the configuration bitstream while VCCINT is below 0.85 V - the I/O buffers may drive into an indeterminate state and cause short-circuit contention. Always assert nCONFIG before changing MODE pins. Configuration data files (.sof / .pof / .jic) must be regenerated for each speed grade variant (I3 vs I4 vs C4) since timing models differ; do not migrate I4 bitstreams to I3 parts without re-running TimeQuest timing analysis. Leave unused I/O banks powered to a defined rail (do not float) to prevent ESD latch-up.
For LVDS links running above 500 Mbps, place 100 ohm differential terminations within 5 mm of receiver pins. Series AC-coupling capacitors (100 nF) at LVDS drivers are required for hot-plug compliance. Avoid routing LVDS traces over split power planes - return-path discontinuities degrade eye margins. Use TimeQuest SI analysis with Altera-supplied IBIS models for all 296 user I/Os to validate cross-talk-induced timing violations before tape-out.
Compliance Information
Lead-free per Altera 'N' suffix convention. AEC-Q100 not applicable (FPGAs not automotive qualified at component level). For halogen-free option, choose EP3SL70F484I4LG variant.
